JPH021561U - - Google Patents
Info
- Publication number
- JPH021561U JPH021561U JP8011288U JP8011288U JPH021561U JP H021561 U JPH021561 U JP H021561U JP 8011288 U JP8011288 U JP 8011288U JP 8011288 U JP8011288 U JP 8011288U JP H021561 U JPH021561 U JP H021561U
- Authority
- JP
- Japan
- Prior art keywords
- section
- reflow
- preheating section
- nozzle
- preheating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の１実施例を示すはんだリフ
ロー装置の概略垂直断面図、第２図は同水平断面
図、第３図はノズル管の部分を拡大して示す斜視
図、第４図は比較試験における温度測定点を示す
基板の概略平面図、第５図は空気噴射のある場合
の温度測定結果を示すグラフ、第６図は空気噴射
のない場合の温度測定結果を示すグラフである。
４……第１予熱部、５……第２予熱部、６……
リフロー部、７，８……ヒータ、１７……ノズル
、１８……フアンモータ。
Fig. 1 is a schematic vertical sectional view of a solder reflow apparatus showing one embodiment of this invention, Fig. 2 is a horizontal sectional view thereof, Fig. 3 is an enlarged perspective view of the nozzle pipe, and Fig. 4 is A schematic plan view of the substrate showing the temperature measurement points in the comparative test, FIG. 5 is a graph showing the temperature measurement results with air injection, and FIG. 6 is a graph showing the temperature measurement results without air injection. 4...First preheating section, 5...Second preheating section, 6...
Reflow section, 7, 8... heater, 17... nozzle, 18... fan motor.
Claims (1)
設けられた輻射型はんだリフロー装置において、 予熱部とリフロー部の所定箇所に配置されたノ
ズルと、外部から取入れた気体をノズルから予熱
部とリフロー部に噴射する手段とが設けられてい
ることを特徴とするはんだリフロー装置。[Scope of Claim for Utility Model Registration] In a radiation type soldering reflow device that is equipped with a preheating section and a reflow section, each equipped with a heater, a nozzle placed at a predetermined location in the preheating section and the reflow section, and a gas introduced from the outside are provided. A solder reflow apparatus characterized by being provided with means for injecting spray from a nozzle into a preheating section and a reflow section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8011288U JPH021561U (en) | 1988-06-16 | 1988-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8011288U JPH021561U (en) | 1988-06-16 | 1988-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021561U true JPH021561U (en) | 1990-01-08 |
Family
ID=31304955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8011288U Pending JPH021561U (en) | 1988-06-16 | 1988-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021561U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH038391A (en) * | 1989-04-20 | 1991-01-16 | Senju Metal Ind Co Ltd | Soldering of printed substrate and device therefor |
| JPH0629655A (en) * | 1992-05-20 | 1994-02-04 | Nippon Dennetsu Keiki Kk | Soldering equipment |
| JP2011528171A (en) * | 2008-07-15 | 2011-11-10 | エーエルエスアー ゲゼルシャフト ミット ベシュレンクテル ハフツング | Heat treatment equipment for processed products |
| JP2012159218A (en) * | 2011-01-31 | 2012-08-23 | Denso Corp | Brazing apparatus |
-
1988
- 1988-06-16 JP JP8011288U patent/JPH021561U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH038391A (en) * | 1989-04-20 | 1991-01-16 | Senju Metal Ind Co Ltd | Soldering of printed substrate and device therefor |
| JPH0629655A (en) * | 1992-05-20 | 1994-02-04 | Nippon Dennetsu Keiki Kk | Soldering equipment |
| JP2011528171A (en) * | 2008-07-15 | 2011-11-10 | エーエルエスアー ゲゼルシャフト ミット ベシュレンクテル ハフツング | Heat treatment equipment for processed products |
| JP2012159218A (en) * | 2011-01-31 | 2012-08-23 | Denso Corp | Brazing apparatus |
| US8418743B2 (en) | 2011-01-31 | 2013-04-16 | Denso Corporation | Brazing system |
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