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JPH03110810A - Coil device - Google Patents

Coil device

Info

Publication number
JPH03110810A
JPH03110810A JP24891689A JP24891689A JPH03110810A JP H03110810 A JPH03110810 A JP H03110810A JP 24891689 A JP24891689 A JP 24891689A JP 24891689 A JP24891689 A JP 24891689A JP H03110810 A JPH03110810 A JP H03110810A
Authority
JP
Japan
Prior art keywords
printed wiring
lead pin
wire
wiring board
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24891689A
Other languages
Japanese (ja)
Inventor
Akio Ishizuka
明朗 石塚
Mitsutoshi Kimura
木村 光俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP24891689A priority Critical patent/JPH03110810A/en
Publication of JPH03110810A publication Critical patent/JPH03110810A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/04Arrangements of electric connections to coils, e.g. leads
    • H01F2005/046Details of formers and pin terminals related to mounting on printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To prevent a lead pin from coming out from a through hole and then, the mainframe of a coil from falling off from a printed wiring board by winding the pointed end of an extraction wire to a protruding part of the lead pin and connecting a part of the protruding part to the printed wiring board with solder. CONSTITUTION:The pointed end of an extraction wire 13 is wound to a protruding part of a lead pin 13 which is installed to a coil mainframe 11. The protruding part of the lead pin 12 on which the extraction wire 13 is wound is allowed to pass through a through hole 17 in a printed wiring board 15 and the protruding part is connected to printed wiring 16 by a solder part 18. Consequently, the solder part 18 comes directly into contact with the extraction wire 13 and a part of contact between the solder part 18 and the lead pin 12 as well as the extraction wire 13 is formed into the shape of unevenness because of the existence of the extraction wire 13. In this way, even it external force and vibrations are applied, the lead pin does not come out simply from the though hole. Such a state of the lead pin prevents the coil mainframe 11 from falling off from the printed wiring board 15.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は印刷配線基板にコイル本体を取付けたコイル装
置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a coil device in which a coil body is attached to a printed wiring board.

(従来の技術) 一般にトランスやインダンタンス素子等のコイル本体を
印刷配線基板に取付ける場合は、第2図に示すように、
コイル本体1のコイルボビンやコアに所定長さのリード
ピン2を取付け、そのリードピン2の上部にコイルボビ
ンに巻装された巻線の引出線3を数回巻き付ける。なお
、引出線3における巻き付は部分4の被覆は除去されて
いる。
(Prior art) Generally, when attaching a coil body such as a transformer or inductance element to a printed wiring board, as shown in Fig. 2,
A lead pin 2 of a predetermined length is attached to the coil bobbin or core of a coil body 1, and a lead wire 3 of the winding wire wound around the coil bobbin is wound several times around the upper part of the lead pin 2. It should be noted that the covering of the winding portion 4 of the leader wire 3 is removed.

そして、その巻き付は部分4にはんだ揚を行う。Then, the winding is performed by soldering on the portion 4.

したがって、はんだ揚げ部5は巻き付は部4全部を覆う
。はんだ揚げ部5を形成した状態で、リードピン2を、
印刷配線基板6の貫通孔7にその下端部2aが印刷配線
面6a側に突出するまで貫通させる。そして、印刷配線
8と下端部2aとをはんだ付けする。
Therefore, the soldering part 5 covers the entire wrapped part 4. With the solder fried portion 5 formed, the lead pin 2 is
The printed wiring board 6 is penetrated through the through hole 7 until its lower end 2a protrudes toward the printed wiring surface 6a side. Then, the printed wiring 8 and the lower end portion 2a are soldered.

したがって、コイル本体1はこのはんだ部9によって印
刷配線基板6に固定される。同時に、印刷配線8とコイ
ル本体1の巻線とは、はんだ部9゜リードピン2および
引出線3を介して電気的に接続される。
Therefore, the coil body 1 is fixed to the printed wiring board 6 by the solder portion 9. At the same time, the printed wiring 8 and the winding of the coil body 1 are electrically connected via the solder portion 9° lead pin 2 and the lead wire 3.

しかしながら、上記のような構成で印刷配線基板6にコ
イル本体1を取付たコイル装置においてもまだ次のよう
な問題があった。
However, even in the coil device having the above configuration in which the coil body 1 is attached to the printed wiring board 6, there still exist the following problems.

すなわち、リードピン2における印刷配線基板6の印刷
配線面6a側に突出している部分の突出長Aはこの印刷
配線基板6を電子機器へ組込む場合の制約等にて一定の
制限がある。したがって、そんなに長く設定できない。
That is, the protrusion length A of the portion of the lead pin 2 that protrudes toward the printed wiring surface 6a of the printed wiring board 6 has a certain limit due to restrictions when incorporating the printed wiring board 6 into an electronic device. Therefore, it cannot be set for that long.

よって、例えば、コイル本体1に矢印B方向の外力が印
加すると、はんだ部9とリードピン2の下端部2aの外
周面との間が剥離して、リードピン2が印刷配線基板6
の貫通孔7から抜け、最終的にコイル本体1が印刷配線
基板6から脱落する懸念がある。
Therefore, for example, when an external force in the direction of arrow B is applied to the coil body 1, the solder portion 9 and the outer circumferential surface of the lower end portion 2a of the lead pin 2 are separated, and the lead pin 2 is attached to the printed wiring board 6.
There is a concern that the coil body 1 may come off through the through hole 7 and the coil body 1 may eventually fall off from the printed wiring board 6.

(発明が解決しようとする課題) このように、従来のコイル装置においては、リードピン
2とはんだ部9との間が外力や振動等にて剥離しやすく
、印刷配線8とコイル本体1の巻線との間が断線する懸
念があり、コイル装置全体の信頼性が低下する問題があ
る。
(Problem to be Solved by the Invention) As described above, in the conventional coil device, the space between the lead pin 2 and the solder portion 9 is likely to separate due to external force, vibration, etc., and the printed wiring 8 and the winding of the coil body 1 There is a concern that the wire between the coil device and the coil device may be disconnected, which may reduce the reliability of the entire coil device.

本発明はこのような事情に鑑みてなされたものであり、
引出線の先端部をリードピンの突出部に巻くことにより
、はんだ部とリードピンおよび引出線との接触面積を増
加でき、簡単にリードピンが貫通孔から抜けるのを防止
でき、もって、コイル本体が印刷配線基板から脱落する
のを防止でき、装置全体の信頼性を向上できるコイル装
置を提供することを目的とする。
The present invention was made in view of these circumstances, and
By wrapping the tip of the leader wire around the protruding part of the lead pin, the contact area between the solder part, the lead pin, and the leader wire can be increased, and the lead pin can be easily prevented from coming out of the through hole. An object of the present invention is to provide a coil device that can be prevented from falling off a substrate and can improve the reliability of the entire device.

[発明の構成] (課題を解決するための手段) 上記課題を解消するために本発明のコイル装置は、一方
面に部品実装面が形成され他方向に印刷配線面が形成さ
れ、さらに部品装管用の貫通孔が穿設された印刷配線基
板と、部品装若面に取付けられたコイル本体と、一端が
コイル本体に取付けられ他端が貫通孔を貫通して印刷配
線面側に突出したリードピンと、一端がコイル本体の巻
線に接続され他端が少なくともリードピンの突出部に巻
かれた引出線と、この引出線が巻かれた突出部と印刷配
線とを接続するはんだ部とを備えたちのである。
[Structure of the Invention] (Means for Solving the Problems) In order to solve the above problems, the coil device of the present invention has a component mounting surface formed on one side, a printed wiring surface formed on the other side, and a component mounting surface formed on the other side. A printed wiring board with a through hole for the pipe, a coil body attached to the component mounting surface, and a lead with one end attached to the coil body and the other end passing through the through hole and protruding to the printed wiring surface side. A pin, a leader wire having one end connected to the winding of the coil body and the other end wound around at least a protrusion of the lead pin, and a solder part connecting the protrusion around which the leader wire is wound and the printed wiring. It is.

(作 用) このように構成されたコイル装置によれば、コイル本体
を印刷配線基板に取付けた状態で貫通孔を介して印刷配
線面側に突出するリードピンの突出部に引出線が巻かれ
ている。この引出線が巻かれたリードピンの突出部と印
刷配線とがはんだ部で接続されている。したがって、は
んだ部は引出線に直接接触すると共に、はんだ部と引出
線およびリードピンとの接触部分は引出線が存在するの
で凹凸が形成される。その結果、たとえ外力や振動が印
加されたとしても、リードピンが簡単に貫通孔から抜は
落ちることはない。
(Function) According to the coil device configured in this manner, the lead wire is wound around the protrusion of the lead pin that protrudes toward the printed wiring surface through the through hole while the coil body is attached to the printed wiring board. There is. The protruding portion of the lead pin around which the lead wire is wound is connected to the printed wiring through a solder portion. Therefore, the solder portion is in direct contact with the leader wire, and the contact portion between the solder portion, the leader wire, and the lead pin is uneven because of the presence of the leader wire. As a result, even if an external force or vibration is applied, the lead pin will not easily fall out of the through hole.

(実施例) 以下本発明の一実施例を図面を用いて説明する。(Example) An embodiment of the present invention will be described below with reference to the drawings.

第1図は実施例のコイル装置の概略構成を示す断面模式
図ある。図中11はトランスやインダクタンス素子等か
らなるコイル本体であり、このコイル本体11の図示し
ないコイルボビンやコアに所定長さのリードピン12が
取付けられている。
FIG. 1 is a schematic cross-sectional view showing a schematic configuration of a coil device according to an embodiment. In the figure, reference numeral 11 denotes a coil body made of a transformer, an inductance element, etc., and a lead pin 12 of a predetermined length is attached to a coil bobbin or core (not shown) of this coil body 11.

また、図中13は図示しないコイルボビンに巻装された
巻線に接続された引出線であり、この引出線13は前記
リードピン12のほぼ全長に亘って螺旋状に巻かれてい
る。そして、リードピン12に巻かれた引出線13のう
ち、コイル本体11の下面11aから距離Cだけ離れた
D点より下方部分が被覆が剥離され裸線状態で巻かれ、
D点より上方部分が被覆線状態で巻かれている。
Further, in the figure, reference numeral 13 denotes a lead wire connected to a winding wound around a coil bobbin (not shown), and this lead wire 13 is spirally wound over almost the entire length of the lead pin 12. Then, of the lead wire 13 wound around the lead pin 12, a portion below a point D, which is a distance C from the lower surface 11a of the coil main body 11, has its coating peeled off and is wound as a bare wire.
The portion above point D is wound in a covered wire state.

そして、そのD点より下方の斜線で示す巻き付は部分1
4がはんだ揚されている。すなわち、引出線13の裸線
部分がリードピン12に対してはんだ付けされている。
The winding indicated by the diagonal line below the point D is part 1.
4 is soldered. That is, the bare wire portion of the leader wire 13 is soldered to the lead pin 12.

このようなリードピン12が取付けられたコイル本体1
1を印刷配線基板15の部品装竹面15b側から、リー
ドピン12を貫通孔17へその下端部12aが印刷配線
面15a側に突出するまで貫通させる。そして、図示す
るように、D点が部品装着面15bから距離Eに達した
時点で挿入動作を停止する。そして、その状態で、印刷
配線16と、引出線13が巻かれ、かつはんだ揚げされ
たリードピン12の突出部分12cとをはんだ付けする
Coil body 1 with such a lead pin 12 attached
1 from the component mounting surface 15b side of the printed wiring board 15, the lead pin 12 is passed through the through hole 17 until its lower end 12a protrudes toward the printed wiring surface 15a side. Then, as shown in the figure, the insertion operation is stopped when point D reaches a distance E from the component mounting surface 15b. Then, in this state, the printed wiring 16 and the protruding portion 12c of the lead pin 12 around which the leader wire 13 is wound and soldered are soldered.

したがって、コイル本体11はこのはんだ部18によっ
て印刷配線基板15に固定されると同時に、印刷配線1
6とコイル本体11の巻線とは、はんだ部18.リード
ビン12および引出線13を介して電気的に接続される
Therefore, the coil body 11 is fixed to the printed wiring board 15 by the solder portion 18, and at the same time, the printed wiring 1
6 and the winding of the coil body 11 are connected to the solder portion 18 . It is electrically connected via the lead bin 12 and the lead wire 13.

このように構成されたコイル装置であれば、コイル本体
11を印刷配線基板15に取付けるためのリードピン1
2のほぼ全長に亘って引出線13が螺旋状に巻かれてい
る。さらに、このコイル本体11を印刷配線基板15に
取付けた状態で、リードピン12のの下端部12aが貫
通孔17を貫通して、印刷配線面15b側に突出してお
り、その引出線13が巻かれた突出部12cと印刷配線
16とがはんだ部18でもって接続されている。
In the coil device configured in this way, the lead pin 1 for attaching the coil body 11 to the printed wiring board 15 is
A leader wire 13 is spirally wound over almost the entire length of the wire. Further, when the coil body 11 is attached to the printed wiring board 15, the lower end 12a of the lead pin 12 passes through the through hole 17 and protrudes toward the printed wiring surface 15b, and the lead wire 13 is wound around the lower end 12a of the lead pin 12. The protruding portion 12c and the printed wiring 16 are connected by a solder portion 18.

したがって、はんだ部18はリードピン12以外にも引
出線13に直接接触する。さらに、引出線13はリード
ピン12に螺旋状に巻かれてこのリードピン12にあら
かじめはんだ揚げされているので、引出線13が巻かれ
た状態のリードピン12の外周面はねじ溝状の凹凸が形
成される。その結果、はんだ部18がその凹凸部に流入
固定されるので、たとえ図中F方向の外力や振動がコイ
ル本体11に印加されたとしても、リードピン12が簡
単に貫通孔17から抜は落ちることはない。
Therefore, the solder portion 18 directly contacts the lead wire 13 in addition to the lead pin 12. Further, since the lead wire 13 is spirally wound around the lead pin 12 and soldered to the lead pin 12 in advance, the outer peripheral surface of the lead pin 12 with the lead wire 13 wound thereon is formed with thread groove-like unevenness. Ru. As a result, the solder portion 18 flows into the uneven portion and is fixed, so even if an external force or vibration in the direction F in the figure is applied to the coil body 11, the lead pin 12 will not easily fall out from the through hole 17. There isn't.

当然、抜は落ちるまでもなく、外力や振動等によって、
はんだ部18とリードピン12または引出線13との接
続面が剥離されることが防止されるので、コイル本体1
1の巻線と印刷配線16との間における断線発生が大幅
に抑制される。
Of course, the extraction does not fall, but due to external force or vibration,
Since the connection surface between the solder portion 18 and the lead pin 12 or the leader wire 13 is prevented from peeling off, the coil body 1
The occurrence of disconnection between the winding 1 and the printed wiring 16 is greatly suppressed.

よって、コイル装置全体の信頼性を大幅に向上できる。Therefore, the reliability of the entire coil device can be significantly improved.

また、リードピン12のほぼ全長に亘って巻かれた引出
線13のうち、D点より上方部分は被覆状態のままであ
るので、D点より上方部分ははんだが上りにくい。した
がって、引出線13をリードピン12に巻く時点で巻き
たるみ部分を形成しておくことによって、たとえリード
ピン12が外力により曲げられ、引出線13に張力が印
加されたとしても、その巻きたるみ部分で張力を吸収し
て、引出線13が断線するのを極力抑制することができ
る。
Further, since the portion above the point D of the leader wire 13 wound over almost the entire length of the lead pin 12 remains covered, the solder is difficult to rise on the portion above the point D. Therefore, by forming a slack part when winding the lead wire 13 around the lead pin 12, even if the lead pin 12 is bent by an external force and tension is applied to the lead wire 13, the tension will be applied to the slack part. By absorbing this, it is possible to suppress disconnection of the leader wire 13 as much as possible.

ちなみに、第2図に示す従来のコイル装置によれば、引
出線3におけるリードピン2に巻がれている部分は全部
被覆が剥され、かつ巻かれている部分全部に互ってはん
だ揚げされているので、引出線3に張力が印加すると、
張力に対する余裕が無いので、はんだが付着した裸線部
分と被覆線部分との境目の6点で断線が発生しゃすがっ
た。
Incidentally, according to the conventional coil device shown in FIG. 2, the coating is stripped off from the entire portion of the lead wire 3 that is wound around the lead pin 2, and the entire wound portion is soldered to each other. Therefore, when tension is applied to leader line 3,
Since there was no margin for tension, wire breakage occurred at six points at the boundary between the bare wire portion to which solder was attached and the covered wire portion.

[発明の効果コ 以上説明したように本発明のコイル装置によれば、引出
線の先端部をリードピンの突出部に巻き、かつこの部分
と印刷配線とをはんだで接続している。したがって、は
んだ部とリードピンおよび引出線との接触面積を増加で
きるので、簡単にリードピンが貫通孔から抜けるのを防
止でき、コイル本体が印刷配線基板から脱落するのを防
止でき、また断線発生を極力抑制でき、もって、装置全
体の信頼性を向上できる。
[Effects of the Invention] As explained above, according to the coil device of the present invention, the tip of the lead wire is wound around the protrusion of the lead pin, and this portion is connected to the printed wiring by solder. Therefore, since the contact area between the solder part and the lead pins and leader wires can be increased, the lead pins can be prevented from easily coming out of the through holes, the coil body can be prevented from falling off the printed wiring board, and the occurrence of wire breakage can be prevented as much as possible. Therefore, the reliability of the entire device can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例に係わるコイル装置を示す断
面模式図、第2図は従来のコイル装置を示す断面模式図
である。 11・・・コイル本体、12・・・リードピン、12a
・・・下端部、12c・・・突出部、13・・・引出線
、15・・・印刷配線基板、15a・・・印刷配線面、
15b・・・部品装若面、16・・・印刷配線、17・
・・貫通孔、18・・・はんだ部。
FIG. 1 is a schematic cross-sectional view showing a coil device according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view showing a conventional coil device. 11... Coil body, 12... Lead pin, 12a
...lower end, 12c... protrusion, 13... leader line, 15... printed wiring board, 15a... printed wiring surface,
15b...Parts mounting surface, 16...Printed wiring, 17.
...Through hole, 18...Solder part.

Claims (1)

【特許請求の範囲】[Claims] 一方面に部品実装面が形成され他方面に印刷配線面が形
成され、さらに部品装着用の貫通孔が穿設された印刷配
線基板と、前記部品装着面に取付けられたコイル本体と
、一端が前記コイル本体に取付けられ他端が前記貫通孔
を貫通して前記印刷配線面側に突出したリードピンと、
一端が前記コイル本体の巻線に接続され他端が少なくと
も前記リードピンの突出部に巻かれた引出線と、この引
出線が巻かれた突出部と前記印刷配線とを接続するはん
だ部とを備えたコイル装置。
A printed wiring board has a component mounting surface formed on one side, a printed wiring surface formed on the other side, and a through hole for mounting components, a coil body attached to the component mounting surface, and one end of the printed wiring board. a lead pin attached to the coil body, the other end of which passes through the through hole and protrudes toward the printed wiring surface;
A leader wire having one end connected to the winding of the coil body and the other end wound around at least a protrusion of the lead pin, and a solder portion connecting the protrusion around which the leader wire is wound and the printed wiring. coil device.
JP24891689A 1989-09-25 1989-09-25 Coil device Pending JPH03110810A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24891689A JPH03110810A (en) 1989-09-25 1989-09-25 Coil device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24891689A JPH03110810A (en) 1989-09-25 1989-09-25 Coil device

Publications (1)

Publication Number Publication Date
JPH03110810A true JPH03110810A (en) 1991-05-10

Family

ID=17185332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24891689A Pending JPH03110810A (en) 1989-09-25 1989-09-25 Coil device

Country Status (1)

Country Link
JP (1) JPH03110810A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018285A (en) * 1996-01-23 2000-01-25 Funai Electric Co., Ltd. Wire-wound component to be mounted on a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018285A (en) * 1996-01-23 2000-01-25 Funai Electric Co., Ltd. Wire-wound component to be mounted on a printed circuit board

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