JPH03176326A - embossing machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to an embossing molding device used for manufacturing a bottom material of an electronic component carrier that packages and transports electronic components such as ICs. .

(Prior Art) Conventionally, electronic component carriers made of synthetic resin are known that package and transport a large number of electronic components such as ICs.

This electronic component carrier includes a bottom material that accommodates electronic components such as ICs, and a flat lid material that covers the bottom material. Among these, the bottom material consists of an embossed part for storing electronic components and a flange part opening at the upper end of the embossed part, and the lid material is heat-sealed to this flange part. Further, a large number of embossed portions are provided continuously in a single row, and each embossed portion is connected by a flange portion at an opening at the upper end of the embossed portion.

In an electronic component carrier made of such a slide, Ic
Electronic components No. 5 are housed in each embossed portion of the bottom material, and then a flat tray material is heat-sealed to the flange portion of the bottom material to package the electronic components.

(Problems to be Solved by the Invention) As mentioned above, the bottom material that houses electronic components such as ■C consists of a continuous embossed part and a flange part that connects each embossed part. .

Generally, this bottom material is manufactured by preheating a synthetic resin sheet plate having a width slightly wider than the body of the embossed part, and then forming the embossed part by vacuum or pressure forming.

By the way, when temporarily forming embossed portions on a sheet, it is possible to form multiple rows of embossed portions on a sheet plate of a predetermined width using an embossing forming device equipped with an embossing mold in order to speed up the forming operation. ing. In order to form multiple rows of embossed portions in this manner, the embossing mold needs to have multiple rows of embossed grooves.

However, when multiple rows of embossed grooves are provided in this manner, it is conceivable that the strength of the embossing mold is reduced due to the embossed grooves.

The present invention has been made in consideration of these points,
It is an object of the present invention to provide an embossing forming device capable of forming multiple rows of embossed portions on a sheet plate and reliably preventing a decrease in strength.

[Structure of the invention]

(Means for Solving the Problems) The present invention is an embossing device that includes an embossing mold and forms an embossed part on a synthetic resin sheet plate to be transferred, the embossing device including a plurality of embossing molds that are continuous to the embossing mold. an embossed part having an embossed groove H and extending in the transfer direction;
The flange molded parts extending in the transport direction are arranged alternately, and an extension reinforcing part is provided in the part of the flange molded part extending in the transport direction.

(Sakukawa) Since the flange forming part of the embossing mold is provided with an extension reinforcing part, the strength of the embossing mold can be increased.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

First, the electronic component carrier will be explained using the hour wheel with reference to FIGS. 5 and 6. In FIGS. 5 and 6, the electronic component carrier 70 includes a bottom material 71 that accommodates an electronic component 77 such as an IC, and a lid material 75 that covers the bottom material 71.

The bottom material 71 is made up of an embossed part 72 for storing electronic components and a flange part 73 opening at the upper end of the embossed part 72, and the lid material 75 is heat-sealed to this flange part 73. The embossed portions 72 are continuously provided in a single row, and the embossed portions 72 are connected to each other by a flange portion 73 having an opening at the upper end.

Among these, the bottom material 71 is formed, for example, by vacuum or pressure forming a vinyl chloride or polystyrene sheet plate,
On the other hand, the lid material is made of a laminated sheet made of acid-containing resin. Further, a plurality of punch holes 74 are continuously provided in the flange portion 73 adjacent to the embossed portion 72 . This punch hole 74 is for transporting the bottom material 71.

Next, the bottom material manufacturing apparatus for an electronic component carrier according to the present invention will be briefly explained with reference to FIG.

In FIG. 3, the bottom material manufacturing apparatus 10 includes a roll 11, a dancer roll 12, a preheating roll 13, a heating device 14, an embossing device 15, a cooling device 16, a punching device 17, a feeding section 18, a dancer roll 19, and an inspection device. It is constructed by sequentially installing a device 20, a slitting device 21, a marking device 22, a tension roll 24, and a roll 23.

Of these, the heating device 14 consists of a one-stage heating device 14a, a two-stage heating device 14b, and a three-stage heating device 14c, and is configured to heat the sheet plate 51 in three stages.

Further, the heating temperature can be individually set to nJ.

1st stage heating device 148% 2nd stage heating device 14b and 3rd stage heating device 14c have the same configuration.

That is, each stage heating device 14a, 14b, 14c is each composed of a lower heating mold 28 and two upper heating molds, and is designed to form a plurality of heating parts extending in the transport direction on the temporary sheet 51 at predetermined intervals. It has become.

Next, the embossing apparatus according to the present invention will be explained in detail with reference to FIGS. 1 and 2.

As shown in FIGS. 1 and 2, an embossing device 1
5 consists of a molding die (embossing mold) 32 and an upper molding die 34.

As shown in FIG. 1, the upper surface of the lower molding mold 32 has an embossed molding portion 35 extending in the transfer direction (in the direction of the arrow in FIG. 1).
and flange molded portions 33 extending in the I and iJ directions are alternately arranged. Among these, the emboss forming part 35 forms the emboss part 72 of the bottom material 70, and forms a plurality of continuous emboss grooves 35a. Further, the flange forming part 33 is mainly used to form the flange part 73. Further, on the upper surface of the lower molding die 32, a pair of guide opening molding grooves 37 are provided symmetrically. This guide opening forming groove 37 is for forming the guide opening lower 9 (FIG. 4) on the sheet plate 51.

Further, as shown in FIG. 1, extension reinforcing parts 38 are provided at both ends of each flange forming part 33 extending in the transfer direction. Since the lower molding mold 32 has the embossed grooves 35 a, it is thought that the strength will be reduced, especially at both ends in the transfer direction. can increase the strength of

Furthermore, as shown in FIG. 2, an embossing protrusion holder 43 is provided below the upper mold 34 to hold the embossing protrusion 41 that enters the embossing fill 5a, and a guide opening molding A guide blade 42 is provided corresponding to the groove 37.

Also, as shown in Figure 2, embossed? Fi 35 a
The embossed part 35 having the shape H is removably attached to the lower molding die 32 by a fastener (not shown). Similarly, an embossed protrusion holder 43 that holds the embossed protrusion 41 is detachably attached to the upper mold 34 with a fastener (not shown). For this reason, the embossed part 35 having the embossed groove 35a of a predetermined width is inserted into the lower mold 3.
2, and by attaching the embossed part holder 43 having the embossed part 41 of a predetermined width to the upper mold 34, the embossed part 72 of a desired width can be molded. Further, the embossed protrusion 41 may be attached to the upper mold 34 so as to be slidable up and down. In this case, after the sheet plate 51 is held between the lower molding die 32 and the upper molding die 34, the embossed convex portion 41 is driven to enter the embossed groove 5a.

Further, the punch device 17 includes a punch upper mold 41 and a punch upper mold 45, and the punch hole 74 is formed by the punch device 17.

Next, the operation of this embodiment having such a configuration will be explained.

First, a sheet plate 51 made of vinyl chloride or polystyrene
is continuously fed from the roll 11 and transferred (through the dancer roll 12 and the preheat roll 13) to the J11 heating device 14. The sheet plate 51 is the first stage heating device 1 of the heating device 14.
4a, two-stage heating device 14b, and three-stage heating device 14c
A plurality of band-shaped heating portions (not shown) are formed on the sheet plate 51 at predetermined intervals and extending in the transport direction.

The sheet plate 51 that is continuously transferred from the roll 11 is intermittently transferred from the preheating roll 13 to the feeding section 18, where it undergoes various treatments, and then continuously transferred to the roll 23 again. However, these transport adjustments are carried out by the two dancer rolls 12 and 19.

Next, the sheet plate 51 is transferred to the embossing device 15, and in the embossing device 15, the embossed portion 72 of the bottom material 70 and the guide opening lower 9 are formed on the sheet plate 51. That is, when the heated part of the sheet plate 51 reaches the embossing part 35 of the lower molding die 32, the sheet plate 51 is held between the upper molding die 34 and the lower molding die 32 and is immediately pressed. In this case, the embossed protrusion 41 of the upper mold 34 enters the embossment a 35 a of the embossed part 35, and a large number of embossed parts 72 are formed on the heated part of the sheet plate 51 by positive air or vacuum forming.

At the same time, the guide blade 42 of the upper mold 34
It passes through and enters the guide opening molding groove 37 of the lower molding mold 32, and the guide opening lower 9 is molded on the sheet plate 51. Further, the portion of the sheet plate 51 other than the embossed portion 72 becomes the flange portion 73 as it is.

When the sheet plate 51 is suppressed between the upper molding die 34 and the lower molding die 32, the upper molding die 34 and the lower molding die 3
2, but since the lower molding die 32 that forms the embossed groove 35a is provided with the extension reinforcing portion 38, the lower molding die 32 will not be damaged or deformed. .

During this time, the sheet plate 51 is transferred from the heating device 14 to the forming device 15.
The sheet plate 51, which has been heated and softened, is supported by the support wires 25 until it reaches the upper end, so that the sheet plate 51 does not sag. This support wire 25 is attached to the support wire storage space 39 of the lower mold 32.
is stored in.

Next, the sheet plate 51 is transferred to the cooling device 16 to be cooled, and then transferred to the punch device 17.

When the sheet plate 51 approaches the punch device 17, the lower punch mold 41 and the upper punch mold 45 approach each other leaving a small Ifl gap. Next, a positioning pin (not shown) projects downward from the upper punch mold 45, passes through the guide opening lower part 9 of the sheet plate 51, and accurately positions the sheet plate 51.

Next, the punch lower mold 41 and the punch upper mold 45 are brought closer to each other, and the sheet plate d51 is sandwiched between the punch lower mold 41 and the punch upper mold 45. (not shown) protrudes downward to form punch holes 74 in the sheet plate 51.

In this way, multiple rows, for example, four rows of embossed portions 72 and corresponding punch holes 74 as shown in FIG.
A bottom material 71 having the following shapes is molded.

Subsequently, this multi-rowed bottom material 71 is transferred from the feeding section 18 to the inspection device 20 via the dancer roll 19.

In the inspection device 20, the multi-row bottom material 71 is subjected to each vertical inspection.

Subsequently, the multi-row bottom material 71 is transferred to a slitting device 21, where the flange portion 73 is cut in the transfer direction and divided into each row, and unnecessary portions on both sides are removed.

Subsequently, the marking device 22 marks predetermined defective portions of the bottom material 71 divided into each row.

Next, four rows of bottom material 71 with defective parts marked like this
is then wound onto a roll 23. In this way, a continuous single row of embossed portions 72, a flange portion 73 that connects the embossed portions 72 to each other, and a single row of punched holes 74 provided in the flange portion 73 to correspond to the embossed portions 72 are formed. A bottom material 71 is manufactured (FIG. 5).

According to this embodiment, band-shaped heated portions are formed at predetermined intervals on the sheet plate 51 by the heating unit 14, and then the embossed portions 72 are formed on the convex and convex portions by the forming device 15. Embossed parts can be formed quickly. Also, in the molding device 15, the embossing 'tR35a
Since the molding die 32 having the molding die 32 is provided with an extension reinforcing portion 38, the lower molding die 32 will not be damaged or deformed during the molding operation.

In the above embodiment, an example was shown in which an embossing groove was provided in the lower molding die and the lower molding die was used as an embossing molding die, but the upper molding die may also be an embossing molding die.

〔Effect of the invention〕

As explained above, according to the present invention, since the extension reinforcing portion is provided in the embossing mold having the embossing groove, the strength of the embossing mold can be increased. Therefore, it is possible to prevent the embossing mold from being deformed or damaged during the molding operation.

[Brief explanation of drawings]

FIG. 1 is a plan view of a lower mold of an embossing device according to the present invention, FIG. 2 is a side sectional view of the embossing device, and FIG. 3 is a bottom material manufacturing device for an electronic component carrier. FIG. 4 is a plan view showing a multi-row bottom material;
FIG. 5 is a partial perspective view of the electronic component carrier, and FIG. 6 is a sectional view taken along the line V[-Vl in FIG. 10... Bottom material manufacturing device, 11... Roll, 12...
Dancer roll, 14... Heating device, 14... Embossing device, 17... Punching device, 20... Inspection device, 21... Slitting device, 22... Marking device, 23... Rolling body, 32... Lower mold for forming, 33...
・Flange forming part, 34... Upper mold, 35...
Embossed part, 35a... Embossed groove, 38...
Extension reinforcement part, 51... Sheet plate, 70... Electronic component carrier, 71... Bottom material, 72... Embossed part, 73...
・Flange part, 74...Punch hole. Outsourcing Agent Sato -Yuji

Claims (2)

[Claims] 1. An embossing molding device that is equipped with an embossing mold and forms an embossed part on a synthetic resin sheet plate to be transported, the embossing molding part having a plurality of embossed grooves continuous with the embossing mold and extending in the transport direction; , and flange forming portions extending in the transfer direction are arranged alternately, and an extension reinforcing portion is provided in a portion of the flange forming portion extending in the transfer direction. 2. 2. The embossing device according to claim 1, wherein the embossing section is detachable from the embossing mold.