JPH03129837A - Mounter - Google Patents

Abstract

PURPOSE:To prevent the failure of mounting by a method wherein the position and amount of a dripped resin are detected by an image processing and the correction of the position and amount is automatically performed. CONSTITUTION:In a device for bonding a semiconductor element to a case 8 using a resin, the device is provided with a control part, which controls the discharge pressure, the discharge time and the like of a resin from a dispenser nozzle 3 for dripping the resin on a lead frame or the case and is used for a dispenser 4. Moreover, the device has a dispenser driving unit 6 for driving the nozzle 3, a drive control part 5 for controlling the unit 6, a camera 2 for recognizing the position, amount and form of the dripped resin and an image processing part 1 and is constituted in such a way as to perform the correction of the dripped position, discharge pressure and discharge time of the resin. Thereby, the failure of mounting can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a mounter, and particularly to a mounter that uses resin to bond a semiconductor element to a lead frame or case.

[Conventional technology]

Conventionally, this type of mounter uses a dispenser to apply adhesive resin to a preset resin discharge pressure, discharge time, and
At the dripping position, as shown in the partial plan view of FIG.
The semiconductor device was then mounted on top of the evenly distributed wafer.

[Problem to be solved by the invention]

The above-mentioned conventional mounter drips resin at a preset dropping position, discharge pressure, and discharge time, so it may cause misalignment of the case due to variations in the feed accuracy of the mounter, deformation if the dispense nozzle is clogged, or resin. There is a drawback that if variations in the amount of dripping occur due to differences in the amount remaining, the IC on which the semiconductor element is mounted will become defective.

In contrast to the conventional mounter described above, the present invention detects the position and amount of dropped resin through image processing, automatically corrects the position and amount, and corrects the position and amount when there is an abnormal drop (for example, no drip).
The difference is that the mounter is stopped.

[Means to solve the problem]

The mounter of the present invention includes a dispenser control unit that controls the resin discharge pressure, discharge time, etc. of a dispense nozzle that drips resin onto a lead frame or a case, a drive unit that drives the dispense nozzle, and a drive that controls this drive unit. Control unit, position and amount of resin dropped,
It has a camera that recognizes the shape and an image processing unit, and is configured to correct the resin dropping position, ejection pressure, and ejection time.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a block diagram of a mounter for explaining an embodiment of the present invention.

As shown in FIG. 1, the mounter of the present embodiment is a device that uses resin to bond a semiconductor element to a case 8, and a rail 7 and a case 8 moving on the rail 7 are placed on the rail 7 where they are stopped. Dispense nozzle 3 installed on each station, a dispense drive unit 6 that drives the dispense nozzle 3, and a drive control unit 5 that controls the dispense nozzle 3.
Then, the resin dripped into the cavity of case 8 is exposed to camera 2.
The image processing unit 1 is configured to include an image processing unit 1 that processes images through the image processing unit 1.

In this mounter, before transferring the case 8 to the mounting station, the position, amount, and shape of the resin dropped at the dispensing station are detected by the image processing unit 1 through the camera 2 at the image processing station, and the position, amount, and shape are detected. In some cases, the amount of deviation is transmitted to the drive control unit 5, and the dispense drive unit 6 is driven to correct the position, and if the amount of drops is small, the discharge pressure and time are increased, and if the amount of drops is large, It is possible to transmit the discharge pressure and time to the dispenser 4 so as to reduce them, thereby optimizing the amount of dripping.

Furthermore, if the amount of dripping is close to zero or too large, it is also possible to issue a command to the mounter body to stop the operation of the mounter.

〔Effect of the invention〕

As explained above, the present invention automatically detects the positional deviation, amount, and shape of the resin dropped by the dispenser, and optimizes the discharging conditions and position of the dispenser, thereby eliminating mounting defects. There is an effect that can be done.

6... Dispense drive unit, 7... Rail,
8...Case, 9...Cavity, 10...Dropped resin.

Claims (3)

[Claims] (1) In a mounter that uses adhesive resin to bond a semiconductor element to a lead frame or case, an image processing device that detects the amount, shape, and positional deviation of the adhesive resin dropped on the lead frame or case, and based on the detection signal A mounter comprising a dispenser and a control unit that controls a dispense nozzle. (2) An image processing station that detects the amount, shape, and positional deviation of the adhesive resin is installed between the dispensing station that drips adhesive resin onto the lead frame or case and the mounting station that joins the semiconductor element to the lead frame or case. The mounter described in the preceding paragraph (1) is provided. (3) If the amount of adhesive resin dripped is detected as abnormal,
The mounter according to the preceding item (1), which has a function of stopping the operation of the mounter.