JPH03167511A - Optical axis aligning method for semiconductor laser module - Google Patents
Optical axis aligning method for semiconductor laser moduleInfo
- Publication number
- JPH03167511A JPH03167511A JP30795189A JP30795189A JPH03167511A JP H03167511 A JPH03167511 A JP H03167511A JP 30795189 A JP30795189 A JP 30795189A JP 30795189 A JP30795189 A JP 30795189A JP H03167511 A JPH03167511 A JP H03167511A
- Authority
- JP
- Japan
- Prior art keywords
- optical axis
- output light
- light amount
- unit
- light quantity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims description 16
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 239000013307 optical fiber Substances 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
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- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体レーザモジュールの光軸合わせ方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for aligning the optical axis of a semiconductor laser module.
従来の半導体レーザモジュールの光軸合わせ方法として
は、発光素子を保持し光軸に垂直な組立用の当接面を有
するレーザユニットと光ファイバを保持し光軸に垂直な
組立用の当接面を有するファイバユニットのいずれか一
方をXYステージを有する移動側保持部に、もう一方を
固定側保持部にそれぞれ当接面を対向して取り付け前記
固定側保持部を光軸方向に加圧し前記両ユニットの当接
面を密着押圧状態とし、前記光ファイバの透過光出力が
最大となるように光軸に垂直な面内で位置合わせをする
ような方法がある。Conventional optical axis alignment methods for semiconductor laser modules include a laser unit that has a contact surface for assembly that holds the light emitting element and is perpendicular to the optical axis, and a contact surface that holds the optical fiber and has a contact surface for assembly that is perpendicular to the optical axis. One of the fiber units having the There is a method in which the abutting surfaces of the unit are brought into a tightly pressed state and the units are aligned in a plane perpendicular to the optical axis so that the transmitted light output of the optical fiber is maximized.
次に従来の半導体レーザモジュールの光軸合わせ方法に
ついて図面を参照して詳細に説明する。Next, a conventional method for aligning the optical axis of a semiconductor laser module will be described in detail with reference to the drawings.
第4図は従来の半導体レーザモジュールの光軸合わせ方
法の一例を示すフローチャート、第5図および第6図(
a),(b)は第4図の方法を説明するための斜視図お
よび平面図,側面図である。FIG. 4 is a flowchart showing an example of a conventional method for aligning the optical axis of a semiconductor laser module, and FIGS. 5 and 6 (
a) and (b) are a perspective view, a plan view, and a side view for explaining the method of FIG. 4;
手順Sll
発光素子を保持し組立用の当接面を有するレーザユニッ
ト18を固定側保持部19に、光ファイバを保持し組立
用の当接面を有するファイバユニット14をXYステー
ジ15.16を有する移動側保持部17にそれぞれ当接
面を対向して取り付け固定側保持部19のビン穴21を
テーバピン22を有する3本の加圧ツメ20で加圧し両
ユニツ}−14.18の当接面を密着押圧状態とする。Procedure Sll: The laser unit 18 that holds the light emitting element and has a contact surface for assembly is placed on the fixed side holding part 19, and the fiber unit 14 that holds the optical fiber and has a contact surface for assembly is provided on the XY stage 15.16. Attach the movable side holding part 17 with their abutting surfaces facing each other, pressurize the bottle hole 21 of the fixed side holding part 19 with three pressurizing claws 20 having taper pins 22, and press the abutting surfaces of both units}-14.18. is in a tightly pressed state.
手順S12
移動側保持部17をX方向に動かし最大出力光量位置を
求め、次にこの位置でY方向に移動し最大出力光量位置
を求める.これら一連の動作を出力光量が増加する限り
繰り返す。Step S12: Move the movable side holder 17 in the X direction to find the maximum output light amount position, and then move it in the Y direction from this position to find the maximum output light amount position. These series of operations are repeated as long as the amount of output light increases.
手順3.13
両ユニット14.15の結合効率を測定し、判定値と比
較し,判定値に達しない場合は手順S12を繰り返し、
判定値に達した場合は光軸が一致したと判断して光軸合
わせを終了する。Step 3.13 Measure the coupling efficiency of both units 14.15 and compare it with the judgment value. If the judgment value is not reached, repeat step S12,
If the determination value is reached, it is determined that the optical axes match, and the optical axis alignment is completed.
実際には、光軸合わせ終了後レーザ溶接によりレーザユ
ニット18とファイバユニット14の当接面を固定する
が、接触面が浮いていると溶接面の光軸ずれの大きな要
因となるためlkg程度の押圧状態にて光軸合わせを行
う必要があり、手順S12の繰り返しが多い。In reality, after the optical axis alignment is completed, the contact surfaces of the laser unit 18 and the fiber unit 14 are fixed by laser welding, but if the contact surfaces are floating, it will be a major cause of optical axis deviation of the welding surfaces, so It is necessary to align the optical axis in the pressed state, and step S12 is often repeated.
上述した従来の半導体レーザモジュールの光軸合わせ方
法は、発光素子を保持し組立用の当接面を有するレーザ
ユニットと光ファイバを保持し組立用の被当接面を有す
るファイバユニットとの両当接面を密着押圧状態とし光
軸に垂直な面内で位置合わせを行うため接触面の摩擦抵
抗により固定側のレーザユニットが移動側のファイバユ
ニットに引きずられて動き、又ひずみが開放された瞬間
にスベリを生じXYステージの移動量に対するレーザユ
ニットとファイバユニットとの相対的ズレ量が一致せず
前記手順S12の繰り返しとなり時間がかかる上、位置
合わせの再現性が得られないためピークの信頼性が低く
概略のピーク位置探索にとどまるという欠点があった。The conventional method for aligning the optical axis of a semiconductor laser module described above involves abutting both a laser unit that holds a light emitting element and has an abutment surface for assembly, and a fiber unit that holds an optical fiber and has an abutment surface for assembly. Because the contact surface is tightly pressed and alignment is performed in a plane perpendicular to the optical axis, the fixed laser unit is dragged by the moving fiber unit due to the frictional resistance of the contact surface, and the moment the strain is released. The relative deviation amount between the laser unit and the fiber unit with respect to the amount of movement of the XY stage does not match, and the step S12 is repeated, which takes time. In addition, the repeatability of positioning cannot be obtained, so the reliability of the peak is reduced. However, this method has the disadvantage that the peak position search is limited to a rough peak position search.
本発明の半導体レーザモジュールの光軸合わせ方法は、
(A>発光素子を保持し光軸に垂直な組立用の当接面を
有するレーザユニットと光ファイバを保持し光軸に垂直
な組立用の被当接面を有するファイバユニットとの光軸
合わせ方法において、前記レーザユニットまたはファイ
バユニットのいずれか一方をXYステージを有する移動
側保持部に、もう一方を光軸方向にバネ性を有する板バ
ネで光軸合わせ方向の1方向に平行に支持され先端にユ
ニット固定部を有する固定側保持部にそれぞれ当接面を
対向して取り付け複数本の加圧ツメにより前記固定側保
持部を光軸方向に加圧し前記両ユニットの当接面を密着
押圧状態とする手順、
(B)前記調整ステージを第1の方向(以下X方向と称
す)に移動し最大出力光量位置を求め、次にこのX位置
で第1の方向に直角な第2の方向(以下Y方向と称す)
に移動し最大出力光量位置を求め、これら一連の動作を
出力光量が増加する限り繰り返し概略のピークを探索す
る手順、
(C)前記概略のピーク位置を中心に探索領域を設定し
板バネの支持方向く以下Y方向とする)にステップ送り
し各Y位置でX方向における出力光量の最大値を求め順
次これらを繰り返し前記探索領域における最大出力光量
および最大となるY位置を求める手順、
(D>前記最大出力光量の得られるY位置においてX方
向にステップ送りし出力光量と前記最大出力光量との出
力差が判定値以下になると光軸か一致したと判断し光軸
合わせを終了する手順、とを含んで構成される。The optical axis alignment method of a semiconductor laser module of the present invention is as follows: (A> A laser unit that holds a light emitting element and has a contact surface for assembly perpendicular to the optical axis; In a method for aligning optical axes with a fiber unit having an abutted surface, one of the laser unit and the fiber unit is mounted on a movable-side holder having an XY stage, and the other is mounted on a leaf spring having spring properties in the optical axis direction. The fixed side holder is supported parallel to one direction of the optical axis alignment direction and has a unit fixing part at the tip, with the abutting surfaces facing each other. (B) move the adjustment stage in the first direction (hereinafter referred to as the X direction) to find the maximum output light amount position; a second direction perpendicular to the first direction at the position (hereinafter referred to as the Y direction)
(C) Set a search area around the approximate peak position and support the leaf spring by repeating this series of operations as long as the output light intensity increases. (hereinafter referred to as the Y direction), and at each Y position, find the maximum value of the output light amount in the X direction, and repeat these sequentially to find the maximum output light amount and the maximum Y position in the search area, (D> Step-feeding in the X direction at the Y position where the maximum output light amount is obtained, and determining that the optical axes coincide when the output difference between the output light amount and the maximum output light amount becomes equal to or less than a determination value, and terminating the optical axis alignment. It consists of:
次に、本発明の実施例について、図面を参照して詳細に
説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第1図は本発明の一実施例を示すフローチャート、第2
図(a>,(b)および第3図(a)〜(c)は第1図
の方法を説明するための平面図,側面図およびグラフで
ある。FIG. 1 is a flowchart showing one embodiment of the present invention, and FIG.
Figures (a>, (b) and Figures 3 (a) to (c) are a plan view, a side view, and a graph for explaining the method of Figure 1.
手順S1
光ファイバを保持し光軸に垂直な当接面を有するファイ
バユニット1をXYステージ2.3を有する移動側保持
部4に、発光素子を保持し光軸に垂直な組立用の当接面
を有するレーザユニット5を光軸方向にバネ性を有する
板バネ6で光軸合わせ方向の1方向10に平行に支持さ
れ先端にユニット固定部を有する固定側保持部7にそれ
ぞれ当接面を対向して取り付け、3本の加圧ツメ8によ
り固定側保持部7を光軸方向に加圧し両ユニット1,5
の当接面を密着押圧状態とする。Step S1 The fiber unit 1 that holds the optical fiber and has a contact surface perpendicular to the optical axis is brought into contact with the moving-side holder 4 having the XY stage 2.3 for assembly, which holds the light emitting element and is perpendicular to the optical axis. A laser unit 5 having a surface is supported parallel to one direction 10 of the optical axis alignment direction by a leaf spring 6 having spring properties in the optical axis direction, and a contact surface is provided to a fixed side holding part 7 having a unit fixing part at the tip. Both units 1 and 5 are mounted facing each other, and press the fixed side holding part 7 in the optical axis direction with the three pressure claws 8.
The contact surfaces of the parts are brought into a close pressed state.
手順S2
移動側保持部4をX方向9に移動し最大出力光量位置を
求め、次にこのX位置でY方向10に移動し最大出力光
量位置を求める。これら一連の動作を出力光量が増加す
る限り繰り返し概略のピーク11を探索する。Step S2: Move the movable side holder 4 in the X direction 9 to find the maximum output light amount position, and then move it from this X position in the Y direction 10 to find the maximum output light amount position. These series of operations are repeated as long as the amount of output light increases to search for the approximate peak 11.
?順S3
手順S2で求めた概略のピーク位置11を中心に探索領
域12を設定し板バネ6の支持方向(Y方向10)にス
テップ送りし各Y位置でX方向9における出力光量の最
大値を求め、順次これらを繰り返し探索領域12におけ
る最大出力光量P maxおよび最大となるY位置y2
を求める.手順S4
最大出力光量P■8の得られるY位置y2においてX方
向9に探索領域12の一端Xiからステップ送りしX方
向9のピーク探索を行う。? Step S3: Set the search area 12 around the approximate peak position 11 obtained in step S2, step-feed in the support direction of the leaf spring 6 (Y direction 10), and calculate the maximum value of the output light amount in the X direction 9 at each Y position. Find the maximum output light amount P max and the maximum Y position y2 in the search area 12 by repeating these steps one after another.
Find. Step S4: At the Y position y2 where the maximum output light amount P8 is obtained, step feed is performed in the X direction 9 from one end Xi of the search area 12, and a peak search in the X direction 9 is performed.
手順S5
手順S4の各ステップ送り毎に出力光量と最大出力光j
l P ...どの差を求め、その出力差が判定値以下
になると光軸が一致したと判断して光軸合わせを終了す
る。Step S5 Output light amount and maximum output light j for each step of step S4
lP. .. .. What difference is determined? When the output difference becomes less than or equal to the determination value, it is determined that the optical axes have coincided, and the optical axis alignment is completed.
一般的にレーザユニット5とファイバユニット1との当
接面を密着押圧状態にして両者の光軸合わせを行う場合
、当接面の摩擦抵抗により固定側のレーザユニット5が
移動側のファイバユニット1に引きずれられて動き、ま
たひずみが開放された瞬間にスベリを生じXYステージ
2.3の移動量に対する両ユニット1.5の相対的ズレ
量が一致しないため、位置の再現性がなく1方向におい
て最大出力光量の得られたと判断した位置に戻しても、
もとの出力光量は得られないことが多い。In general, when aligning the optical axes of the laser unit 5 and the fiber unit 1 by pressing their abutting surfaces closely together, the fixed laser unit 5 moves to the movable fiber unit 1 due to the frictional resistance of the abutting surfaces. The movement is dragged by the XY stage 2.3, and slippage occurs the moment the strain is released.The relative displacement of both units 1.5 and the amount of movement of the XY stage 2.3 does not match, so the position is not reproducible and the Even if you return it to the position where it was determined that the maximum output light amount was obtained,
In many cases, the original output light amount cannot be obtained.
従って1方向ずつ交互にピーク探索を繰り返す一般的な
従来の手順S2の工程では真のピーク位置13は求まら
ず、最終的にはマニュアル調整により作業者がピークだ
と判断した所で光軸合わせを終了していた。Therefore, the true peak position 13 cannot be found in the general conventional procedure S2, in which peak searches are repeated alternately in one direction at a time, and in the end, the optical axis is reached at the point where the operator determines that the peak is the peak through manual adjustment. I had finished matching.
本発明では手順S2の工程終了後、概略ピーク位置11
を中心に探索領域12を設定しピーク近傍を再探索する
ことにより信頼性の高い光軸合わせができる。In the present invention, after the completion of step S2, the approximate peak position 11
By setting the search area 12 around the peak and re-searching the vicinity of the peak, highly reliable optical axis alignment can be achieved.
特にピーク近傍の探索においては、板バネ6の変形しや
すい支持方向くX方向10)にはステップ送りを、変形
しにくい横方向(X方向9)には連続送りを行っている
が、Y方向10にステップ送りした直後のY方向10の
ひずみはX方向9に?動して解消させることにより、両
ユニット1.5の当接面の摩擦抵抗の影響を受けずに探
索領域12における最大出力光量P■8とその時のY位
置y2を再現性よく探索できる。In particular, when searching near the peak, step feed is performed in the support direction where the leaf spring 6 is easily deformed (X direction 10), and continuous feed is performed in the lateral direction (X direction 9) where leaf spring 6 is less likely to deform. Is the strain in the Y direction 10 immediately after step feeding to 10 equal to 9 in the X direction? By moving and canceling it, the maximum output light amount P8 in the search area 12 and the Y position y2 at that time can be searched with good reproducibility without being affected by the frictional resistance of the contact surfaces of both units 1.5.
本発明の半導体レーザモジュールの光軸合わせ方法は、
固定側保持部を板バネ支持とすることで両ユニットの当
接面の密着性を保ちながら固定性を上げることができ、
さらに概略ピーク位置で探索領域を設定し板バネの支持
方向にステップ送り、横方向に連続送りを行うことで当
接面の摩擦抵抗の影響を受けずに探索領域における最大
出力光量および最大となる板バネの支持方向の位置を再
現性よく探索できるため、上記最大出力の得られる板バ
ネの支持方向の位置で横方向に探索し、出力光量と最大
出力光量との出力差が判定値以下になることで光軸が一
致したと判断するこにより、信頼性の高い光軸合わせが
できるという効果がある.The method for aligning the optical axis of a semiconductor laser module of the present invention is as follows:
By supporting the fixed side holding part with a leaf spring, it is possible to improve the fixity while maintaining the adhesion between the contact surfaces of both units.
Furthermore, by setting the search area at the approximate peak position and performing step feed in the support direction of the leaf spring and continuous feed in the lateral direction, the maximum output light amount in the search area is achieved without being affected by the frictional resistance of the contact surface. Since the position in the support direction of the leaf spring can be searched with good reproducibility, the position in the support direction of the leaf spring where the maximum output can be obtained is searched laterally, and the output difference between the output light amount and the maximum output light amount is below the judgment value. By determining that the optical axes have coincided, this has the effect of allowing highly reliable optical axis alignment.
第1図は本発明の一実施例を示すフローチャート、第2
図(a>,(b)および第3図(a),(b),(c)
は第1図の方法を説明するための平面図,側面図および
グラフ、第4図は従来の一例を示すフローチャート、第
5図および第6図(a>.(b)は第4図の方法を説明
するための斜視図および平面図,側面図である。
1,14・・・ファイバユニット、2,15・・・Xス
テージ、3,16・・・Yステージ、4,17・・・移
動側保持部、5.18・・・レーザユニット、6・・・
板バネ、7,19・・・固定側保持部、8,20・・・
加圧ツメ、9・・・X方向、10・・・Y方向、11・
・・概略ピーク位置、12・・・探索領域、13・・・
真のピーク位置、21・・・ビン穴、22・・・テーパ
ピン。FIG. 1 is a flowchart showing one embodiment of the present invention, and FIG.
Figures (a>, (b) and Figure 3 (a), (b), (c)
1 is a plan view, a side view, and a graph for explaining the method shown in FIG. 1, FIG. 4 is a flowchart showing a conventional example, and FIGS. 5 and 6 (a>. 1, 14...Fiber unit, 2,15...X stage, 3,16...Y stage, 4,17...Movement. Side holding part, 5.18... Laser unit, 6...
Leaf spring, 7, 19...Fixed side holding part, 8, 20...
Pressure claw, 9...X direction, 10...Y direction, 11.
...Approximate peak position, 12... Search area, 13...
True peak position, 21... Bottle hole, 22... Taper pin.
Claims (1)
有するレーザユニットと光ファイバを保持し光軸に垂直
な組立用の被当接面を有するファイバユニットとの光軸
合わせ方法において、前記レーザユニットまたはファイ
バユニットのいずれか一方をXYステージを有する移動
側保持部に、もう一方を光軸方向にバネ性を有する板バ
ネで光軸合わせ方向の1方向に平行に支持され先端にユ
ニット固定部を有する固定側保持部にそれぞれ当接面を
対向して取り付け複数本の加圧ツメにより前記固定側保
持部を光軸方向に加圧し前記両ユニットの当接面を密着
押圧状態とする手順、 (B)前記調整ステージを第1の方向(以下X方向と称
す)に移動し最大出力光量位置を求め、次にこのX位置
で第1の方向に直角な第2の方向(以下Y方向と称す)
に移動し最大出力光量位置を求め、これら一連の動作を
出力光量が増加する限り繰り返し概略のピークを探索す
る手順、 (C)前記概略のピーク位置を中心に探索領域を設定し
板バネの支持方向(以下Y方向とする)にステップ送り
し各Y位置でX方向における出力光量の最大値を求め順
次これらを繰り返し前記探索領域における最大出力光量
および最大となるY位置を求める手順、 (D)前記最大出力光量の得られるY位置においてX方
向にステップ送りし出力光量と前記最大出力光量との出
力差が判定値以下になると光軸が一致したと判断し光軸
合わせを終了する手順、とを含むことを特徴とする半導
体レーザモジュールの光軸合わせ方法。[Claims] (A) A laser unit that holds a light emitting element and has an abutment surface for assembly that is perpendicular to the optical axis, and a fiber that holds an optical fiber and has an abutment surface for assembly that is perpendicular to the optical axis. In the method for aligning the optical axis with the optical axis unit, either the laser unit or the fiber unit is attached to a moving-side holder having an The fixed side holding parts are supported parallel to the direction and have a unit fixing part at the tip, and are attached with their abutting surfaces facing each other. Steps for bringing the contact surface into a tightly pressed state: (B) moving the adjustment stage in the first direction (hereinafter referred to as the X direction) to find the maximum output light amount position; then moving the adjustment stage in the first direction at this X position; Perpendicular second direction (hereinafter referred to as the Y direction)
(C) Set a search area around the approximate peak position and support the leaf spring by repeating this series of operations as long as the output light intensity increases. step in the direction (hereinafter referred to as the Y direction), finding the maximum value of the output light amount in the X direction at each Y position, and sequentially repeating these steps to find the maximum output light amount and the maximum Y position in the search area, (D) Step-feeding in the X direction at the Y position where the maximum output light amount is obtained, and determining that the optical axes have coincided when the output difference between the output light amount and the maximum output light amount becomes equal to or less than a determination value, and terminating the optical axis alignment; A method for aligning an optical axis of a semiconductor laser module, the method comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30795189A JPH03167511A (en) | 1989-11-27 | 1989-11-27 | Optical axis aligning method for semiconductor laser module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30795189A JPH03167511A (en) | 1989-11-27 | 1989-11-27 | Optical axis aligning method for semiconductor laser module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03167511A true JPH03167511A (en) | 1991-07-19 |
Family
ID=17975136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30795189A Pending JPH03167511A (en) | 1989-11-27 | 1989-11-27 | Optical axis aligning method for semiconductor laser module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03167511A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05297251A (en) * | 1991-08-14 | 1993-11-12 | Sumitomo Electric Ind Ltd | Alignment assembly device |
| US7384228B2 (en) * | 2004-05-24 | 2008-06-10 | Asml Netherlands B.V. | Insertion device, lithographic apparatus with said insertion device and device manufacturing method |
| CN107238895A (en) * | 2017-07-31 | 2017-10-10 | 河南中基阳光电子技术有限公司 | It is a kind of to look for light method suitable for the quick of optical device |
| JP7661636B1 (en) * | 2024-04-24 | 2025-04-14 | 三菱電機株式会社 | Optical property inspection equipment |
-
1989
- 1989-11-27 JP JP30795189A patent/JPH03167511A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05297251A (en) * | 1991-08-14 | 1993-11-12 | Sumitomo Electric Ind Ltd | Alignment assembly device |
| US7384228B2 (en) * | 2004-05-24 | 2008-06-10 | Asml Netherlands B.V. | Insertion device, lithographic apparatus with said insertion device and device manufacturing method |
| CN107238895A (en) * | 2017-07-31 | 2017-10-10 | 河南中基阳光电子技术有限公司 | It is a kind of to look for light method suitable for the quick of optical device |
| JP7661636B1 (en) * | 2024-04-24 | 2025-04-14 | 三菱電機株式会社 | Optical property inspection equipment |
| WO2025224871A1 (en) * | 2024-04-24 | 2025-10-30 | 三菱電機株式会社 | Optical characteristic inspection device |
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