JPH03167870A - semiconductor integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Industrial applications The present invention relates to cooling of semiconductor integrated circuits.

Conventional Technology Conventional When using a thermoelectric cooling module that utilizes the Peltier effect to cool a semiconductor integrated circuit, the integrated circuit chip and the thermoelectric cooling module are manufactured separately, or the thermoelectric cooling module is placed under the integrated circuit chip to cool it. 1, and the temperature of an integrated circuit was measured by placing a temperature sensor near the integrated circuit package.The problem that the invention was intended to solve, however, was With the cooling method for semiconductor integrated circuits as described above, there is a problem that the integrated circuit chip and the thermoelectric cooling module are separate, but they inevitably take up a large amount of space. In measurement, there is a problem that it is possible to measure the temperature near the integrated circuit package, but it is not possible to measure the temperature of the integrated circuit chip itself.The present invention solves this problem and uses a very small A means for solving the problems is to supply an integrated circuit chip and to make it possible to measure the temperature of the integrated circuit chip itself. This semiconductor integrated circuit is characterized by having a thermoelectric cooling mechanism based on the Peltier effect, having a second layer insulating film on top of the thermoelectric cooling mechanism using the Peltier effect, and having functional circuit elements on the second layer insulating film. The present invention is a semiconductor integrated circuit characterized by having a temperature sensor within an integrated circuit chip.
It has a thermoelectric cooling mechanism based on the Peltier effect on the layer insulation film.
By having a second layer insulating film on top of the thermoelectric cooling mechanism based on the Peltier effect and having functional circuit elements on the second layer insulating film, a very small integrated circuit chip including the cooling mechanism can be provided. Moreover, the semiconductor integrated circuit of the present invention (
By having a temperature sensor within the integrated circuit chip, it is possible to measure the temperature of the integrated circuit chip itself.

Embodiment FIG. 1 is a sectional view of a semiconductor integrated circuit according to an embodiment of the present invention. In FIG. 1, 2 is a functional circuit element, 4 is a thermoelectric cooling device, and 6 is a temperature sensor section.

10 to 22 form the thermoelectric cooling unit 4, 10 is the first layer of insulation with high thermal conductivity, l2 is the first layer of gold, 14 is the n-type semiconductor, 16 is the p-type semiconductor, 18 is the insulation 1 20 is the second layer of gold, 22 is the second layer insulating film with high thermal conductivity, 30 to 38 are the form of the temperature sensor 6, and 30
32 is a first metal winding that forms a thermocouple; 34 is a second metal winding that forms a thermocouple; 36 is a temperature measuring element; 3
8 is a wiring connected to the input of a circuit that controls the current supplied to the thermoelectric cooling unit 4, and is the same as the thermoelectric cooling unit 4 Cet. First, a first layer insulating film 10 with high thermal conductivity is formed.
On top of the first layer metal 12, an n-type semiconductor I4 and a p-type semiconductor 16 are placed alternately, and there is insulation between them. Shape the object 18. Shape the second layer metal 20 so as to connect the adjacent n-type semiconductor 14 and p-type semiconductor 16 plates that are not in the same first layer metal 12. An insulator 18 is formed between each of the second layer metals 20, and a highly thermally conductive second layer insulating film 22 is formed on top of the insulator 18. From the first layer metal 12 to the n-type semiconductor 14 From the n-type semiconductor 14 to the second layer metal 20
When a current flows in the direction from the second layer metal 20 to the p-type semiconductor 16 and from the p-type semiconductor l6 to the first layer metal l2, the n-type semiconductor 14, the second layer metal 20, and the second layer An endothermic phenomenon occurs at the boundary between the metal 20 and the p-type semiconductor 16. It is possible to cool this vicinity, and the cooling ability can be adjusted by controlling the amount of current flowing. The functional circuit element section 2 is formed on the upper part of the thermoelectric cooling section 4, and the temperature sensor section 6 is formed on the top of the thermoelectric cooling section 4. take shape The upper cover plate of the first metal 32 that forms the thermocouple is covered with an insulator 30 except for the part connected to the wiring 38 connected to the input of the circuit that controls the current supplied to the temperature measuring section 36 and the thermoelectric cooling section 4. .

Additionally, a second metal 34 is formed to form a thermocouple so as to overlap the temperature measuring portion 36. The upper plate of the second metal 34 forming the thermocouple is covered with an insulator 30 except for the portion connected to the wiring 38 connected to the input of the circuit that controls the current supplied to the thermoelectric cooling unit 4. A wiring 38 connected to the input of a circuit that controls the current supplied to the thermoelectric cooling unit 4 is connected to a first metal 32 forming a thermocouple and a second metal 32 forming a thermocouple.
The potential difference corresponding to the temperature at the temperature measuring part 36, which is the junction between the first metal 32 forming the thermocouple and the second metal 34 forming the thermocouple, is the thermoelectric cooling. Through the wiring 38 connected to the input of the circuit that controls the current supplied to the thermoelectric cooling section 4, a current controlled to reach the desired temperature flows into the thermoelectric cooling section 4 even when inputted manually to the control circuit. As described above, according to this embodiment, the thermoelectric cooling section 4 is formed within the integrated circuit chip, and the temperature sensor section 6 is formed within the integrated circuit chip. Or, by controlling the current value applied to the thermoelectric cooling unit 4 using the temperature obtained from the temperature sensor channel 6 as input to adjust the temperature of the chip, a very small integrated circuit chip including a cooling mechanism is provided. Furthermore, it is possible to accurately measure the temperature in the vicinity of the functional circuit element section 2, enabling quick and accurate temperature control, and minimizing changes in the characteristics of the semiconductor integrated circuit due to temperature changes. Effects of the Invention As explained above, according to the present invention, there is a thermoelectric cooling mechanism based on the Peltier effect on the first layer insulating film in the integrated circuit chip, and a second thermoelectric cooling mechanism based on the Peltier effect is provided on the top of the thermoelectric cooling mechanism based on the Peltier effect.
It has a layer insulating film, has a functional circuit element on the second layer insulating film, has a temperature sensor in the integrated circuit chip, and uses the temperature obtained from the temperature sensor as manual power to control the current value applied to the thermoelectric cooling section. By adjusting the temperature of the chip, it is possible to provide a very small integrated circuit chip that includes a cooling mechanism, and it is also possible to accurately measure the temperature in the vicinity of functional circuit elements. This makes it possible to control temperature in a way that minimizes changes in the characteristics of semiconductor integrated circuits due to temperature changes, and the practical effects of this are enormous.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a semiconductor integrated circuit according to an embodiment of the present invention. 2. Functional circuit elements 4. Thermoelectric cooling device 6.
・Temperature sensor lO...First layer insulation Kl with high thermal conductivity
2...First layer gold wind 14...n-type semiconductor l6
...p-type semiconductor E 18.30 ...insulation I 20.
...Second layer of metal wind 22...Second layer of insulation with high thermal conductivity [32...First metal wind to form a thermocouple 34.
・Second metal wind that controls the thermocouple 36 ・Temperature measurement target 38 ・Wire connected to the input of the circuit that controls the current supplied to the thermoelectric cooling unit 4

Claims (4)

[Claims] (1) A thermoelectric cooling mechanism based on the Peltier effect is provided on a first layer insulating film in an integrated circuit chip, a second layer insulating film is provided on top of the thermoelectric cooling mechanism using the Peltier effect, and the second layer insulating film A semiconductor integrated circuit having a functional circuit element thereon. (2) A thermoelectric cooling mechanism based on the Peltier effect according to claim 1, having first to nth metals in the first layer, each separated by an insulator, on the first layer insulating film. , has p-type and n-type semiconductors separated by an insulator from the second metal to the n-1th metal in the first layer, with the n-type semiconductor on the first metal and the p-type semiconductor on the n-th metal. a second layer having a type semiconductor and connecting the upper part of the n-type semiconductor on the i-th metal and the upper part of the p-type semiconductor on the i+1-th metal as 0<i<n, each separated by an insulator; of the first metal, and a second layer of metal on the second layer of metal.
A semiconductor integrated circuit characterized by having a layered insulating film. (3) A semiconductor integrated circuit characterized by having a temperature sensor within an integrated circuit chip. (4) A thermoelectric cooling mechanism based on the Peltier effect according to claim 1, and a temperature sensor according to claim 3, and the temperature obtained from the temperature sensor is input to the cooling mechanism. A semiconductor integrated circuit that adjusts the temperature of a chip by controlling the value of current applied to the circuit.