JPH028183U - - Google Patents
Info
- Publication number
- JPH028183U JPH028183U JP8515688U JP8515688U JPH028183U JP H028183 U JPH028183 U JP H028183U JP 8515688 U JP8515688 U JP 8515688U JP 8515688 U JP8515688 U JP 8515688U JP H028183 U JPH028183 U JP H028183U
- Authority
- JP
- Japan
- Prior art keywords
- panel
- frame
- electronic device
- holes
- common
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
図は本考案の一実施例を示すもので、第１図は
本考案を用いた電子機器の框体内を示す斜視図、
第２図、第３図は本考案の要部の断面を示す説明
図である。
１……電子機器の框体、４……電気接続用パネ
ル、４０１……剛性基板、４０２……パネル基板
、５……フレキシブル回路板、８……接続ピン、
８０１……接続ピンの圧接固定部、Ｃ……剛性基
板の厚さ、Ｄ……接続ピンの圧接固定部の長さ。
The figure shows one embodiment of the present invention, and Fig. 1 is a perspective view showing the inside of the frame of an electronic device using the present invention;
FIGS. 2 and 3 are explanatory diagrams showing cross sections of essential parts of the present invention. 1... Frame of electronic equipment, 4... Electrical connection panel, 401... Rigid board, 402... Panel board, 5... Flexible circuit board, 8... Connection pin,
801... Pressure-welding fixing portion of the connection pin, C... Thickness of the rigid substrate, D... Length of the pressure-welding fixing portion of the connection pin.
Claims (1)
装置を電気的に接続するのに用いるものであつて
、剛性基板の一側面に圧着によりフレキシブル回
路板を設けて一体に設けてパネル基板を形成し、
このパネル基板を慣通させて複数個の慣通孔を設
け、この複数個の慣通孔に接続ピンを加圧挿入し
て接続ピンの両端部をパネル基板の面上より突出
させると共に、前記接続ピンの圧接固定部の長さ
の値はパネル基板の剛性基板の厚さの値よりも小
さいことを特徴とする電子機器における電気接続
用パネル。 It is installed inside the frame of an electronic device and is used to electrically connect each electronic device within the frame.A flexible circuit board is attached to one side of a rigid substrate by pressure bonding and is integrated into a panel board. form,
A plurality of common through holes are formed by making the panel board pass through, and connecting pins are inserted under pressure into the plurality of common through holes so that both ends of the connecting pin protrude from the surface of the panel board. 1. An electrical connection panel for electronic equipment, characterized in that a length of a press-fitting fixing portion of a connection pin is smaller than a thickness of a rigid substrate of a panel substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8515688U JPH028183U (en) | 1988-06-29 | 1988-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8515688U JPH028183U (en) | 1988-06-29 | 1988-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028183U true JPH028183U (en) | 1990-01-19 |
Family
ID=31309832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8515688U Pending JPH028183U (en) | 1988-06-29 | 1988-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028183U (en) |
-
1988
- 1988-06-29 JP JP8515688U patent/JPH028183U/ja active Pending