JPH02303139A - Probe card for semiconductor devices - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a probe card used for measuring electrical characteristics and the like of semiconductor elements.

[Conventional technology]

Conventionally, in the manufacturing process of semiconductor devices, the electrical characteristics of the semiconductor devices are measured before the semiconductor devices are separated from the semiconductor wafer because the yield of semiconductor devices is low. Typically, a probe card equipped with a stylus that contacts the electrodes of the semiconductor element is used for this type of measurement.The probe card is placed on the semiconductor wafer, and the stylus contacts the electrode of each semiconductor element from above. Measurements were carried out by Semiconductor elements determined to have poor performance after measurement are coated with identification ink to prevent them from being mixed with normal semiconductor elements after being separated from the semiconductor wafer. The conventional probe card is shown in Figures 5 and 6.
This will be explained using figures.

FIG. 5 is a plan view showing a state in which the electrical characteristics of a semiconductor element are being measured by a conventional probe card, and FIG. 6 is a sectional view taken along the line VI--Vl in FIG. In these figures, 1 is a printed substrate as the probe card body;
The printed substrate 1 is made of opaque epoxy resin, etc., and has a circular opening in the center in the width direction for applying identification ink to semiconductor elements, which will be described later, and for checking the contact state of the stylus, which will be described later. A portion 1a is bored. Further, the printed circuit board 1 is provided with a terminal 2 connected to the measuring instrument main body (not shown) on one side thereof, and a wiring pattern 3 connecting the terminal 2 and a stylus to be described later is provided on both the front and back sides. Or it is formed on one side. 4 is a support member for fixing a stylus, which will be described later, to the printed circuit board 1;
This support member 4 is formed in an annular shape from an insulating resin, and has a circular opening 1 on the back surface of the printed circuit board 1.
It is glued at a position concentric with a. 5 is a stylus,
A plurality of these stylus 5 are arranged in parallel at predetermined intervals along the circumferential direction of the circular opening 1a, and each stylus 5 is oriented such that its longitudinal direction is parallel to the radial direction of the circular opening 1a. has been done. The bases of the stylus 5 are soldered to the wiring pattern 3 of the printed circuit board 1 directly or through a through hole, and are also bonded to the support member 4, and the tip ends are connected to the circular opening of the printed circuit board 1. The probes 1a are arranged in a downwardly bent state, and the tip of each probe 5 is positioned at a predetermined position so as to be in contact with an electrode of a semiconductor element, which will be described later. 6
7 indicates a plurality of semiconductor elements formed on a semiconductor wafer, and 7 indicates an electrode of the semiconductor element 6. In addition, in the same figure, 8 is the stylus 5.
shows an indentation left on the electrode 7 of the semiconductor element 6 by
Reference numeral 9 indicates identification ink applied to the defective semiconductor element 6.

In order to measure the electrical characteristics of a semiconductor element using the conventional probe card configured as described above, first, the printed circuit board 1 is connected to the main body of the measuring instrument and placed on the semiconductor element 6 in the form of a semiconductor wafer.

Then, the tip of the stylus 5 is brought into contact with the electrode 7 of the semiconductor element 6 from above. In this state, the electrical characteristics of the semiconductor element are measured. To confirm after measurement whether the stylus 5 has accurately contacted the electrode 7 of the semiconductor element 6, move the probe card from above the semiconductor wafer and visually check the impression 8 left on the electrode 7. This is done by checking. Semiconductor element 6 determined to have poor performance after measurement
Identification ink 9 is applied from the circular opening 1a of the printed circuit board 1 by an ink application device (not shown).

[Problem to be solved by the invention]

However, in the conventional probe card configured in this manner, the semiconductor element 6 after measurement cannot be visually confirmed from the outside during measurement.
If measurement is performed with the stylus deviated from the predetermined position, or if so much identification ink 9 is supplied that it flows to other adjacent semiconductor elements 6, The above-mentioned abnormality cannot be discovered until the measurement of all semiconductor elements 6 is completed and the probe card or semiconductor wafer is moved.

In order to eliminate such problems, it is possible to stop the measurement midway through, move the semiconductor wafer, and perform a visual inspection.
The work of positioning the stylus 5 and the like when starting measurement again is complicated, resulting in reduced efficiency.

[Means for Solving the Problems] A first probe card according to the present invention has a card body made of a transparent material having insulating properties. Moreover, the probe card of the second invention according to the present invention is
A transparent part made of an insulating transparent material is provided in a part of the card body surrounding the stylus. Furthermore, a probe card according to a third aspect of the present invention has an opening for inspecting semiconductor elements in the card body.

[For production]

The probe card according to the present invention allows a semiconductor device that has already been measured to be visually observed while measuring another semiconductor device, so it is possible to make an indentation with a stylus and apply identification ink without interrupting the measurement operation. The amount etc. can be inspected.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 4.

FIG. 1 is a plan view showing a state in which the electrical characteristics of a semiconductor element are measured by the probe card of the first invention according to the present invention, and FIG. A plan view showing a state in which the electrical characteristics of a semiconductor device are being measured, and FIGS. 3 and 4 show a state in which the electrical characteristics of a semiconductor device are being measured by the probe card of the third invention according to the present invention. In plan views, FIG. 3 shows a probe card with only one opening, and FIG. 4 shows a probe card with multiple openings.

In these figures, the same or equivalent members as those explained in FIGS. 5 and 6 are given the same reference numerals, and detailed explanations will be omitted here. First, a first probe card according to the present invention will be explained with reference to FIG. In FIG. 1, reference numeral 11 denotes a printed circuit board as the main body of the probe card, and this printed circuit board 11 is integrally molded from transparent acrylic resin. Further, a circular opening 11a is bored in the widthwise central portion of the printed circuit board 11 for applying identification ink 9 to the semiconductor element 6 and for checking the contact state of the stylus 5. That is, when the printed circuit board 11 is formed of acrylic resin in this manner, the entire semiconductor wafer can be seen through the printed circuit board 11 when the probe card is placed on the semiconductor wafer.

Therefore, since the semiconductor element 6 whose measurement has already been completed can be visually observed while the measurement work is being performed on other semiconductor elements 6, the indentation 8.
The applied amount of the identification ink 9 and the like can be inspected.

Although this embodiment shows an example in which the printed circuit board 11 is integrally formed of transparent acrylic resin, the material of the printed circuit board 11 is not limited to acrylic resin, and may include transparent vinyl chloride resin, styrene resin, Alternatively, any transparent and electrically insulating material such as glass can be used to obtain the same effect as in the above embodiment.

Next, the probe card of the second invention according to the present invention is
This will be explained using figures. In FIG. 2, 21 is a transparent plate for forming a see-through part on the printed circuit board 1, and this transparent plate 21 is formed into a disk shape from transparent acrylic resin.
It is attached in series with the printed circuit board 1 within an opening for attaching a transparent plate in the printed circuit board 1. The see-through plate 21 also has a circular opening 21a for applying identification ink 9 to the semiconductor element 6 and for checking the contact state of the stylus 5.
is drilled. In the probe card in which the see-through plate 21 is attached in this way, the wiring pattern 3 is formed from the printed circuit board 1 to the see-through plate 21, and the base of the stylus 5 is connected directly to the wiring pattern 3 on the see-through plate 21 or through the see-through plate 21. Soldered through the hole. That is, when the transparent plate 21 is attached to the printed circuit board 1 in this way,
When the probe card is placed on the semiconductor wafer, the semiconductor element 6 located around the stylus 5 after measurement can be seen through the see-through plate 21.

Therefore, even with this configuration, since the semiconductor element 6 for which measurement has already been completed can be visually observed during the measurement work of other semiconductor elements 6, the indentation 8 made by the stylus 5 can be made without interrupting the measurement work. ．． The applied amount of the identification ink 9 and the like can be inspected.

In the above embodiment, the transparent plate 21 is made of transparent acrylic resin, but the transparent plate 21 may be made of transparent and electrically insulating material such as transparent vinyl chloride resin, styrene resin, or glass. No matter what material is used, the same effects as in the above embodiments can be obtained.

Next, the probe card of the third invention according to the present invention was
This will be explained with reference to the drawings and FIG. In FIGS. 3 and 4, reference numeral 31 denotes an opening for looking into the semiconductor wafer during measurement, and this opening 31 is provided in a portion of the printed circuit board 1 where the wiring pattern 3 is not formed.

In the probe card shown in FIG. 3, the opening 31 is provided on the tip side of the printed circuit board 1, and in the probe card shown in FIG. are also provided on both sides.

Therefore, even if the opening 31 is provided in the printed circuit board 1 in this way, the semiconductor element 6 whose measurement has already been completed can be visually observed during the measurement operation of other semiconductor elements 6, so that it is not necessary to interrupt the measurement operation. 8. No impression caused by the stylus 5. The applied amount of the identification ink 9 and the like can be inspected.

〔Effect of the invention〕

As explained above, the probe card of the first invention according to the present invention has a card body made of an insulating transparent material, and the probe card of the second invention according to the present invention has a A see-through part made of a transparent material with insulating properties is provided in the area surrounding the needle, so by looking through the card body, the semiconductor device after measurement can be visually observed while measuring other semiconductor devices. can. Furthermore, since the probe card of the third aspect of the present invention has an opening for inspecting semiconductor elements in the card body, the semiconductor element after measurement can be inspected through the opening in the card body while the semiconductor element is being measured on another semiconductor element. It can be visually observed from the area. Therefore, when using the probe card according to the present invention, it is possible to remove the impression caused by the stylus without interrupting the measurement operation.
Because it is possible to inspect the amount of identification ink applied, etc.
Measurement work can be carried out efficiently and reliably.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a state in which the electrical characteristics of a semiconductor element are measured by the probe card of the first invention according to the present invention, and FIG. A plan view showing a state in which the electrical characteristics of a semiconductor device are being measured, and FIGS. 3 and 4 show a state in which the electrical characteristics of a semiconductor device are being measured by the probe card of the third invention according to the present invention. In plan views, FIG. 3 shows a probe card with only one opening, and FIG. 4 shows a probe card with multiple openings. FIG. 5 is a plan view showing a state in which the electrical characteristics of a semiconductor element are being measured by a conventional probe card, and FIG. 6 is a sectional view taken along the line vr-yvt in FIG. 5...Stylus, 6...Semiconductor element, 11...
Printed circuit board, 21... see-through plate, 31... opening.

Claims (3)

[Claims] (1) A probe card for a semiconductor device in which a stylus for contacting an electrode of a semiconductor device from above is provided protruding from the back surface of a card body, characterized in that the card body is formed of a transparent material having an insulating property. Probe card for semiconductor devices. (2) In a probe card for a semiconductor device in which a stylus that contacts the electrode of a semiconductor device from above is provided protruding from the back surface of the card body, a portion of the card body surrounding the stylus is made of an insulating transparent material. A probe card for semiconductor devices characterized by having a see-through portion. (3) A probe card for a semiconductor device in which a stylus for contacting an electrode of a semiconductor device from above is provided protruding from the back surface of the card body, characterized in that the card body is provided with an opening for inspecting the semiconductor device. Probe card for semiconductor devices.