JPH01132074A - IC socket - Google Patents
IC socketInfo
- Publication number
- JPH01132074A JPH01132074A JP29131387A JP29131387A JPH01132074A JP H01132074 A JPH01132074 A JP H01132074A JP 29131387 A JP29131387 A JP 29131387A JP 29131387 A JP29131387 A JP 29131387A JP H01132074 A JPH01132074 A JP H01132074A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- frame
- present
- dip
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connecting Device With Holders (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ＤＩＰ、５ＤＩＰタイプのＩＣをプリント
基板等ｔこ取り付ける際に用いるソケット（こ関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a socket used when attaching a DIP or 5DIP type IC to a printed circuit board or the like.
第４図は従来のＤＩＰ、５ＤＩＰタイプＩＣの着脱が可
能なソケットの一例である１図において（１）はソケッ
ト本体、（２）はＩＣのリードを差し込むための電極で
ある。このソケットにＩＣを取り付ける場合は、ＩＣの
リードと電極（２）の位置を合せ、ＩＣを押し込む・ま
た・ ＩＣを外す場合には、ＩＣを引き抜けば外すこと
ができる。FIG. 4 is an example of a conventional DIP or 5DIP type IC socket that can be attached and detached. In FIG. 1, (1) is the socket body, and (2) is an electrode into which an IC lead is inserted. When attaching an IC to this socket, align the IC leads and electrodes (2) and push the IC in. To remove the IC, pull it out.
従来のソケットでは、ＩＣを素手でソケットから引き抜
く作業はあまシ容易とは言えない。ＩＣをソケットから
抜くには均等に真上へ引き抜かなければならないが、こ
の作業にはかなシの握力等が必要なため、容易な作業と
は言えず、ＩＣのリードを曲げてしまうことがしばしば
ある。また、最悪の場合、リードを完全に折ってしまい
、ＩＣを破損させてしまうといった事態すら発生する。With conventional sockets, it is not easy to pull out an IC from the socket with bare hands. To remove the IC from the socket, it must be pulled straight upwards evenly, but this process requires a great deal of grip strength, so it is not an easy task and often ends up bending the IC leads. be. Furthermore, in the worst case, the lead may be completely broken and the IC may be damaged.
この発明は上記のような問題点を解消するためになされ
たもので、ＩＣを容易にかつ破損させることなく取り外
すことのできるソケットを得ることを目的とする。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a socket from which an IC can be easily removed without damaging the socket.
″この発明に係るＤＩＰ、５ＤＩＰタイプのＩＣ用ソケ
ットは、ＩＣを取り外すための装置を付加したものであ
る。``The DIP and 5DIP type IC sockets according to the present invention have an additional device for removing the IC.
Ｃ作用〕
この発明におけるＩＣ用ソケットは、ＩＣを取り外すた
めの装置を付加したことｌζより、ＩＣを容易に１かつ
破損させることなく取り外すことを可能にする。C Effect] Since the IC socket of the present invention is equipped with a device for removing the IC, it is possible to easily remove the IC without damaging it.
以下、この発明の一実施例を図によって説明する。第１
図はＩＣソケットの三面図、第２図はＩＣソケットから
ＩＣを引抜く主要ａｍを示す斜視図、第８図はＩＣソケ
ットからＩＣを引抜く動作を示す側面図である１図にお
いて（１）はソケット本体、（２）は電極、（３）はフ
レームＡ １（４）はフレームＢ１（５）はプレート、
（６） （７）は支点、（８１（９）およびαＯ（ロ）
はそれぞれフレームＡ（３）およびフレームＢ（４）の
端末にあるつまみ部、（財）はこのソケットに挿入する
ＩＣである。プレート（６）はフレームＡ（３）と、フ
レームＢ（４）に支点（６） （７）を軸として回転し
得るよう支持されている。ＩＣ（ロ）を取り外すために
はつまみ部（８）（９）αＧ（ロ）を同時に両手の指で
はさむように図中の矢印方向へ押す、第８図（ａ）はＩ
Ｃ（２）が挿入された状ａ、（ｂ）はこの作業によ）Ｉ
Ｃがソケットよシ外された状態を示す。フレームＡ（３
）、フレームＢ（４）の動きによシブレート（５）が上
へと励きＩＣ（２）を持ち上げ、ソケットよシ取）外す
。この際支点ｆ６） （７）は図中の点線矢印方向、す
なわち真上へと動き、プレート（５）とＩＣ（財）が接
触している面上の任意の点は、いずれも均一に真上へと
上がる。したがってＩＣに）のどのリードも均一に真上
へとソケットから引き抜かれ、不必要にリードを曲げて
しまうことはない。Hereinafter, one embodiment of the present invention will be described with reference to the drawings. 1st
Figure 2 is a three-sided view of the IC socket, Figure 2 is a perspective view showing the main part that pulls out the IC from the IC socket, and Figure 8 is a side view showing the operation of pulling out the IC from the IC socket. is the socket body, (2) is the electrode, (3) is the frame A1 (4) is the frame B1 (5) is the plate,
(6) (7) is the fulcrum, (81 (9) and αO (b)
are knobs located at the terminals of frame A (3) and frame B (4), respectively, and (b) is an IC to be inserted into this socket. The plate (6) is supported by the frame A (3) and the frame B (4) so as to be rotatable about the fulcrums (6) and (7). To remove the IC (b), hold the tabs (8), (9), αG (b) between both fingers at the same time and push in the direction of the arrow in the figure.
C (2) inserted state a, (b) is due to this operation)I
C shows a state in which the socket is removed. Frame A (3
), the movement of frame B (4) forces the sib plate (5) upwards, lifts the IC (2), and removes it from the socket. At this time, the fulcrum f6) (7) moves in the direction of the dotted arrow in the figure, that is, directly upward, and any point on the surface where the plate (5) and the IC are in contact is uniformly aligned. Go up. Therefore, all the leads (of the IC) are evenly pulled straight up and out of the socket without unnecessarily bending the leads.
以上のように、この発明によればＤＩＰ、５ＤＩＰタイ
プのＩＣ用ソケットに、ＩＣを取り外すための装置を付
加したので、ＩＣを物損させることなく容易にソケット
から取り外すことのできる効果がある。As described above, according to the present invention, since a device for removing an IC is added to a DIP or 5DIP type IC socket, there is an effect that the IC can be easily removed from the socket without causing property damage.
第１図はこの発明の一実施例によるＩＣ用ソケットの三
面図、第２図はＩＣソケットからＩＣを引抜く主要機構
を示す斜視図１第８図はＩＣソケットか−らＩＣを引抜
く動作を示す側面図、第４図は従来のＩＣ用ソケットを
示した図である・図において（１）はソケット本体、（
２）は電極、（３）はフレームＡｓ （４）はフレーム
Ｂ、 （５）はプレート、（６）（７）は支点、（８）
（９）α（ＩＣ旧よつまみ部、（２）はＩＣである。
なお、図中、同一符号は同一、又は相当部分を示す。Figure 1 is a three-sided view of an IC socket according to an embodiment of the present invention. Figure 2 is a perspective view showing the main mechanism for pulling out an IC from the IC socket. Figure 8 is the operation of pulling out an IC from the IC socket. 4 is a side view showing a conventional IC socket. In the figure, (1) is the socket body, (
2) is the electrode, (3) is the frame As, (4) is the frame B, (5) is the plate, (6) and (7) is the fulcrum, (8)
(9) α (old IC knob, (2) is an IC. In the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
シユリンクデュアルインラインパツケージ）等のＩＣを
基板等に取り付ける際に用いる、ＩＣの着脱が可能なソ
ケットにおいて、ＩＣの取り外しを容易にし、ＩＣを破
損させることなく取り外すことのできる装置を備えたこ
とを特徴とするＩＣ用ソケット。DIP (Dual Inline Package) SDIP (
A removable socket used to attach an IC such as a Shrink Dual Inline Package to a board, etc., is equipped with a device that facilitates the removal of the IC and allows it to be removed without damaging the IC. Characteristic IC socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29131387A JPH01132074A (en) | 1987-11-17 | 1987-11-17 | IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29131387A JPH01132074A (en) | 1987-11-17 | 1987-11-17 | IC socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01132074A true JPH01132074A (en) | 1989-05-24 |
Family
ID=17767283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29131387A Pending JPH01132074A (en) | 1987-11-17 | 1987-11-17 | IC socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01132074A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5389001A (en) * | 1992-08-10 | 1995-02-14 | The Whitaker Corporation | Card ejecting mechanism |
| US5707245A (en) * | 1994-06-07 | 1998-01-13 | The Whitaker Corporation | Card connector with an ejection mechanism and a flexible printed circuit harness therefor |
| US5980284A (en) * | 1997-05-19 | 1999-11-09 | Hon Hai Precision Ind. Co., Ltd. | Ejector mechanism for a memory card connector |
| JP2007258151A (en) * | 2006-03-20 | 2007-10-04 | Hon Hai Precision Industry Co Ltd | Card connector |
| US7329132B1 (en) | 2006-07-31 | 2008-02-12 | Yazaki North America, Inc. | Low-insertion force-lever connector for blind mating |
-
1987
- 1987-11-17 JP JP29131387A patent/JPH01132074A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5389001A (en) * | 1992-08-10 | 1995-02-14 | The Whitaker Corporation | Card ejecting mechanism |
| US5707245A (en) * | 1994-06-07 | 1998-01-13 | The Whitaker Corporation | Card connector with an ejection mechanism and a flexible printed circuit harness therefor |
| US5899758A (en) * | 1994-06-07 | 1999-05-04 | The Whitaker Corporation | Flexible printed circuit harness |
| US5980284A (en) * | 1997-05-19 | 1999-11-09 | Hon Hai Precision Ind. Co., Ltd. | Ejector mechanism for a memory card connector |
| JP2007258151A (en) * | 2006-03-20 | 2007-10-04 | Hon Hai Precision Industry Co Ltd | Card connector |
| US7329132B1 (en) | 2006-07-31 | 2008-02-12 | Yazaki North America, Inc. | Low-insertion force-lever connector for blind mating |
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