JPH0246971A - Solder tank - Google Patents
Solder tankInfo
- Publication number
- JPH0246971A JPH0246971A JP19402888A JP19402888A JPH0246971A JP H0246971 A JPH0246971 A JP H0246971A JP 19402888 A JP19402888 A JP 19402888A JP 19402888 A JP19402888 A JP 19402888A JP H0246971 A JPH0246971 A JP H0246971A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- liquid level
- supply
- bottom end
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 53
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 238000005476 soldering Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は半田槽に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a solder tank.
（従来技術）
従来、半１月槽には半田の液面高さを検出する装置が無
かったため、作業者の目測による判断で液面が低下して
いれば、棒状の半田を手作業で供給していた。(Prior technology) Conventionally, there was no device for detecting the solder liquid level in the semi-circular tank, so if the liquid level was low as determined by visual inspection by the operator, bar-shaped solder was manually supplied. Was.
（発明が解決しようとする課題）
しかしながら、重連のように目測による判断では、液面
高さにばらつきが生じ、しかもその液面高さを管理する
ために、作・業者が半田槽を監視すると同時に手作業で
半田を供給する必要がある。(Problem to be solved by the invention) However, when determining by visual measurement as in the case of soldering, the liquid level height varies, and in order to control the liquid level height, operators must monitor the solder tank. At the same time, it is necessary to supply solder manually.
まｌ為その半田が棒状であるために液面管理が難しいと
いう問題がある。Another problem is that the solder is rod-shaped, making it difficult to control the liquid level.
（課題を解決するための手段）
本発明は前記問題点を解決するために、従来の半田槽に
、半田槽内の半田液面高さを検出するための測定手段と
、粒状の半田を一定量づつ半田槽に自動供給する供給手
段と、前記測定手段からの信号に基づき前記供給装置を
動作させる制御手段と、を設けたものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a conventional solder tank with a measuring means for detecting the height of the solder liquid level in the solder tank, and a measuring means for detecting the height of the solder liquid level in the solder tank. The present invention is provided with a supply means for automatically supplying the solder to the solder tank in quantities, and a control means for operating the supply device based on a signal from the measurement means.
（実施例） 以下、本発明を添付図面に従って説明する。(Example) The present invention will be described below with reference to the accompanying drawings.
第１図は本発明に係る半田槽の概略を示す図で、従来の
半田槽ｌに測定装置２、供給装置１４、制御装置（マイ
クロコンピュータＭＣ）、を設けたものである。FIG. 1 is a diagram schematically showing a solder tank according to the present invention, in which a conventional solder tank 1 is provided with a measuring device 2, a supply device 14, and a control device (microcomputer MC).
前記測定装置２は、基板２ａに電極棒３，４．５を取り
付けた構造で、半田槽ｌの側面上方部に設けられている
。The measuring device 2 has a structure in which electrode rods 3, 4.5 are attached to a substrate 2a, and is provided at the upper side of the solder bath l.
そして、前記電極棒３．／１．５は半田液下において、
下端部３ ａ、 ４ ａ、 ５ ａ以外は絶縁されてお
り、これら下端部３ ａ、 ４ ａ、 ５ ａは半１０
槽１内の異なった液面高さに配置されている。このうち
、一番上方に設けられた半田液面上限の検知棒３の下端
部３ａと、真ん中に設けられた半田液面下限の検知棒４
の下端部４ａとは、最下部に設けられた電極棒５の下端
部５ａとの間で導通するようになっている。Then, the electrode rod 3. /1.5 under solder liquid,
The parts other than the lower end parts 3a, 4a, and 5a are insulated, and these lower end parts 3a, 4a, and 5a are
They are arranged at different liquid level heights within the tank 1. Among these, the lower end 3a of the detection rod 3 for detecting the upper limit of the solder liquid level is provided at the top, and the detection rod 4 for detecting the lower limit of the solder liquid level provided in the middle.
The lower end portion 4a is electrically connected to the lower end portion 5a of the electrode rod 5 provided at the lowest portion.
らし、前記下端部３ａより上方に半田液面が上昇すると
、下端部３ａと下端部５ａとの間が導通し、反対に、前
記下端部４ａより下降すると、下端部４ａと下端部５ａ
との間は不導通となる。そして、前記導通あるいは不導
通を示す信号はそれぞれマイクロコンピュータＭＣに送
られている。When the solder liquid level rises above the lower end 3a, electrical conduction occurs between the lower end 3a and the lower end 5a, and conversely, when the solder level lowers from the lower end 4a, the lower end 4a and the lower end 5a become conductive.
There will be no continuity between the two. The signals indicating conduction or non-conduction are each sent to the microcomputer MC.
次に、供給装置１４について説明すると、９は回転ロー
タで、第２図に示すように粒状の半田１４を一定量づつ
ためることのできる複数のポケット１３を有しており、
これらポケット１３は前記回転ロータ９の外周上に等間
隔で設けられている。Next, the supply device 14 will be explained. Reference numeral 9 denotes a rotating rotor, and as shown in FIG.
These pockets 13 are provided on the outer circumference of the rotating rotor 9 at equal intervals.
また、回転ロータ９は軸１２を中心としてエアーホース
１１で駆動するエアーモータ１０により矢印ａ方向に一
定量づつ、つまり一回の動作で１ポケット分の゛ト田１
４が半田ＶｉＩに送られるように回転する。なお、この
回転ロータ９はマイクロコンピュータＭＣに制御されて
作動するようにしである。The rotating rotor 9 is rotated by an air motor 10 driven by an air hose 11 around a shaft 12, which rotates the rotor 9 by a fixed amount in the direction of the arrow a.
Rotate so that 4 is sent to solder ViI. Note that this rotating rotor 9 is operated under the control of a microcomputer MC.
６はパーツボックスで前記粒状の半田１４が貯留されて
、ポケット１３に供給されるようになっている。そして
、こぼれ防止カバー７により半田Ｉ４がこぼれるのを防
止しされながら運ばれて、ガイド部材８を介して半田槽
ｌに流し込まれる。Reference numeral 6 denotes a parts box in which the granular solder 14 is stored and supplied to the pocket 13. Then, the solder I4 is carried while being prevented from spilling by the spill prevention cover 7, and is poured into the solder bath l via the guide member 8.
前述のような構成の本発明に係る早口］槽ｌにおいては
、測定装置２より下端部４ａと下端部５ａの不導通状態
を示す信号がマイクロコンピュータＭＣに送られると、
このマイクロコンピュータＭＣより供給装置１４に信号
が送られる。そして、エアモータ１０が作動し、回転ロ
ータ９が矢印ａ方向に一定距離だけ回転して半田槽１内
にポケット−杯分の粒状半田１４が供給される。この半
田１４は下端部３ａと下端部５ａとの間が導通されるま
で供給され続け、この間の導通か回復することよって導
通信号がマイクロコンピュータＭＣに送うして回転ロー
タ９が停止させられ、半田１４の供給が阻止される。In the tank 1 according to the present invention configured as described above, when a signal indicating a non-conducting state between the lower end portion 4a and the lower end portion 5a is sent from the measuring device 2 to the microcomputer MC,
A signal is sent to the supply device 14 from this microcomputer MC. Then, the air motor 10 is activated, and the rotating rotor 9 is rotated by a certain distance in the direction of the arrow a, thereby supplying a pocket-full of granular solder 14 into the solder bath 1. This solder 14 continues to be supplied until continuity is established between the lower end portion 3a and the lower end portion 5a, and when the continuity is restored, a continuity signal is sent to the microcomputer MC to stop the rotating rotor 9, and the solder The supply of 14 is blocked.
なお、この装置は前述のように液面高さを細かく管理で
き、しかも供給針る半田１４が粒状であるために小型半
田槽にも展開可能である。This device can finely control the liquid level height as described above, and since the solder 14 fed by the supply needle is granular, it can also be applied to a small solder tank.
（発明の効果）
以上の説明で明らかなように、今まで人手を介して行っ
てきた半田の供給が自動化できろ。(Effects of the invention) As is clear from the above explanation, it is now possible to automate the supply of solder, which has traditionally been done manually.
そして、測定装置により液面高さか検出されているので
、常に、一定範囲の高さを維持できる。Since the liquid level height is detected by the measuring device, the height can always be maintained within a certain range.
しかも、半田が粒状で一定小単位づつ供給できるので前
記液面高さを細かく管理でき、従来の棒状のものと比べ
て半田液温の低下か少なくなると同時に半田液面に起こ
る波も小さくなる。Moreover, since the solder is in granular form and can be supplied in fixed small units, the height of the liquid level can be precisely controlled, and compared to conventional bar-shaped solder liquids, the temperature of the solder liquid decreases and at the same time the waves that occur on the solder liquid level are also reduced.
第１図は本発明に係る半田槽の概略図、第２図はその要
部断面図である。
１〜半田漕、２〜基板、３．４〜検知棒、５〜？ＩＸ極
棒、６〜パーツボツクス、７〜こぼれ防止カバ、８〜ガ
イド部材、９〜回転ロータ、ｌＯ〜エアモータ、［１〜
エアホース、１２〜軸、■３〜ポケット、１４〜粒状半
田。FIG. 1 is a schematic diagram of a solder tank according to the present invention, and FIG. 2 is a sectional view of the main part thereof. 1 ~ solder row, 2 ~ board, 3.4 ~ detection rod, 5 ~? IX pole rod, 6-parts box, 7-spill prevention cover, 8-guide member, 9-rotating rotor, lO-air motor, [1-
Air hose, 12~shaft, ■3~pocket, 14~granular solder.
Claims (1)
段と、粒状の半田を一定量づつ半田槽に自動供給する供
給手段と、前記測定手段からの信号に基づき、前記供給
手段を動作させる制御手段と、を有することを特徴とす
る半田槽。(1) Measuring means for detecting the level of solder liquid in the solder tank; supply means for automatically supplying a fixed amount of granular solder to the solder tank; and based on the signal from the measuring means, the supply means A soldering bath characterized by having a control means for operating the soldering bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19402888A JPH0246971A (en) | 1988-08-03 | 1988-08-03 | Solder tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19402888A JPH0246971A (en) | 1988-08-03 | 1988-08-03 | Solder tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246971A true JPH0246971A (en) | 1990-02-16 |
Family
ID=16317740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19402888A Pending JPH0246971A (en) | 1988-08-03 | 1988-08-03 | Solder tank |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246971A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7131565B2 (en) * | 2003-11-25 | 2006-11-07 | International Business Machines Corporation | Feed devices and methods for injection molded solder systems |
| CN101870022A (en) * | 2010-03-29 | 2010-10-27 | 严永农 | Automatic solder adding device |
-
1988
- 1988-08-03 JP JP19402888A patent/JPH0246971A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7131565B2 (en) * | 2003-11-25 | 2006-11-07 | International Business Machines Corporation | Feed devices and methods for injection molded solder systems |
| US7296725B2 (en) | 2003-11-25 | 2007-11-20 | International Business Machines Corporation | Feed devices and methods for injection molded solder systems |
| CN101870022A (en) * | 2010-03-29 | 2010-10-27 | 严永农 | Automatic solder adding device |
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