JPH0134401Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a microwave integrated circuit device, and in particular, to a package structure that facilitates connection between modules when a plurality of microwave integrated circuit modules are arranged in a box. Regarding improvements.

In response to the demand for smaller size, higher frequency, and wider bandwidth of microwave circuits, instead of conventional microwave integrated circuits in which transistors, diodes, etc. are individually packaged and matching circuits are added, transistors and diodes are being used. using chips,
In recent years, microwave integrated circuits have come into widespread use as modules in which the entire package, including matching circuits and input/output circuits, is hermetically sealed.

FIGS. 1A, 1B, and 1C are a plan view, a right side view, and a sectional view showing an example of such a modular microwave integrated circuit. In Figure 1, 1, 2,
3 is a microwave integrated circuit equipped with diodes, transistors, etc., 4 is the outer frame of the module that houses this, 5 and 6 are coaxial input/output terminals for microwave signals, and 7, 8, 9, and 10 are DC bias or base. Band, intermediate frequency signal input/output terminal. 11
12 is a flange for screwing the module to a box, etc., and in this figure, it has a through hole for screwing.

Such microwave integrated circuits 1, 2, and 3 have their microwave signal input/output terminals 5, 6 connected to coaxial plugs or waveguides using appropriate jigs to obtain the necessary electrical characteristics. After making adjustments to obtain the desired result, the lid 11 is hermetically sealed to complete the module.

Figures 2a and 2b show a plurality of modules thus manufactured connected inside the box. In Figures 2a and b, 13 is a box casing, 14, 15 are modules, 16, 17,
18 is a 50Ω line for connection. Each module and the center conductor of the connecting circuit are usually connected by soldering, bonding, etc.

It is a well-known fact that in the microwave band, the transmission characteristics are greatly affected by the connection state between the center conductors. The conditions must be the same. In other words, the microwave signal input/output terminals of the module must be connected once by soldering or bonding, etc. until the product is completed, and then removed after electrical adjustment, and then connected again by soldering or bonding, etc. Become. During these processes, thermal or mechanical stress is applied multiple times to the microwave signal input/output terminals of the module, but since the inside of the module is already hermetically sealed, it is necessary to repair it or prevent deterioration due to stress. etc. cannot be easily confirmed.

This is particularly inconvenient when high reliability is required, such as when mounted on a satellite.

The present invention was developed in view of the above-mentioned conventional circumstances, and therefore, the purpose of the present invention is to protect the microwave signal input/output terminals of a microwave integrated circuit module from stress applied during the manufacturing process. An object of the present invention is to provide a novel microwave integrated circuit device having functions.

In order to achieve the above object, the microwave integrated circuit device according to the present invention has one or more microwave integrated circuits disposed inside hermetically sealed, microwave signal input/output terminals, direct current, baseband - A microwave integrated circuit module having an intermediate frequency signal input/output terminal, one end of which is connected to the microwave signal input/output terminal of the module,
A connection circuit constituted by a microwave integrated circuit having a line for connection to another circuit at the other end is formed on the same flange for mounting the box.

Next, a preferred embodiment of the present invention will be specifically explained with reference to the drawings.

FIGS. 3a, 3b, and 3c are a plan view, a right side view, and a sectional view showing an embodiment of the present invention. In FIG. 3, the same reference numbers as in FIG. 1 indicate similar elements. Reference number 19 is a microwave integrated circuit module, and 21 and 22 have one end connected to the microwave signal input/output terminal 5 or 6 by soldering, bonding, etc., and the other end forming a connection interface with other circuits. 50Ω line for connection (connection circuit), 2
Reference numeral 0 designates a flange which arranges the connection circuit 21 or 22 and the module 19 on the same plane and has a hole for attachment to a box or the like. This flange 2
0 and the module outer frame 4 are usually molded as one piece. The rest is the same as in Figure 1.

When manufacturing this module 19 from FIG. 3, the microwave integrated circuit 1 inside the module,
2 and 3 and the outer input/output connection circuits 21 and 22 are placed on the package at the same time, and after connecting each integrated circuit and the connection circuit by soldering, bonding, etc., the module lid 11 is hermetically sealed. Since connections with other circuits are made via connection circuits 21 and 22, direct thermal and mechanical stress due to soldering, bonding, etc. is applied to the hermetically sealed microwave signal input/output terminals and inside the module. It is possible to prevent this from being applied.

FIGS. 4a and 4b are a plan view and a sectional view showing the module shown in FIG. 3 arranged in a box.
In FIG. 4, 23 is a box housing, 24, 2
5 is a microwave integrated circuit module similar to the module 19 shown in FIG. 3, and 26, 27, and 28 are 50Ω lines for connection.

From Figure 4, when arranging the module, the connections between the microwave signal input and output terminals are made by soldering or bonding, but these connections are for connection to the connection circuit 21 or 22 outside the module.
It can be seen that this is done between the 50Ω lines 26, 27, or 28, and no thermal or mechanical stress is directly applied to the inside of the module.

Figure 4 shows 50Ω line 2 for connection between modules.
6, 27, or 28, as is clear from the figure, if the package of the present invention is used, it is also possible to directly connect the modules.

As mentioned above, a microwave integrated circuit device having a connection circuit with one end connected to a microwave signal input/output terminal outside a module that is hermetically sealed has a structure that prevents direct access to the inside of the module during the manufacturing process. Since it is possible to avoid thermal or mechanical stress, it is particularly effective when used onboard a satellite where high reliability is required.

[Brief explanation of the drawing]

Figures 1 a, b, and c are a plan view, side view, and front sectional view of a conventional microwave integrated circuit module, and Figures 2 a and b are a conventional microwave integrated circuit module assembled in one box. Top view of the case,
3a, b, and c are a plan view, a side view, and a front sectional view showing an embodiment of a microwave integrated circuit device using the package of the present invention; FIGS. 4a, b are sectional views of the present invention. FIG. 3 is a plan view and a front sectional view of a microwave integrated circuit device using the package of FIG. 1, 2, 3, 16, 17, 18, 21, 22,
26, 27, 28...Microwave integrated circuit, 4...
... Outer frame of microwave integrated circuit module, 5, 6
...Input/output coaxial terminal, 7, 8, 9, 10...DC, baseband or intermediate frequency input/output terminal, 11
...Microwave integrated circuit module lid, 13,
23...Box housing, 19, 20...Microwave integrated circuit module mounting flange, 14,
15, 19, 24, 25...Microwave integrated circuit module, 30...Connection ribbon or wire.

Claims (1)

[Scope of utility model registration request] A microwave integrated circuit module in which one or more microwave integrated circuits arranged inside are hermetically sealed and has a microwave signal input/output terminal and a DC, baseband or intermediate frequency signal input/output terminal; A connecting circuit formed of a microwave integrated circuit having one end connected to the microwave signal input/output terminal and a connecting line with another circuit at the other end is formed on the same flange for mounting the box. A microwave integrated circuit device characterized by: