JPH01126238A - Quartz glass member - Google Patents
Quartz glass memberInfo
- Publication number
- JPH01126238A JPH01126238A JP28252887A JP28252887A JPH01126238A JP H01126238 A JPH01126238 A JP H01126238A JP 28252887 A JP28252887 A JP 28252887A JP 28252887 A JP28252887 A JP 28252887A JP H01126238 A JPH01126238 A JP H01126238A
- Authority
- JP
- Japan
- Prior art keywords
- quartz glass
- strain
- nuclei
- glass member
- cristobalite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Melting And Manufacturing (AREA)
- Glass Compositions (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は石英ガラス部材、特には半導体工業用に用いら
れる石英ガラス製の炉芯管、ペルジャーなどとして有用
とされる半導体ウェーハの熱処理工程でもたわみ、変形
、そりを低減することのできる石英ガラス部材に関する
ものである。Detailed Description of the Invention (Field of Industrial Application) The present invention is applicable to the heat treatment process of semiconductor wafers, which are useful as quartz glass members, particularly quartz glass furnace core tubes and Pel jars used in the semiconductor industry. The present invention relates to a quartz glass member that can reduce deflection, deformation, and warpage.
(従来の技術)
半導体ウェーハの熱処理用治具としては高純度で高温に
耐えるということから石英ガラス部材が汎用されている
が、これについてはその使用中における変形、たわみ、
そりなどを防止する目的において石英ガラス部材の外表
面をクリストバライト層で被覆するということが提案さ
れている(特公昭47−1477号公報、同47−18
83号公報参照)。(Prior Art) Quartz glass members are commonly used as jigs for heat treatment of semiconductor wafers due to their high purity and ability to withstand high temperatures.
It has been proposed to coat the outer surface of a quartz glass member with a cristobalite layer for the purpose of preventing warping (Japanese Patent Publication No. 47-1477, No. 47-18).
(See Publication No. 83).
しかし、このクリストバライト層を有する石英ガラス管
の製造は、石英ガラス管上に粉末状の純粋なりリストパ
ル石をスプレーしたのち、これを火焔処理するかあるい
は炉中で加熱してこのクリストバル石を石英ガラス管表
面に焼付け、これを微細結晶層に成長させるように高温
下に長時間加熱するという工程で行われるために、処理
時間が長く、この工程中に石英ガラス管がつぶれるとい
う不利があるし、このようにして得られた石英ガラス管
にはこのクリストバライト層がダストの原因となるため
にクリーンルーム内で使用することができないという欠
点もある。However, in order to manufacture a quartz glass tube with a layer of cristobalite, pure or powdered listopalite is sprayed onto the quartz glass tube, and then this is treated with a flame or heated in a furnace to convert the cristobalite into quartz. The process involves baking the surface of the glass tube and heating it at high temperatures for a long time to grow it into a fine crystal layer, which has the disadvantage that the processing time is long and the quartz glass tube can be crushed during this process. However, the quartz glass tube thus obtained has the disadvantage that it cannot be used in a clean room because the cristobalite layer causes dust.
(発明の構成)
本発明はこのような不利を解決した石英ガラス部材に関
するもので、これはガラス層中に高温下でクリストバラ
イト結晶に成長し得る、大きさが5〜1+ OOOgm
のひずみ核を多数存在せしめてなることを特徴とするも
のである。(Structure of the Invention) The present invention relates to a quartz glass member which solves such disadvantages, and which has crystals of 5 to 1+ OOOgm in size that can grow into cristobalite crystals at high temperatures in the glass layer.
It is characterized by the presence of a large number of strain nuclei.
すなわち、本発明者は半導体工業用に使用される石英ガ
ラス製品の加熱使用時における変形、たわみ、そりなど
に伴う事故を防止する方法について種々検討した結果、
石英ガラス層中にひずみ核を形成し、これを半導体工業
用に高温下で使用するとこのひずみ核が比較的すみやか
にクリストバライト結晶に成長するのでこの石英ガラス
部材は機械的強度の大きいものになり、高温使用時にお
いても変形、たわみ、そりなどが生じなくなるというこ
とを見出し、このひずみ核の形成方法、ひずみ核の好ま
しい態様などについての研究を進めて本発明を完成させ
た。That is, as a result of various studies conducted by the present inventor on methods for preventing accidents caused by deformation, deflection, warping, etc. during heating of quartz glass products used in the semiconductor industry,
When strain nuclei are formed in the quartz glass layer and used at high temperatures in the semiconductor industry, these strain nuclei grow into cristobalite crystals relatively quickly, resulting in the quartz glass member having high mechanical strength. It was discovered that deformation, deflection, warpage, etc. do not occur even when used at high temperatures, and the present invention was completed by conducting research on methods for forming strain nuclei and preferred embodiments of strain nuclei.
本発明の石英ガラス部材は従来公知の方法で作られた石
英ガラス製品を始発材として用いればよい、したがって
、これは天然水晶の溶融、またはけい素化合物の加水分
解、熱分解などで得た石英ガラス母材を加熱成形するこ
とによって作ったものとすればよく、これはまた透明あ
るいは微細気泡入りの半透明のいずれでもよい。なお、
通常このものは透明のものとされるが、微細気泡入り半
透明のものは気泡によって半透明となっているだけで純
度が低いものではなく、これはNa、K。For the quartz glass member of the present invention, a quartz glass product made by a conventionally known method may be used as a starting material. It may be made by thermoforming a glass matrix, which may also be transparent or translucent with microbubbles. In addition,
Normally, this material is considered to be transparent, but the translucent material containing microbubbles is only translucent due to the bubbles, and is not low in purity.
Liなどのアルカリ金属含有量はそれぞれtppm以下
のものである。また、このものは微細気泡によって加熱
時の均熱効果を高めるという効果をもっており、さらに
この気泡が楕円球状のものであるものはその配位方向に
よってその均熱効果をさらに高めるものであるので、こ
れを使用してもよいがこの泡の大きさは楕円球状のもの
については長径が15〜1,0001IMのもの、真球
であれば直径が10〜100即のものとすればよい。The content of alkali metals such as Li is tppm or less. In addition, this product has the effect of increasing the heat-uniforming effect during heating due to the fine bubbles, and furthermore, when the bubbles are in the shape of an ellipsoid, the direction of arrangement of the bubbles further enhances the heat-uniforming effect. Although this may be used, the size of the bubble may be such that an ellipsoidal bubble has a major axis of 15 to 1,0001 IM, and a true sphere has a diameter of 10 to 100 mm.
この石英ガラス部材にひずみ核を形成させるには例えば
石英ガラス成形品の表面に核形成剤を付着させて加熱処
理すればよい、このひずみ核形成剤としては例えば亜鉛
、マグネシウム、カルシウム、ジルコニウム、すす、は
う素、アルミニウム、りん、2アンチモンおよび/また
はこれらの元素の一つの化合物が適しているが、これは
その添加量が少なすぎると植成形が少なくなり、多すぎ
ると石英ガラス部材の表面が失透する。In order to form strain nuclei in this quartz glass member, for example, a nucleating agent may be attached to the surface of the quartz glass molded product and heat treated. Examples of this strain nucleating agent include zinc, magnesium, calcium, zirconium, soot, etc. , boronic acid, aluminum, phosphorus, diantimony and/or a compound of one of these elements are suitable; however, if the amount added is too small, the implantation will be reduced, and if the amount is too large, the surface of the quartz glass member will be damaged. becomes devitrified.
また、この加熱処理はこの石英ガラス部材を直接火焔で
加熱するか電気炉中で加熱すればよいが、この加熱温度
は1,000℃以下では核形成が行われないので1.O
OO’C以上、好ましくは1.200〜1,300℃ト
シ、コノ温度で10分〜10時間加熱するようにすれば
よく、この成形品が管状体で高温加熱によって管がつぶ
れるおそれがある場合にはこの成形品を適宜回転させる
ことがよい。In addition, this heat treatment can be performed by heating the quartz glass member directly with a flame or in an electric furnace, but nucleation does not occur at a heating temperature of 1,000°C or lower, so 1. O
The molded product may be heated for 10 minutes to 10 hours at a temperature of OO'C or above, preferably 1.200 to 1,300 degrees Celsius.If the molded product is a tubular body and there is a risk that the tube may collapse due to high temperature heating. It is advisable to rotate this molded product appropriately.
このように処理された石英ガラス部材はその表面に付着
した核形成剤がガラス層内に浸透し、加熱によってガラ
ス層内に核が形成されるのであるが、このひずみ核はそ
の大きさが5μ霧以下のものではクリストバライト結晶
に成長するのに長時間を要するので効果がない、一方、
1.OOOIlmよりも大きくなるともはや本発明が目
的とするひずみ核ではなく、すでにクリストバライト結
晶層をもった石英ガラス部材製品となってしまうので、
本発明におけるひずみ核は1,00oII11以下のも
のとされる。The nucleating agent attached to the surface of the quartz glass member treated in this way penetrates into the glass layer, and nuclei are formed within the glass layer by heating, but these strain nuclei have a size of 5 μm. If it is less than fog, it will take a long time to grow into cristobalite crystals, so it will not be effective.
1. If it is larger than OOOIlm, it will no longer be the strain nucleus that is the object of the present invention, but will become a quartz glass member product that already has a cristobalite crystal layer.
The strain nucleus in the present invention is 1,00oII11 or less.
このひずみ核を含有する石英ガラス部材は高温時におけ
る機械的強度の大きいものになるのであるが、そのひず
み核は外表面から100μ−の深さのところに存在して
いればよい。ひずみ核の存在数についてはこれが核とな
ってクリストバライト結晶が成長されるものであること
がら、あまり少なくては効果が薄くなり、10,000
個/IIa3以上とすると外表面までクリストバライト
となってしまってダストの原因となり、クリーンルーム
内で使用することができなくなるので、ll1I113
当り10〜10,000個、好ましくは100〜5,0
00個の範囲となるようにすることがよい。A quartz glass member containing these strain nuclei has a high mechanical strength at high temperatures, but the strain nuclei only need to be present at a depth of 100 .mu.- from the outer surface. Regarding the number of strain nuclei present, since these serve as nuclei for the growth of cristobalite crystals, if there are too few, the effect will be weak,
If it exceeds 1/IIa3, the outer surface will become cristobalite and cause dust, making it impossible to use it in a clean room.
10-10,000 pieces per unit, preferably 100-5,000 pieces
It is preferable that the number is in the range of 00.
(発明の効果)
本発明の石英ガラス部材はそのガラス層中に高温下でク
リストバライト結晶に成長するひずみ核を含有している
ので、これを半導体工業におけるウェーハ処理用などに
使用するとこの処理が比較的高温で行われることからこ
のガラス層中にクリストバライト結晶が比較的すみやか
に成長し、これによって機械的強度の大きいものとなる
ので、これが使用中にたわんだり、変形したり、そると
いうことがなくなるという有利性をもつものである。(Effects of the Invention) The quartz glass member of the present invention contains strain nuclei that grow into cristobalite crystals at high temperatures in its glass layer, so when it is used for wafer processing in the semiconductor industry, this processing Since the process is carried out at a relatively high temperature, cristobalite crystals grow relatively quickly in this glass layer, resulting in high mechanical strength, which prevents it from bending, deforming, or warping during use. It has this advantage.
(実施例)
つぎに本発明の実施例、比較例をあげる6実施例1〜5
、比較例1〜4
天然水晶を酸水素火焔で溶融して外径202m。(Example) Next, examples of the present invention and comparative examples are given below. 6 Examples 1 to 5
, Comparative Examples 1 to 4 Natural crystal was melted with an oxyhydrogen flame to obtain an outer diameter of 202 m.
厚さ6■の透明石英ガラス製炉芯管1を作り、また天然
石英を電気溶融して微細気泡入りの半透明な石英ガラス
製炉芯管2を作った。一方、上記と同様にして作った炉
芯管1および2についてこれらの外表面にアルミニウム
イオンを含む酸性溶液を塗布し、ついで加熱処理するこ
とにより、外表面から75.のどころのアルミニウム平
均濃度が200ppmである透明石英ガラス製炉芯管3
1、および微細気泡入り半透明の石英ガラス製炉芯管4
を作った。A transparent quartz glass furnace core tube 1 with a thickness of 6 cm was made, and a translucent quartz glass furnace core tube 2 containing microbubbles was also manufactured by electrically melting natural quartz. On the other hand, by applying an acidic solution containing aluminum ions to the outer surfaces of the furnace core tubes 1 and 2 made in the same manner as described above, and then heat-treating them, 75. Transparent quartz glass furnace core tube 3 with an average aluminum concentration of 200 ppm
1, and a translucent quartz glass furnace core tube 4 with microbubbles
made.
つぎに、この炉心管3.4から長さ20mのリングを切
り出してリングI、リング■を作り、このリングを箱型
電気炉内の石英ガラス炉床板上に横向きに置き、1,2
50”Cで10時間または1.300℃で30分間加熱
してから取り出し冷却したものについてこれらのリング
中に存在するひずみ核の平均濃度、ひずみ核の大きさを
測定し、外観をしらべると共に、これらのリングについ
てはこれを箱型電気炉中に立てN入れ1,200℃で1
20時間加熱したときのリングのつぶれ量を測定したと
ころ、第1表に示したとおりの結果が得られた。Next, rings 20 m in length were cut out from this furnace core tube 3.4 to make rings I and ring ■, and these rings were placed horizontally on a quartz glass hearth plate in a box-type electric furnace.
The rings were heated at 50"C for 10 hours or 1.300℃ for 30 minutes, then taken out and cooled. The average concentration of strain nuclei present in these rings and the size of the strain nuclei were measured, and the appearance was examined. For these rings, place them in a box-type electric furnace and put them in N at 1,200°C.
When the amount of crushing of the ring was measured after heating for 20 hours, the results shown in Table 1 were obtained.
つぎに比較のために上記における透明石英ガラス製炉芯
管3から得られたリング■を加熱処理しないもの(比較
例1)、リング■を箱型電気炉中に横向きにおいて1,
350℃で24時間加熱したもの(比較例2)について
、そのリング中に存在しているひずみ核の平均濃度、ひ
ずみ核の大きさ、外観をしらべると共に、上記と同じ加
熱条件におけるリングのつぶれ量を測定したところ、第
1表に併記したとおりの結果が得られた。Next, for comparison, the ring ■ obtained from the above transparent quartz glass furnace core tube 3 was not heat-treated (Comparative Example 1), and the ring ■ was placed horizontally in a box electric furnace.
Regarding the ring heated at 350°C for 24 hours (Comparative Example 2), we investigated the average concentration of strain nuclei present in the ring, the size of the strain nucleus, and the appearance, as well as the amount of collapse of the ring under the same heating conditions as above. When measured, the results shown in Table 1 were obtained.
また、横型管状炉に装着し、この炉内で半導体シリコー
ンウェーへの熱処理を1,200℃で2.000時間行
なったところ、第2表に示したように1,250℃で1
0時間熱処理したもの(実施例3,4)はひずみ核の発
生が適性であり、したがってクリストバライト結晶の成
長も適度であり、これによって機械的強度が大きくなっ
ているのでウェーハ処理中にたわみ、変形、そりなどが
生じなかったが、ひずみ核を発生させていない炉芯管3
(比較例3)はクリストバライト結晶の成長が始まる前
の速い時期につぶれてしまい。In addition, the semiconductor silicone wafer was installed in a horizontal tubular furnace and heat treated at 1,200°C for 2,000 hours in this furnace.
The wafers heat-treated for 0 hours (Examples 3 and 4) have appropriate generation of strain nuclei, and therefore appropriate growth of cristobalite crystals, which increases mechanical strength and prevents bending and deformation during wafer processing. , Furnace core tube 3 where no warping occurred, but no strain nuclei were generated.
(Comparative Example 3) was crushed at a rapid stage before cristobalite crystal growth started.
1.350”Cで24°時間処理したもの(比較例4)
は横型管状炉に装着する前に外表面がクリストバライト
層になっていたために、装着時にこれがダストの原因と
なり、ウェーへの歩留りが低下した。1. Treated at 350"C for 24 degrees (Comparative Example 4)
Since the outer surface of the wafer had a cristobalite layer before it was installed in the horizontal tube furnace, this caused dust when it was installed, reducing the yield of wafers.
なお、上記で得た透明石英炉芯管1の外表面に塩化アル
ミニウムの10重量%溶液を塗布し、さらにバーナーで
焼き仕上げをした炉芯管から長さ20mmのリングを切
り出し、箱型電気炉内において1,250℃で10時間
加熱したのち、大気中で冷却し、このリングの外表面か
ら低速カッターを用いて厚さ100pのガラス片を切り
出して、このものについての偏光顕微鏡写真をオリンパ
ス社製の実体顕微鏡の偏光装置を用いて倍率40倍で撮
影したところ、このひずみ核について第1図に示したと
おりの′結果が得られ、この箱型電気炉における加熱を
1,200℃で5時間としたものについては第2図に示
したとおりの結果が得られた。In addition, a 10% by weight solution of aluminum chloride was applied to the outer surface of the transparent quartz furnace core tube 1 obtained above, and a ring with a length of 20 mm was cut out from the furnace core tube that had been baked with a burner. After heating the ring at 1,250°C for 10 hours, it was cooled in the air, and a 100p thick piece of glass was cut from the outer surface of the ring using a low-speed cutter. When the strain nuclei were photographed at a magnification of 40 times using a polarization device of a stereomicroscope made by Komatsu, the results shown in Fig. 1 were obtained. As for time, the results shown in Figure 2 were obtained.
第1図は実施例における透明石英炉芯管の外表面に塩化
アルミニウム溶液を塗布し、焼き上げてから切り出した
リングを1,250℃で10時間加熱処理したものから
切り出したガラス片の偏光顕微鏡写真を示したものであ
り、第2図はこの加熱を1,200℃で5時間としたガ
ラス片の偏光顕微鏡写真を示したものである。Figure 1 is a polarized light micrograph of a glass piece cut from a ring that was cut out after applying an aluminum chloride solution to the outer surface of the transparent quartz furnace core tube and baking it in an example, and then heat-treated at 1,250°C for 10 hours. Figure 2 shows a polarized light micrograph of a glass piece that was heated at 1,200°C for 5 hours.
Claims (1)
し得る、大きさが5〜1,000μmのひずみ核を多数
存在せしめてなることを特徴とする石英ガラス部材。 2、ひずみ核が外表面から100μmまでのガラス層中
に1mm^3当り10〜10,000個存在する特許請
求の範囲第1項記載の石英ガラス部材。 3、石英ガラス部材が透明もしくは微細気泡入りの半透
明な炉芯管である特許請求の範囲第1項または第2項記
載の石英ガラス部材。[Scope of Claims] 1. A quartz glass member characterized in that a large number of strain nuclei having a size of 5 to 1,000 μm exist in a glass layer, which can grow into cristobalite crystals at high temperatures. 2. The quartz glass member according to claim 1, wherein 10 to 10,000 strain nuclei exist per 1 mm^3 in the glass layer up to 100 μm from the outer surface. 3. The quartz glass member according to claim 1 or 2, wherein the quartz glass member is a transparent or semitransparent furnace core tube containing microbubbles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28252887A JPH01126238A (en) | 1987-11-09 | 1987-11-09 | Quartz glass member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28252887A JPH01126238A (en) | 1987-11-09 | 1987-11-09 | Quartz glass member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01126238A true JPH01126238A (en) | 1989-05-18 |
| JPH0460934B2 JPH0460934B2 (en) | 1992-09-29 |
Family
ID=17653631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28252887A Granted JPH01126238A (en) | 1987-11-09 | 1987-11-09 | Quartz glass member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01126238A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04292440A (en) * | 1990-10-22 | 1992-10-16 | E I Du Pont De Nemours & Co | Chemically stable cristobalite |
| WO1996026908A1 (en) * | 1995-02-28 | 1996-09-06 | Heraeus Quarzglas Gmbh | Cristobalite-contained silica glass, method of producing same and silica glass jig made of same |
| US6641663B2 (en) | 2001-12-12 | 2003-11-04 | Heracus Shin-Estu America | Silica crucible with inner layer crystallizer and method |
| JP2005525284A (en) * | 2002-05-10 | 2005-08-25 | ゼネラル・エレクトリック・カンパニイ | Devitrified controlled fused silica articles |
| US7118789B2 (en) | 2001-07-16 | 2006-10-10 | Heraeus Shin-Etsu America | Silica glass crucible |
| JP2007073923A (en) * | 2005-08-12 | 2007-03-22 | Sumco Corp | Heat treatment jig for semiconductor silicon substrate and manufacturing method thereof |
| US7383696B2 (en) | 2005-09-08 | 2008-06-10 | Heraeus Shin-Etsu America, Inc. | Silica glass crucible with bubble-free and reduced bubble growth wall |
| US7427327B2 (en) | 2005-09-08 | 2008-09-23 | Heraeus Shin-Etsu America, Inc. | Silica glass crucible with barium-doped inner wall |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2038564A1 (en) * | 1970-08-04 | 1972-02-10 | Heraeus Schott Quarzsehmelze G | Quartz glass device part |
| JPS5210312A (en) * | 1975-07-10 | 1977-01-26 | Bayer Ag | Heattstable silica glass |
-
1987
- 1987-11-09 JP JP28252887A patent/JPH01126238A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2038564A1 (en) * | 1970-08-04 | 1972-02-10 | Heraeus Schott Quarzsehmelze G | Quartz glass device part |
| US3772134A (en) * | 1970-08-04 | 1973-11-13 | Heraeus Schott Quarzschmelze | Quartz glass elements |
| JPS5210312A (en) * | 1975-07-10 | 1977-01-26 | Bayer Ag | Heattstable silica glass |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04292440A (en) * | 1990-10-22 | 1992-10-16 | E I Du Pont De Nemours & Co | Chemically stable cristobalite |
| WO1996026908A1 (en) * | 1995-02-28 | 1996-09-06 | Heraeus Quarzglas Gmbh | Cristobalite-contained silica glass, method of producing same and silica glass jig made of same |
| EP0854116A3 (en) * | 1995-02-28 | 1999-01-07 | Heraeus Quarzglas GmbH | Cristobalite-contained silica glass, and silica glass jig made of same |
| US5876473A (en) * | 1995-02-28 | 1999-03-02 | Inaki; Kyoichi | Method of producing cristobalite containing silica glass |
| US7118789B2 (en) | 2001-07-16 | 2006-10-10 | Heraeus Shin-Etsu America | Silica glass crucible |
| US6641663B2 (en) | 2001-12-12 | 2003-11-04 | Heracus Shin-Estu America | Silica crucible with inner layer crystallizer and method |
| JP2005525284A (en) * | 2002-05-10 | 2005-08-25 | ゼネラル・エレクトリック・カンパニイ | Devitrified controlled fused silica articles |
| JP2007073923A (en) * | 2005-08-12 | 2007-03-22 | Sumco Corp | Heat treatment jig for semiconductor silicon substrate and manufacturing method thereof |
| US7383696B2 (en) | 2005-09-08 | 2008-06-10 | Heraeus Shin-Etsu America, Inc. | Silica glass crucible with bubble-free and reduced bubble growth wall |
| US7427327B2 (en) | 2005-09-08 | 2008-09-23 | Heraeus Shin-Etsu America, Inc. | Silica glass crucible with barium-doped inner wall |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0460934B2 (en) | 1992-09-29 |
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