JPH01288772A - Probe card - Google Patents

Abstract

PURPOSE:To lessen factors such as noise and cross-talk which deteriorate the precision in measurement at the time of measurement by a high-frequency signal, by fixing probes to a wiring pattern which is formed on a probe support ring fixed to an opening part of a circuit board. CONSTITUTION:A support ring 12 formed on an insulator such as ceramics is fixed to a circuit board 11 along the periphery of an opening part 11a thereof. A wiring pattern 13 corresponding to the number of probes 14 is formed on a slanting surface 12b of the support ring 12. The probes 14 are connected electrically to a part in the vicinity of the inner peripheral edge of the wiring pattern 13 respectively and they are so fixed and supported as to project downward obliquely in the direction of the center of the opening part 11a. The length of the probes 14 can be shortened by connecting and fixing them to the wiring pattern 13 in this way. The end part of the wiring pattern 13 is connected electrically to conductive layers 15 formed on the board 11, while these conductive layers 15 are connected respectively to terminals for connection with a measuring apparatus which are arranged in the end part of the board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a probe card disposed in a wafer prober or the like and used for testing and measuring semiconductor devices or the like.

(Prior Art) Generally, a large number of integrated circuits formed on the surface of a semiconductor wafer undergo electrical testing and measurement during the manufacturing process.

For example, electrical connection between an integrated circuit on a semiconductor wafer and a measuring device is often made by probe terminals called a probe card.

FIG. 2 shows the configuration of an example of a conventional probe card, in which a substrate 1 made of a printed circuit board or the like is provided with an opening 1a, and a support is provided along the periphery of the opening 1a. Ring 2 is fixed. The support ring 2 has a sloped surface 2a at the bottom that is sloped from the outer circumferential direction to the inner circumferential direction, and a large number of probes 3 are arranged on this sloped surface 2a toward the center of the support ring 2. It is fixed so that it protrudes. Also, one end 3a of the probe 3
is electrically connected to a conductive layer 4 formed on the substrate 1, and this conductive layer 4 is connected to a measuring device connection terminal provided at an end of the substrate 1. Then, by connecting the other end 3b of the probe 3 to an electrode butt on the semiconductor wafer, electrical connection with the measuring instrument is established.

Incidentally, in recent years, in order to shorten inspection time, attempts have been made to increase the frequency of measurement signals from measuring instruments such as IC testers to increase the speed. Moreover, the number of integrated circuits to be measured that use high frequencies is increasing, and accordingly, probe cards are also required to be compatible with high frequency signals.

Therefore, in order to prevent noise increase and signal attenuation due to high frequency signals, measures such as sufficient impedance matching of the conductive layer 4 provided on the substrate 1 have been taken.

(Communication to be solved by the invention) However, in the conventional probe card described above,
Since the support ring 2 only has the role of positioning and fixing the probe 3, the electrical connection between the probe 3 and the conductive layer 4 formed on the substrate 1 is achieved by making the end 3a of the probe 3 conductive. This is done by connecting to layer 4. For this reason, the length of the probe 3 becomes long, for example, about 25 mm to 35 mm, which causes problems such as interference between the probes 3, noise, crosstalk, etc., and a decrease in measurement accuracy. is occurring. Furthermore, JP-A-51-32181, JP-A-5
8-162045 etc. However, it has not been put into practice.

The present invention has been made to address the problems of the prior art, and aims to provide a probe card that reduces factors that reduce measurement accuracy, such as noise and crosstalk, when measuring using high-frequency signals. The purpose is

[Structure of the Invention] (Means for Solving the Problems) That is, the present invention provides a method for directing a plurality of probes along the opening of a first printed wiring board having an opening in the direction of the center of the opening. In a probe card comprising a ring-shaped probe support fixedly provided so as to protrude from the probe, a first printed wiring provided on the probe support and electrically connected to the first printed wiring is provided. The device is characterized in that it includes a printed wiring pattern and a probe connected and fixed to a portion of the wiring pattern near the inside of the probe support.

(Function) In the probe card of the present invention, a wiring pattern is formed on the probe support fixed along the opening of the substrate, and the probe is fixed to this wiring pattern and electrical connection is made. There is. This makes it possible to significantly shorten the length of the probe compared to conventional probe cards.

Therefore, interference between the probes is reduced, and noise, crosstalk, etc. can be significantly reduced even when high frequency signals are used.

(Example) Next, an example of the probe card of the present invention will be described with reference to the drawings.

A board 1 composed of a printed circuit board made of resin etc.
1 has a circular opening 11 with a diameter of several centimeters.
A support ring 12 made of an insulating material such as ceramics such as alumina is provided along the periphery of this opening 11a, and a convex portion 12 formed at the inner end thereof is provided.
It is fixed to a. This support ring 12 has an inclined surface 12b at the lower part thereof that is inclined upward from the outer circumferential side toward the inner circumferential side. Wiring patterns 13 are formed according to the number of wires.

A probe 14 is provided near the inner peripheral end of the wiring pattern 13 formed on the inclined surface 12b of the support ring 12.
are electrically connected and are fixedly supported so as to project downwardly toward the center of the opening 11a.

The probe 14 is made of W or Pd and has a diameter of about 200 μm to 250 μm, for example.

It is made of a Be--Cu alloy or the like, and its tip 14a is bent downward and has a small diameter of, for example, about 50 μm. The length of the probe 14 can be determined by connecting and fixing it to the corresponding wiring pattern formed on the support ring 12 in this way.
For example, it is possible to shorten the length to about 5 cm.

The closer this connecting portion is to the inner end of the inclined surface 12b, the shorter the length of the probe 14 can be formed. Further, the probe 14 can also be made shorter by having a structure without a bent portion at the tip, and can be made even shorter by standing vertically.

On the other hand, the end of the wiring pattern 13 located on the upper surface 12d of the support ring 12 is electrically connected to the conductive layer 15 formed on the substrate 11. li layer 15
are respectively connected to measuring device connection terminals (not shown) arranged at the end of the substrate 11.

In the probe card of this embodiment having the above configuration, the opening 12
A semiconductor wafer is placed under the substrate 1, and the tip of the probe 14 is brought into contact with an electrode bat formed on the semiconductor wafer and having a size of, for example, 100 μm x 80 μm.
The connection terminal provided in 1 is electrically connected to a measuring device to perform test measurements on an integrated circuit formed on a semiconductor wafer.

According to this embodiment, the probe is electrically connected and fixed to the wiring pattern provided on the support ring, so the length of the probe can be significantly shortened compared to conventional probe cards. It becomes possible.

For example, a probe having a length of about 51 mm can perform the same function as the conventional probe having a length of 2511 to 35 mm. Therefore, interference between the probes when high frequency signals are used is significantly reduced, and noise, crosstalk, etc. due to this high frequency signal can be significantly reduced compared to the conventional method.

[Effects of the Invention] As explained above, the probe card of the present invention can significantly reduce noise and crosstalk caused by high-frequency signals compared to the conventional ones, so it is possible to significantly improve measurement accuracy. Become.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the configuration of the main parts of a probe card according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of the main parts of a conventional probe card. 11...Substrate, lla...Opening, 1
2... Support ring, 13... Wiring pattern, 14... Probe, 15... Conductive layer Applicant Tokyo Electron Ltd. Agent Patent attorney Suyama Sa −

Claims (1)

[Scope of Claims] An annular ring provided along the opening of a first printed wiring board having an opening so as to fix a plurality of probes so as to protrude toward the center of the opening. A probe card having a probe support fixed thereto, a second printed wiring pattern provided on the probe support and electrically connected to the first printed wiring; and this wiring pattern. and a probe connected and fixed to a portion close to the inside of the probe support.