JPH02249201A - Leads of electronic component, and linkage of the components with leads - Google Patents
Leads of electronic component, and linkage of the components with leadsInfo
- Publication number
- JPH02249201A JPH02249201A JP1071275A JP7127589A JPH02249201A JP H02249201 A JPH02249201 A JP H02249201A JP 1071275 A JP1071275 A JP 1071275A JP 7127589 A JP7127589 A JP 7127589A JP H02249201 A JPH02249201 A JP H02249201A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- wires
- electronic components
- wire
- linkage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000003990 capacitor Substances 0.000 claims abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052742 iron Inorganic materials 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Packages (AREA)
Abstract
Description
【発明の詳細な説明】
産粟上夏肌■立■
本発明は、端部にテーピングが施されプリント基板への
装着時該テーピング部分が切断除去されるリード線を両
端に有する抵抗、コンデンサ、コイル等の電子部品に関
する。[Detailed Description of the Invention] The present invention relates to resistors, capacitors, coils, etc. that have lead wires at both ends that are taped at the ends and the taped portions are cut and removed when attached to a printed circuit board. related to electronic components.
l米及歪
−〜に、抵抗、コンデンサ、コイル等の電子部品は導電
率の高い軟鋼からなるリード線を両端に有し、このリー
ド線を自動挿入機等によってプリント基板に挿通し、プ
リント基板上の配線に半田付は等で接合される。In general, electronic components such as resistors, capacitors, and coils have lead wires made of high-conductivity mild steel at both ends, and these lead wires are inserted into the printed circuit board using an automatic insertion machine or the like. The upper wiring is joined by soldering or the like.
そして、これらリード線を両端に有する電子部品におい
ては、電子部品を一定間隔に配列し、そのリード線両端
をそれぞれ同一幅の帯状台紙及び帯状粘着紙によって挟
持固定し、多数の電子部品をこれら上下の帯状紙を介し
て連設することにより、収納、加工処理等の便が図られ
ている。For electronic components that have lead wires at both ends, the electronic components are arranged at regular intervals, and both ends of the lead wires are clamped and fixed between strip-shaped mounts and strip-shaped adhesive paper of the same width, and a large number of electronic components are placed above and below these. The storage, processing, etc. are facilitated by connecting them through a strip of paper.
そして、これら連設された電子部品は前記プリント基板
への装着にさきだち、リード線が挟持部の内側で切断さ
れて個々の電子部品に切離され、自動挿入機等にかけら
れるようになっている。Before these connected electronic components are mounted on the printed circuit board, the lead wires are cut inside the clamping part to separate the electronic components into individual electronic components, and the electronic components are placed in an automatic insertion machine or the like. .
゛ しよ゛と る
しかしながら、上記従来技術においては、移送されてく
る前記した上下の帯状紙間に電子部品のリード線を順次
導入して挟持固定する際、すなわちテーピング装置によ
って電子部品をテーピングし連設する際、リード線が一
本の細い軟銅線からなるので、少しの外力に対しても曲
がり易く、多数のリード線を常時所定間隔で平行に保持
することが困難で、隣接する電子部品が衝当したり、ま
たリード線の先端部が所定の位置からずれて前記導入に
支障をきたすこともあり、さらにリード線の折曲により
加工精度が出し難く、切断後のリード線長さが不均一に
なるなどの欠点もあった。However, in the above-mentioned conventional technology, when the lead wires of electronic components are successively introduced between the upper and lower paper strips being transferred and clamped and fixed, that is, the electronic components are taped with a taping device. When connecting the lead wires in series, since each lead wire is made of a single thin annealed copper wire, it is easily bent by even the slightest external force, and it is difficult to maintain multiple lead wires in parallel at regular intervals, making it difficult for adjacent electronic components to be connected. In addition, the tip of the lead wire may be displaced from the specified position, which may interfere with the introduction.Furthermore, the lead wire may be bent, making it difficult to achieve machining accuracy, and the length of the lead wire may be shortened after cutting. There were also drawbacks such as non-uniformity.
また、上記した折曲の惧れから、テーピング時上下の帯
状紙に強い押圧力を加えることができないので、上下紙
にはともに比較的広い挟持幅が必要となり、必然的にテ
ーピング時多量の帯状紙を要するとともに、リード線の
切断除去される挟持部分も長くなり、生産コスト上好ま
しくなかった。Furthermore, due to the above-mentioned risk of bending, it is not possible to apply a strong pressing force to the upper and lower paper strips during taping, so a relatively wide clamping width is required for both the upper and lower paper, which inevitably results in a large amount of paper strips being used during taping. In addition to requiring paper, the clamping portion where the lead wire is cut and removed also becomes long, which is unfavorable in terms of production costs.
また、リード線が1本の比較的高価な銅線からなり、切
断除去される部分も当然のことながら高価な銅線である
ので、この点からも生産コストの上昇を招いていた。Further, since the lead wire consists of a single relatively expensive copper wire, and the portion to be cut and removed is also an expensive copper wire, this also causes an increase in production costs.
るための び
本発明は上記した難点を克服しようとするもので、プリ
ント基板に装着するリード線を両端に具備する抵抗、コ
ンデンサー、コイル等の電子部品において、該リード線
を良導電性の金属線と切断除去されるこれより硬い異種
金属線とを軸線方向に接合した構成とし、また多数の電
子部品をその上記硬い金属線を帯状台紙とこれより小幅
の帯状粘着紙とによって所定間隔で挟持固定して連設体
としたものであって、硬い金属線部分にテーピングを施
して電子部品を連設し、プリント基板へリード線の良導
電線部分が接合される。The present invention aims to overcome the above-mentioned difficulties, and is intended to solve the above-mentioned problems in electronic components such as resistors, capacitors, and coils that are equipped with lead wires at both ends to be attached to printed circuit boards. The wire and a harder dissimilar metal wire to be cut and removed are joined in the axial direction, and a large number of electronic components are sandwiched at predetermined intervals by the hard metal wire between a band-shaped mount and a narrower band-shaped adhesive paper. The electronic parts are fixedly connected to each other by taping the hard metal wires, and the highly conductive wires of the lead wires are joined to the printed circuit board.
また、前記゛電子部品の連設体は上下の帯状紙によって
圧着保持され、電子部品は取付位置が移動することのな
いよう確実に固定される。Further, the above-mentioned continuous body of electronic components is held under pressure by the upper and lower paper strips, and the electronic components are securely fixed so that the mounting position does not move.
1施■ 実施例について図面を参照して説明する。1 serving■ Examples will be described with reference to the drawings.
1は電子部品の1実施例である抵抗で、抵抗本体2とそ
の両端に付設されたリード線3とからなり、リード1I
IA3は抵抗本体2に固着されて電気的に接続された導
電性の良い軟鋼線4とその先端に溶接、接着等で接合さ
れ軸線方向に延びる硬い鉄線5とからなっている。6は
上記接合部である。Reference numeral 1 denotes a resistor which is an example of an electronic component, and consists of a resistor body 2 and lead wires 3 attached to both ends of the resistor body 2.
The IA 3 is made up of a highly conductive mild steel wire 4 that is fixed and electrically connected to the resistor main body 2, and a hard iron wire 5 that is joined to the tip of the wire by welding, adhesive, etc. and extends in the axial direction. 6 is the above-mentioned joint portion.
そして、上記構成の抵抗1は1個ずつ定間隔で順次送ら
れ、定速度で下方から移送されてくる所定幅の帯状台紙
7とその略半幅の上方からの帯状粘着紙8間に両端の鉄
線5が挟入され押圧接着される。この両帯状祇7.8間
に挟入圧着される抵抗工のリード線3両端の上記テーピ
ングは従来公知のテーピング装置によって行われる。こ
のようにして第1図に示すような両端がテーピングされ
定間隔に配列された多数の抵抗1の連設体が形成される
。The resistors 1 having the above configuration are sequentially sent one by one at regular intervals, and the iron wires at both ends are placed between the band-shaped mount 7 of a predetermined width, which is transferred from below at a constant speed, and the band-shaped adhesive paper 8, which extends from above approximately half of the width. 5 is inserted and pressure bonded. The above-mentioned taping of both ends of the resistor lead wire 3, which is inserted and crimped between the two belt-like bands 7 and 8, is performed by a conventionally known taping device. In this way, a series of a large number of resistors 1 with both ends taped and arranged at regular intervals as shown in FIG. 1 is formed.
次に、この連設体は切断機に搬送され、銅線4と鉄線5
の接合部6の内側でリード線3が切断されて連設体から
個々の抵抗1が順次切離され、テーピング部分を含めて
鉄線5部分は除去される。Next, this continuous body is conveyed to a cutting machine, and the copper wire 4 and the iron wire 5 are cut.
The lead wire 3 is cut inside the joint 6, and the individual resistors 1 are sequentially separated from the connected body, and the portion of the iron wire 5 including the taped portion is removed.
このようにして切離された抵抗1は公知の挿入機により
プリント基板9の所定の孔10にリード線3(銅線4)
が挿通され、端部が折曲げられてプリント基板9上の印
刷配線11に半田12によって接合される(第3図参照
)。The resistor 1 separated in this way is inserted into a predetermined hole 10 of the printed circuit board 9 by a lead wire 3 (copper wire 4) using a known insertion machine.
is inserted, the end portion is bent and joined to the printed wiring 11 on the printed circuit board 9 with solder 12 (see FIG. 3).
光匪互殖果
本発明は以上説明したように構成されているので、以下
に記載されるような効果を奏する。Since the present invention is constructed as described above, it produces the effects described below.
リード線を良導電性の金属線と切断除去されるこれより
硬い異種金属線とを接合した複合線としたので、硬い金
属線によってリード線ひいては電子部品の前記連設体の
強度が補強され、従来のリード線のように小さな外力で
も折れ曲がるようなことはない。したがって、部品の位
置が移動して搬送中部品が接触するようなこともない。Since the lead wire is a composite wire made by joining a highly conductive metal wire and a harder dissimilar metal wire that is cut and removed, the strength of the lead wire and thus the connected body of the electronic component is reinforced by the hard metal wire. Unlike conventional lead wires, it does not bend even under small external forces. Therefore, there is no possibility that the parts may come into contact with each other during transportation due to movement of the parts.
また、このような硬い金属を用いたことにより大きな押
圧力を与えることができ、強制的にリード線を整列する
ことが可能でテーピング時部品間の間隔、帯状紙の幅な
どで精度の高い加工処理を行うことができ、またリード
線に大きな押圧力を与えることができるので、上下の帯
状紙を従来のものに比べ幅挟としても確実に保持するこ
とができ、さらに前記請求項(2)のように粘着紙を台
紙よりも小幅にしても、リード線を確実に挟持固定する
ことができるので、帯状粘着紙の使用量が少なくてすみ
、コストダウンを図ることができる。In addition, by using such a hard metal, it is possible to apply a large pressing force, making it possible to forcibly align the lead wires, allowing for highly precise processing such as the spacing between parts during taping, the width of the paper strip, etc. Since it is possible to carry out processing and apply a large pressing force to the lead wire, the upper and lower paper strips can be held more reliably even when the width is between the paper strips compared to conventional paper strips. Even if the width of the adhesive paper is made smaller than the mount, the lead wire can be securely clamped and fixed, so the amount of adhesive paper strip used can be reduced, and costs can be reduced.
そして、リード線の切断除去される部分である上記硬い
金属線には良導電金属線に比べ著しく安価な材料を使用
できるので、この点からも生産費の大幅なコストダウン
を図ることができる。Further, since the hard metal wire, which is the portion of the lead wire that is cut and removed, can be made of a material that is significantly cheaper than the highly conductive metal wire, it is possible to significantly reduce production costs from this point of view as well.
第1図は本発明に係る電子部品を帯状紙を介して連設し
一部断面で示した平面図、第2図は第1図の■−■線断
面図、第3図は電子部品をプリント基板に装着した正面
図である。
1・・・抵抗、2・・・抵抗本体、3・・・リード線、
4・・・軟銅線、5・・・鉄線、6・・・接合部、7・
・・帯状台紙、8・・・帯状粘着紙、9・・・プリント
基板、10・・・孔、11・・・印刷配線、12・・・
半田Fig. 1 is a partially cross-sectional plan view of electronic components according to the present invention arranged one after another via a strip of paper, Fig. 2 is a sectional view taken along the line ■-■ of Fig. 1, and Fig. 3 shows the electronic components. It is a front view mounted on a printed circuit board. 1...Resistor, 2...Resistor body, 3...Lead wire,
4...Annealed copper wire, 5...Iron wire, 6...Joint part, 7.
... Band-shaped mount, 8... Band-shaped adhesive paper, 9... Printed circuit board, 10... Hole, 11... Printed wiring, 12...
solder
Claims (2)
に設けられ、プリント基板に装着するリード線において
、該リード線が良導電性金属線と切断除去されるこれよ
り硬い異種金属線とを軸線方向に接合した構成であるこ
とを特徴とする電子部品のリード線(1) In a lead wire that is installed at both ends of an electronic component such as a resistor, capacitor, or coil and is attached to a printed circuit board, the axis of the lead wire connects a highly conductive metal wire and a harder dissimilar metal wire to be cut and removed. A lead wire for an electronic component characterized by having a configuration in which it is joined in a direction.
これより小幅の帯状粘着紙とによって所定間隔で挟持固
定したことを特徴とする請求項(1)記載のリード線を
具備する電子部品の連設体。(2) An electronic device having lead wires according to claim (1), wherein both ends of the lead wires of a large number of electronic components are clamped and fixed at predetermined intervals between a strip-shaped mount and a strip-shaped adhesive paper having a narrower width. A series of parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1071275A JPH02249201A (en) | 1989-03-23 | 1989-03-23 | Leads of electronic component, and linkage of the components with leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1071275A JPH02249201A (en) | 1989-03-23 | 1989-03-23 | Leads of electronic component, and linkage of the components with leads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02249201A true JPH02249201A (en) | 1990-10-05 |
Family
ID=13456000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1071275A Pending JPH02249201A (en) | 1989-03-23 | 1989-03-23 | Leads of electronic component, and linkage of the components with leads |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02249201A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8096463B2 (en) * | 2004-12-29 | 2012-01-17 | Mosaid Technologies Incorporated | Wiring method and device |
-
1989
- 1989-03-23 JP JP1071275A patent/JPH02249201A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8096463B2 (en) * | 2004-12-29 | 2012-01-17 | Mosaid Technologies Incorporated | Wiring method and device |
| US20120118938A1 (en) * | 2004-12-29 | 2012-05-17 | Mosaid Technologies Incorporated | Wiring method and device |
| US8439251B2 (en) * | 2004-12-29 | 2013-05-14 | Google Inc. | Wiring method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4836435A (en) | Component self alignment | |
| US8479390B2 (en) | Method for producing connector | |
| US5291179A (en) | Printed circuit board | |
| EP0025244B2 (en) | A method of making electrical connectors | |
| US4433892A (en) | Terminal strip with auxiliary support | |
| EP0806063B1 (en) | Array of leads assembled with electric components and corresponding method of assembling | |
| WO1999002022A1 (en) | Printed circuit board with a leaded component and method of securing the component | |
| US5406458A (en) | Printed circuit board having tapered contact pads for surface mounted electrical components | |
| JPH0151064B2 (en) | ||
| JPH02249201A (en) | Leads of electronic component, and linkage of the components with leads | |
| JPS6159707A (en) | Coil part | |
| US6005465A (en) | Coil assembly and method for contacting the coil on a support body | |
| US4562514A (en) | Polarized electronic component and its manufacturing process | |
| JP2002368453A (en) | Printed circuit board assembly, isolation insulator thereof, and method of determining existence of many isolation insulators thereof | |
| EP0198697A2 (en) | Improvements in or relating to an adaptor for a printed circuit board connector | |
| EP0158230B1 (en) | Piezoelectric-acoustic transducer for electroacoustic units with constructional features for assembling | |
| US5141450A (en) | Tape carrier type electrical connector | |
| JPH0897090A (en) | Electrolytic capacitor | |
| JP3445696B2 (en) | Electronic components | |
| JP3348596B2 (en) | Manufacturing method of integrated circuit device | |
| JPH0760924B2 (en) | Arrangement method of electronic parts | |
| JPH0831686B2 (en) | How to attach electronic components to the printed circuit board | |
| JPH0621600A (en) | Fixing device for electronic component of printed board | |
| JPS6311698Y2 (en) | ||
| JPH02126695A (en) | How to connect electronic components to printed wiring boards |