JPH01175166U - - Google Patents
Info
- Publication number
- JPH01175166U JPH01175166U JP7136488U JP7136488U JPH01175166U JP H01175166 U JPH01175166 U JP H01175166U JP 7136488 U JP7136488 U JP 7136488U JP 7136488 U JP7136488 U JP 7136488U JP H01175166 U JPH01175166 U JP H01175166U
- Authority
- JP
- Japan
- Prior art keywords
- blade
- center
- particles
- cutting blade
- center blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図Ａは本考案の一実施例の切断刃の先端部
分の拡大断面図で、第１図Ｂはこの切断刃を用い
た半導体ウエーハのダイシング時の状態を示す断
面図である。第２図は本考案の他の実施例の切断
刃の先端部分の拡大断面図である。第３図は半導
体ウエーハのダイシング時の状態を示す傾斜図で
ある。第４図Ａは従来の切断刃の先端部分の拡大
断面図で、第４図Ｂはこの切断刃を用いた半導体
ウエーハをダイシング時の状態を示す断面図であ
る。
１０，２０……切断刃、１０ａ，２０ａ……中
心刃、１０ｂ，２０ｂ……両側刃。
FIG. 1A is an enlarged cross-sectional view of the tip of a cutting blade according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view showing a state in which a semiconductor wafer is diced using this cutting blade. FIG. 2 is an enlarged sectional view of the tip of a cutting blade according to another embodiment of the present invention. FIG. 3 is a tilted view showing the state of the semiconductor wafer during dicing. FIG. 4A is an enlarged cross-sectional view of the tip of a conventional cutting blade, and FIG. 4B is a cross-sectional view showing a state in which a semiconductor wafer is diced using this cutting blade. 10, 20...cutting blade, 10a, 20a...center blade, 10b, 20b...both side blades.
Claims (1)
小で、かつ中心刃粒子より両側刃粒子が細かいこ
とを特徴とするダイシング用切断刃。 A cutting blade for dicing, which has a center blade and both side blades, and is characterized in that both side blades have a smaller diameter than the center blade, and both side blade particles are finer than the center blade particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7136488U JPH01175166U (en) | 1988-05-30 | 1988-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7136488U JPH01175166U (en) | 1988-05-30 | 1988-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01175166U true JPH01175166U (en) | 1989-12-13 |
Family
ID=31296572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7136488U Pending JPH01175166U (en) | 1988-05-30 | 1988-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01175166U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000013870A1 (en) * | 1998-09-04 | 2000-03-16 | Riken | Method and device for cutting and mirror finishing single crystal silicon carbide |
| JP2011222698A (en) * | 2010-04-08 | 2011-11-04 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
| EP3067194A3 (en) * | 2015-03-13 | 2016-09-28 | NGK Insulators, Ltd. | Manufacturing method of honeycomb structure, and grinding wheel |
| JP2019503881A (en) * | 2015-12-09 | 2019-02-14 | ユニバーシティ・オブ・ノーザンブリア・アット・ニューカッスル | Combined processing tool |
-
1988
- 1988-05-30 JP JP7136488U patent/JPH01175166U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000013870A1 (en) * | 1998-09-04 | 2000-03-16 | Riken | Method and device for cutting and mirror finishing single crystal silicon carbide |
| US6699105B1 (en) | 1998-09-04 | 2004-03-02 | Riken | Method and apparatus for cutting and grinding single crystal SiC |
| JP2011222698A (en) * | 2010-04-08 | 2011-11-04 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
| EP3067194A3 (en) * | 2015-03-13 | 2016-09-28 | NGK Insulators, Ltd. | Manufacturing method of honeycomb structure, and grinding wheel |
| US10576609B2 (en) | 2015-03-13 | 2020-03-03 | Ngk Insulators, Ltd. | Manufacturing method of honeycomb structure, and grinding wheel |
| JP2019503881A (en) * | 2015-12-09 | 2019-02-14 | ユニバーシティ・オブ・ノーザンブリア・アット・ニューカッスル | Combined processing tool |