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JPH02201880A - Circuit device - Google Patents

Circuit device

Info

Publication number
JPH02201880A
JPH02201880A JP1019464A JP1946489A JPH02201880A JP H02201880 A JPH02201880 A JP H02201880A JP 1019464 A JP1019464 A JP 1019464A JP 1946489 A JP1946489 A JP 1946489A JP H02201880 A JPH02201880 A JP H02201880A
Authority
JP
Japan
Prior art keywords
conductor
base body
circuit element
circuit
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1019464A
Other languages
Japanese (ja)
Inventor
Chiharu Harayama
原山 千春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Junkosha Co Ltd
Original Assignee
Junkosha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Junkosha Co Ltd filed Critical Junkosha Co Ltd
Priority to JP1019464A priority Critical patent/JPH02201880A/en
Publication of JPH02201880A publication Critical patent/JPH02201880A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To facilitate the connecting operation and save the labor by inserting press-type contact pieces of each circuit element into a connecting base body for contact with a conductor of the connecting base body so as to connect circuit elements to each other. CONSTITUTION:To interconnect elements 3A-3D via a connecting base body 2, each press-type contact piece 31 is inserted into the connecting base body 2 through a covering 22. The base body 2 and a circuit element 3 are aligned with each other so that a conductor 21 fits into a groove 32 in the contact piece 31. In a particular example given here, the distance between the lower edges of inserting portions 33 is equal to the width of a protrusion 23, and thus the lower edges of the inserting portions 33 can be aligned with the side edges of the protrusion 23 to achieve proper positioning. After alignment has been made, the contact piece 31 is inserted into the base body 2 to fit the conductor 21 into the groove 32, allowing the conductor 21 to be in contact with both sides of the groove 32. As a result, the circuit element is connected to the conductor 21. The other circuit elements 36 are also connected to the conductor 21 in the same way. This results in the elements 3 being interconnected via the conductor 21 of the base body 2.

Description

【発明の詳細な説明】 [産業上の利用分野1 この発明は、複数の回路素子を互いに接続してなる回路
装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a circuit device formed by connecting a plurality of circuit elements to each other.

[従来の技術1 従来のこの種の回路装置においては、複数の回路素子の
それぞれに接続ケーブルの一端部を接続するとともに、
各ケーブルの他端部にコネクタをそれぞれ接続する。そ
して、各コネクタどうしを接続することにより、回路素
子どうしを接続していた。
[Prior art 1] In a conventional circuit device of this type, one end of a connection cable is connected to each of a plurality of circuit elements, and
Connect the connector to the other end of each cable. By connecting the respective connectors, the circuit elements are connected to each other.

[発明が解決しようとする課題1 しかしながら、上記のようにして複数の回路素子を接続
するようにした回路装置においては、回路素子どうしを
コネクタを介して接続しているため、多数のコネクタを
必要とし、製造費が嵩むとともに、コネクタをケーブル
に接続するのに手間がかかるという問題があった。
[Problem to be Solved by the Invention 1] However, in a circuit device in which a plurality of circuit elements are connected as described above, a large number of connectors are required because the circuit elements are connected to each other via connectors. However, there were problems in that manufacturing costs increased and it took time and effort to connect the connector to the cable.

この発明は、上記問題を解決するためになされたもので
、コネクタを用いることなく回路素子どうしを接続する
ことができ、したがって製造費を低減することができる
とともに、省力化をなし得る回路装置を提供することを
目的とする。
This invention was made to solve the above problem, and provides a circuit device that can connect circuit elements without using connectors, thereby reducing manufacturing costs and saving labor. The purpose is to provide.

[課題を解決するための手段1 この発明は、上記の目的を達成するために、平行に配設
された複数の導線を絶縁性を有する樹脂によって被覆し
てなる配線基体と、この配線基体の導線を介して電気的
に接続される複数の回路素子とを備え、前記複数の回路
素子どうしを電気的に接続するために、前記回路素子に
前記配線基体に突き刺されてそれぞれ異なる導線に接触
する複数の圧接接触子を設けたものである。
[Means for Solving the Problems 1] In order to achieve the above object, the present invention provides a wiring base formed by covering a plurality of conductive wires arranged in parallel with an insulating resin, and a wiring base of this wiring base. A plurality of circuit elements are electrically connected via conductive wires, and in order to electrically connect the plurality of circuit elements, the circuit elements are pierced through the wiring base and come into contact with different conductive wires respectively. It is equipped with a plurality of pressure contacts.

[作用1 回路素子の圧接接触子を配線基体に突き刺し、回路素子
の圧接接触子と配線基体の導線とを接触させる。他の回
路素子についても同様に圧接接触子を配線基体の導線に
接触させる。この結果、回路素子どうしが配線基体の導
線を介して接続される。
[Action 1] The pressure contact of the circuit element is pierced into the wiring base, and the pressure contact of the circuit element and the conducting wire of the wiring base are brought into contact. Similarly, for other circuit elements, press contactors are brought into contact with the conductive wires of the wiring base. As a result, the circuit elements are connected to each other via the conductive wires of the wiring base.

[実施例1 以下、この発明の一実施例について添付の第1図ないし
第4図を参照して説明する。
[Embodiment 1] Hereinafter, an embodiment of the present invention will be described with reference to the attached FIGS. 1 to 4.

第3図および第4図に示すように、この回路装置1は、
接続基体2と複数の回路素子3(3A〜3D)とから構
成されている。
As shown in FIGS. 3 and 4, this circuit device 1 includes:
It is composed of a connection base 2 and a plurality of circuit elements 3 (3A to 3D).

接続基体2は、平板状をなすもので、複数の導線21を
有している。各導線21は、第1図お上び第2図に示す
ように、同一平面上に配置され、互いに平行に、かつ一
定間隔をもって並べられている。そのように並べられた
状態で、各導線21は、被覆部22によって被覆されて
いる。この被覆部22は、P、T F E (ポリテト
ラ70ロエチレン)、ポリ塩化ビニル、ポリイミド等の
絶縁性を有する樹脂からなるものであり、その上下面の
各導線21に対応する箇所には、導線21に沿って延び
る断面円弧状の突条23が形成されている。
The connection base 2 has a flat plate shape and has a plurality of conductive wires 21. As shown in FIGS. 1 and 2, the conductive wires 21 are arranged on the same plane, parallel to each other, and arranged at regular intervals. In such a state, each conducting wire 21 is covered with a covering portion 22. This covering portion 22 is made of an insulating resin such as P, T F E (polytetra 70 roethylene), polyvinyl chloride, polyimide, etc., and there are conductive wires at locations corresponding to the respective conductive wires 21 on the upper and lower surfaces thereof. A protrusion 23 having an arcuate cross section and extending along the line 21 is formed.

また、被覆部22の下面には、保護層24が貼り付けら
れている。この保護層24は、被覆部22の下面から突
出した圧接接触子31(後述する)の先端部を保護する
と同時に、その先端部間の短絡を防止するためのもので
あり、スポンジ等の絶縁性とクツシコン性とを有する部
材が用いられている。
Further, a protective layer 24 is attached to the lower surface of the covering portion 22 . This protective layer 24 protects the tip of the pressure contact 31 (described later) protruding from the lower surface of the covering portion 22, and at the same time prevents a short circuit between the tips. A member is used that has the following properties:

上記、回路素子3としては、多層プリント配線基板、L
SIその他各種の回路素子が用いられており、ここでは
内部回路が互いに異なる4個の回路素子3A〜3Dが取
り付けられている。各回路素子3の下面には、下方へ向
かって延びる複数の圧接接触子31が設けられている。
The above circuit element 3 is a multilayer printed wiring board, L
SI and other various circuit elements are used, and here four circuit elements 3A to 3D with different internal circuits are attached. A plurality of pressure contacts 31 extending downward are provided on the lower surface of each circuit element 3.

各圧接接触子31の幅方向の中央部には、下端面から上
方へ向かって延びる溝32が形成されている。この溝3
2は、その内部に導線21が嵌まり込むことによって導
線21と圧接接触子31とを接触させるためのものであ
り、その幅は導線21の直径とほぼ同じ大きさになされ
ている。しかも、各圧接接触子31を予め定められた導
線21と接続し得るよう、−の圧接接触子31の溝32
と池の圧接接触子21の溝32との中心間距離は、それ
ら2つの圧接接触子21にそれぞれ接続される2つの導
線21の中心間距離と等しくなされている。また、圧接
接触子31の下端部で溝32の両側に位置する部分には
、下方に向かうにしたがって漸次幅狭になり、下端が尖
鋭になされた刺し込み部33.33が形成されている。
A groove 32 extending upward from the lower end surface is formed in the widthwise center of each pressure contact 31 . This groove 3
Reference numeral 2 is used to bring the conducting wire 21 into contact with the pressure contact 31 by fitting the conducting wire 21 therein, and its width is made to be approximately the same size as the diameter of the conducting wire 21. Moreover, in order to connect each pressure contact 31 to a predetermined conductor 21, the groove 32 of the negative pressure contact 31 is
The center-to-center distance between the groove 32 and the pressure contact 21 is equal to the center-to-center distance between the two conducting wires 21 connected to the two pressure contact 21, respectively. In addition, at the lower end of the pressure contact 31, located on both sides of the groove 32, stab parts 33, 33 are formed, which gradually become narrower toward the bottom and have sharp lower ends.

刺し込み部33.33の各下端間の距離W1は、突条2
3の幅W2と等しくなされている。
The distance W1 between the lower ends of the piercing portions 33 and 33 is
It is made equal to the width W2 of 3.

上記回路素子3A〜3Dを接続基体2を介して接続する
場合には、各圧接接触子31を接続基体2に被覆部22
側から刺し込む。この場合、各圧接接触子31の溝32
に導線21が嵌まり込むよう、接続基体2と回路素子3
との位置合わせを行う必要がある。、この実施例の場合
には、刺し込み部33.33の下端縁の幅が突条23の
幅と同一になっているので、刺し込み部33の各下端縁
を突条の両側縁に位置させることによって位置合わせを
行うことができる。勿論、接続基体2および回路素子3
の各−側面を基準面とし、その基準面を基準として接続
基体2および回路素子3を位置決めし、これによって両
者を位置合わしてもよい。
When the circuit elements 3A to 3D are connected via the connection base 2, each pressure contact 31 is connected to the connection base 2 by the covering portion 22.
Insert from the side. In this case, the groove 32 of each pressure contact 31
Connect the connection base 2 and the circuit element 3 so that the conductor 21 fits into the
It is necessary to perform alignment with the In the case of this embodiment, since the width of the lower edge of the piercing portions 33 and 33 is the same as the width of the protrusion 23, the lower edges of the piercing portions 33 are positioned on both side edges of the protrusion. Positioning can be performed by doing this. Of course, the connection base 2 and the circuit element 3
The connection base 2 and the circuit element 3 may be positioned using each side surface as a reference plane, and the connection base 2 and the circuit element 3 may be aligned thereby.

いずれにしても、位置合わせした状態で圧接接触子31
を接続基体2に刺し込むと、導線211溝32に嵌まり
込み、溝32の両側面と接触する。
In any case, in the aligned state, press contact 31
When inserted into the connection base 2, the conductive wire 211 fits into the groove 32 and comes into contact with both side surfaces of the groove 32.

これによって、回路素子3が導線21に接続される。同
様にして、池の回路素子3も導線21に接続される。そ
して、回路素子3どうじが接続基体2の導線21を介し
て接続される。
This connects the circuit element 3 to the conducting wire 21. Similarly, the circuit element 3 of the pond is also connected to the conducting wire 21. Then, the circuit elements 3 are connected via the conductive wires 21 of the connection base 2.

なお、回路素子3Aの上面には、上記と同様の圧接接触
子34が設けられており、圧接接触子34には池の接続
基体2Aが接続されている。そして、接続基体2Aを介
して回路装置1が他の回路゛装置等に接続されている。
In addition, the pressure contact 34 similar to the above is provided on the upper surface of the circuit element 3A, and the connection base 2A of the pond is connected to the pressure contact 34. The circuit device 1 is connected to other circuits, devices, etc. via the connection base 2A.

上記の回路装置1においては、各回路素子3の圧接接触
子31を接続基体2に刺し込むことによって回路素子3
どうじを接続しており、接続フネクタが用いられていな
い。したがって、その分だけ製造費を低減することがで
きる。また、接続コネクタを接続する手間を省くことが
できる。しかも、回路素子3と接続基体2とを接続する
には、圧接接触子31を接続基体2に単に刺し込むだけ
でよく、それらの接続を極めて容易に行うことができる
。したがって、回路素子3どうじの接続の手間をより一
層軽減することがでとる。
In the circuit device 1 described above, the pressure contact 31 of each circuit element 3 is inserted into the connection base 2 so that the circuit element 3
The joints are connected, and no connecting connectors are used. Therefore, manufacturing costs can be reduced accordingly. Further, it is possible to save time and effort in connecting the connectors. Furthermore, in order to connect the circuit element 3 and the connection base 2, it is sufficient to simply insert the pressure contact 31 into the connection base 2, making the connection extremely easy. Therefore, the effort required to connect the circuit elements 3 to each other can be further reduced.

なお、上記の実施例においては、接続基体2を平板状に
形成しているが、これに限定されるものではない。例え
ば、接続基体を断面矩形の直方体状に形成してもよく、
そのようにすれば4つの側面に沿って導線を配設するこ
とにより、各側面に回路素子を取り付けることができる
In addition, in the above embodiment, the connection base 2 is formed into a flat plate shape, but it is not limited to this. For example, the connection base may be formed into a rectangular parallelepiped shape with a rectangular cross section,
In this way, circuit elements can be attached to each side by arranging conductive wires along the four sides.

また、複数の導線21を同一間隔をもって配設している
が、間隔を一定にする必要はない。要は、導線の間隔と
それら各導線に接触する圧接接触子との間隔を同一−に
すればよい。
Further, although the plurality of conducting wires 21 are arranged at the same intervals, the intervals do not need to be constant. The point is that the distance between the conducting wires and the distance between the pressure contacts that contact each of the conducting wires may be made the same.

さらに、各導線21の真上に位置する被覆部22に互い
に異なる符号もしくは色を付すとともに、圧接接触子3
1にそれが接続される導線21と同一の符号もしくは色
を付すようにすれば、回路素子3を接続基体2に取り付
ける際に、圧接接触子31を接続すべき導線21と異な
る導線21に接続するという事故を未然に防止すること
ができる。
Further, the sheathing portion 22 located directly above each conducting wire 21 is given a different code or color, and the insulation displacement contact 3
1 with the same code or color as the conductor 21 to which it is connected, it is possible to connect the pressure contact 31 to a conductor 21 different from the conductor 21 to which it is to be connected when attaching the circuit element 3 to the connection base 2. It is possible to prevent such accidents from occurring.

[発明の効果1 以上説明したように、この発明の回路装置によれば、回
路素子の圧接接触子を接続基体に刺し込むことによって
各回路素子の圧接接触子を接続基体の導線に接触させ、
これによって回路素子どうしを接続するようにしている
から、接続コネクタを用いる必要が全くない。したがっ
て、製造費の低減および省力化を図ることができる。し
かも、回路素子と接続基体とは、回路素子の圧接接触子
を接続基体に単に刺し込むことによって接続することが
できるから、接続作業が容易であり、したがってより一
層省力化を図ることができる等の効果が得られる。
[Effect of the Invention 1] As explained above, according to the circuit device of the present invention, the pressure contact of each circuit element is brought into contact with the conductor of the connection base by inserting the pressure contact of the circuit element into the connection base,
Since the circuit elements are thereby connected to each other, there is no need to use a connecting connector. Therefore, it is possible to reduce manufacturing costs and save labor. Moreover, since the circuit element and the connection base can be connected by simply inserting the pressure contact of the circuit element into the connection base, the connection work is easy, and therefore, further labor savings can be achieved. The effect of this can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

添付の第1図ないし第4図はこの発明の一実施例を示す
もので、第1図は要部の拡大斜視図、第2図は要部の拡
大断面図、第3図は全体を示す側面図、第4図は同平面
図である。 1・・・回路装置、2・・・接続基体、3(3A、3 
B。 3C,3D)・・・回路素子、21・・・導線、22・
・・被覆部、31・・・圧接接触子。
The attached FIGS. 1 to 4 show an embodiment of the present invention. FIG. 1 is an enlarged perspective view of the main part, FIG. 2 is an enlarged sectional view of the main part, and FIG. 3 shows the whole. The side view and FIG. 4 are the same plan views. DESCRIPTION OF SYMBOLS 1... Circuit device, 2... Connection base, 3 (3A, 3
B. 3C, 3D)...Circuit element, 21...Conducting wire, 22.
... Sheathing part, 31... Pressure contact.

Claims (1)

【特許請求の範囲】[Claims]  平行に配設された複数の導線を絶縁性を有する樹脂に
よって被覆してなる配線基体と、この配線基体の導線を
介して電気的に接続される複数の回路素子とを備え、前
記複数の回路素子どうしを電気的に接続するために、前
記回路素子に前記配線基体に突き刺されてそれぞれ異な
る導線に接触せしめられる複数の圧接接触子を設けたこ
とを特徴とする回路装置。
A wiring base formed by covering a plurality of conductive wires arranged in parallel with an insulating resin, and a plurality of circuit elements electrically connected via the conductive wires of the wiring base, the plurality of circuits comprising: 1. A circuit device characterized in that the circuit element is provided with a plurality of press-contact contacts that are inserted into the wiring base and brought into contact with different conductive wires, respectively, in order to electrically connect the elements.
JP1019464A 1989-01-31 1989-01-31 Circuit device Pending JPH02201880A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1019464A JPH02201880A (en) 1989-01-31 1989-01-31 Circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1019464A JPH02201880A (en) 1989-01-31 1989-01-31 Circuit device

Publications (1)

Publication Number Publication Date
JPH02201880A true JPH02201880A (en) 1990-08-10

Family

ID=12000046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1019464A Pending JPH02201880A (en) 1989-01-31 1989-01-31 Circuit device

Country Status (1)

Country Link
JP (1) JPH02201880A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162138A (en) * 1993-12-03 1995-06-23 Nec Corp Integrated circuit mounting method
US7598684B2 (en) 2001-05-30 2009-10-06 Philips Solid-State Lighting Solutions, Inc. Methods and apparatus for controlling devices in a networked lighting system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162138A (en) * 1993-12-03 1995-06-23 Nec Corp Integrated circuit mounting method
US7598684B2 (en) 2001-05-30 2009-10-06 Philips Solid-State Lighting Solutions, Inc. Methods and apparatus for controlling devices in a networked lighting system
US7598681B2 (en) 2001-05-30 2009-10-06 Philips Solid-State Lighting Solutions, Inc. Methods and apparatus for controlling devices in a networked lighting system

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