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JPH02129905A - Capacitor - Google Patents

Capacitor

Info

Publication number
JPH02129905A
JPH02129905A JP28306788A JP28306788A JPH02129905A JP H02129905 A JPH02129905 A JP H02129905A JP 28306788 A JP28306788 A JP 28306788A JP 28306788 A JP28306788 A JP 28306788A JP H02129905 A JPH02129905 A JP H02129905A
Authority
JP
Japan
Prior art keywords
film
temperature
degree
peak temperature
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28306788A
Other languages
Japanese (ja)
Other versions
JPH0642441B2 (en
Inventor
Megumi Tanaka
恵 田中
Yoshinori Kotani
小谷 義則
Kenichi Kawakami
河上 憲市
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP28306788A priority Critical patent/JPH0642441B2/en
Publication of JPH02129905A publication Critical patent/JPH02129905A/en
Publication of JPH0642441B2 publication Critical patent/JPH0642441B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE:To realize good deposition processability and high breakdown voltage by using as a dielectric a biaxial oriented polypropylene film having a specified isotactic degree, crystal size, peak temperature of fusion, peak temperature of crystallization of component extracted using n-heptane, and degree of face orientation. CONSTITUTION:As for a dielectric is used a biaxial oriented polypropylene film of which an isotactic degree is at least 98.0%, a crystal size at most 13.5nm, a peak temperature of fusion at least 165 deg.C, a peak temperature of crystallization of component extracted using n-heptane of 135 deg.C, 85 deg.C or above, and a degree of face orientation 12.0X10<-3> or above. A breakdown voltage is thereby improved resulting in reduction of deposition processing loss.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、誘電体として二軸延伸ポリプロピレンフィ
ルムを用いたコンデンサーに関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a capacitor using a biaxially oriented polypropylene film as a dielectric.

(従来の技術) 誘電体層にポリプロピレンフィルムを用いたコンデンサ
ーは、誘電正接が小さく絶縁耐力等の電気特性に優れて
いることから常用されている。
(Prior Art) Capacitors using a polypropylene film as a dielectric layer are commonly used because of their small dielectric loss tangent and excellent electrical properties such as dielectric strength.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、かかる従来のポリプロピレンフィルムは
蒸着加工時に熱を受ける為、厚みの薄いポリプロピレン
フィルムは加工時の皺が混入しやすく加工ロスが多い。
However, since such conventional polypropylene films are subjected to heat during vapor deposition processing, thin polypropylene films are susceptible to wrinkles during processing, resulting in a large amount of processing loss.

又必ずしも高絶縁性でなくポリプロピレン固有の優れた
電気特性を十分享受するものではなかった。例えば特公
昭62−14564号公報の様にアイソタクチックペン
タッド分率が高く、沸@n−ヘプタンでの含有物が小さ
いものがあるが、絶縁耐圧は必ずしも満足するものでは
ない。特開昭61−110906号公報は結晶性の高い
フィルムであるが蒸着加工性を満足するものではなく、
絶縁耐圧においても必ずしも十分ではない。
Moreover, it does not necessarily have high insulation properties and does not fully enjoy the excellent electrical properties unique to polypropylene. For example, there are materials such as those disclosed in Japanese Patent Publication No. 14564/1983, which have a high isotactic pentad fraction and a small content in boiling@n-heptane, but the dielectric strength voltage is not necessarily satisfactory. Although JP-A-61-110906 is a film with high crystallinity, it does not satisfy vapor deposition processability.
The dielectric strength is also not necessarily sufficient.

本発明は、かかる課題に鑑みて、蒸着加工性に優れ、破
壊電圧が高く、寿命の優れたコンデンサーを提供せんと
するものである。
In view of these problems, the present invention aims to provide a capacitor with excellent vapor deposition processability, high breakdown voltage, and long life.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、誘電体の少なくとも一面に金属蒸着層を備え
たコンデンサーにおいて、誘電体として、アイソタクチ
ック度98.0%以上、結晶サイズが13.5nm以下
、融解ピーク温度が165℃以上、135℃のn−ヘプ
タンで抽出した成分の結晶化ピーク温度が85℃以上、
面配向度12゜0X10’以上の二軸延伸ポリプロピレ
ンフィルムを用いたことを特徴とする。
The present invention provides a capacitor having a metal vapor deposited layer on at least one surface of the dielectric, in which the dielectric has an isotactic degree of 98.0% or more, a crystal size of 13.5 nm or less, a melting peak temperature of 165° C. or more, and 135 The crystallization peak temperature of the component extracted with n-heptane at °C is 85 °C or higher,
It is characterized by using a biaxially stretched polypropylene film with a degree of plane orientation of 12°0 x 10' or more.

本発明において、アイソタクチック度(以下r1.IJ
と略記する)とは135℃のn−ヘプタン12時間抽出
後の残漬の重量百分率をいい、本発明に使用するポリプ
ロピレンフィルムの■。
In the present invention, isotactic degree (r1.IJ
) refers to the weight percentage of the residue after extraction with n-heptane at 135°C for 12 hours, and is the weight percentage of the polypropylene film used in the present invention.

■は98%以上であり、好ましくは98.5%以上であ
る。
(2) is 98% or more, preferably 98.5% or more.

通常のモンテ系触媒であれば、重合温度を低くすること
が立体規則性を高く保つ方法であり、また活性度の高い
触媒系を用いると、立体規則性の高いポリプロピレンを
容易に作ることができる。
With regular Monte catalysts, lowering the polymerization temperature is the way to maintain high stereoregularity, and using a catalyst system with high activity makes it easy to produce polypropylene with high stereoregularity. .

−例をあげると、特公昭43−21741号公報に記載
されている三塩化チタン、ビスジエチルアルミニウム硫
酸および三塩化リンを、モル比で2:1:0.1の割合
で用いて常法によって重合したポリプロピレンは、極め
て高い立体規則性を示す。
- For example, using titanium trichloride, bisdiethylaluminum sulfate and phosphorus trichloride described in Japanese Patent Publication No. 43-21741 in a molar ratio of 2:1:0.1, Polymerized polypropylene exhibits extremely high stereoregularity.

この様にして、融解ピーク温度が165℃以上で、1.
Iが98%以上、好ましくは98.5%以上の結晶性の
高いポリプロピレンは重合温度や触媒の選択によって作
ることができる。
In this way, when the melting peak temperature is 165°C or higher, 1.
Highly crystalline polypropylene with I of 98% or more, preferably 98.5% or more can be produced by selecting the polymerization temperature and catalyst.

1、Iが98.0%未満でおれば、フィルム内の非晶部
の割合が高くなり、絶縁耐力の低下ばかりでなく、結晶
性を低下せしめ、蒸着加工時の熱変形により皺の混入に
よる加工ロスが増える傾向にある。なお、1.Iの上限
は特に限定するものではないが、通常99.6%程度で
ある。
1. If I is less than 98.0%, the proportion of amorphous parts in the film will be high, which will not only reduce the dielectric strength but also reduce the crystallinity and cause wrinkles to be introduced due to thermal deformation during vapor deposition. Processing losses tend to increase. In addition, 1. The upper limit of I is not particularly limited, but is usually about 99.6%.

本発明に使用するポリプロピレンフィルムのX線広角散
乱での結晶サイズは13.5nm以下でおり、好ましく
は13.0nm以下である。13゜5nmを越えると、
フィルム内の非晶部のセグメント密度の低下や分子鎖長
ざが短くなり、ライフ寿命、すなわち一定課電電圧にお
ける絶縁耐圧の低下につながり寿命が短くなる。結晶サ
イズの下限は特に限定されないが、通常、11.0nm
程度である。
The crystal size of the polypropylene film used in the present invention as determined by wide-angle X-ray scattering is 13.5 nm or less, preferably 13.0 nm or less. If it exceeds 13°5nm,
The segment density of the amorphous portion in the film decreases and the length of the molecular chains decreases, leading to a decrease in life span, that is, a decrease in dielectric strength voltage at a constant applied voltage, resulting in a shortened life span. The lower limit of the crystal size is not particularly limited, but is usually 11.0 nm.
That's about it.

本発明において、融解ピーク温度(以下rTmJと略記
する)とは、示差走査熱量計(DSC)における融解の
温度をいい、本発明に使用するポリプロピレンフィルム
のTmは165℃以上であり、好ましくは167℃以上
でおる。165℃未満であれば結晶性の低下により熱変
形による皺の発生や金属表面の欠点発生につながる。T
mの上限は特に限定されないが、通常、172℃程度で
ある。
In the present invention, the melting peak temperature (hereinafter abbreviated as rTmJ) refers to the temperature of melting in a differential scanning calorimeter (DSC), and the Tm of the polypropylene film used in the present invention is 165°C or higher, preferably 167°C. Stay above ℃. If the temperature is less than 165° C., the crystallinity decreases, leading to the generation of wrinkles and defects on the metal surface due to thermal deformation. T
The upper limit of m is not particularly limited, but is usually about 172°C.

本発明に使用するポリプロピレンフィルムの135℃の
n−ヘプタン抽出成分の結晶化ピーク温度(以下「Tm
cJと略記する)は、85℃以上であり、好ましくは8
89℃以上である。TmCの上限は特に限定されないが
、通常、95℃である。
The crystallization peak temperature (hereinafter referred to as "Tm
(abbreviated as cJ) is 85°C or higher, preferably 85°C or higher.
The temperature is 89°C or higher. The upper limit of TmC is not particularly limited, but is usually 95°C.

該フィルムを構成するポリプロピレンは、必ずしもポリ
プロピレンホモポリマーからなる必要はなく、本発明の
目的、効果を損なわない範囲で、少量、好ましくは5重
量%以下のポリエチレンやポリ4メチルペンテン1など
の他種ポリオレフィンが混合されてもよい。TmCが低
くなると絶縁耐力の低下が著しい。
The polypropylene constituting the film does not necessarily have to be a polypropylene homopolymer, but may contain other species such as polyethylene or poly(4-methylpentene) in a small amount, preferably 5% by weight or less, as long as it does not impair the purpose and effect of the present invention. Polyolefins may also be mixed. When TmC decreases, the dielectric strength decreases significantly.

本発明に使用するポリプロピレンフィルムの面配向度は
12.0X10−3以上であり、好ましくは14X10
’以上である。面配向度が12.0×10−3未満であ
れば、ヤング率の低下すなわちフィルムの腰が弱く、蒸
着加工時に高温下での抗張力が低下し、フィルムが熱変
形しやすく、この結果として巻取り時に長さ方向に対し
て直角の横方向に皺が混入しやすい欠点となる。面配向
度の上限は特に限定されないが、通常、16.0X10
−3程度である。
The degree of plane orientation of the polypropylene film used in the present invention is 12.0X10-3 or more, preferably 14X10
'That's it. If the degree of plane orientation is less than 12.0 x 10-3, the Young's modulus decreases, that is, the film becomes stiff, the tensile strength at high temperatures during vapor deposition decreases, and the film is likely to be thermally deformed, resulting in poor winding. The disadvantage is that wrinkles tend to form in the transverse direction perpendicular to the length direction during removal. The upper limit of the degree of plane orientation is not particularly limited, but is usually 16.0×10
It is about -3.

本発明の二軸延伸ポリプロピレンフィルムの表面粗さは
特に限定されるものではないが、粗さ(Ra>は0.1
μm以下であるのが望ましく、粗さが小さいほど本発明
の効果はより顕著となる。
The surface roughness of the biaxially stretched polypropylene film of the present invention is not particularly limited, but the roughness (Ra> is 0.1
It is desirable that the roughness is less than μm, and the smaller the roughness, the more remarkable the effects of the present invention will be.

すなわち、粗さが小さい程微細な結晶が密に存在し、結
晶性が高く、フィルムの剛性も大きく、蒸着時の熱変形
を抑制し、皺の発生を大幅に軽減することができる。
That is, the smaller the roughness, the denser the presence of fine crystals, the higher the crystallinity, and the greater the rigidity of the film, suppressing thermal deformation during vapor deposition and significantly reducing the occurrence of wrinkles.

特にフィルム厚みが2〜12μm位の非常に薄いフィル
ムにおいてその効果はより顕著である。
In particular, the effect is more remarkable in very thin films with a film thickness of about 2 to 12 μm.

フィルムの構成は単膜に限定されるものではなく、複合
されているものでもよい。
The structure of the film is not limited to a single film, but may be a composite film.

金属蒸着フィルムを用いたコンデンサーにおいては、適
用される蒸着の金属としては、アルミニウム(A l 
) 、亜鉛(Zn)等、又はそれらの合金が例示できる
が、これらに限定されず公知の金属であればいずれであ
ってもよい。
In a capacitor using a metal-deposited film, aluminum (Al
), zinc (Zn), and alloys thereof, but the present invention is not limited thereto, and any known metal may be used.

次に、本発明のコンデンサーの製造法の一例について説
明する。但し、本発明は以下の方法に限定されるもので
はない。
Next, an example of the method for manufacturing the capacitor of the present invention will be explained. However, the present invention is not limited to the following method.

超高活性化触媒を用いて無溶媒の液化プロピレン中で重
合、俊処理によって得られた1、Iが98.5〜99.
5%なるポリプロピレン樹脂を230〜285℃に加熱
された押出機に供給し、スリット状の口金から吐出し、
表面温度20〜95℃のチルロールに接触させて冷却固
化し、厚み350〜800μm相当の未延伸フィルムを
得る。
1,I obtained by polymerization in solvent-free liquefied propylene using an ultra-highly activated catalyst and a rapid treatment has a value of 98.5 to 99.
A 5% polypropylene resin was supplied to an extruder heated to 230 to 285°C and discharged from a slit-shaped mouthpiece.
The film is cooled and solidified by contacting with a chill roll having a surface temperature of 20 to 95°C to obtain an unstretched film having a thickness of 350 to 800 μm.

面配向度を高めるにはフィルムを高結晶化させる程好ま
しい値となることからチルロールでの冷却は徐冷が好ま
しい。但し、この場合、0品生成によりフィルム表面が
粗面化する傾向にあるため、注意する必要がある。
In order to increase the degree of plane orientation, the higher the crystallization of the film, the better the value, so slow cooling with a chill roll is preferable. However, in this case, care must be taken because the film surface tends to become rough due to the production of zero products.

二輪延伸フィルムとする場合、上記未延伸フィルムを1
25〜155℃の温度で加熱した後、長さ方向に4.0
〜5.8倍延伸する。
When making a two-wheel stretched film, the above unstretched film is
4.0 in the length direction after heating at a temperature of 25-155℃
Stretch by ~5.8 times.

なお、面配向度を高めるには低い温度で高倍率延伸する
程好ましいが厚み斑を助長することから加熱温度は14
0〜152℃が好ましく、延伸倍率は4.8〜5.5倍
が好ましい。
In addition, in order to increase the degree of plane orientation, it is preferable to stretch at a low temperature and a high magnification, but since it promotes uneven thickness, the heating temperature is 14
The temperature is preferably 0 to 152°C, and the stretching ratio is preferably 4.8 to 5.5 times.

ざらにより好ましくは140〜152℃で4゜75〜5
.0倍延伸後、145〜154℃の温度で1.05〜1
.1倍の再延伸を行うことである。
Preferably 4°75-5 at 140-152°C
.. 1.05-1 at a temperature of 145-154℃ after 0 times stretching
.. 1x re-stretching.

135℃のn−ヘプタンで抽出した成分のTfflCは
原料にも依存するが、TmCを高めるには、溶融ポリマ
ーを冷却する際、徐冷が好ましい。長さ方向の延伸条件
にも依存し、前述のとおり再延伸を行なうことが好まし
い。
The TfflC of the component extracted with n-heptane at 135°C depends on the raw material, but in order to increase the TmC, slow cooling is preferable when cooling the molten polymer. Depending on the stretching conditions in the length direction, it is preferable to perform re-stretching as described above.

次いで、該フィルムをテンター式延伸装置に送り込み、
直角方向(横方向〉に7〜12倍延伸する。この時の延
伸温度は140〜165℃でおる。
Next, the film is sent to a tenter type stretching device,
The film is stretched 7 to 12 times in the perpendicular direction (transverse direction).The stretching temperature at this time is 140 to 165°C.

延伸後140〜163℃の温度で10%以下の弛緩をし
ながら熱処理をする。Tmを高めるには高温での熱処理
が好ましいが、結晶サイズが大きくなることから145
〜155℃の温度が好ましい。
After stretching, heat treatment is performed at a temperature of 140 to 163° C. with relaxation of 10% or less. Heat treatment at high temperature is preferable to increase Tm, but since the crystal size increases,
Temperatures between 155°C and 155°C are preferred.

次いで、必要に応じてフィルム表面の片面もしくは両面
に必要に応じて表面活性化処理(コロナ放電処理など公
知の放電処理のいずれでもよい)を行ない巻取る。以上
の様にして形成されたフィルムに、真空中でAI、Zn
等の金属を膜抵抗2〜6Ω/口になる様に蒸着して電極
とし、これを2枚重ねて巻回し、必要容量のコンデンサ
ー素子とする。
Then, if necessary, one or both surfaces of the film are subjected to surface activation treatment (any known discharge treatment such as corona discharge treatment), and the film is wound up. The film formed as described above was coated with AI and Zn in a vacuum.
A metal such as the following is vapor-deposited so as to have a film resistance of 2 to 6 Ω/portion to form an electrode, and two layers of this are wound together to form a capacitor element with the required capacity.

なお、誘電体は、上記フィルムだけでもよいが、他のフ
ィルムや紙との積層体としてもよい。本発明のコンデン
サーは、乾式、油含浸式のいずれでおってもよい。
Note that the dielectric may be the above film alone, or may be a laminate with other films or paper. The capacitor of the present invention may be either a dry type or an oil-impregnated type.

なお、この発明の特性値は、次の測定法により測定する
ものである。
Note that the characteristic values of this invention are measured by the following measuring method.

(1)アイツタチック度(1,I) A、フィルムから重量W(g)の試料をとり、円筒濾紙
にこれを入れる。
(1) Aistatic degree (1, I) A. Take a sample of weight W (g) from the film and place it in a thimble filter paper.

B、抽出器に試料の入った円筒濾紙とn−ヘプタン80
m1を入れ、135℃で12時間抽出を行なう。
B, thimble with sample in extractor and n-heptane 80
ml and perform extraction at 135°C for 12 hours.

C0抽出終了後円筒濾紙を取り外し真空乾燥器で5時間
乾燥後の試料の重量を測定し、その値をW’  (Q)
とする。
After the C0 extraction, remove the thimble and dry it in a vacuum dryer for 5 hours. Measure the weight of the sample, and calculate the value as W' (Q).
shall be.

01次式により1.I(%)を求める。According to the 01st equation, 1. Find I (%).

1、I(%)= (W’ /W)xloo(2)結晶サ
イズ 広角X線回折法(反射法)で、印加電圧35に■、15
mA、5can  5peed  1°/mnS7’i
me  C0n5t  2sec、FS8000cps
、スリット系 DS SS 1゜R80,3mm、フィ
ルターはニッケルを用い、上記条件で測定後、次式で求
め、(110)面の測定値をフィルムの結晶サイズ(n
m)と定義した。
1. I (%) = (W' /W)
mA, 5can 5peed 1°/mnS7'i
me C0n5t 2sec, FS8000cps
, slit system DS SS 1°R80.3mm, nickel filter was used, and after measurement under the above conditions, it was calculated using the following formula, and the measured value of the (110) plane was calculated as the crystal size of the film (n
m).

結晶サイズ=K・λ/(β・COSθ)にニジエラー常
数、ここではに=1とした。
Crystal size = K·λ/(β·COSθ) and Nizier error constant, here, K=1.

λ:0.15418 β:半価幅 θ:ビーク角度 (3)融解ピーク温度(Tm) PERKIN  ELMER社製DSC−II型の走査
示差熱量計を用いて、次の測定条件にて得られた溶融時
のピーク温度を融解ピーク温度(Tm>と定義した。
λ: 0.15418 β: Half width θ: Beak angle (3) Melting peak temperature (Tm) Melting temperature obtained under the following measurement conditions using a DSC-II type scanning differential calorimeter manufactured by PERKIN ELMER. The peak temperature at 100°C was defined as the melting peak temperature (Tm>).

試料量: 5mg 範  囲:5mcal/sec 昇温速度:20℃/分 感  度: 10mV (4)抽出成分の結晶化ピーク温度(Tmc>1、Iの
測定で得られた抽出物を蒸発乾固させた後、前記の走査
型示差熱量計にて降温冷却時のピーク温度を結晶化ピー
ク温度(TmC>と定義した。
Sample amount: 5 mg Range: 5 mcal/sec Heating rate: 20°C/min Sensitivity: 10 mV (4) Crystallization peak temperature of extracted components (Tmc>1, extract obtained by measurement of I was evaporated to dryness) After cooling, the peak temperature during cooling was defined as the crystallization peak temperature (TmC>) using the scanning differential calorimeter.

試料量: 5mg 範   囲: 5mca l/sec 昇温速度:20℃/分 感  度:iomv 溶融温度、保持時間:280℃、5分 (5)面配向度 アツベ屈折計を用いて、フィルムの両面をサリチル酸メ
チルでマウントを行ない、長さ方向、横方向、厚さ方向
の屈折率を測定し、次式にて求めた。
Sample amount: 5 mg Range: 5 mcal/sec Heating rate: 20°C/min Sensitivity: IOMV Melting temperature, holding time: 280°C, 5 minutes (5) Degree of plane orientation Using an Atsube refractometer, both sides of the film was mounted with methyl salicylate, and the refractive index in the length direction, lateral direction, and thickness direction was measured and calculated using the following formula.

面配向度−(η8+ηy)/2−η7 ここでηX:長さ方向の屈折率 ηy=横方向の屈折率 η2:厚さ方向の屈折率 (6)蒸着加工ロス率 幅530mm、長さ20000mで厚み8μmのフィル
ムを3X10−4丁orrの真空下でA1金属を膜抵抗
2.50/口を300m/分でマージン3mmを含む幅
100mmとして蒸着加工を行なう。蒸看俊100mm
幅に裁断しながら350m/分の速度で巻取り、折れシ
ワ混入による製品のロス率(%)を、次式にて求めた。
Degree of plane orientation - (η8 + ηy) / 2 - η7 where ηX: refractive index in the length direction ηy = refractive index in the lateral direction η2: refractive index in the thickness direction (6) Vapor deposition processing loss rate Width 530 mm, length 20000 m A film having a thickness of 8 μm is vapor-deposited with A1 metal under a vacuum of 3×10 −4 orr at a film resistance of 2.50/mouth at a rate of 300 m/min to a width of 100 mm including a margin of 3 mm. Steamer Shun 100mm
The product was wound up at a speed of 350 m/min while being cut into widths, and the loss rate (%) of the product due to folding and wrinkles was determined using the following formula.

ここでは検査対象蒸着製品本数は500本とした。Here, the number of vapor-deposited products to be inspected was 500.

(7)絶縁破壊電圧 厚み8μmで膜抵抗2.50/口のA1@看された幅1
00mm <マージン幅3mmを含む)のフィルムを用
いて素子巻機で10μFの容量のコンデンサー素子を作
製し、メタリコンを行って端部を融着させる。115℃
で5時間熱処理俊端子付けてコンデンサーとする。
(7) Dielectric breakdown voltage 8 μm thick and membrane resistance 2.50/mouth A1 @ observed width 1
A capacitor element with a capacitance of 10 μF is manufactured using a device winding machine using a film of 00 mm (including a margin width of 3 mm), and the ends are fused by metallization. 115℃
Heat treated for 5 hours and attached terminals to form a capacitor.

このコンデンサーを交流で600Vから1分間課電を行
ない50Vずつ課電圧を昇圧しその破壊電圧を求めた。
This capacitor was charged with alternating current from 600 V for 1 minute, and the applied voltage was increased by 50 V to determine its breakdown voltage.

破壊電圧はコンデンサー20個の平均値である。The breakdown voltage is the average value of 20 capacitors.

(8)シートV−を破壊率(%) 厚み8μmのフィルムを150mmx150mmのサイ
ズでサンプリングを行ない、春日m1llll製AC耐
圧試験機15kVの耐圧装置を用いて陽極に50mmφ
の黄銅製電極、陰極に8μmのA1箔を3mm厚のシリ
コーンゴムに3枚重巻として、陽極と陰極の間にフィル
ムをおき、交流で1kV課電する。課電後から破壊する
までの時間を求め、60秒以下で破壊する割合を次式に
て求めた。但し、測定総数は50本とした。
(8) Destruction rate (%) of sheet V- A film with a thickness of 8 μm was sampled in a size of 150 mm x 150 mm, and an anode of 50 mmφ was
Brass electrode, cathode made of 8 μm A1 foil wrapped in three layers of 3 mm thick silicone rubber, a film placed between the anode and cathode, and 1 kV AC current applied. The time from when electricity was applied until destruction was determined, and the percentage of destruction within 60 seconds was determined using the following formula. However, the total number of measurements was 50.

シートV−を破壊率(%) 〔実施例〕 以下、実施例に基づいて、この発明の実施態様を説明す
る。
Destruction rate (%) of sheet V- [Example] Hereinafter, embodiments of the present invention will be described based on Examples.

実施例1 1、Iが99.3%なるポリプロピレン樹脂を250℃
に加熱された押出機に供給し、スリット状の口金から吐
出し、85℃のチルロールに接触させて冷却固化し、4
40μmの未延伸シートを得た。このシートを145℃
の温度で長さ方向に4.75倍延伸を行なった後、ざら
に150℃の温度で1.1倍の延伸を行なった後、直角
方向に160℃の温度で10.5倍延伸後、145℃の
温度で5.0%弛緩しつつ熱処理し、8μmのフィルム
を作った。このフィルムの片面に10W・min/m2
のコロナ放電処理を施した。このフィルムを530mm
幅にスリット後3X10’Torrの真空下で2.5Ω
/口の膜抵抗でA1の金属をコロナ放電処理面へ蒸着し
た。
Example 1 1. Polypropylene resin with I of 99.3% was heated at 250°C
The mixture was fed to an extruder heated to 40°C, discharged from a slit-shaped mouthpiece, cooled and solidified by contacting a chill roll at 85°C, and
An unstretched sheet of 40 μm was obtained. Heat this sheet to 145℃
After stretching 4.75 times in the longitudinal direction at a temperature of Heat treatment was performed at a temperature of 145° C. with 5.0% relaxation to form a film of 8 μm. 10W・min/m2 on one side of this film
corona discharge treatment was applied. This film is 530mm
2.5Ω under vacuum of 3X10'Torr after slit width
A metal of A1 was deposited on the corona discharge treated surface using a film resistor of /.

マージン幅3mmを含んだフィルム幅100mm幅にス
リット後素子巻機にかけて10μFのコンデンサー素子
を作り常法によってメタリコン115℃で5時間熱処理
俊リード線の取付けを行なった。このコンデンサーを用
いて交流で600Vから1分間課電を行ない破壊にいた
るまで50Vずつ段階をえて昇圧を行なった。その結果
は第1表に示した通りであって、1.Iが98%以上で
結晶サイズが13.5nm以下、Tmが165℃以上、
抽出成分のTmCが85℃以上、面配向度12.0X1
0’以上のものは、すなわち実施例1のコンデンサーは
、後述の比較例1〜4に比べ明らかに耐電圧の向上して
いることがわかる。
After slitting the film to have a film width of 100 mm including a margin width of 3 mm, a capacitor element of 10 μF was made using an element winding machine, and a metallicon was heat-treated at 115° C. for 5 hours by a conventional method and a lead wire was attached. Using this capacitor, an alternating current voltage of 600 V was applied for 1 minute, and the voltage was increased in steps of 50 V until breakdown occurred. The results are shown in Table 1.1. I is 98% or more, crystal size is 13.5 nm or less, Tm is 165°C or more,
TmC of extracted components is 85℃ or higher, degree of plane orientation 12.0X1
0' or more, that is, the capacitor of Example 1, it can be seen that the withstand voltage is clearly improved compared to Comparative Examples 1 to 4 described later.

一方、蒸着加工ロス率についても製品中での皺の発生も
なく加工ロスの向上していることが明らかでおる。
On the other hand, it is clear that the rate of processing loss during vapor deposition has improved, with no wrinkles occurring in the product.

実施例2 1.7が98.3%なるポリプロピレン樹脂を用いて、
他は実施例1と同様の条件で行った。
Example 2 Using a polypropylene resin with 98.3% of 1.7,
The other conditions were the same as in Example 1.

第1表に示す通り、実施例1と同じく絶縁耐圧、蒸着の
加工性の優れていることがわかる。
As shown in Table 1, it can be seen that, like Example 1, the dielectric strength and processability of vapor deposition are excellent.

比較例1 1、Iが97.5%なるポリプロピレン樹脂を用いて、
チルロール温度は88℃以外は実施例1と同じ条件で未
延伸シートを得た。このシートを150℃の温度で長さ
方向に5.0倍延伸を行った後、直角方向に158℃の
温度で10.0倍延伸後、150℃の温度で5.0%弛
緩しつつ熱処理をし、8μmのフィルムを得た。以後は
実施例1と同様である。第1表の結果で明らかな様に得
られたフィルムは結晶性が低く、結晶サイズが大きくな
り、面配向度が小ざく、絶縁耐圧は劣り、蒸着時での熱
変形が大きくなり、皺混入によるロス率が大きくなる。
Comparative Example 1 1. Using a polypropylene resin with I of 97.5%,
An unstretched sheet was obtained under the same conditions as in Example 1 except that the chill roll temperature was 88°C. This sheet was stretched 5.0 times in the longitudinal direction at a temperature of 150°C, then 10.0 times in the perpendicular direction at a temperature of 158°C, and then heat treated at a temperature of 150°C while relaxing by 5.0%. A film of 8 μm was obtained. The subsequent steps are the same as in Example 1. As is clear from the results in Table 1, the obtained film has low crystallinity, large crystal size, low degree of plane orientation, poor dielectric strength, large thermal deformation during vapor deposition, and wrinkles. The loss rate increases due to

比較例2 1、I97.5%なるポリプロピレン樹脂を用いて、他
は実施例1と同様の条件で行った。
Comparative Example 2 The same conditions as in Example 1 were used except that a polypropylene resin containing 1.1 and 97.5% I was used.

面配向度が大きくなり、wL混入によるロス率は改良傾
向でおるが絶縁耐圧は不十分である。
Although the degree of plane orientation increases and the loss rate due to wL contamination tends to improve, the dielectric strength is insufficient.

比較例3 1、Iが98.3%なるポリプロピレン樹脂を用いて、
他は比較例1と同様の条件で行った。
Comparative Example 3 1. Using a polypropylene resin with I of 98.3%,
The other conditions were the same as in Comparative Example 1.

1、Iアップの効果により絶縁耐圧は良化傾向であるが
結晶サイズが大きく、一定課電圧下でのライフ特性はま
だ不十分である。
1. Due to the effect of increasing I, the dielectric strength tends to improve, but the crystal size is large and the life characteristics under a constant applied voltage are still insufficient.

比較例4 1、Iが99.3%なるポリプロピレン樹脂を用いて比
較例1と同様の条件で行った。
Comparative Example 4 A test was carried out under the same conditions as in Comparative Example 1 using a polypropylene resin containing 99.3% of 1.I.

面配向度が小さく、皺混入によるロス率が大きい。The degree of plane orientation is low, and the loss rate due to wrinkles is high.

〔発明の効果〕〔Effect of the invention〕

この発明のコンデンサーは上述した様に、I。 As mentioned above, the capacitor of this invention has I.

■が98%以上、結晶サイズが13.5nm以下、Tm
が165℃以上、抽出成分のTmCが85℃以上、面配
向度12X10’以上の二軸延伸ポリプロピレンフィル
ムを誘電体層としたので従来品に比べて破壊電圧が向上
し、かつ、蒸着加工ロスが小さくなっている。
■ is 98% or more, crystal size is 13.5 nm or less, Tm
Since the dielectric layer is a biaxially oriented polypropylene film with a temperature of 165°C or higher, a TmC of extracted components of 85°C or higher, and a plane orientation of 12X10' or higher, the breakdown voltage is improved compared to conventional products, and the vapor deposition process loss is reduced. It's getting smaller.

そのため促進テストでの寿命性で約20%の向上が期待
され、耐電圧を大幅に高めることができる。
Therefore, it is expected that the lifespan in accelerated tests will be improved by about 20%, and the withstand voltage can be significantly increased.

Claims (1)

【特許請求の範囲】[Claims] (1)誘導体の少なくとも一面に金属蒸着層を備えたコ
ンデンサーにおいて、誘電体として、アイソタクチック
度98.0%以上、結晶サイズが13.5nm以下、融
解ピーク温度が165℃以上、135℃のn−ヘプタン
で抽出した成分の結晶化ピーク温度が85℃以上、面配
向度12.0×10^−^3以上の二軸延伸ポリプロピ
レンフイルムを用いたことを特徴とするコンデンサー。
(1) In a capacitor having a metal vapor deposited layer on at least one surface of a dielectric, the dielectric has an isotactic degree of 98.0% or more, a crystal size of 13.5 nm or less, a melting peak temperature of 165°C or more, and a temperature of 135°C. A capacitor characterized by using a biaxially stretched polypropylene film having a crystallization peak temperature of components extracted with n-heptane of 85° C. or higher and a plane orientation of 12.0×10^-^3 or higher.
JP28306788A 1988-11-09 1988-11-09 condenser Expired - Fee Related JPH0642441B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28306788A JPH0642441B2 (en) 1988-11-09 1988-11-09 condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28306788A JPH0642441B2 (en) 1988-11-09 1988-11-09 condenser

Publications (2)

Publication Number Publication Date
JPH02129905A true JPH02129905A (en) 1990-05-18
JPH0642441B2 JPH0642441B2 (en) 1994-06-01

Family

ID=17660777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28306788A Expired - Fee Related JPH0642441B2 (en) 1988-11-09 1988-11-09 condenser

Country Status (1)

Country Link
JP (1) JPH0642441B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002528875A (en) * 1998-10-28 2002-09-03 トレスパファン、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング Biaxially oriented electrically insulating film with improved shrinkage at elevated temperatures
JP2014231584A (en) * 2013-05-30 2014-12-11 王子ホールディングス株式会社 Biaxially oriented polypropylene film for capacitor
KR20180005670A (en) 2015-05-12 2018-01-16 도레이 카부시키가이샤 Polypropylene film, metal film laminated film and film capacitor
WO2020171163A1 (en) 2019-02-21 2020-08-27 東レ株式会社 Polypropylene film, metallized film using polypropylene film, and film capacitor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002528875A (en) * 1998-10-28 2002-09-03 トレスパファン、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング Biaxially oriented electrically insulating film with improved shrinkage at elevated temperatures
JP2014231584A (en) * 2013-05-30 2014-12-11 王子ホールディングス株式会社 Biaxially oriented polypropylene film for capacitor
KR20180005670A (en) 2015-05-12 2018-01-16 도레이 카부시키가이샤 Polypropylene film, metal film laminated film and film capacitor
WO2020171163A1 (en) 2019-02-21 2020-08-27 東レ株式会社 Polypropylene film, metallized film using polypropylene film, and film capacitor
KR20210130714A (en) 2019-02-21 2021-11-01 도레이 카부시키가이샤 Polypropylene film and metal film laminated film using same, film capacitor
US12202958B2 (en) 2019-02-21 2025-01-21 Toray Industries, Inc. Polypropylene film, metal layer laminated film using polypropylene film, and film capacitor

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