JPH01119008A - Formation of ferromagnetic thin film - Google Patents
Formation of ferromagnetic thin filmInfo
- Publication number
- JPH01119008A JPH01119008A JP27659687A JP27659687A JPH01119008A JP H01119008 A JPH01119008 A JP H01119008A JP 27659687 A JP27659687 A JP 27659687A JP 27659687 A JP27659687 A JP 27659687A JP H01119008 A JPH01119008 A JP H01119008A
- Authority
- JP
- Japan
- Prior art keywords
- annealing
- thin film
- line
- substrate
- annealing time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Magnetic Record Carriers (AREA)
- Thin Magnetic Films (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は磁気記録媒体や高性能小型モーフ等に用いら
れる強磁性薄膜に係り、最大エネルギ積(BH)ma
xを大きくする形成方法に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a ferromagnetic thin film used in magnetic recording media, high-performance compact morphs, etc.
This invention relates to a forming method for increasing x.
(従来の技術)
大きな保磁力と最大エネルギ積(BH)maxを有する
SmCO5系磁石は機器の小型化に貢献するためその利
用が進められている。ところが。(Prior Art) SmCO5-based magnets, which have a large coercive force and a maximum energy product (BH) max, are being used more and more because they contribute to the miniaturization of devices. However.
この磁石は成形性と加工性が困難なため薄肉化や特殊形
状での使用ができない。そのため、液体急冷法、スパッ
タ法、スプレー法等により、任意の形状のfiv膜を形
成する研究が行われており、たとえば、スパッタ法の例
は、J、Appl。This magnet cannot be used in thin walls or special shapes because it is difficult to form and process. Therefore, research has been conducted to form FIV films of arbitrary shapes by liquid quenching, sputtering, spraying, etc. For example, an example of the sputtering method is J. Appl.
Phys、57 (6)15.March1982、
P、2147〜2154に示されている。Phys, 57 (6)15. March1982,
P, 2147-2154.
(発明が解決しようとする問題点)
磁気を利用した装置を高性能化、小型化する場合には最
大エネルギ積(BH)maxが大きく。(Problems to be Solved by the Invention) When improving the performance and downsizing of devices that utilize magnetism, the maximum energy product (BH) max is large.
たとえば10MGOe以上の値のものが必要であるが、
特に膜厚方向に異方性をそなえたもので最大エネルギ積
(BH)maxが上記の値を超えるものは前項文献に示
されているように得られていないのが現状である。For example, a value of 10 MGOe or more is required,
In particular, at present, as shown in the above-mentioned literature, a film with anisotropy in the film thickness direction and a maximum energy product (BH) max exceeding the above value has not been obtained.
この発明の目的は上記の問題点を解決した最大エネルギ
積(BH)ma xの高い膜厚方向に異方性をもつ膜の
形成方法を提供するものである。An object of the present invention is to provide a method for forming a film having a high maximum energy product (BH) max and anisotropy in the film thickness direction, which solves the above-mentioned problems.
(問題点を解決するための手段)
このため希土類金fism、Prの一種以上とCoから
なる合金薄膜をスパッタリング法により形成したのち、
膜厚方向の角形比が0.7以上のものを真空中もしくは
非酸化性ガス雰囲気中(例えばN2ガス中)で750〜
1000″Cの温度で10秒ないし300時間アニール
処理を行う。(Means for solving the problem) For this purpose, after forming an alloy thin film consisting of one or more of rare earth gold fism and Pr and Co by sputtering method,
Films with a squareness ratio of 0.7 or more in the film thickness direction are heated to 750 or more in vacuum or in a non-oxidizing gas atmosphere (for example, in N2 gas).
Annealing is performed at a temperature of 1000''C for 10 seconds to 300 hours.
(作用)
スパッタリング法により膜厚方向に異方性のついた膜を
上記の条件でアニールすることにより結晶化が計られる
と共に欠陥や不純物が粒内から除かれて、逆方向の磁区
が発生する核がなくなり。(Function) By annealing a film with anisotropy in the film thickness direction using the sputtering method under the above conditions, crystallization is achieved, defects and impurities are removed from the grains, and magnetic domains in opposite directions are generated. The nucleus is gone.
このため外部磁界が作用しても磁壁の移動が妨げられる
ので、高エネルギ積を有する膜厚方向に異方性をもった
膜が得られる。Therefore, even if an external magnetic field is applied, the movement of the domain walls is prevented, so that a film having a high energy product and anisotropy in the film thickness direction can be obtained.
(実施例)
第1図は本発明の垂直磁化膜を形成するための多極マグ
ネトロンスパッタリング装置の断面図である。真空容器
1の中にターゲット2を設け、これと対向させて25m
mの間隔を置き基板3を基板取付台4に配置している。(Example) FIG. 1 is a sectional view of a multipolar magnetron sputtering apparatus for forming a perpendicularly magnetized film of the present invention. A target 2 is provided in a vacuum container 1, and a distance of 25 m is set opposite to the target 2.
The substrates 3 are placed on a substrate mount 4 at intervals of m.
基)反3はヒータ6によって加熱することができ。Base) The paper 3 can be heated by the heater 6.
基板の温度をヒータ電源13によってコントロールする
ようにしである。ターゲット2と基板3の間にはスパッ
タリング初期に飛散する粒子が基板に付着するのを防ぐ
ためシャッタ5を配設しており、ターゲット2にはター
ゲット電a7によって直流電圧または高周波電圧を印加
できるようにしである。ターゲットの近傍にはフィラメ
ント8とアノード電極10を配置しフィラメント電源9
によりフィラメントを加熱し熱電子を発生させてアノー
ド電極lOへ集めるようにしており、フィラメント電源
9とアノード電源11によりターゲット電流は任意に変
えられるのでターゲット電圧とターゲット電流は独立に
変えることが可能である。The temperature of the substrate is controlled by a heater power source 13. A shutter 5 is provided between the target 2 and the substrate 3 to prevent particles scattered during the initial stage of sputtering from adhering to the substrate, and a DC voltage or high frequency voltage can be applied to the target 2 by a target electrode a7. It's Nishide. A filament 8 and an anode electrode 10 are arranged near the target, and a filament power source 9
The filament is heated to generate thermoelectrons, which are collected at the anode electrode lO.The target current can be changed arbitrarily by the filament power source 9 and the anode power source 11, so the target voltage and target current can be changed independently. be.
クーゲット2はSmが7原子%、Prが7原子%、Co
が86原子%の組成で各粉末を混合し。Kuget 2 contains 7 at% Sm, 7 at% Pr, and Co
Each powder was mixed with a composition of 86 at%.
真空中で焼結したものを用い、このターゲットをスパッ
タリング電極に取り付け、基板3を基板台4に設置した
後、真空容器内を排気系14により2X10−’Tor
r以下に排気する。ヒータ電源13を調整しながら基板
3を300°Cに加熱しておき、フィラメント電源9を
調整してフィラメント8を加熱した後、アルゴンガス導
入パルプ12を開いてアルゴンガスを導入し、圧力が8
×10−”To r rになるように調整した。アノー
ド電源11を調整してターゲット電流を0.5 Aにし
だ後2 シャッタ5を閉じたままターゲット電源7によ
り負の直流電圧300vを印加して15分間予備スパッ
タリングを行い、ターゲット表面の酸化物等を除去し、
シャッタを開いて20分間スパッタリングを行い9約2
μmの厚さの膜を形成した。この後、再び真空容器内を
2X10”’Torr以下に排気し、基板温度が室温に
なるまで冷却した。この中から膜厚方向の角形比が0.
7以上のものを選択して急加熱急冷が可能な赤外線イメ
ージ炉にセントし炉内を2X 10−’To r r以
下に排気した後、900’Cに象、加熱して10秒間保
持してアニールを行った後ただちに冷却した。Using a target sintered in a vacuum, this target is attached to a sputtering electrode, and the substrate 3 is placed on the substrate stand 4, and then the inside of the vacuum container is heated to 2X10-'Tor by the exhaust system 14.
Exhaust to below r. The substrate 3 is heated to 300°C while adjusting the heater power supply 13, and the filament power supply 9 is adjusted to heat the filament 8. After that, the argon gas introducing pulp 12 is opened to introduce argon gas, and the pressure is increased to 8°C.
×10-”Torr. After adjusting the anode power supply 11 to bring the target current to 0.5 A, apply a negative DC voltage of 300 V from the target power supply 7 while keeping the shutter 5 closed. Perform preliminary sputtering for 15 minutes to remove oxides etc. on the target surface.
Open the shutter and perform sputtering for 20 minutes.
A film with a thickness of μm was formed. After that, the inside of the vacuum chamber was again evacuated to 2×10''' Torr or less, and the substrate was cooled to room temperature. Among these, the squareness ratio in the film thickness direction was 0.
Select one of 7 or higher, place it in an infrared image furnace capable of rapid heating and cooling, evacuate the inside of the furnace to below 2X 10-'Torr, heat it to 900'C, and hold it for 10 seconds. After annealing, it was immediately cooled.
この結果、10MGOe以上のエネルギー積の強磁性膜
が得られた。第2図は温度と時間を種々変えてアニール
をしたときの膜の特性の測定値を10 MGOe以上と
以下に分けた分布を示す、丸印はアニール後膜厚方向の
最大エネルギ積(BH)maxがIOMC;Oe、以上
となったものである。As a result, a ferromagnetic film with an energy product of 10 MGOe or more was obtained. Figure 2 shows the distribution of the measured values of film characteristics when annealing was performed at various temperatures and times, divided into 10 MGOe and above and below.The circles indicate the maximum energy product (BH) in the film thickness direction after annealing. max is IOMC; Oe, or more.
すなわち斜線で示した領域の条件でアニールを行えば膜
厚方向の最大エネルギ積(BH)ma xが10MGO
e以上のものが得られる。アニール温度が1000℃を
超えると常磁性相の成長により磁気特性が損われ、逆に
750℃に満たないとSm1CO1?相の析出により逆
方向の磁区が発生して保磁力が下がることが明らかにな
った。In other words, if annealing is performed under the conditions of the shaded area, the maximum energy product (BH) max in the film thickness direction will be 10 MGO.
e or more can be obtained. If the annealing temperature exceeds 1000°C, the magnetic properties will be impaired due to the growth of the paramagnetic phase, and conversely, if the annealing temperature is less than 750°C, Sm1CO1? It was revealed that phase precipitation causes magnetic domains in opposite directions, which lowers the coercive force.
またアニール保持時間はアニール温度により異なり、た
とえばアニール温度850°C〜1000°Cのときは
保持時間10秒で良いが、アニール温度が820℃のと
きは保持時間100秒、780°Cのときは2500秒
というようにアニール温度が低いほど保持時間が長くな
るが、保持時間が10時間を超えるときはアニール温度
は750〜1000°Cの間であれば10MGOe以上
のものが得られる。Also, the annealing holding time varies depending on the annealing temperature. For example, when the annealing temperature is 850°C to 1000°C, the holding time is 10 seconds, but when the annealing temperature is 820°C, the holding time is 100 seconds, and when the annealing temperature is 780°C, the holding time is 100 seconds. The lower the annealing temperature is, such as 2500 seconds, the longer the holding time becomes. However, when the holding time exceeds 10 hours and the annealing temperature is between 750 and 1000°C, 10 MGOe or more can be obtained.
なお1合金薄膜の組成を変え5調べたところ。In addition, 5 investigations were conducted by changing the composition of the alloy thin film.
表に示す組成で角形比0.7以上のものを選び、前記ア
ニール条件で実験した結果は、いずれも良好な結果が得
られた。すなわちSmが20〜100原子%、PrがO
〜80原子%原子部がCoからなる組成の膜を上記アニ
ール条件でアニールすることにより最大エネルギ積(B
H)maxが10M G Oe以上でかつ異方性の膜が
得られる。Selecting the compositions shown in the table with a squareness ratio of 0.7 or more, experiments were conducted under the annealing conditions described above, and good results were obtained in all cases. That is, Sm is 20 to 100 atomic %, Pr is O
The maximum energy product (B
H) An anisotropic film with a max of 10 M G Oe or more can be obtained.
表
(発明の効果)
以上説明したように本発明によれば、最大エネルギ積(
BH)maxが10MGOe以上の垂直磁化膜が得られ
る効果があり、このため磁気を利用した装置を高性能化
、小型化することができる。Table (Effects of the Invention) As explained above, according to the present invention, the maximum energy product (
There is an effect that a perpendicular magnetization film with BH)max of 10 MGOe or more can be obtained, and therefore a device using magnetism can be made high-performance and compact.
第1図は本発明の垂直磁化膜を形成するための多極マグ
ネトロンスパッタリング装置の例を示す断面図、第2図
は本発明のアニール条件を示す特性図である。
図において2はターゲット、3は基板、5はシャッタで
ある。
第 1 図
1、真空容器 7.ターゲット電M13.ヒータ電濡
2、ターゲット 8.フィラメント 14.
排筑系3・基 、板 q、フィラメント電源4、
基板取付台 10.アノード電極
5、シャッタ 11.アノードffl源6、ヒータ
12.アルづシガス導入バルゴ第2図
アニールイ呆持詩間(Jlols)FIG. 1 is a sectional view showing an example of a multipolar magnetron sputtering apparatus for forming a perpendicularly magnetized film of the present invention, and FIG. 2 is a characteristic diagram showing annealing conditions of the present invention. In the figure, 2 is a target, 3 is a substrate, and 5 is a shutter. 1 Figure 1, Vacuum container 7. Target electric M13. Heater electric wetting 2, target 8. Filament 14.
Scaffolding system 3, base, board q, filament power supply 4,
Board mounting stand 10. Anode electrode 5, shutter 11. Anode ffl source 6, heater 12. Alzu Shigas Introduction Bargo Figure 2 Anne Louis Kumochi Shima (Jlols)
Claims (1)
薄膜をスパッタリング法により基板上に形成し、膜厚方
向の角形比が0.7以上の合金薄膜を有する基板を選択
して真空中または非酸化製ガス雰囲気中で,アニール保
持時間(logs)をX軸にとり,アニール保持温度(
℃)をY軸にとったとき,直線Y=1000,直線X=
1,直線Y=750,直線X=6および点(1,850
)と点(4.55,750)を結ぶ直線で囲まれる範囲
でアニールすることを特徴とする強磁性薄膜の形成方法
。An alloy thin film consisting of one or more of the rare earth metals Sm and Pr and Co is formed on a substrate by sputtering, and a substrate having an alloy thin film with a squareness ratio of 0.7 or more in the film thickness direction is selected and heated in a vacuum or in a non-oxidized state. In the manufacturing gas atmosphere, the annealing holding time (logs) is plotted on the X axis, and the annealing holding temperature (
℃) on the Y axis, straight line Y = 1000, straight line X =
1, straight line Y=750, straight line X=6 and point (1,850
) and a point (4,55,750).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27659687A JPH01119008A (en) | 1987-10-30 | 1987-10-30 | Formation of ferromagnetic thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27659687A JPH01119008A (en) | 1987-10-30 | 1987-10-30 | Formation of ferromagnetic thin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01119008A true JPH01119008A (en) | 1989-05-11 |
Family
ID=17571650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27659687A Pending JPH01119008A (en) | 1987-10-30 | 1987-10-30 | Formation of ferromagnetic thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01119008A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4986895A (en) * | 1972-12-04 | 1974-08-20 |
-
1987
- 1987-10-30 JP JP27659687A patent/JPH01119008A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4986895A (en) * | 1972-12-04 | 1974-08-20 |
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