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JPH03116812A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor

Info

Publication number
JPH03116812A
JPH03116812A JP25402489A JP25402489A JPH03116812A JP H03116812 A JPH03116812 A JP H03116812A JP 25402489 A JP25402489 A JP 25402489A JP 25402489 A JP25402489 A JP 25402489A JP H03116812 A JPH03116812 A JP H03116812A
Authority
JP
Japan
Prior art keywords
capacitor element
metal cap
cathode
case body
cathode surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25402489A
Other languages
Japanese (ja)
Inventor
Kenichi Hitosugi
一杉 健一
Kaname Kurihara
要 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elna Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Elna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Elna Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP25402489A priority Critical patent/JPH03116812A/en
Publication of JPH03116812A publication Critical patent/JPH03116812A/en
Pending legal-status Critical Current

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  • Electric Double-Layer Capacitors Or The Like (AREA)

Abstract

PURPOSE:To prevent characteristical deterioration due to mechanical stress, and to obtain a chip type solid electrolytic capacitor suitable for surface packaging by a method wherein a capacitor element is housed in the main body of a case, both ends of which are opened, and a metal cap, which will electrically be connected to the anode lead of the capacitor element and a cathode surface, is attached to both sides of the case main body. CONSTITUTION:A capacitor element 1, having a solid electrolyte consisting of a conductive high molecule between foils, is housed in a square-shaped electrically insulative resin case main body 3, both ends of which are opened. One of the opened parts of the above-mentioned case main body 3, namely, the opened part on the side facing the cathode surface 2b of the capacitor element 1 is covered by a metal cap 4 which becomes a cathode side terminal. This metal cap 4 is electrically connected to the cathode surface 2 of the capacitor element 1 through bonding silver 5, for example. As the capacitor element is housed in an outer covering case as above-mentioned, the solid electrolyte is effectively protected from the mechanical stress coming from outside and the like. Also, as the cap becomes a solder-bonded part, the title capacitor can be surface-packaged on a printed substrate, using an automatic machine and the like.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は固体電解コンデンサに舅し、さらに詳しく肯
えば、導電性高分子を固体電解質とするチップ型の固体
電解コンデンサに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to solid electrolytic capacitors, and more particularly to a chip-type solid electrolytic capacitor using a conductive polymer as a solid electrolyte.

〔従来の技術〕[Conventional technology]

固体電解質を導電性高分子とする場合には、例えばアル
ミニウムなどの弁作用金属箔の巻回体からなるコンデン
サ素子をピロールなどのモノマー中に浸漬したのち、こ
れを電気的もしくは化学的に重合してそのアルミニウム
箔間にポリピロール(固体電解質)を形成し、最終的に
樹脂液中へのデイツプもしくはモールド成形により、コ
ンデンサ素子のまわりに樹脂外装体を形成するようにし
ている。
When the solid electrolyte is a conductive polymer, for example, a capacitor element made of a rolled body of valve metal foil such as aluminum is immersed in a monomer such as pyrrole, and then this is electrically or chemically polymerized. Then, polypyrrole (solid electrolyte) is formed between the aluminum foils, and finally, by dipping or molding into a resin liquid, a resin exterior body is formed around the capacitor element.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、この種の導電性高分子からなる固体電解
質は機械的ストレスに弱い。したがって。
However, solid electrolytes made of this type of conductive polymer are susceptible to mechanical stress. therefore.

樹脂によって被覆された状態で、高温雰囲気内に長時間
貯蔵されたりすると、コンデンサ素子の陽極酸化膜およ
び導電性高分子と樹脂外装体の膨張係数との差により、
各層間で微小剥離が生じ、特に高周波域のインピーダン
ス劣化を起こす。
If the capacitor element is coated with resin and stored in a high temperature atmosphere for a long time, the difference in expansion coefficient between the anodic oxide film and conductive polymer of the capacitor element and the resin outer body causes
Microscopic peeling occurs between each layer, causing impedance deterioration, especially in the high frequency range.

この発明は上記従来の事情に鑑みなされたもので、その
目的は、機械的ストレスによる特性劣化を生ずることが
なく、しかも表面実装に好適なチップ型とした固体電解
コンデンサを提供することにある。
The present invention has been made in view of the above-mentioned conventional circumstances, and its object is to provide a chip-type solid electrolytic capacitor that does not suffer from characteristic deterioration due to mechanical stress and is suitable for surface mounting.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するため、この発明においては、導電性
高分子からなる固体電解質および同固体電解質上に所定
の陰極引出し層を介して形成された陰極面を有するとと
もに陽極リード線を備えたコンデンサ素子を、電気絶縁
性樹脂からなる両端が開放された筒状のケース本体内に
収納し、同ケース本体の一方の開口部にコンデンサ素子
の陰極面に電気的に接続される陰極側金属キャップを被
せるとともに、同ケース本体の他方の開口部にコンデン
サ素子の陽極リード線に電気的に接続される陽極側金属
キャップを被せた構成としている。
In order to achieve the above object, the present invention provides a capacitor element having a solid electrolyte made of a conductive polymer, a cathode surface formed on the solid electrolyte via a predetermined cathode lead layer, and an anode lead wire. is housed in a cylindrical case body made of electrically insulating resin that is open at both ends, and one opening of the case body is covered with a cathode side metal cap that is electrically connected to the cathode surface of the capacitor element. In addition, the other opening of the case body is covered with an anode-side metal cap that is electrically connected to the anode lead wire of the capacitor element.

この場合において、好ましくは陰極側金属キャップは導
電性接着材を介してコンデンサ素子の陰極面に電気的に
接続され、陽極側金属キャップは陽極リード線に溶接さ
れる。
In this case, preferably the cathode side metal cap is electrically connected to the cathode surface of the capacitor element via a conductive adhesive, and the anode side metal cap is welded to the anode lead wire.

また、上記コンデンサ素子をケース本体内に収納する際
、その陰極面の一部分が同ケース本体の一方の開口部か
ら突出するように配置し、同開口部から突出されている
陰極面上に所定の導電材料(例えば銀塗料)を介してハ
ンダ外皮層を形成するようにしてもよい。
When the capacitor element is housed in the case body, it is arranged so that a part of its cathode surface protrudes from one opening of the case body, and a predetermined position is placed on the cathode surface protruding from the opening. The solder skin layer may be formed using a conductive material (for example, silver paint).

〔作   用〕[For production]

上記のように、コンデンサ素子は外装ケース内に収納さ
れるため、コンデンサ素子の固体電解質は外部などから
の機械的ストレスから効果的に保護される。また、ケー
ス本体の両端に設けられたキャップ(もしくはハンダ外
皮N)がプリント基板に対するハンダ接着部となるため
、自動機などによりプリント基板に表面実装することが
できる。
As described above, since the capacitor element is housed within the outer case, the solid electrolyte of the capacitor element is effectively protected from external mechanical stress. Furthermore, since the caps (or solder sheaths N) provided at both ends of the case body serve as solder bonding parts for the printed circuit board, surface mounting on the printed circuit board can be performed using an automatic machine or the like.

〔実 施 例〕〔Example〕

以下、この発明の実施例を添付図面を参照しながら詳細
に説明する。
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

第1図と第2図とを参照すると、この固体電解コンデン
サは、例えば弁作用金属箔の巻回体からなり、その層間
に導電性高分子よりなる固体電解質を有するコンデンサ
素子1を備えている。
Referring to FIGS. 1 and 2, this solid electrolytic capacitor includes a capacitor element 1 made of a wound body of, for example, valve metal foil, and having a solid electrolyte made of a conductive polymer between the layers. .

ここで、このコンデンサ素子1の製造方法の一例を説明
する。まず、アルミニウムなどの弁作用金属箔からなる
エツチング済の電極箔に例えばアジピン酸を含む水溶液
中において陽極酸化皮膜を形成したのち、所定の長さに
切断する。この電極箔の所定部位に陽極リード線2aを
取付けたのち、セパレータを重ねて渦巻状に巻き取る。
Here, an example of a method for manufacturing this capacitor element 1 will be explained. First, an anodized film is formed on an etched electrode foil made of a valve metal foil such as aluminum in an aqueous solution containing, for example, adipic acid, and then cut into a predetermined length. After the anode lead wire 2a is attached to a predetermined portion of the electrode foil, separators are stacked on top of each other and the electrode foil is wound into a spiral shape.

次に、2゜0〜400℃でセパレータを炭化したのち、
アジピン酸アンモニウム水溶液で再化成を行う。そして
Next, after carbonizing the separator at 2°0 to 400°C,
Reconstitution is performed with an aqueous ammonium adipate solution. and.

導電性高分子(例えばピロール)モノマーの水溶液中に
浸漬したのち、過硫酸アンモニウムなどを含む酸化剤に
所定時間浸漬し、導電性高分子の固体電解質を形成する
。さらに、導電性モノマーおよびトルエンスルホン酸な
どを含む水溶液に浸漬し。
After being immersed in an aqueous solution of a conductive polymer (eg, pyrrole) monomer, it is immersed in an oxidizing agent containing ammonium persulfate or the like for a predetermined time to form a solid electrolyte of the conductive polymer. Furthermore, it is immersed in an aqueous solution containing a conductive monomer and toluenesulfonic acid.

電気化学的に重合させて導電率の優れたポリマー(固体
電解質、例えばポリピロール)を形成する。
Electrochemically polymerized to form a polymer (solid electrolyte, e.g. polypyrrole) with good electrical conductivity.

この固体電解質上に、カーボン(例えば日立粉末冶金社
製ヒタゾールAB−1)を塗布したのち、銀ペースト(
福田金属社IBGL−110)を塗布することにより陰
極面2bを形成する。
After coating carbon (for example Hitazol AB-1 manufactured by Hitachi Powder Metallurgy) on this solid electrolyte, silver paste (
The cathode surface 2b is formed by applying IBGL-110 (manufactured by Fukuda Metal Co., Ltd.).

この実施例において、コンデンサ素子1は電気絶縁性樹
脂製の両端が開放された角筒状のケース本体3内に収納
される。このケース本体3の一方の開口部、すなわちコ
ンデンサ素子1の陰極面2bが臨む側の開口部に陰極側
端子となる金属キャップ4が被せられる。この金属キャ
ップ4は導電性接着材、この例では接着銀5を介してコ
ンデンサ素子1の陰極面2bに電気的に接続される。ま
た、ケース本体3に対する金属キャップ4の取付けは、
好ましくは圧着によるが、適当な接着材を用いてもよい
、ケース本体3の他方の開口部には、陽極側端子となる
金属キャップ6が被せられる。
In this embodiment, a capacitor element 1 is housed in a rectangular cylindrical case body 3 made of electrically insulating resin and open at both ends. One opening of the case body 3, that is, the opening on the side facing the cathode surface 2b of the capacitor element 1, is covered with a metal cap 4 serving as a cathode terminal. This metal cap 4 is electrically connected to the cathode surface 2b of the capacitor element 1 via a conductive adhesive, in this example adhesive silver 5. Also, the attachment of the metal cap 4 to the case body 3 is as follows:
The other opening of the case body 3 is covered with a metal cap 6, which serves as the anode side terminal, preferably by crimping, but a suitable adhesive may also be used.

ケース本体3に対する金属キャップ6の取付けは。How to attach the metal cap 6 to the case body 3.

上記と同様、好ましくは圧着によるが、適当な接着材を
用いてもよい、この実施例によると、金属キャップ6に
は陽極リード線2aを挿通する孔6aが穿設されており
、陽極リード線2aはこの孔6aの部分でキャップ6に
溶接され、かつ、その余剰部分が切断される。
Similarly to the above, it is preferably crimped, but an appropriate adhesive may be used. According to this embodiment, the metal cap 6 is provided with a hole 6a through which the anode lead wire 2a is inserted. 2a is welded to the cap 6 at the hole 6a, and its excess portion is cut off.

第3図には上記陽極側端子となる金属キャップを変形し
てなる変形例が示されている。すなわち、この金属キャ
ップ6′にはケース本体3の内側に突出する突起6bが
設けられている。これによると、陽極リード線2aは予
め短く切断されてその突起6bに溶接される。しかるの
ち、コンデンサ素子1をケース本体3内に挿通し、その
陰極面2b側に上記実施例と同様に陰極側の金属キャッ
プ4が取付けられる。
FIG. 3 shows a modification in which the metal cap serving as the anode side terminal is modified. That is, this metal cap 6' is provided with a protrusion 6b that projects inside the case body 3. According to this, the anode lead wire 2a is cut short in advance and welded to the protrusion 6b. Thereafter, the capacitor element 1 is inserted into the case body 3, and the cathode side metal cap 4 is attached to the cathode side 2b in the same manner as in the above embodiment.

第4図には第2図の実施例中に示されている陰m#キャ
ップ4に代えてハンダ外皮717を形成してなる変形例
が示されている。すなわち、上記実施例においてはコン
デンサ素子1の陰極面2bを必ずしもケース本体3の開
口部から突出させる必要はないが、この変形例において
は、陰極面2bの一部分をケース本体3の開口部から突
出させ、その突出された部分に導電性材料、この例では
銀塗料8を下塗りし、その上にハンダよりなる外皮層7
を形成するようにしている。これによれば。
FIG. 4 shows a modification in which a solder skin 717 is formed in place of the negative m# cap 4 shown in the embodiment of FIG. That is, in the above embodiment, the cathode surface 2b of the capacitor element 1 does not necessarily need to protrude from the opening of the case body 3, but in this modification, a part of the cathode surface 2b is made to protrude from the opening of the case body 3. The protruding portion is undercoated with a conductive material, in this example silver paint 8, and an outer skin layer 7 made of solder is applied thereon.
We are trying to form a According to this.

金属キャップに比べてコストダウンが図れる。Cost reduction can be achieved compared to metal caps.

なお、この発明において、導電性高分子の固体電解質を
担持したコンデンサ素子としては、上記実施例の箔巻回
型コンデンサ素子に限定されるものではなく、弁作用金
属粉末の焼結体からなるコンデンサ素子をも含む。
In this invention, the capacitor element supporting a solid electrolyte of a conductive polymer is not limited to the foil-wound type capacitor element of the above embodiment, but also a capacitor made of a sintered body of valve metal powder. Also includes elements.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、この発明によれば、導電性高分子
よりなる固体電解質を有するコンデンサ素子を両端が開
放されたケース本体内に収納するとともに、同ケース本
体の両側にコンデンサ素子の陽極リードと陰極面とに電
気的に接続する金属キャップを取付けた構成としたこと
により、導電性高分子の固体電解質を外部などからの機
械的ストレスから効果的に保護することができ、しかも
表面実装に好適なチップ型の固体電解コンデンサが提供
される。
As explained above, according to the present invention, a capacitor element having a solid electrolyte made of a conductive polymer is housed in a case body with both ends open, and an anode lead of the capacitor element is placed on both sides of the case body. By attaching a metal cap that is electrically connected to the cathode surface, the conductive polymer solid electrolyte can be effectively protected from external mechanical stress, and is suitable for surface mounting. A chip-type solid electrolytic capacitor is provided.

【図面の簡単な説明】[Brief explanation of drawings]

図はいずれもこの発明の実施例に関するもので。 第1図はコンデンサ素子と同コンデンサ素子を収納する
ケース本体とを分離して示す斜視図、第2図は第1の実
施例に係る固体電解コンデンサの断面図、第3図および
第4図はそれぞれ同固体電解コンデンサの変形例を示す
断面図であ、る。 図中、1はコンデンサ素子、2aは陽極リード線、2b
は陰極面、3はケース本体、4,6は金属キャップ、5
は接着銀、7はハンダ外皮層である。
All figures relate to embodiments of this invention. FIG. 1 is a perspective view showing a capacitor element and a case body housing the capacitor element separated, FIG. 2 is a sectional view of the solid electrolytic capacitor according to the first embodiment, and FIGS. 3 and 4 are FIG. 6 is a cross-sectional view showing a modification of the same solid electrolytic capacitor. In the figure, 1 is a capacitor element, 2a is an anode lead wire, 2b
is the cathode surface, 3 is the case body, 4 and 6 are the metal caps, 5
7 is adhesive silver and 7 is solder outer skin layer.

Claims (3)

【特許請求の範囲】[Claims] (1)導電性高分子からなる固体電解質および同固体電
解質上に所定の陰極引出し層を介して形成された陰極面
を有するとともに陽極リード線を備えたコンデンサ素子
を、電気絶縁性樹脂からなる両端が開放された筒状のケ
ース本体内に収納し、同ケース本体の一方の開口部に上
記コンデンサ素子の陰極面に電気的に接続される陰極側
金属キャップを被せるとともに、同ケース本体の他方の
開口部に上記コンデンサ素子の陽極リード線に電気的に
接続される陽極側金属キャップを被せてなることを特徴
とする固体電解コンデンサ。
(1) A capacitor element having a solid electrolyte made of a conductive polymer, a cathode surface formed on the solid electrolyte via a predetermined cathode lead layer, and an anode lead wire, and both ends made of an electrically insulating resin. is housed in an open cylindrical case body, and one opening of the case body is covered with a cathode side metal cap electrically connected to the cathode surface of the capacitor element, and the other opening of the case body is A solid electrolytic capacitor characterized in that the opening is covered with an anode-side metal cap electrically connected to the anode lead wire of the capacitor element.
(2)上記陰極側金属キャップは導電性接着材を介して
上記コンデンサ素子の陰極面に電気的に接続され、上記
陽極側金属キャップは上記陽極リード線に溶接される請
求項1に記載の固体電解コンデンサ。
(2) The solid state according to claim 1, wherein the cathode side metal cap is electrically connected to the cathode surface of the capacitor element via a conductive adhesive, and the anode side metal cap is welded to the anode lead wire. Electrolytic capacitor.
(3)導電性高分子からなる固体電解質および同固体電
解質上に所定の陰極引出し層を介して形成された陰極面
を有するとともに陽極リード線を備えたコンデンサ素子
を、電気絶縁性樹脂からなる両端が開放された筒状のケ
ース本体内にその陰極面の一部分が同ケース本体の一方
の開口部から突出するように配置し、同開口部から突出
されている上記陰極面上に所定の導電材料を介してハン
ダ外皮層を形成するとともに、上記ケース本体の他方の
開口部に上記コンデンサ素子の陽極リード線に電気的に
接続される陽極側金属キャップを被せてなることを特徴
とする固体電解コンデンサ。
(3) A capacitor element having a solid electrolyte made of a conductive polymer, a cathode surface formed on the solid electrolyte via a predetermined cathode lead layer, and an anode lead wire, with both ends made of an electrically insulating resin. is arranged in an open cylindrical case body so that a part of its cathode surface protrudes from one opening of the case body, and a predetermined conductive material is placed on the cathode surface protruding from the opening. A solid electrolytic capacitor characterized in that a solder skin layer is formed through the capacitor, and the other opening of the case body is covered with an anode-side metal cap electrically connected to the anode lead wire of the capacitor element. .
JP25402489A 1989-09-29 1989-09-29 Solid electrolytic capacitor Pending JPH03116812A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25402489A JPH03116812A (en) 1989-09-29 1989-09-29 Solid electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25402489A JPH03116812A (en) 1989-09-29 1989-09-29 Solid electrolytic capacitor

Publications (1)

Publication Number Publication Date
JPH03116812A true JPH03116812A (en) 1991-05-17

Family

ID=17259181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25402489A Pending JPH03116812A (en) 1989-09-29 1989-09-29 Solid electrolytic capacitor

Country Status (1)

Country Link
JP (1) JPH03116812A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0877400A1 (en) * 1997-05-01 1998-11-11 Wilson Greatbatch Ltd. Hermetically sealed capacitor
EP0880152A1 (en) * 1997-05-23 1998-11-25 Wolfgang Westermann Method of manufacturing an SMD-plastic film capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0877400A1 (en) * 1997-05-01 1998-11-11 Wilson Greatbatch Ltd. Hermetically sealed capacitor
EP0880152A1 (en) * 1997-05-23 1998-11-25 Wolfgang Westermann Method of manufacturing an SMD-plastic film capacitor

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