JPH02146401U - - Google Patents
Info
- Publication number
- JPH02146401U JPH02146401U JP5545689U JP5545689U JPH02146401U JP H02146401 U JPH02146401 U JP H02146401U JP 5545689 U JP5545689 U JP 5545689U JP 5545689 U JP5545689 U JP 5545689U JP H02146401 U JPH02146401 U JP H02146401U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- solder plating
- lead wire
- plating layer
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Description
第１図は本考案によるポリマーＰＴＣ素子の一
実施例を示す斜視図、第２図ＡないしＤは該実施
例の製造工程を示すもので、Ａ，Ｂはそれぞれ素
子本体と電極の固着前、固着後の状態を示す側面
図、Ｃは打ち抜き後でリード線取付け前の中間製
品を示す斜視図、Ｄは電極にリード線を取付けて
いる状態を示す斜視図、第３図は従来例と本考案
による実施例の断続負荷試験における抵抗値変化
を比較して示すグラフである。
１：素子本体、２：電極、３，５：半田メツキ
層、４：リード線。
FIG. 1 is a perspective view showing an embodiment of a polymer PTC element according to the present invention, and FIGS. 2A to 2D show the manufacturing process of the embodiment. A side view showing the state after fixation, C is a perspective view showing the intermediate product after punching and before lead wire attachment, D is a perspective view showing the state where the lead wire is attached to the electrode, and Figure 3 shows the conventional example and the book. It is a graph showing a comparison of resistance value changes in an intermittent load test of an example according to the invention. 1: element body, 2: electrode, 3, 5: solder plating layer, 4: lead wire.
Claims (1)
各電極にリード線を半田付けしてなるポリマーＰ
ＴＣ素子において、電極の表面全面をあらかじめ
半田メツキ層で被覆すると共に、リード線の少な
くとも電極への固定部分を半田メツキ層で被覆し
、両半田メツキ層を溶融させてリード線を電極に
固定したことを特徴とするポリマーＰＴＣ素子。 Electrodes made of metal foil are fixed to both sides of the element body,
Polymer P made by soldering lead wires to each electrode
In the TC element, the entire surface of the electrode was coated in advance with a solder plating layer, at least the part of the lead wire fixed to the electrode was covered with a solder plating layer, and both solder plating layers were melted to fix the lead wire to the electrode. A polymer PTC element characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5545689U JPH02146401U (en) | 1989-05-15 | 1989-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5545689U JPH02146401U (en) | 1989-05-15 | 1989-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146401U true JPH02146401U (en) | 1990-12-12 |
Family
ID=31578423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5545689U Pending JPH02146401U (en) | 1989-05-15 | 1989-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146401U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011135092A (en) * | 2002-09-06 | 2011-07-07 | Tyco Electronics Raychem Kk | Method for manufacturing connection structure between ptc element and metal lead element, and ptc element for use in the same |
-
1989
- 1989-05-15 JP JP5545689U patent/JPH02146401U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011135092A (en) * | 2002-09-06 | 2011-07-07 | Tyco Electronics Raychem Kk | Method for manufacturing connection structure between ptc element and metal lead element, and ptc element for use in the same |