JPH01145900A - Electronic component mounting method - Google Patents

Abstract

PURPOSE:To form electronic component mounting data in a short time as effective electronic component mounting data by incorporating component data as data base in a computer. CONSTITUTION:A mounting method of an electronic component includes storing mounting data necessary in case of mounting components in a storage unit in advance, calling the data corresponding to a predetermined component from the storage unit when mounting the predetermined component, and mounting the predetermined component at a predetermined position on a substrate. When the mounting data is formed, whether the component data to be mounted is contained in the data base in the computer or not at present is first checked. If it is not contained in the data base, data of the component to be mounted is formed in the data base. Then, data in which component name (name of parts) are formed in the order of mounting to the substrate to be mounted with the component. Thereafter, the computer is used to retrieve and record the component name (number of component), and starts retrieving the data from the data base. When the data is discovered, it is removed from the data base, and component mounting data are automatically generated.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an electronic component mounting method for mounting electronic components on an object to be mounted such as a board, and particularly relates to an effective method for creating electronic component mounting data. be.

Prior Art Before explaining the conventional technology, electronic component mounting data will be explained. FIG. 8 is a schematic explanatory diagram of an electronic component mounting machine.

In FIG. 8, 1 is a component supply section, 2 is a board, 3 is a component mounting head, and 4 is an XY table. Electronic components sent from the component supply section by the component mounting head are mounted by moving the X-Y table to a mounting position on the board. This series of operations requires mounting information data including the mounting head height, X-Y table, and mounting head speed during electronic component mounting, specification of adhesive application amount and application method, and application time. Coating information data using the X-Y table and the speed of the coating head as information,
Electronic component supply data that uses the sensor value to determine whether the electronic component was successfully taken out from the component supply section and the type of mounting head depending on the size of the component, and the electronic component supply data. Electronic component mounting data includes recognition data for correcting the mounting position of components or inspecting the board and components based on misalignment of the components when mounted on the circuit board, and electronic component supply format information data that contains information on the supply format of electronic components. It is. Hereinafter, an example of a conventional method for creating electronic component mounting data will be described with reference to the drawings.

FIG. 7 is a flowchart showing the process of conventional data creation. First, the data creator checks whether existing data materials can be used for the electronic component mounting data (step 16). If possible, use the existing one (Step 17), investigate the mounting position data, and manually input each piece of data to complete the creation of the electronic component mounting data. In addition, if there is no existing data or if existing data materials cannot be used, empirically determine the electronic component mounting data (step 18), and operate the electronic component mounting machine based on that data (step 19). . If the result is not acceptable (step 20), the process of applying feedback to re-determine the electronic component mounting data and operating the electronic component mounting machine is repeated until the component mounting condition becomes good. If the condition is satisfactory, the electronic component mounting data at that time is left as a document (step 21). This completes the creation of electronic component mounting data, and the components are mounted on the board using this data.

Problems to be Solved by the Invention However, with the method described above, it is possible to create electronic component mounting position coordinate data, but mounting information data, coating information data, electronic component supply data, recognition data, and electronic component supply form are not possible. The problem was that the time-consuming process of researching information data and inputting it one by one by hand was inevitable.

The present invention aims to significantly reduce the time required for this time-consuming process by automatically generating electronic component mounting data by storing component data as a database inside a computer. This is the implementation method.

Means for Solving the Problems In order to solve the above problems, the electronic component mounting method of the present invention is a method of mounting multiple types of components at predetermined positions on a board. The first step is to store the necessary mounting data in the storage section, and the second step is to load the mounting data corresponding to the component from the storage section when mounting a predetermined component. This process consists of a third step of mounting at the location.

Effects The present invention has the above-described configuration, and by having component data grouped by component form, size, and component name as a database inside a computer, the mounting data can be automatically processed once the mounting order of electronic components is clear. Since it is now possible to generate electronic component mounting data, the traditional time-consuming work process of having humans investigate the actual values of electronic component mounting data and manually input them is no longer necessary, and it is possible to generate electronic component mounting data effectively in a short time. It becomes possible to create.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 shows a procedure for creating electronic component mounting data according to the present invention. First, it is checked whether there is part data to be mounted in the database currently in the computer (step 1). If the corresponding data does not exist in the database, create data for the electronic component to be mounted in the database (step 2). Next, data is created in which component names (product numbers) are arranged in the order of mounting on the board on which the electronic components are to be mounted (step 3). Next, using a computer, the part name (product number) is used as a search record to start searching for the corresponding data in the database. When relevant data is found, it is retrieved from the database and electronic component mounting data is automatically generated.

The details of steps 2 to 4 in FIG. 1 will be explained below.

FIG. 2 is a flowchart showing the procedure for creating component data in step 2. First, all parts are classified according to their shape (step 5). This clarifies the supply form of υ parts. Next, the individual data classified in the step 6 is further classified according to external dimensions (step 6). This classification clarifies the amount of adhesive applied, the application method, the speed of the table that moves the board, the speed of the application head, the speed, height, and type of the mounting head, and sensor values for determining electronic component supply errors. Become. Furthermore, the individual data classified in the step 6 is classified by part name (product number) (step 7). This classification clarifies the recognition data for correcting and inspecting the board and parts. The component data created as described above is stored as a database in the computer with the data structure shown in FIG.

FIG. 3 is a flowchart showing the procedure for creating mounting order component name data in step 3. The board on which the electronic components are to be mounted and the order in which the electronic components are to be mounted are determined (step 8).

Next, data on mounted component names is created in correspondence with the mounting order determined in step 8 (step 9). In addition to the component name, the mounted component name data includes mounting/coating position coordinates and mounting/coating direction (FIG. 6).

FIG. 4 is a flowchart showing the procedure for automatically creating electronic component mounting data in step 4. First, the part name (product number)
Execute a search using and retrieve the relevant parts data (
Step 10). Next, from the component data extracted in step 10, mounting information data, coating information data, electronic component supply data, electronic component supply form information data, and recognition data are extracted and compiled to create electronic component mounting data. Automatic generation is performed (steps 11-15).

Note that in the above embodiment, the necessary electronic component mounting data is created all at once and then the components are mounted on the board, but the process of creating mounting data for each individual component one by one and mounting the components on the board is repeated 9 times. You may return it.

Effects of the Invention As described above, the present invention allows electronic component mounting data to be created in a short time and effectively by storing component data in a computer as a database.

[Brief explanation of the drawing]

FIG. 1 is a flowchart of a data creation method for an electronic component mounting method according to an embodiment of the present invention, and FIG. 2 is a flowchart showing an embodiment of a database creation procedure.
3 is a flowchart showing an example of the procedure for creating mounting order component name data, FIG. 4 is a flowchart showing an example of the procedure for automatically generating electronic component mounting data, and FIG. 6 is a flowchart showing an example of the procedure for automatically generating electronic component mounting data. FIG. 6 is an explanatory diagram showing the contents of component data according to an embodiment; FIG. 6 is an explanatory diagram showing the contents of component mounting order data on a board according to an embodiment; FIG. 7 is a flowchart diagram showing an example of a conventional technique; FIG. 8 is a schematic perspective view of the electronic component mounting machine. 1... Parts supply section, 2... Board, 3.
...Component mounting head, 4...X-Y table. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure K Figure 7 Figure 8

Claims (2)

[Claims] (1) A method for mounting multiple types of components at predetermined positions on a board, which includes a first step of storing necessary mounting data for each component in a storage unit in advance, and mounting the predetermined components. An electronic component mounting method comprising a second step of loading mounting data corresponding to this component from a storage unit, and a third step of mounting a predetermined component at a predetermined position on a board. (2) Mounting data includes mounting information data that includes the height of the mounting head during electronic component mounting, the table that fixes the object to be mounted, and the speed of the mounting head, specification of the coating amount and method, and the object to be mounted. Dispensing information data that includes the speed of the table and coating head for fixing the electronic components, electronic component supply data that includes sensor values for determining electronic component supply errors and the type of mounting head, and correction and inspection of boards and components. The electronic component mounting method according to claim 1, characterized in that the recognition data to be carried out is electronic component supply form information data in which the format of electronic component supply is information.