JPH023354U - - Google Patents
Info
- Publication number
- JPH023354U JPH023354U JP7910888U JP7910888U JPH023354U JP H023354 U JPH023354 U JP H023354U JP 7910888 U JP7910888 U JP 7910888U JP 7910888 U JP7910888 U JP 7910888U JP H023354 U JPH023354 U JP H023354U
- Authority
- JP
- Japan
- Prior art keywords
- measuring
- signal
- processing device
- main body
- correction calculation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 238000009529 body temperature measurement Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 1
Landscapes
- Automatic Control Of Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
第１〜３図は本考案による加工装置の一実施例
を示す図であり、第１図はその機能ブロツク図、
第２図は各種状況におけるラーニングモードに基
づくデータテーブルを何種類か熱変位補正演算装
置に設定・記憶させる手順を示すフローチヤート
、第３図は本考案における制御手順を示すフロー
チヤート、第４図は従来の加工精度特性図である
。
１……ワーク加工マシン（加工装置本体）、２
……ＮＣ制御装置（制御部）、４……排出ワーク
シユート、５……寸法測定装置（アフターゲージ
）、７……温度センサ、８……熱変位補正演算装
置。
1 to 3 are diagrams showing an embodiment of the processing device according to the present invention, and FIG. 1 is a functional block diagram thereof;
Fig. 2 is a flowchart showing the procedure for setting and storing several types of data tables based on the learning mode in various situations in the thermal displacement correction calculation device, Fig. 3 is a flowchart showing the control procedure in the present invention, and Fig. 4 is a conventional machining accuracy characteristic diagram. 1...Work processing machine (processing equipment main body), 2
. . . NC control device (control unit), 4 . . . Discharge work chute, 5 .
Claims (1)
態を制御できる加工装置本体と、加工されたワー
クの寸法を測定する寸法測定装置と、前記加工装
置本体内部の温度を測定する温度測定手段と、前
記寸法測定装置と温度測定手段からの信号に基づ
いて所定の補正演算を行い熱的に安定するまで前
記制御部に補正信号を出力する熱変位補正演算装
置とを備えたことを特徴とする加工装置。 a processing device main body capable of controlling a processing state based on a signal from the outside by a control section; a dimension measuring device measuring the dimensions of a processed workpiece; a temperature measuring means for measuring the temperature inside the processing device main body; A processing device comprising a dimension measuring device and a thermal displacement correction calculation device that performs a predetermined correction calculation based on a signal from a temperature measurement means and outputs a correction signal to the control unit until thermal stability is achieved. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7910888U JPH023354U (en) | 1988-06-15 | 1988-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7910888U JPH023354U (en) | 1988-06-15 | 1988-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH023354U true JPH023354U (en) | 1990-01-10 |
Family
ID=31303995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7910888U Pending JPH023354U (en) | 1988-06-15 | 1988-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023354U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019022920A (en) * | 2017-07-24 | 2019-02-14 | 株式会社ディスコ | Wafer processing method |
-
1988
- 1988-06-15 JP JP7910888U patent/JPH023354U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019022920A (en) * | 2017-07-24 | 2019-02-14 | 株式会社ディスコ | Wafer processing method |
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