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JPH03160811A - Surface acoustic wave device - Google Patents

Surface acoustic wave device

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Publication number
JPH03160811A
JPH03160811A JP30031389A JP30031389A JPH03160811A JP H03160811 A JPH03160811 A JP H03160811A JP 30031389 A JP30031389 A JP 30031389A JP 30031389 A JP30031389 A JP 30031389A JP H03160811 A JPH03160811 A JP H03160811A
Authority
JP
Japan
Prior art keywords
film
acoustic wave
surface acoustic
refractive index
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30031389A
Other languages
Japanese (ja)
Inventor
Kiyoshi Sato
清 佐藤
Yoshiaki Fujiwara
嘉朗 藤原
Kazuyuki Hashimoto
和志 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP30031389A priority Critical patent/JPH03160811A/en
Publication of JPH03160811A publication Critical patent/JPH03160811A/en
Pending legal-status Critical Current

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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To prevent contamination of the surface of the device and to improve the performance by adhering an SiO2 film whose refractive index is within a specific range to the surface of the piezoelectric substrate on which electrodes mainly made of aluminum are formed and setting the thickness of the SiO2 film based on the wavelength and the propagation speed of surface acoustic waves generated on the surface. CONSTITUTION:Plural electrodes 3 are formed on the surface of a piezoelectric substrate 2 in a surface acoustic wave device 1 and a passivation film 4 made of SiO2 whose refractive index is nearly 1.5-1.8 is coated on the surface. The surface contamination and adhesion of dust are prevented by coating the film 4 and since the refractive index of the film 4 is large, the effect onto the temperature characteristic is less, but the propagation speed of the surface acoustic wave is constant with respect to a ratio H/lambda (H is thickness and lambda is wavelength) and the oscillating frequency is made stable. Thus, the contamination of the device surface is prevented and the performance is improved.

Description

【発明の詳細な説明】 〔概要〕 弾性表面波デバイス、特に圧電基板にアルミニウムを主
威分とした電極が形成された弾性表面波デバイスの構或
に関し、 特性を安定化させると共に、該安定化に伴う製造上の問
題点除去を目的とし、 アルミニウムを主戒分とした電極の形成された圧電基板
の表面に、光屈折率がほぼ1.5〜1.8であるSiO
,膜を被着せしめ、 該S i O,膜の厚さをH,該表面に発生する弾性表
面波の波長をλ.該弾性表面波の伝播速度をVとしたと
き、VとH/λとの関係からVがほぼ一定化されるH/
λより厚さHを設定したことを特徴とし構戒する。
[Detailed Description of the Invention] [Summary] Regarding the structure of a surface acoustic wave device, particularly a surface acoustic wave device in which an electrode mainly composed of aluminum is formed on a piezoelectric substrate, the present invention provides stabilization of characteristics and stabilization of the surface acoustic wave device. With the aim of eliminating manufacturing problems associated with
, a film is applied, the thickness of the SiO film is H, and the wavelength of the surface acoustic wave generated on the surface is λ. When the propagation velocity of the surface acoustic wave is V, from the relationship between V and H/λ, V is approximately constant H/λ.
The feature is that the thickness H is set higher than λ.

〔産業上の利用分野〕[Industrial application field]

本発明は弾性表面波デバイス、特に、圧電基板の表面に
アルミニウムを主戒分とした電極の形成されたデバイス
の構威に関する。
The present invention relates to a surface acoustic wave device, and particularly to a structure of a device in which electrodes mainly made of aluminum are formed on the surface of a piezoelectric substrate.

弾性表面波デバイスは共振子を利用したvC○(Vol
tage−controlled oscillato
r)やフィルタとして無線通信,伝送通信,オーディオ
等に広く用いられる。特に、通信分野では情報量の増大
に伴って使用周波数が100MHzを越えるもの、自動
車電話等では800MHzを越えるものが要求されると
共に、前記装置の小型化のためVCOおよびフィルタの
小型化も要求されている。
The surface acoustic wave device is vC○ (Vol.
stage-controlled oscillato
r) and filters in wireless communications, transmission communications, audio, etc. In particular, in the communication field, as the amount of information increases, a frequency exceeding 100 MHz is required, and a frequency exceeding 800 MHz is required for car phones, etc., and VCOs and filters are also required to be miniaturized in order to miniaturize the devices. ing.

(従来の技術) 従来、高周波数帯域のVCOやフィルタには、使用周波
数より低周波数の水晶発振(バルク波)に逓倍回路を組
み合わせたvC○や、誘電体共振器によるフィルタ等を
用いられていた。
(Conventional technology) Conventionally, VCOs and filters in high frequency bands have used vC○, which combines a crystal oscillation (bulk wave) with a frequency lower than the operating frequency and a multiplier circuit, and filters using dielectric resonators. Ta.

このように、振動基板の厚さによって発振子自体の周波
数が決まるため逓倍回路を必要とする水晶発振を使用し
た■COおよび、誘電体共振器を使用したフィルタは、
その構戒上小型化が不可能であり、それに代わるものと
して圧1基板に電極を形成した弾性表面波デバイスを利
用した共振器およびフィルタが使用されるようになった
In this way, CO using crystal oscillation, which requires a multiplier circuit because the frequency of the oscillator itself is determined by the thickness of the vibrating substrate, and filters using dielectric resonators,
Due to its structure, miniaturization is impossible, and as an alternative, resonators and filters using surface acoustic wave devices in which electrodes are formed on a pressure-sensitive substrate have come to be used.

弾性表面波デバイスを利用した共振器およびフィルタは
、形成された手指状電極のピッチが発振周波数のA波長
に比例するため、製造が容易であり、かつ、数mm角程
度の小型化が可能である。
Resonators and filters using surface acoustic wave devices are easy to manufacture and can be miniaturized to several mm square because the pitch of the formed finger-like electrodes is proportional to the A wavelength of the oscillation frequency. be.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、圧電基板の表面に電極が表呈する従来の
弾性表面波デバイスは、表面の汚染および塵の付着等に
よって性能が左右されるという欠点があり、そのことに
よって製造上の取り扱いが困難であるという問題点があ
った。
However, conventional surface acoustic wave devices in which electrodes are exposed on the surface of a piezoelectric substrate have the disadvantage that their performance is affected by surface contamination and dust adhesion, which makes them difficult to handle during manufacturing. There was a problem.

本発明の目的は、前記欠点および問題点を排除し、性能
の良い弾性表面波デバイスを提供することである。
An object of the present invention is to eliminate the above-mentioned drawbacks and problems and provide a surface acoustic wave device with good performance.

〔課題を解決するための手段〕[Means to solve the problem]

本発明による弾性表面波デバイスはその実施例を示す第
1図によれば、アルミニウムを主戒分とした電極3の形
戒された圧!基板2の表面に、光屈折率がほぼ1,5〜
1.8であるSi○2膜4を被着せしめ、 該SiO.膜4の厚さをH.該表面に発生する弾性表面
波の波長をλ,該弾性表面波の伝播速度をVとしたとき
、VとH/λとの関係からVがほぼ一定化されるH/λ
より厚さHを設定したことを特徴とする。
According to FIG. 1, which shows an embodiment of the surface acoustic wave device according to the present invention, an electrode 3 mainly made of aluminum has a certain pressure. The surface of the substrate 2 has a light refractive index of approximately 1.5 to
1.8, a SiO2 film 4 having an SiO. The thickness of membrane 4 is H. When the wavelength of the surface acoustic wave generated on the surface is λ, and the propagation velocity of the surface acoustic wave is V, then from the relationship between V and H/λ, V is approximately constant H/λ.
The feature is that the thickness H is set higher than that.

?作用〕 上記手段は、アルミニウムを主成分とした電極の形成さ
れた圧電基板の表面にSiO.膜(パッシベーション膜
)を被着さ廿たことによって、該表面の汚染および塵の
付着されることをなくし、かつ、該SiO■膜は膜厚変
動に対して弾性表面波伝播速度の安定領域を有するもの
とし光屈折率をほぼ1.5〜1.8に限定したことによ
って、発振周波数の高い弾性表面波デバイスに対し、性
能を安定化すると共に、取り扱いおよび製造が容易にし
た。
? Effect] The above means uses SiO. By depositing a film (passivation film), the surface is free from contamination and dust adhesion, and the SiO2 film maintains a stable region of surface acoustic wave propagation velocity against film thickness variations. By limiting the optical refractive index to approximately 1.5 to 1.8, performance is stabilized for surface acoustic wave devices with high oscillation frequencies, and handling and manufacturing are facilitated.

〔実施例〕〔Example〕

以下に、図面を用いて本発明の実施例による弾性表面波
デバイスを説明する。
Below, a surface acoustic wave device according to an embodiment of the present invention will be described using the drawings.

第1図は本発明の一実施例による弾性表面波デバイスの
断面図である。
FIG. 1 is a sectional view of a surface acoustic wave device according to an embodiment of the present invention.

第1図において、弾性表面波デバイス1は圧電基板2の
表面に複数本の電極(手指状電極)3を形成し、その上
に光屈折率Nがほぼ1.5〜1.8であるStowのパ
ッシベーション膜(S i O! II)4を被着させ
る。
In FIG. 1, a surface acoustic wave device 1 has a plurality of electrodes (finger-like electrodes) 3 formed on the surface of a piezoelectric substrate 2, and a Stow electrode having an optical refractive index N of approximately 1.5 to 1.8. A passivation film (S i O! II) 4 is deposited.

混戒集積回路装置および半導体装置において、一般に使
用されるSiO.膜の屈折率Nは1.46程度であり、
石英のそれに近い屈折率NのSiO,膜をパッシベーシ
ョン膜として使用した弾性表面波デバイスは、温度特性
がよいという利点を有する反面、発振周波数が膜厚によ
って変化するため、該膜厚のコントロールが必要になる
SiO. The refractive index N of the film is about 1.46,
Surface acoustic wave devices using a SiO film with a refractive index N close to that of quartz as a passivation film have the advantage of good temperature characteristics, but the oscillation frequency changes depending on the film thickness, so the film thickness must be controlled. become.

そこで、本発明者らは屈折率Nの異なるSfO,膜につ
いて調査したところ、高屈折率NのSiO,膜は温度特
性に対する効果は見られないが発振周波数を安定化でき
ることが分かった。
Therefore, the present inventors investigated SfO films with different refractive indexes N, and found that SiO films with a high refractive index N can stabilize the oscillation frequency, although they have no effect on temperature characteristics.

第2図は弾性表面波の伝播速度VとSiCh膜の厚さ比
H/λとの関係を示す図である。
FIG. 2 is a diagram showing the relationship between the propagation velocity V of surface acoustic waves and the thickness ratio H/λ of the SiCh film.

第2図において、縦軸は弾性表面波の伝播速度v(a+
/s),横軸はSiO,膜の厚さHと弾性表面波の波長
との比H/λ(%)である。
In Fig. 2, the vertical axis is the propagation velocity v(a+
/s), and the horizontal axis is SiO, the ratio H/λ (%) between the thickness H of the film and the wavelength of the surface acoustic wave.

?チウムタンタレートの36度回転Y板から切り出し弾
性表面波の伝播方向がX方向である圧電基板2にアルミ
ニウム電極3を形成したのち、電極3を覆うSiO,膜
4を被着した弾性表面波デバイス1において、光屈折率
Nが1.467である通常のSiO!膜4を被着させる
と、第2図に破線で示す如く伝播速度Vは膜厚比H/λ
の増加と共に低減される。
? A surface acoustic wave device in which an aluminum electrode 3 is formed on a piezoelectric substrate 2 cut out from a 36-degree rotated Y plate of lithium tantalate and whose surface acoustic wave propagation direction is the X direction, and then a SiO film 4 covering the electrode 3 is attached. 1, normal SiO! has an optical refractive index N of 1.467! When the film 4 is deposited, the propagation velocity V becomes equal to the film thickness ratio H/λ, as shown by the broken line in FIG.
decreases as the value increases.

しかし、SiO■膜4の屈折率Nを替えたところ、例え
ば第2図に一点鎖線で示す如く屈折率Nが1.5である
SiO■膜4は、H/λを約15%以上としたとき、伝
播速度Vは屈折率1.467のものより著しく安定化さ
れ、さらに第2図に実線で示す如く屈折率Nを1.6に
すると、伝播速度VはH/λを5%以上とすることによ
ってほぼ一定になる。
However, when the refractive index N of the SiO film 4 was changed, for example, the SiO film 4 with a refractive index N of 1.5, as shown by the dashed line in FIG. In this case, the propagation velocity V is significantly stabilized compared to that with a refractive index of 1.467, and when the refractive index N is set to 1.6 as shown by the solid line in Fig. 2, the propagation velocity V becomes H/λ by 5% or more. By doing so, it becomes almost constant.

従って、第2図より屈折率を約1.5以上にすればH/
λが或る値を越えた領域で、H/λの変化に係わらず安
定化された伝播速度Vが得られることが分かる。
Therefore, from Figure 2, if the refractive index is set to about 1.5 or more, H/
It can be seen that in a region where λ exceeds a certain value, a stabilized propagation velocity V can be obtained regardless of changes in H/λ.

なお、SiO,膜4の形或方法は一般に、c■D(Ch
e+++ical Vapor Deposition
)+スパッタリング,蒸着,M化等を利用する方法が知
られているが、アルミニウムを主戒分とした電極3の加
熱温度を400゜C以下とし、ステップカバレージに優
れた方法として、CVDによることが得策である. C
VDにより被着されるSiO.膜4は、N.OガスとS
iH.ガスの混合比を変えることにより、屈折率Nの変
化することが知られている.第3図はSiO,膜の屈折
率NとNtO/SiH4との関係を示す図であり、デボ
アップ型プラズマCVD装置を用いた本発明者らの実験
により求められた第3図において、縦軸はSiO!膜の
屈折率N,横軸はNtOガスとSiHaガスとのモル比
N*O/SiHaであり、図中のプロット点を実線で結
んだ曲線は300゜Cの加熱状態で形成したSiO.膜
の屈折率特性、図中のプロット点を一点鎖線で結んだ曲
線は250’Cの加熱状態で形成したStow膜の屈折
率特性である.そして、実線および一点鎖線で示す屈折
率特性において屈折率が約1.8を越えると、SiOg
膜には白濁が起こってl危くなる。
Incidentally, the shape or method of the SiO film 4 is generally c■D (Ch
e+++ical Vapor Deposition
) + methods using sputtering, vapor deposition, M conversion, etc. are known, but as a method with excellent step coverage, the heating temperature of the electrode 3 mainly made of aluminum is 400 ° C or less, CVD is known. is a good idea. C
SiO. Membrane 4 is N. O gas and S
iH. It is known that the refractive index N changes by changing the gas mixture ratio. Figure 3 is a diagram showing the relationship between SiO, the refractive index N of the film, and NtO/SiH4. SiO! The refractive index N of the film, the horizontal axis is the molar ratio N*O/SiHa of NtO gas and SiHa gas, and the curve connecting the plot points in the figure with a solid line is the SiO. The refractive index characteristic of the film, the curve connecting the plot points in the figure with a dashed line is the refractive index characteristic of the Stow film formed under heating at 250'C. When the refractive index exceeds about 1.8 in the refractive index characteristics shown by the solid line and the dashed-dotted line, SiOg
The membrane becomes cloudy and becomes dangerous.

第4図は第1図に示す電極の断線率nとSiO.膜の屈
折率Nとの関係を示す図、第5図は第1図に示すS i
O t膜の浸透性試験装置の主要構威図である。
FIG. 4 shows the disconnection rate n of the electrode shown in FIG. 1 and the SiO. A diagram showing the relationship with the refractive index N of the film, FIG. 5 shows the S i shown in FIG. 1.
1 is a diagram showing the main configuration of an Ot membrane permeability test device.

第4図において、縦線は電極3の断線率n,横軸はS 
t O t膜4の屈折率Nであり、第5図に示す装置に
てS i O z膜4の耐性試験が行われた弾性表面波
デバイスlは、SiOg膜4の屈折率Nが1.8を越え
ると、電極3の断線率nが急激に大きくなる。
In Fig. 4, the vertical line is the disconnection rate n of the electrode 3, and the horizontal axis is S.
The surface acoustic wave device 1, in which the SiOz film 4 was subjected to the resistance test using the apparatus shown in FIG. 5, had a refractive index N of the SiOg film 4 of 1. When it exceeds 8, the disconnection rate n of the electrode 3 increases rapidly.

断線率nに係わるSiOt膜4の浸透性は第5図に示す
如く、容器6内の水7に弾性表面波デバイス1と試験電
極5を浸漬し、装置のプラス電極に接続された基板2と
装置のマイナス電極に接続された電極5とに直流電流を
流す。すると、絶縁性に優れるSiO.膜4にて被覆さ
れた電極3には何らの変化も現れないのに対し、絶縁性
の悪いSift膜4にて被覆された電極3は腐食され切
断されるようになる. 以上説明したように本発明においてSiO.膜の屈折率
は、第2図よりほぼ1.5以上とし第4図よりほぼ1.
8以下に限定したものである.〔発明の効果〕 以上説明したように本発明による弾性表面波デバイスは
、電極の形成された圧電基板の表面が汚染されないおよ
び塵が付着されないこと、SiO2膜の膜厚変動に対し
て弾性表面波伝播速度が変化しないことによって、性能
が安定し取り扱いおよび製造を容易にした効果がある。
The permeability of the SiOt film 4 in relation to the disconnection rate n is determined by immersing the surface acoustic wave device 1 and the test electrode 5 in water 7 in a container 6, and comparing the surface acoustic wave device 1 and the test electrode 5 with the substrate 2 connected to the positive electrode of the device, as shown in FIG. A direct current is passed through the electrode 5 connected to the negative electrode of the device. Then, SiO. While the electrode 3 covered with the film 4 does not show any change, the electrode 3 covered with the Sift film 4, which has poor insulation, corrodes and becomes cut. As explained above, in the present invention, SiO. The refractive index of the film is approximately 1.5 or more as shown in FIG. 2, and approximately 1.5 as shown in FIG.
It is limited to 8 or less. [Effects of the Invention] As explained above, the surface acoustic wave device according to the present invention is characterized in that the surface of the piezoelectric substrate on which electrodes are formed is not contaminated and dust is not attached, and that surface acoustic wave Since the propagation speed does not change, performance is stable and handling and manufacturing are facilitated.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例による弾性表面波デバイスの
断面図、 第2図は弾性表面波の伝播速度VとSiOg膜の厚さ比
H/λとの関係を示す図、 第3図はSiOg膜の屈折率NとN z O / S 
i H 4との関係を示す図、 第4図は第1図に示す電極の断線率nとSiO2膜の屈
折率Nとの関係を示す図、 第5図は第1図に示すSiO2膜の浸透性試験装置の主
要構或図、 である. 図中において、 1は弾性表面波デバイス、 2は圧電基板、 3は電極、 4はSiO,W!、 を示す, f弾・l主t面:反テ′ハ′イス 第 図 5,02腰の,摩二比CHl人) ク 沖・1iたお:皮のイ云播え長VとS:(h朕の7摩二
LヒH/λと/)関係とホ1図 茅2阻 5iDz贋のER−g¥−NとNZ O/ S ; 8
4との関代ヲ示iffi第3図 第ヰ図 第1図1:干13’+Oz贋の:畳搗→1試験技置の主
要積六図菖 5 図
FIG. 1 is a cross-sectional view of a surface acoustic wave device according to an embodiment of the present invention. FIG. 2 is a diagram showing the relationship between the propagation velocity V of the surface acoustic wave and the thickness ratio H/λ of the SiOg film. is the refractive index N of the SiOg film and NzO/S
FIG. 4 is a diagram showing the relationship between the disconnection rate n of the electrode shown in FIG. 1 and the refractive index N of the SiO2 film. FIG. This is the main configuration diagram of the permeability test device. In the figure, 1 is a surface acoustic wave device, 2 is a piezoelectric substrate, 3 is an electrode, and 4 is SiO, W! , shows, f bullet/l main t-plane: anti-teeth high-chair Figure 5, 02 waist, Manihi CHl person) Kuoki/1i Tao: skin's i-yunae length V and S: (h my 7 maji Lhi H/λ and/) relationship and ho1 figure 2 5 iDz false ER-g¥-N and NZ O/S; 8
Figure 3 shows the connection with 4 iffi Figure 3 Figure 1 Figure 1: Dry 13'+Oz Fake: Tatami → 1 Main area of the examination technique 6 diagrams 5 Figure

Claims (1)

【特許請求の範囲】[Claims] アルミニウムを主成分とした電極(3)の形成された圧
電基板(2)の表面に、光屈折率がほぼ1.5〜1.8
であるSiO_2膜(4)を被着せしめ、該SiO_2
膜(4)の厚さをH,該表面に発生する弾性表面波の波
長をλ,該弾性表面波の伝播速度をvとしたとき、vと
H/λとの関係からvがほぼ一定化されるH/λより厚
さHを設定したことを特徴とする弾性表面波デバイス。
The surface of the piezoelectric substrate (2) on which the electrode (3) mainly composed of aluminum is formed has a light refractive index of approximately 1.5 to 1.8.
A SiO_2 film (4) is deposited, and the SiO_2
When the thickness of the film (4) is H, the wavelength of the surface acoustic wave generated on the surface is λ, and the propagation speed of the surface acoustic wave is v, then v is approximately constant from the relationship between v and H/λ. A surface acoustic wave device characterized in that a thickness H is set from H/λ.
JP30031389A 1989-11-17 1989-11-17 Surface acoustic wave device Pending JPH03160811A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30031389A JPH03160811A (en) 1989-11-17 1989-11-17 Surface acoustic wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30031389A JPH03160811A (en) 1989-11-17 1989-11-17 Surface acoustic wave device

Publications (1)

Publication Number Publication Date
JPH03160811A true JPH03160811A (en) 1991-07-10

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Family Applications (1)

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JP30031389A Pending JPH03160811A (en) 1989-11-17 1989-11-17 Surface acoustic wave device

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258008A (en) * 1991-02-12 1992-09-14 Murata Mfg Co Ltd Surface acoustic wave device
US5783896A (en) * 1995-08-08 1998-07-21 Sumitomo Electric Industries, Ltd. Diamond-Zn0 surface acoustic wave device
US5959389A (en) * 1995-08-08 1999-09-28 Sumitomo Electronic Industries, Ltd. Diamond-ZnO surface acoustic wave device
WO2002045262A1 (en) * 2000-11-29 2002-06-06 Mitsubishi Denki Kabushiki Kaisha Acoustic wave device
US6650205B2 (en) * 2001-03-29 2003-11-18 Clarisay, Inc. Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
CN115765662A (en) * 2022-10-25 2023-03-07 上海馨欧集成微电有限公司 Method for compensating frequency temperature coefficient of acoustic wave device and acoustic wave device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258008A (en) * 1991-02-12 1992-09-14 Murata Mfg Co Ltd Surface acoustic wave device
US5783896A (en) * 1995-08-08 1998-07-21 Sumitomo Electric Industries, Ltd. Diamond-Zn0 surface acoustic wave device
US5959389A (en) * 1995-08-08 1999-09-28 Sumitomo Electronic Industries, Ltd. Diamond-ZnO surface acoustic wave device
WO2002045262A1 (en) * 2000-11-29 2002-06-06 Mitsubishi Denki Kabushiki Kaisha Acoustic wave device
US6650205B2 (en) * 2001-03-29 2003-11-18 Clarisay, Inc. Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
US6744336B1 (en) * 2001-03-29 2004-06-01 Clarisay, Incorporated Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
CN115765662A (en) * 2022-10-25 2023-03-07 上海馨欧集成微电有限公司 Method for compensating frequency temperature coefficient of acoustic wave device and acoustic wave device

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