JPH02193813A - Arranging/reversing method for electronic component - Google Patents

Abstract

PURPOSE:To ensure improve efficiency by installing, side by side, a pair of rotary bodies that have a groove equal in width to electronic components on their peripheries and rotating them in opposite directions to each other so that a component is made to adhere to the groove of one rotary body through electrostatic adsorption and after being released at the contact portion between the two rotary bodies, the component is made to adhere to the other rotary body. CONSTITUTION:An electronic component 1 in a supply box 2 has its one side 1b made to adhere to a groove 12a of a first rotary body 10 through electrostatic adsorption. The component 1 is then pressed into the groove 12a by a roller 3 for arrangement. The components 1 arranged in this manner is inspected by a surface inspection device 7, and if found defective, is removed by a defective suction tube 8. If found good, the component 1 is further carried to a detaching claw 9 which detaches it from the rotary body 10. As this occurs, the component 1 is turned over by the action of the upper surface of the detaching claw 9, and thus has its opposite side 1a made to adhere to a groove 22a of a second rotary body 20, with the resulting efficient component arrangement/reversing.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a multilayer capacitor having a rectangular cross section and opposing surfaces parallel to each other in the thickness direction and the width direction. Convenient for surface inspection, etc.
Regarding the method of aligning and reversing electronic components, in detail, after arranging the electronic components with one side facing up, flip the electronic components upside down and align them with the opposite side that was previously located facing up. This paper relates to a method for aligning and reversing electronic components.

This method of aligning and reversing electronic components is generally used when inspecting the entire surface of an electronic component. This method involves taking out electronic components 1, such as multilayer capacitors, stored in a supply box 30 as shown in FIG. 3(a), and forming a large number of them on a jig 31 as shown in FIG. 3(b). The electronic components 1 are fitted into the recesses 31a and aligned, and the upper surface is inspected.Next, as shown in FIG. After stacking the formed jigs 31 upside down, the two jigs 31 are turned upside down to invert the electronic component 1, and then the upper jig 31 is removed and aligned with the lower jig 31. Inspect the surface of the opposite side of the electronic component 1 that has been
As shown in the figure, the inspected electronic components 1 are collected into a collection box 32.

In addition to the above-mentioned surface inspection, this method is also used for sorting out good and defective products, feeding products to a taping machine, and the like.

However, when using the conventional method as described above,
Inserting the product into the jig, transferring it, collecting it, etc. are all done manually, which has the disadvantage of being inefficient and requiring a long time to complete the work.

The present invention has been made to solve such problems,
Alignment and alignment of electronic components that can be automated and work efficiently
The purpose is to provide an inversion method.

According to the present invention, electronic components having a rectangular cross section and opposing surfaces parallel to each other in the thickness direction and the width direction are aligned with respect to one of the opposing surfaces in the thickness direction. In the method for aligning and reversing electronic components, the method comprises: aligning and reversing electronic components in a manner that the electronic components are rotated in opposite directions;
A first member having a circumferential surface having a width approximately the same as the width of the electronic component and exerting an electrostatic adsorption force on the electronic component. Using the second rotating body, first, the one surface side of the electronic component is fitted into the groove of the first rotating body in a state where it is electrostatically attracted and aligned, and then the first rotating body and a second rotating body, separating the electronic component from the first rotating body and guiding the separated electronic component to the circumferential surface of the second rotating body with the other surface facing; The electronic component is characterized in that the other side of the electronic component is fitted into the groove of the second rotating body in a state where it is electrostatically attracted and aligned.

According to the present invention, when one side of the electronic component is fitted into the groove of the first rotating body, the width of this groove is determined to be such that the electronic component can fit in an aligned state. , the electronic components are automatically aligned by fitting into the groove.

Then, when moving from the first rotating body to the second rotating body, the electronic component is turned upside down, and when the other side of the electronic component is fitted into the groove of the second rotating body, this groove Since the width of the groove is determined to allow the electronic components to be inserted in an aligned state, the electronic components are automatically aligned by fitting into the groove, and alignment is performed on both sides.

FIG. 1 is a front cross-sectional view showing the implementation state of the method for aligning and reversing electronic components according to the present invention. In the method of the present invention, an apparatus is used that includes a first rotary body 10 and a second rotary body 20 which are disk-shaped and rotate in opposite directions. 1st. Second
The rotating body 10.20 includes a rotating part 11.21 made of a conductive material and each having a circular cross section, and an outer frame 12.22 made of an endless dielectric material provided on the circumferential surface of the rotating part 11.21.
DC voltage is applied from the charging devices 5 and 25 at ゜21, and the outer frame 12.22 is charged, and the electronic component 1 is transferred to the rotating body 10.
．． 20 and moved in an S-shape.

Around the first rotating body 10, there is a supply box 2 storing a large number of electronic components 1 such as multilayer capacitors along the rotation direction, and a pressing means 4 for pressing the alignment rollers 3 against the outer peripheral surface of the rotating body 10. A surface inspection device 7 that optically detects surface defects such as cracks and chips, a defective product suction tube 8 that sucks up defective products determined by the surface inspection device 7 at the same time, and a wedge-shaped separation A claw 9 is provided. Note that the electronic component 1 has a width of, for example, 5Il! 11. Thickness: 311
II11, a rectangular parallelepiped with length: 10 m+s is applied.

One of the second rotating bodies 20 is provided a little apart from the first rotating body 10 with the separating claw 9 sandwiched therebetween. A surface inspection device 23 that optically detects surface defects such as cracks and chips along the surface, and a defective product suction pipe 24 that sucks up defective products determined by the surface inspection device 23 in a timely manner.
A wedge-shaped separation claw 27 is provided, and a collection box 26 is arranged below the separation claw 27.

The method of the present invention using such an apparatus will be explained below.

A DC voltage of, for example, 500 to 10,000 cm is applied to the first rotating body 10 by the charging device 5, so that the electronic components 1 stored in the supply box 2 located below the rotating body 10 are , adheres to the outer frame 12 of the charged rotating body 10 by electrostatic attraction. Note that the supply box 2 is vertically and
The height adjustment and horizontal position adjustment can be performed by the horizontal movement means, and all the electronic parts workers can be attached to the rotating body IO.

As shown in FIG. 2, the outer frame 12 of the rotating body 10 has a trapezoidal groove 12a formed over the entire outer circumference.
The width a of the inner part of the electronic component 2a is slightly wider than the width of the electronic component 1. The pressing means 4 includes a rod 4a having one end attached to the shaft of the roller 3 and the other end rotatably supported, and a spring 4b having one end attached to the center of the rod 4a and the other end fixed. The roller 3 presses the circumferential surface of the rotary body 10 at a lower part 4a pulled by a spring 4b. Therefore, the electronic component 1 attached to the circumferential surface of the rotary body 1O is pushed by the alignment roller 3 to form two parallel surfaces 1a on both sides in the thickness direction.

One surface 1a of 1b is placed outside, and the other surface lb enters into the groove 12a. Note that the length direction of the electronic component 1 is along the groove 12a. Thereby, the electronic components 1 are aligned. Note that the opening width b of the groove 12a (see Fig. 2)
is wider than the inner width a, but its dimensions are:
An inclined surface 12b extending from the outside to the innermost part of the groove 12a is set so as to allow the electronic component 1 to move smoothly.

When the electronic component 1 rotates in this state and reaches the inspection area of the surface inspection device 7, a surface inspection is performed on the outer surface 1a, and the electronic component 1 determined to be a defective product is sucked into the defective product. It is suctioned and removed through the tube 8. Note that the surface inspection device 7 simultaneously inspects three surfaces, one surface 1a and both sides.
It is convenient to have a configuration that allows inspection from any direction.

When the good electronic component 1 reaches the separating claw 9, it is separated from the rotating body 10. The upper surface of the separation claw 9 is inclined so that the separated electronic component 1 can slide down with the other surface 1b, which had been attached to the rotating body 10, facing down. Similarly to the first rotating body 10, a trapezoidal groove 22a is formed over the entire outer circumference of the outer frame 22. With the lower end of the second rotating body 20 in the groove 22a, the periphery of the rotating body 20 is reach the surface.

The second rotating body 20 is also configured in the same manner as the first rotating body 10 (see Figures 1 and 2), and the rotating part 21 includes, for example, 50 mm.
A DC voltage of 0 to 100 OOV is applied by the charging device 25, and the outer frame 22 is charged. Therefore, the electronic component 1 that has reached the outer frame 22 of the rotating body 20 has one surface 1a attached to the first rotating body 10 and the other surface 1b opposite to the charged groove 22a of the outer frame 22. It adheres to the inside of the body by electrostatic adsorption.

Therefore, by entering the groove 22a, the electronic component 1
alignment is also performed on the opposing surface side.

When the electronic component 1 rotates in this state and reaches the inspection area of the surface inspection device 23, the surface inspection is performed on the other surface 1b which is attached to the first rotating body 10 and has not been inspected. The surface inspection device 23 is configured to be able to inspect the other surface 1b and both sides, a total of three surfaces, from three directions at the same time.
．． Trapezoidal groove 12a formed in second rotating body 10.20
, 22a (see FIG. 2) is determined to be one-half or less of the thickness of the electronic component l, so that more than half of the thickness in the thickness direction is exposed from the grooves 12a, 22a. This completes the surface inspection of the entire surface of the electronic component 1.

Then, the electronic component 1 determined to be a defective product is sucked into the defective product suction pipe 24 and removed.

When the good electronic component 1 reaches the separating claw 27, it is separated from the rotating body 20. The separated electronic component 1 falls and is collected in a collection box 26 provided below the separation claw 27.

In the above embodiment, the surface inspection devices 7 and 23 are used to inspect the surface defects of electronic components, but the present invention is not limited to this. Alternatively, electrical characteristics such as capacitance characteristics may be measured.

Further, the present invention provides a first rotating body 10 or a second rotating body 2.
A counter may be provided around the second rotating body 20 to count the number of products, and a taping machine may be provided near the separating claw 25 provided around the second rotating body 20 to perform the taping. Alternatively, a bagging machine may be provided to pack the product into bags.

Further, in the embodiments described above, a disk-shaped rotating body is used, but the present invention is not limited to this, and the present invention can also be implemented with a configuration in which a belt of a belt conveyor is provided with grooves into which electronic components are inserted in an aligned state.

As described in detail above, in the case of the present invention, when one side of the electronic component is fitted into the groove of the first rotating body, the width of this groove is such that the electronic component can be inserted in an aligned state. As the dimensions are specified,
The electronic components align themselves by fitting into the groove. Then, when moving from the first rotating body to the second rotating body, the electronic component is turned upside down, and when the other side of the electronic component is fitted into the groove of the second rotating body, the width of this groove is changed. Since the dimensions are specified for the electronic components to be inserted in an aligned state, the electronic components are automatically aligned by fitting into the groove, and alignment is performed on both sides, making it possible to automate the alignment of the electronic components. In addition, surface inspection, sorting, taping, measurement of electrical characteristics of products, etc., which are performed along with alignment,
This has the effect of improving the efficiency of operations such as product quantity counters and product bagging.

[Brief explanation of the drawing]

FIG. 1 is a front cross-sectional view showing the implementation state of the present invention, FIG. 2 is a front view showing the groove shape of a rotating body used in the present invention, and FIG. 3 is a schematic diagram showing each step in a conventional method. . DESCRIPTION OF SYMBOLS 1... Electronic component, 1a... One surface, 1b... Other surface, 5... Charging device, 9... Separation claw, 10...
・First rotating body, 11... Rotating part, 12... Outer frame,
12a...Groove, 20...Second rotating body, 21...
Rotating part, 22...outer frame, 22a...groove, 25...
Charging device. Patent applicant Murata Manufacturing Co., Ltd. (a) (b) Figure (C)

Claims (1)

[Claims] (1) Electronic components having a rectangular cross section and opposing surfaces parallel to each other in the thickness direction and the width direction are aligned with one of the opposing surfaces in the thickness direction as a reference, and then inverted, In the method for aligning and reversing electronic components, the electronic components are aligned with respect to the other surface of the opposing surfaces, wherein two rotating bodies are arranged in a row so as to rotate in opposite directions, and the width of the electronic component is set on the circumferential surface. First, one of the electronic components is placed in the groove of the first rotating body using first and second rotating bodies that have approximately the same width as the electronic component and exert an electrostatic adsorption force on the electronic component. The electronic components are fitted and aligned with their surfaces electrostatically attracted, and then the electronic components are separated from the first rotating body between the first rotating body and the second rotating body and rotated for a second rotation. Guide the separated electronic component with the other side facing the circumferential surface of the body, and fit the other side of the electronic component into the groove of the second rotating body while being attracted by static electricity. A method for aligning and reversing electronic components, which is characterized by aligning electronic components.