JPH01161079A - Adhesive for heat sealing - Google Patents
Adhesive for heat sealingInfo
- Publication number
- JPH01161079A JPH01161079A JP31933587A JP31933587A JPH01161079A JP H01161079 A JPH01161079 A JP H01161079A JP 31933587 A JP31933587 A JP 31933587A JP 31933587 A JP31933587 A JP 31933587A JP H01161079 A JPH01161079 A JP H01161079A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- silane coupling
- coupling agent
- adhesive
- ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 13
- 239000000853 adhesive Substances 0.000 title claims abstract description 12
- 238000007789 sealing Methods 0.000 title claims 2
- -1 polypropylene Polymers 0.000 claims abstract description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 12
- 239000004698 Polyethylene Substances 0.000 claims abstract description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 7
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims abstract description 7
- 239000011976 maleic acid Substances 0.000 claims abstract description 7
- 229920000573 polyethylene Polymers 0.000 claims abstract description 7
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000012945 sealing adhesive Substances 0.000 claims description 8
- 150000001451 organic peroxides Chemical class 0.000 claims description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 3
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 abstract description 15
- 239000004033 plastic Substances 0.000 abstract description 15
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000004743 Polypropylene Substances 0.000 abstract description 5
- 229920001155 polypropylene Polymers 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 abstract description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 abstract description 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005977 Ethylene Substances 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 238000009472 formulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 229920006113 non-polar polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- WIJVUKXVPNVPAQ-UHFFFAOYSA-N silyl 2-methylprop-2-enoate Chemical class CC(=C)C(=O)O[SiH3] WIJVUKXVPNVPAQ-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 210000000538 tail Anatomy 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
(発明の技術分野)
本発明は、金属とプラスチック、またはプラスチック相
互を良好に接着させるヒートシール用接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a heat-sealing adhesive that provides good adhesion between metals and plastics, or between plastics.
(発明の技術的背景およびその問題点)ポリエチレン、
ポリプロピレン等の非極性ポリマーは、成型性、電気特
性など多くの優れた特性を持ち、これらプラスチックの
使用は、物品の軽量化を実現させる要求等から多種用途
に及んでいる0
ヒートシール用接着剤は、接着剤を加熱して半溶融状態
とし、その後湯度の降下とともに接着し硬化するタイプ
のもので、例えば金属とプラスチックとを接着させる制
振鋼板やエアコン用蓄熱容器等に用いられている。しか
しながら、一般にプラスチックは接着性の悪さが欠点で
あり、金属とプラスチック、あるいはプラスチック相互
の接着は従来大きな課題であった。(Technical background of the invention and its problems) Polyethylene,
Non-polar polymers such as polypropylene have many excellent properties such as moldability and electrical properties, and these plastics are used in a wide variety of applications due to the need to reduce the weight of products.0 Heat-sealing adhesives is a type of adhesive that is heated to a semi-molten state, and then adheres and hardens as the temperature of the hot water falls, and is used, for example, in vibration-damping steel plates for bonding metal and plastic, and in heat storage containers for air conditioners. . However, plastics generally have a drawback of poor adhesion, and adhesion between metals and plastics, or between plastics, has traditionally been a major problem.
このため、従来はポリウレタン系、ポリエステル系、エ
ポキシ系の接着剤を用いる方法や、マレイン酸等をグラ
フト化したポリオレフィンを用いる方法などが行われて
きた。また、特開昭56−194732号公報に見られ
るように、エポキシ樹脂を介してシラン架橋ポリオレフ
ィン層を設ケる方法も提案されている。しかしながら、
これら従来例の接着方法では、接着強度が不充分であり
、特に高温時における接着強度が低いため、耐熱性に欠
けるなどの問題点があった。For this reason, methods using polyurethane-based, polyester-based, or epoxy-based adhesives, methods using polyolefin grafted with maleic acid, etc. have been conventionally used. Furthermore, as seen in JP-A-56-194732, a method of providing a silane crosslinked polyolefin layer via an epoxy resin has also been proposed. however,
These conventional bonding methods have problems such as insufficient bonding strength, particularly low bonding strength at high temperatures, and lack of heat resistance.
(発明の目的)
本発明は以上の点に着目し、金属とプラスチック、およ
びプラスチック相互の接着性を向上さ悠かつ耐熱性を向
上させることにより、幅広い用途に使用できるヒートシ
ール用接着剤を提供することを目的とする。(Objective of the Invention) The present invention focuses on the above points and provides a heat sealing adhesive that can be used in a wide range of applications by improving adhesiveness between metals and plastics, and between plastics, and improving heat resistance. The purpose is to
(発明の概要)
本発明は即ち、マレイン酸および/またはアクリル酸を
0.5〜lO重M%グラフト化してなるポリエチレン、
ポリプロピレン、エチレン−酢酸ビニル共重合体、エチ
レン−アクリル酸エチルコポリマーの1種または2種以
上100重量部に、シラン系カップリング剤0.1〜5
重量部を混合してなるヒートシール用接着剤に関する。(Summary of the Invention) The present invention relates to a polyethylene grafted with 0.5 to 10% by weight of maleic acid and/or acrylic acid;
100 parts by weight of one or more of polypropylene, ethylene-vinyl acetate copolymer, and ethylene-ethyl acrylate copolymer, and 0.1 to 5 parts of a silane coupling agent.
The present invention relates to a heat-sealing adhesive formed by mixing parts by weight.
本発明におけるポリエチレンとしては、低密度ポリエチ
レン(鎖状低密度ポリエチレンを含む)、中密度ポリエ
チレン、高密度ポリエチレンのいずれも使用することが
できる。As the polyethylene in the present invention, any of low density polyethylene (including chain low density polyethylene), medium density polyethylene, and high density polyethylene can be used.
ポリエチレン、ポリプロピレン、エチレン−酢酸ビニル
共重合体、エチレン−アクリル酸エチルコポリマーにグ
ラフトするマレインじおよび/またはアクリル酸のグラ
フト量は、0.5〜10重量%が望ましく、0.5重i
t%未満では接着性に劣り、10重量%を越えると耐熱
性が低下する(以下、グラフト化したこれらの樹脂をペ
ースポリマーという)。The amount of maleic acid and/or acrylic acid grafted onto polyethylene, polypropylene, ethylene-vinyl acetate copolymer, and ethylene-ethyl acrylate copolymer is preferably 0.5 to 10% by weight, and 0.5% by weight.
If it is less than t%, the adhesion will be poor, and if it exceeds 10% by weight, the heat resistance will be reduced (hereinafter, these grafted resins will be referred to as pace polymers).
本発明のシラン系カップリング剤としては、Y。The silane coupling agent of the present invention is Y.
篭
X−8i−Y、の構造式を持ち、Xの中に1個以上の炭
素炭素2重結合を有し、Y、−Y、の中に1個以上のメ
トキシ基またはエトキシ基を有する化合物を使用する。Compounds having the structural formula X-8i-Y, having one or more carbon-carbon double bonds in X, and one or more methoxy or ethoxy groups in Y, -Y use.
具体的には、次に示すメタクリロキシシランやビニルシ
ランなどがある。Specifically, there are the following methacryloxysilanes and vinylsilanes.
C′H8
CjH* −OCj 0 0sHo S i (0O
Hs )a■
0H。C'H8 CjH* -OCj 0 0sHo S i (0O
Hs)a■ 0H.
CH2−0−00C5HaSi(00tHs)s0HM
−CH3i (00tHs )sCut −(!H8
i (00t H40CjHs )s Y
+これらのシラン系カップリング剤は、x−si−yt
で表わされるX成分のうちの炭素炭素2重結合により、
プラスチックを形成する樹脂間の接着性を向上させ、ま
たX成分が金属表面の水酸基と反応することによって金
属との接着性が向上すると考えられる。シラン系カップ
リング剤の添加量としでは、ベースポリマー100重量
部に対して0.1〜5重量部が望ましい。添加量が0.
1重量部未満だと耐熱性が劣り、5重量部を越えると接
着性の向上が見られなくなる。CH2-0-00C5HaSi(00tHs)s0HM
-CH3i (00tHs)sCut -(!H8
i (00t H40CjHs )s Y
+These silane coupling agents are x-si-yt
Due to the carbon-carbon double bond of the X component represented by
It is thought that the adhesion between the resins forming the plastic is improved, and the X component reacts with the hydroxyl group on the metal surface, thereby improving the adhesion with the metal. The amount of the silane coupling agent added is preferably 0.1 to 5 parts by weight per 100 parts by weight of the base polymer. Addition amount is 0.
If it is less than 1 part by weight, heat resistance will be poor, and if it exceeds 5 parts by weight, no improvement in adhesion will be observed.
また、本発明においては、1分半減期の温度が100〜
180℃の範囲内にある有機過酸化物を添加することに
より、さらに接着性が向上する。In addition, in the present invention, the temperature of 1 minute half-life is 100~
Adhesion is further improved by adding an organic peroxide within the range of 180°C.
例えばt−プチルペルオキシイソブロビルカーボ*−)
(158℃)、ベンゾイルペルオキシド(130″C
)、1.1−ビス(t−ブチルペルオキシ)3,3,5
−)リメチルシクロヘキサン(148℃)、2,2−ビ
ス(t−ブチルペルオキシ)ブタン(160,5°C)
、ジクミルペルオキシド(171℃)等が使用できる(
カッコ内は1分半減期の温度)0
この有機過酸化物の添加量は、ペースポリマーとシラン
系カップリング剤の混合物に対して、0.05〜3重景
%重量ましく、0.05重量%未満では打。For example, t-butylperoxyisobrobyl carb *-)
(158°C), benzoyl peroxide (130″C)
), 1,1-bis(t-butylperoxy)3,3,5
-) Limethylcyclohexane (148°C), 2,2-bis(t-butylperoxy)butane (160,5°C)
, dicumyl peroxide (171°C), etc. can be used (
(The temperature in parentheses is the temperature with a half-life of 1 minute) 0 The amount of organic peroxide added is preferably 0.05 to 3% by weight, and 0.05% by weight, based on the mixture of the pace polymer and the silane coupling agent. If it is less than % by weight, it is struck.
層性向上の効果はほとんど無く、3重量%を越えると、
得られるヒートシール用接着剤の硬化が著しく柔軟性に
欠ける。There is almost no effect of improving layer properties, and if it exceeds 3% by weight,
The resulting heat-sealing adhesive is cured and is extremely inflexible.
(発明の実施例) 本発明における実施例を詳細に説明する。(Example of the invention) Examples of the present invention will be described in detail.
実施例1
メルトインデックス1.0の低密度ポリエチレン120
〜170°Cで押出成型してペレットを得た。Example 1 Low density polyethylene 120 with melt index 1.0
Pellets were obtained by extrusion molding at ~170°C.
得られたペレットに、トリエトキシビニルシラ22本社
部を混合し、再度押出機にて押出成型してヒートシール
用接着剤を得た。これを30μ111厚のフィルムに成
型して2 cm X B amサイズの試験片を作成し
た。Triethoxyvinylsila 22 main part was mixed with the obtained pellets and extrusion molded again using an extruder to obtain a heat-sealing adhesive. This was molded into a film with a thickness of 30μ111 to prepare a test piece with a size of 2 cm×Bam.
実施例2〜7及び9は、第1表に示す配合で、実施例1
と同様にして作成した。又、実施例8゜10は、第1表
に示す配合で実施例1と同様にして試験片を作成した後
、第1表に示す有機過酸化物でそれぞれ含浸した。Examples 2 to 7 and 9 are the formulations shown in Table 1, and Example 1.
Created in the same way. In Examples 8 and 10, test pieces were prepared in the same manner as in Example 1 using the formulations shown in Table 1, and then impregnated with the organic peroxides shown in Table 1.
比較例1及び3〜6は、実施例1と同様にして又比較例
2は、実施例8と同様にして、それぞれ第1表に示す配
合で作成した。Comparative Examples 1 and 3 to 6 were prepared in the same manner as in Example 1, and Comparative Example 2 was prepared in the same manner as in Example 8, with the respective formulations shown in Table 1.
接着強度の評価は、1.5鴎厚銅板と2關厚ポリプロピ
レン板との間に試験片をはさみ、150°CX5分、圧
力5 kg / ctlで接着させた後、室温と90°
Cのそれぞれについてせん断剥離試験を実施したO又、
プラスチック相互の接着強度の評価は、2枚のポリプロ
ピレン板の間に試験片をはさみ、同様に接着させて同様
の試験を行った。For evaluation of adhesive strength, a test piece was sandwiched between a 1.5-thickness copper plate and a 2-thickness polypropylene plate, and the specimen was bonded at 150°C for 5 minutes at a pressure of 5 kg/ctl, then at 90° from room temperature.
A shear peeling test was conducted on each of C.
To evaluate the adhesive strength between plastics, a similar test was conducted by sandwiching a test piece between two polypropylene plates and adhering them in the same manner.
実施例1〜10は、良好な接着強度と耐熱性を示してい
る。なお、実施例8及び10は、実施例2.9の配合に
それぞれ有機過酸化物を添加しており、接着性はさらに
優れたものとなりている。Examples 1-10 show good adhesive strength and heat resistance. In Examples 8 and 10, an organic peroxide was added to the formulation of Example 2.9, and the adhesion was even more excellent.
比較例1は、シラン系カップリング剤として炭素炭素2
重結合を含まないアミノシランを用いた場合、比較例2
,3.6はシラン系カップリング剤を添加しない場合・
比較例4はシラン系カップリング剤を過剰量添加した場
合が示してあり、いずれも接着強度が著しく低下した。Comparative Example 1 uses carbon carbon 2 as a silane coupling agent.
Comparative Example 2 when using aminosilane that does not contain heavy bonds
, 3.6 is when no silane coupling agent is added.
Comparative Example 4 shows the case where an excessive amount of the silane coupling agent was added, and in both cases, the adhesive strength was significantly reduced.
比較例5は、マレイン酪のグラフト曾が少なすぎる場合
で、この場合も接着強度は著しく低下している。Comparative Example 5 is a case in which the amount of grafted maleic acid is too small, and the adhesive strength is also significantly reduced in this case as well.
第1図及び第2図は、幅広い温度領域における、実施例
及び比較例の接着強度をグラフに示したもので、第1図
は銅−プラスチック、第2図はプラスチック相互の接着
である。図中・は実施例10゜0は実施例9、×は比較
例6の配合内容で試験片作成方法及び試験方法は前述と
同様である。FIGS. 1 and 2 are graphs showing the adhesion strength of Examples and Comparative Examples over a wide temperature range. FIG. 1 shows the adhesion between copper and plastic, and FIG. 2 shows the adhesion between plastics. In the figure, "*" indicates the composition of Example 10, "0" indicates the composition of Example 9, and "X" indicates the composition of Comparative Example 6, and the test piece preparation method and test method were the same as described above.
以下余白 ※l・・・信越化学社製 商品名 シラン系カップア リング剤。Below margin *L: Manufactured by Shin-Etsu Chemical Co., Ltd. Product name: Silane-based cupa ring agent.
※2・・・同上、 CH2−CH8i(OO2Hs)
s※3・・・同上、 OR。*2...Same as above, CH2-CH8i (OO2Hs)
s*3...Same as above, OR.
0Ht−0−00GjsHaSI(OCHs)s※4・
・・同上+ H2N 02 H4NU Cs I(6
S ! (QC! H3)!※5・・・日本油脂社製
商品名 、 t−ブチルペルオキシイソプロビルカーボ
ネート
(1分半減期の湿度158°C)
※6・・・同上、 ジクミルペルオキシド(1分半減期
の湿度171°C)
(発明の効果)
本発明のヒートシール用接着剤は、耐オ“〜性と接着性
に優れ、幅広い湿度で使用可能である。0Ht-0-00GjsHaSI(OCHs)s*4・
・・Same as above + H2N 02 H4NU Cs I (6
S! (QC! H3)! *5: Manufactured by Nippon Oil & Fats Co., Ltd.
Trade name: t-butylperoxyisopropyl carbonate (1 minute half-life, humidity 158°C) *6... Same as above, dicumyl peroxide (1 minute half-life, humidity 171°C) (Effects of the invention) Heat-sealing adhesives have excellent odor resistance and adhesive properties, and can be used in a wide range of humidity.
第1図及び第2図は、本発明の実施例と比較例における
、湿度と接着強度の関係を示すグラフである。
°吐°二′FIGS. 1 and 2 are graphs showing the relationship between humidity and adhesive strength in Examples and Comparative Examples of the present invention. °discharge °2'
Claims (1)
0重量%グラフト化してなるポリエチレン、ポリプロピ
レン、エチレン−酢酸ビニル共重合体、エチレン−アク
リル酸エチルコポリマーの1種または2種以上100重
量部に、シラン系カップリング剤0.1〜5重量部を混
合してなるヒートシール用接着剤。 2、1分半減期の温度が100〜180℃である有機過
酸化物を0.05〜3重量%配合してなる特許請求の範
囲第1項記載のヒートシール用接着剤。[Claims] 1. Maleic acid and/or acrylic acid from 0.5 to 1
0.1 to 5 parts by weight of a silane coupling agent to 100 parts by weight of one or more of 0% by weight grafted polyethylene, polypropylene, ethylene-vinyl acetate copolymer, and ethylene-ethyl acrylate copolymer. Heat sealing adhesive made by mixing. 2. The adhesive for heat sealing according to claim 1, which contains 0.05 to 3% by weight of an organic peroxide having a 1-minute half-life temperature of 100 to 180°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31933587A JPH01161079A (en) | 1987-12-17 | 1987-12-17 | Adhesive for heat sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31933587A JPH01161079A (en) | 1987-12-17 | 1987-12-17 | Adhesive for heat sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161079A true JPH01161079A (en) | 1989-06-23 |
Family
ID=18109028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31933587A Pending JPH01161079A (en) | 1987-12-17 | 1987-12-17 | Adhesive for heat sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161079A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004113066A1 (en) * | 2003-06-23 | 2004-12-29 | Usinor | A metal-cured polyethylene-metal laminate |
| EP1712604A4 (en) * | 2004-02-03 | 2008-07-30 | Asahi Glass Co Ltd | ADHESIVE COMPOSITION AND GLASS PLATE COMPRISING MOLDING MADE OF THERMOPLASTIC ELASTOMER |
| JP2010059319A (en) * | 2008-09-04 | 2010-03-18 | Sunstar Engineering Inc | Polyolefinic adhesive composition |
| US20110209760A1 (en) * | 2007-10-04 | 2011-09-01 | Antonio Bonucci | Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system |
| WO2012144838A3 (en) * | 2011-04-19 | 2013-01-10 | 주식회사 엘지화학 | Olefin-based ionomer resin composition |
-
1987
- 1987-12-17 JP JP31933587A patent/JPH01161079A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004113066A1 (en) * | 2003-06-23 | 2004-12-29 | Usinor | A metal-cured polyethylene-metal laminate |
| EP1712604A4 (en) * | 2004-02-03 | 2008-07-30 | Asahi Glass Co Ltd | ADHESIVE COMPOSITION AND GLASS PLATE COMPRISING MOLDING MADE OF THERMOPLASTIC ELASTOMER |
| US20110209760A1 (en) * | 2007-10-04 | 2011-09-01 | Antonio Bonucci | Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system |
| US9595626B2 (en) * | 2007-10-04 | 2017-03-14 | Saes Getters S.P.A. | Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system |
| JP2010059319A (en) * | 2008-09-04 | 2010-03-18 | Sunstar Engineering Inc | Polyolefinic adhesive composition |
| WO2012144838A3 (en) * | 2011-04-19 | 2013-01-10 | 주식회사 엘지화학 | Olefin-based ionomer resin composition |
| US8981011B2 (en) | 2011-04-19 | 2015-03-17 | Lg Chem, Ltd. | OLEFIN-based ionomer resin composition |
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