JPH0220844Y2 - - Google Patents

Description

[Detailed description of the invention] This invention is an IC socket in which the IC lead of the IC package is placed on the contact of the IC socket, and the contact is elastically deflected downward, and the restoring force is used to create pressure contact with the IC lead. Regarding.

Traditionally, IC packages have been used as external contacts for the IC, with conductive foil arranged in parallel on the bottom edge, or with IC leads protruding in parallel to the sides.
An IC package is known as an external contact of an IC.

An example of the contact form of the above-mentioned two IC sockets for IC packages is as shown in FIG. planted in the socket base 1 as schematically shown in the figure.
The IC contact 3 is provided with a contact piece 3a bent into a substantially horizontal U-shape, and the contact piece 3a is arranged on the upper surface side of the socket base 1.
For example, IC contacts (conductive foil) 2 of the IC package IC are mounted to support the entire IC package, and the IC package IC is attached to, for example, the socket base 1.
By applying a downward force F using an IC pressing cover or the like to press down the contact piece 3a, the contact piece 3a is elastically deflected downward, and its restoring force is used to press the IC contact 2. In the figure, reference numeral 4 denotes a printed board connection pin of the contact 3 which penetrates the board 1 and projects downward.

As mentioned above, conventional IC sockets support the entire IC package with contacts placed on the top surface of the socket base, and are designed so that contact with the IC contacts can be made with the body of the IC package floating. However, with this method, the IC package can float freely and the contact 3 can be elastically deflected, but the contact 3
In particular, since there is a tolerance in the thickness of the IC package IC, the amount of elastic deflection of the contact 3 will change due to changes in the thickness of the IC package of the same type, and the contact pressure will always be constant. In addition to the tolerance of IC package IC,
If the amount of bending deviation increases due to manufacturing errors in the holding mechanism or the contact itself, an unnecessary load will be applied to the bending fulcrum of the contact piece 3a of the contact 3, and if this is repeated, the bending fulcrum may be permanently deformed or broken. This may occur. Such a phenomenon is further promoted as the contact 3 becomes finer. Also, in order to maintain contact between IC contacts 2 and 3, it is essential to apply a downward force F to the IC package IC, but for example, if a pressing force of 100 g is required per pin to obtain a specified contact pressure. For 40 pins, a downward force of 4 kg is required, and when the force due to the increase in elastic deflection mentioned above is added to this, it places an excessive burden on the operation of the IC holding covers, causing fatigue for workers who frequently do this. It is the cause of promotion.

The present invention was devised to improve these drawbacks, and FIG. 1 and subsequent figures show examples thereof. The present invention will be explained in detail below based on the same figure.

In the figure, numeral 10 indicates a base that constitutes an IC socket. The base 10 has an IC package accommodating cavity 11 approximately in the center thereof. The IC package housing space 11 has a rectangular shape with the same shape as the outer shape of the IC package IC, and receives the package IC from the top side of the board.If the contacts of the IC package IC are conductive foil and there are no protruding leads, the IC package housing space 11 is rectangular in shape and has the same shape as the outer shape of the IC package IC. The IC package has a size that regulates the four sides of the IC and accommodates it with almost no looseness. That is, the inner wall defining the IC package accommodation space 11 has a position regulating function for the IC package, thereby preventing the IC package from being placed.
A one-to-one correspondence is established between the contact point 2 and the contact described later.

The bottom of the IC package housing space 11 is equipped with an IC.
A support wall 12 is provided. The IC support wall 12 extends from the four sides of the IC housing cavity 11 to the IC package IC as shown in the figure.
It is composed of a frame-shaped bottom plate extending parallel to the bottom surface of the frame, and a heat dissipation port 13 is formed in the center. In addition to the example shown in the drawings, the support wall 12 may be constructed of support pieces partially protruding from each corner or each side of the IC housing cavity 11.

Furthermore, the bottom surface of the socket base 10, that is, the
Contact accommodating grooves 14 are provided horizontally in parallel on the bottom surface of the base portion defining the IC accommodating cavity 11. The contact accommodating grooves 14 are arranged around the IC accommodating cavity 11 at right angles to its four sides as shown in the figure, or
Depending on the arrangement of the contacts of the package IC, they are arranged on two or three sides of the package IC, and the ends thereof are opened in the IC accommodation space 11. In the figure, 14a indicates the opening.

Furthermore, an IC contact 15 is provided in the contact receiving groove 14. The contact 15 has an implanted leg 15a erected upward, and the implanted leg 15a is forcefully inserted into a hole pre-drilled in the upper bottom wall of the contact housing groove 14 to firmly implant it. .

The contact 15 has an elastic arm 15b for contacting an IC contact, which is connected to the lower end of the implant leg 15a, and an arm 15c for connecting to a printed circuit board or the like.
The elastic arm 15b for IC contact contact is in the IC accommodation groove 1.
4 toward the IC housing cavity 11, and its free end 15d faces into the IC housing cavity 11 from the open part 14a at the end of the IC housing groove, and the free end 15d has a shape as shown in the figure. Form an upwardly curved end 15d' or form an upwardly directed protrusion, and
It is made to protrude above the IC support wall 12.

The IC supporting wall 12 has a free end portion 15 of the elastic arm.
Holes 12a that allow the protrusion of d are drilled in parallel, and the IC
At a position that supports the bottom end of the package IC, contact is made between the IC contact 2 and the contact 15 arranged at the same location.

Further, in the above, preferably the elastic arm 1
5b at a substantially right angle from the implantation leg 15a, and
It extends along the groove while being attached and supported by the upper bottom wall of IC 4, with its end facing into the IC housing cavity 11 as described above.

As a result of the above, the elastic arm 15b is connected to the implantable leg 15a.
A downward elastic deflection action is applied using the connection point as a fulcrum. If the planting position of the implantation leg 15a is set as far away from the IC storage cavity 11 as possible as shown in the figure, the length of the arm 15b will be made longer and the elastic deflection will be used as a fulcrum. This can be done more flexibly than before.

On the other hand, the printed circuit board connecting arm 15c is bent from the lower end of the implant leg 15a in the opposite direction to the elastic arm 15b, and is caused to protrude laterally from the other end of the contact receiving groove 14. This printed board connecting arm 15c may be made to protrude vertically below the board depending on the application.

In the figure, 16 indicates an elastic band hanging plate for holding the IC. The belt hanging plate 16 is bent downward at the center.
An IC holding portion 16c is formed, and has a substantially L-shaped engagement tongue piece 16a at one end and a hook piece 16b at the other end. On the other hand, the IC accommodating space 11 is diagonally crossed on the upper surface of the socket base 10 (therefore, the IC package IC
A belt-shaped groove 17 (crossing diagonally across the base) is formed, one end of the belt-shaped groove 17 is opened at the end of the base, and an engagement window 18 passing through the base is bored at the other end, and the above-mentioned strap hanging plate is formed in the engagement window 18. 16 While inserting the engaging tongue piece 16a at one end and engaging it with the window edge, the hook piece 1 at the other end is inserted.
6b is latched to the end of the base, thereby elastically pressing down the upper surface of the IC package IC existing under the IC holding part 16c on its diagonal.

That is, the obi hanging plate 16 is formed by its downward curvature.
Since it has an IC holding part 16c, first this IC holding part 16c comes into contact with the top surface of the IC package IC,
When the hook piece 16b is pushed down while resisting elasticity and hooked onto the base 10, the IC package IC will be seated on the support wall 12 by the elastic pressing action of the holding part 16c, and the IC housing cavity will be seated. 11
The contact 15 is firmly held within the contact 15, and is pressed into contact with the contact 15.

That is, when the IC package IC is fitted into the IC housing cavity 11, the IC contact 2 is first placed on the free end 15d of the elastic arm 15b that protrudes upward from the IC support wall 12, as shown in FIG. 3A. Then, by pressing the IC pressing means such as the elastic band hanging plate 16 or a known pressing cover and applying a downward force F, the elastic arm 15b is elastically biased downward as shown in FIGS. 3B and 4. elastic arm 15
The free end portion 15d of b is offset below the top surface of the IC support wall 12, and the bottom surface of the IC package IC is
The pressure contact between the elastic arm 15b of the contact 15 and the IC contact 2 is completed while the contact 15 is seated on the support wall 12.

According to the above, the elastic arm 1 of the contact 15
The amount of elastic deflection of 5b is always constant. Since the amount of elastic deflection is constant, the contact pressure between the IC contact 2 and the contact 15 is always uniform, and highly reliable contact can be obtained.
In addition, since the elastic arm 15b is not excessively deflected, no excessive load is placed on the bending fulcrum, and deformation or breakage of the arm 15b can be prevented.

In addition, since the contact pressure and deviation amount are constant, there is no need for excessive holding force, and it is possible to close the IC holding means such as the IC holding cover or the exemplified band hanging plate.
There is no burden on the locking work, and there is no increase in worker fatigue.

In addition, the elastic arm 15b is not as thick in the thickness direction as compared to the conventional contact piece shown in FIG. 6, and has the advantage of contributing to making the socket thinner and lighter. Furthermore, by arranging the contacts 14 in parallel on the back surface of the socket board 10, the design for installing the IC holding means on the top surface is facilitated, which prevents accidental short circuits or damage when mounting the printed circuit board. It also disappears. Furthermore, when the IC socket according to the present invention is mounted on a printed circuit board etc., the elastic arm 15b of the contact 14 is housed in the contact housing groove 14 on the bottom surface of the socket base 10 and is hidden between the bottom surface of the socket base 10 and the printed circuit board. It can be placed in a stable condition and can be well protected from deformation caused by external factors.

In addition, as can be understood from the comparison between the conventional example shown in FIG. 6 and the embodiment of the present invention shown in FIG. Compared to the conventional example in which the IC package IC is mounted and contact pressure is applied, in the case of the present invention, the IC package IC can be stored deeper into the area occupied by the conventional contact piece, and the height of the IC package IC can be reduced to about the height of the IC package IC. This makes it possible to reduce the height to an extent suitable for the same size as the previous model, which has the effect of promoting thinning.

This IC socket can also be used in an IC package with IC leads protruding sideways in parallel. In this case, it is preferable to provide positioning means for regulating the side surface of the body portion of the IC package in the IC housing cavity 11.

[Brief explanation of drawings]

Figure 1 is a plan view of an IC socket showing an embodiment of the present invention, Figure 2 is a back view of the IC socket, and Figure 3A is a diagram of Figure 1A.
- A cross-sectional view showing the fitted state of the IC package,
Figure B shows the same sectional view in which a downward force is applied to the fitted IC package, and Figure 4 shows the state shown in Figure 1B-
The cross-sectional view taken along the line B shows a state in which a downward force is applied to the IC package cage by the elastic band hanging plate. Figure 5A is a plan view of the elastic band hanging plate, Figure B is a side view of the same, and Figure 6 is a conventional IC.
FIG. 3 is a sectional view schematically showing the contact state of the socket. IC...IC package, 2...Same contact, 10...
...Socket base, 11...IC storage space, 12...
...IC support wall, 14...Contact accommodation groove, 14
a... Same open part, 15... IC contact contact,
15a... The implanted leg, 15b... The elastic arm for contacting the IC contact, 15c... The connecting arm for the printed circuit board, etc., 15d... The free end, 15d'... The curved end of the free end. Section 16...Elastic band hanging plate for holding IC.

Claims (1)

[Claims for Utility Model Registration] (1) A socket base having an IC accommodating cavity approximately in the center for receiving an IC package from the top side of the base, and an IC supporting the bottom of the IC package at the bottom of the IC accommodating cavity. A support wall is provided, contact housing grooves are provided in horizontal parallel on the bottom surface of the socket base, the ends of the contact housing grooves are released in the IC housing cavity, and IC contact contacts are planted on the upper bottom wall of the IC housing groove. , the contact is connected to the IC
an elastic arm extending along the accommodation groove;
The free end of the elastic arm faces the IC housing space from the open end of the IC housing groove, and the IC
It is characterized by protruding above the supporting wall.
IC socket. (2) The IC socket according to claim 1, wherein the elastic arm is attached to the upper bottom wall of the contact housing wall.