JPH03104011A - Manufacturing method of thin film magnetic head - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film magnetic head, and particularly to an insulating layer structure of a multilayer coil conductor that provides good magnetic properties. [Prior Art] The structure of a conventional thin film magnetic head will be explained with reference to the cross section of the head shown in FIG. A nonmagnetic image 12, a lower magnetic material 13, and a gap layer 14 are laminated on a substrate 11, and a first layer l5 of an insulating layer made of an organic resin is formed thereon. A multilayer coil conductor layer 17 and a second insulating layer 18 were formed thereon, and an upper magnetic material 19 was further formed on the topmost insulating layer. [Problems to be Solved by the Invention] In the above-mentioned conventional thin film head manufacturing process, there was an RM in which the gap 14 was etched during the ion milling performed in the form of the coil conductor layer 17, and the gap length Ge could not be controlled with high precision. .

The purpose of the invention is to protect the gap. [Means for Solving the Problems] In the thin film magnetic head of the present invention, as shown in FIG. This is the first layer.

[For production]

Since the gap 14 corresponding to the length difference a between the positions of the tips of the first insulating layer 15 and 16 is protected from etching by ion milling performed in the form of the coil conductor layer 17, the gap length Ge is increased. It can be determined with precision.

〔Example〕

Examples of the present invention will be described below.

Example 1: This will be explained with reference to Figure 2, which shows only the tip of the magnetic pole. An insulating layer 15 of silane resin is formed on the gap 14, and an insulating layer 16 of novolac resin is further formed thereon to form a first insulating layer. At this time, the dimension a shown in Fig. 2(a) is greater than or equal to the gap depth (Gd). After that, a multilayer coil conductor layer is formed with an insulating layer made of organic resin interposed. Further, oxygen etching is performed after the top layer insulation is increased.At this time, since the selectivity ratio of silane resin and novolac resin to oxygen is approximately 100:1, the oxygen etching is sufficient to completely etch the novolac resin. When this is done, the tip of the first insulating layer is determined by the tip of the silane resin, as shown in Figure 2(b). By this method, the gap 14 in the dimension a shown in FIG. be able to. Furthermore, since the tip of the silane resin 15 is also protected, the tip forms a smooth inclined surface. Additionally, the alignment accuracy of the tips of the first layer insulating film is improved. Example 2: After laminating the layers up to FIG. 2(b), an insulating layer 2o of organic resin is further formed thereon. The end of this uppermost insulating layer 20 is a smooth sloped surface with a predetermined angle, as shown in FIG. 2(c). The shape of the upper magnetic body 19 formed thereon follows the shape of the uppermost insulating layer 2o, so that it also has a smooth surface. Example 3: This will be explained with reference to FIG. 3, which shows only the tip of the magnetic pole. An insulating layer 15 made of silane resin is formed on the gap 14, and an insulating layer 16 made of novolac resin is further formed thereon to form a first insulating layer. At this time, the insulating layers 15 and 16 are shaped so that the dimension a shown in FIG. 3(a) is equal to the dimension of the gap depth (Gd). Thereafter, a multilayer coil conductor layer is formed with an insulating layer made of organic resin interposed therebetween. Furthermore, after forming the uppermost insulating layer, using the first insulating layer as a mask, the gap is cut by ion milling using a gas with a high selectivity between the organic resin and the gap material, as shown in Figure 3(b). Next, as described in Example 1, oxygen etching is performed to define the tip of the first insulating layer with the tip of the silane resin. That is, as shown in FIG. 3(c).

The dimension b shown in FIG. 3(c) determined by this method is the third
It is equal to the dimension a in figure (a), that is, the gap depth Gd.
As explained above, the gap depth Gd can be determined with high precision by the process of the present invention. Furthermore, as explained in Example 1, the gap length Ge can be determined with high accuracy through this process, and the shape of the tip becomes a smooth sloped surface, which improves alignment accuracy.

Embodiment 4: After laminating the layers up to FIG. 3(c), an insulating layer 20 of organic resin is further formed thereon. The end of the uppermost insulating layer 20 is a smooth inclined surface with a predetermined angle, as shown in FIG. 3(d). The shape of the upper magnetic body 19 formed thereon follows the shape of the uppermost insulating layer 20, so that it also has a smooth surface.

〔Effect of the invention〕

According to the present invention, a thin film magnetic head having small dimensions and highly accurate gap depth and gap length can be realized, and a head with uniform electromagnetic characteristics can be stably manufactured.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a thin film magnetic head for explaining the present invention, FIG. 2 is a cross-sectional view for explaining one embodiment of the present invention at the tip of a magnetic pole, and FIG. FIG. 2 is a cross-sectional view illustrating an example at the tip of a magnetic pole. In FIG. 1, 11...substrate, 12... base film, 13... lower magnetic material, l4... gap, 15, 16, 18... organic insulating layer, 17... coil conductor Layer 19... Upper magnetic body In FIG. 2, 20... Organic insulating layer (α)

Claims (1)

[Claims] 1. A non-magnetic gap material between the lower magnetic body and the upper magnetic body;
In the method for manufacturing a thin film magnetic head comprising a first insulating layer, a conductor coil, and a second insulating layer, the first layer of the first insulating layer is made of a silane resist, and A method for manufacturing a thin film magnetic head, characterized by laminating a novolac resist at a distance of at least the gap depth. 2. In the method for manufacturing a thin film magnetic head as set forth in claim 1, the first layer of the first insulating film is composed of an inorganic insulating film, and further, the first layer of the first insulating film is made of an inorganic insulating film, and the first layer is further separated from the tip by a gap depth or more. , a method for manufacturing a thin film magnetic head characterized by laminating a novolak resist. 3. In the method for manufacturing a thin-film magnetic head according to claim 1 or 2, the zero gap depth position is determined by a silane-based photoresist or an inorganic insulating film as the first layer of the first insulating layer. A method for manufacturing a thin film magnetic head. 4. In the method for manufacturing a thin film magnetic head as set forth in claim 1 or 2, after laminating the novolac photoresist, the gap material is etched using this as a mask, and the novolac photoresist is further retreated by oxygen dry etching. A method of manufacturing a thin film magnetic head, characterized in that: 5. In the method for manufacturing a thin film magnetic head according to claim 4, the thin film magnetic head is characterized in that after the novolac photoresist is retreated, a novolac photoresist is further laminated to improve the tapered tip shape. manufacturing method. 6. In the method for manufacturing a thin film magnetic head according to claim 1, the first layer of the first insulating layer is made of a material that is selective to oxygen dry etching, and further, from the tip thereof, A method for manufacturing a thin-film magnetic head characterized by laminating a material with low selectivity to oxygen dry etching at a distance greater than the gap depth.