JPH0974225A - LED light source - Google Patents
LED light sourceInfo
- Publication number
- JPH0974225A JPH0974225A JP7228830A JP22883095A JPH0974225A JP H0974225 A JPH0974225 A JP H0974225A JP 7228830 A JP7228830 A JP 7228830A JP 22883095 A JP22883095 A JP 22883095A JP H0974225 A JPH0974225 A JP H0974225A
- Authority
- JP
- Japan
- Prior art keywords
- light source
- led
- light
- led lamp
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】
【目的】 ＬＥＤランプが支持体に固定されてなるＬＥ
Ｄ光源において、発光チップからの発光を効率よく外部
に取り出すことのできるＬＥＤ光源を提供する。
【構成】 リードフレーム１１上に設置された発光チッ
プが樹脂モールドで封止されてなるＬＥＤランプを白色
の支持体１３に形成された貫通孔１４に挿入して固定さ
れてなるＬＥＤ光源において、ＬＥＤランプのリードフ
レーム１１突出側には、発光チップの発光を反射する反
射層５が設けられている。
(57) [Abstract] [Purpose] LE with LED lamp fixed to a support
Provided is a D light source, which is an LED light source capable of efficiently extracting light emitted from a light emitting chip to the outside. An LED light source in which an LED lamp, in which a light emitting chip installed on a lead frame 11 is sealed with a resin mold, is inserted into a through hole 14 formed in a white support 13 and fixed, A reflection layer 5 that reflects the light emitted from the light emitting chip is provided on the protruding side of the lead frame 11 of the lamp.
Description
【０００１】[0001]
【産業上の利用分野】本発明はＬＥＤ光源に係り、特に
ＬＥＤランプが支持体に設置されてなるＬＥＤ光源に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED light source, and more particularly to an LED light source in which an LED lamp is mounted on a support.
【０００２】[0002]
【従来の技術】近年、液晶ディスプレイ等の薄型表示装
置のバックライト用面光源として、ＬＥＤが注目されて
いる。ＬＥＤを用いたディスプレイ等の面光源は、ＬＥ
Ｄランプが導光板の端面に埋め込まれたり、あるいは支
持体を介して密着させることにより光を導光板に導入す
る。2. Description of the Related Art In recent years, LEDs have been attracting attention as a surface light source for backlights of thin display devices such as liquid crystal displays. Surface light sources such as displays using LEDs are LE
Light is introduced into the light guide plate by embedding the D lamp in the end surface of the light guide plate or by adhering it to the light guide plate via a support.
【０００３】図１は従来のＬＥＤランプ１２が支持体１
３に装着された状態を示す斜視図である。ＬＥＤランプ
１２は支持体１３に設けられた貫通孔１４に挿入して固
定されている。図２はＬＥＤランプを支持体に装着して
得られた従来のＬＥＤ光源を示す模式断面図である。Ｌ
ＥＤランプ１２は、リードフレーム１１に載置された発
光チップをエポキシ樹脂等でモールドされた構造をして
おり、このモールド樹脂は発光チップからの発光を効率
よく外部に取り出すために透光性の高い樹脂が用いられ
ている。支持体１３は例えば白色のポリカーボネートよ
りなっており、貫通孔１４はＬＥＤランプ１２のモール
ド形状に合わせて、ＬＥＤランプ１２が支持体１３にほ
ぼ密着して貫通するように形成されている。また、ＬＥ
Ｄランプ１２は貫通孔１４に挿入後、固定されてＬＥＤ
光源となる。In FIG. 1, a conventional LED lamp 12 is a support 1
It is a perspective view showing the state where it was attached to No. 3. The LED lamp 12 is inserted and fixed in a through hole 14 provided in the support 13. FIG. 2 is a schematic cross-sectional view showing a conventional LED light source obtained by mounting an LED lamp on a support. L
The ED lamp 12 has a structure in which a light emitting chip mounted on the lead frame 11 is molded with epoxy resin or the like. This molding resin has a light-transmitting property in order to efficiently take out light emitted from the light emitting chip to the outside. High resin is used. The support 13 is made of, for example, white polycarbonate, and the through hole 14 is formed so as to fit the mold shape of the LED lamp 12 so that the LED lamp 12 is substantially in close contact with the support 13 and penetrates the support 13. Also, LE
After the D lamp 12 is inserted into the through hole 14, it is fixed and the LED
It becomes a light source.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、前記に
示した従来のＬＥＤ光源はＬＥＤランプ１２からの発光
が白色の支持体１３の貫通孔１４内部で反射され、反射
された光の一部は、ＬＥＤランプ１２のリードフレーム
１１突出側に漏れてしまうため、発光観測面側に放射さ
れる発光の輝度が下がるという欠点があった。However, in the conventional LED light source described above, the light emitted from the LED lamp 12 is reflected inside the through hole 14 of the white support 13, and a part of the reflected light is Since the light leaks to the protruding side of the lead frame 11 of the LED lamp 12, there is a drawback that the luminance of the light emitted toward the light emission observation surface side is reduced.
【０００５】また、先端部がフラットなモールド形状で
あるＬＥＤランプ１２は、発光チップからの発光の一部
が先端部で全反射されやすく、全反射された光の一部が
上記と同様にＬＥＤランプ１２のリードフレーム１１突
出側から漏れてしまうという問題があった。Further, in the LED lamp 12 having a flat mold end, a part of the light emitted from the light emitting chip is likely to be totally reflected at the end, and a part of the totally reflected light is the same as the above. There is a problem that the lamp 12 leaks from the protruding side of the lead frame 11.
【０００６】従って、本発明は上記課題を解決する為に
成されたものであり、その目的とするところは発光チッ
プからの発光を効率よく外部に取り出すことのできるＬ
ＥＤ光源を提供するところにある。Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to make it possible to efficiently take out light emitted from a light emitting chip to the outside.
It is in the area of providing an ED light source.
【０００７】[0007]
【課題を解決するための手段】本発明のＬＥＤ光源は、
リードフレーム上に設置された発光チップが樹脂モール
ドで封止されてなるＬＥＤランプを、白色の支持体に形
成された貫通孔に挿入して固定されてなるＬＥＤ光源に
おいて、前記ＬＥＤランプのリードフレーム突出側に発
光チップの発光を反射する反射層が設けられていること
を特徴とする。The LED light source according to the present invention comprises:
In an LED light source in which an LED lamp, in which a light emitting chip installed on a lead frame is sealed with a resin mold, is inserted and fixed in a through hole formed in a white support, the lead frame of the LED lamp It is characterized in that a reflective layer for reflecting light emitted from the light emitting chip is provided on the protruding side.
【０００８】前記反射層としては、ＴｉＯ2を混入させ
たエポキシ樹脂、ＢａＴｉＯ3を混入させたエポキシ樹
脂、白色のシリコン樹脂を用いることができるが、特に
限定するものでなく反射率の高いものであれば何でもよ
い。また支持体３としては、白色のポリカーボネート、
ＰＢＣ、ＡＢＳ等が用いられるが、これも反射率の高い
ものであれば何でもよい。As the reflective layer, an epoxy resin mixed with TiO 2 , an epoxy resin mixed with BaTiO 3 , or a white silicone resin can be used, but the reflective layer is not particularly limited, and has a high reflectance. Anything is fine. As the support 3, white polycarbonate,
PBC, ABS or the like is used, but any material having a high reflectance may be used.
【０００９】[0009]
【作用】図２に示す従来のＬＥＤ光源では、白色の支持
体１３およびＬＥＤランプ１２の先端部で反射された光
の一部が、ＬＥＤランプ１２のリードフレーム１１突出
側に漏れてしまうため、発光観測面側から放射される光
の輝度が下がってしまっていた。しかしながら、本発明
のＬＥＤ光源は、図４に示すようにＬＥＤランプ１２の
リードフレーム１１突出側に反射層５を設けているた
め、支持体１３やＬＥＤランプ１２先端部から反射され
た光を再び発光観測面側へ反射することができる。従っ
て、ＬＥＤランプ１２のリードフレーム１１突出側へ光
が漏れず、発光観測面側への発光輝度が向上する。In the conventional LED light source shown in FIG. 2, part of the light reflected by the white support 13 and the tip of the LED lamp 12 leaks to the protruding side of the lead frame 11 of the LED lamp 12. The brightness of the light radiated from the side of the emission observation surface has decreased. However, since the LED light source of the present invention is provided with the reflective layer 5 on the protruding side of the lead frame 11 of the LED lamp 12 as shown in FIG. 4, the light reflected from the support 13 and the tip of the LED lamp 12 is re-generated. The light can be reflected toward the observation surface side. Therefore, light does not leak to the protruding side of the lead frame 11 of the LED lamp 12, and the emission brightness to the emission observation surface side is improved.
【００１０】[0010]
【実施例】本発明のＬＥＤ光源を実施例に基づき説明す
る。ただし、以下に示す実施例は本発明のＬＥＤ光源を
下記のものに限定するものではない。 ［実施例１］図３は本発明の一実施例を説明するＬＥＤ
ランプの模式断面図である。発光チップをリードフレー
ム１１上に接着固定する。次に、発光チップ上の電極に
金線を溶着し、リードフレーム１１と電気的に接続す
る。続いて、型に入れた透明なエポキシ樹脂中に、ワイ
ヤーボンディングされた発光チップを投入し固化させ
る。エポキシ樹脂が固化した後、ＴｉＯ2を入れたエポ
キシ樹脂を流し込み固化させてＬＥＤのリードフレーム
１１突出側に反射層５を形成した。EXAMPLES The LED light source of the present invention will be described based on examples. However, the examples shown below do not limit the LED light source of the present invention to the following. [Embodiment 1] FIG. 3 is an LED for explaining an embodiment of the present invention.
It is a schematic cross section of a lamp. The light emitting chip is adhesively fixed onto the lead frame 11. Next, a gold wire is welded to the electrode on the light emitting chip and electrically connected to the lead frame 11. Then, the wire-bonded light emitting chip is put into a transparent epoxy resin placed in a mold and solidified. After the epoxy resin was solidified, the epoxy resin containing TiO 2 was poured and solidified to form the reflective layer 5 on the protruding side of the lead frame 11 of the LED.
【００１１】次に、前記反射層５が形成されたＬＥＤラ
ンプを、支持体である白色のポリカーボネート枠に設け
られた貫通孔に挿入してＬＥＤ光源を作製した。このよ
うにして得られたＬＥＤ光源を発光させたところ、ＬＥ
Ｄランプのリードフレーム突出側に反射層が設けられて
いるためＬＥＤランプのリードフレーム突出側へ光が漏
れず、発光観測面側からは輝度の向上した発光を観測で
きた。Next, the LED lamp having the reflective layer 5 formed therein was inserted into a through hole provided in a white polycarbonate frame as a support to manufacture an LED light source. When the LED light source thus obtained was made to emit light, LE
Since the reflection layer was provided on the protruding side of the D lamp lead frame, light did not leak to the protruding side of the LED lamp lead frame, and light emission with improved brightness could be observed from the emission observation surface side.
【００１２】［実施例２］実施例１と同様にして発光チ
ップをリードフレームに固定後、ワイヤーボンディング
を行う。続いて、型に入れた透明なエポキシ樹脂中に、
ワイヤーボンディングされた発光チップを投入し固化さ
せる。[Embodiment 2] As in Embodiment 1, after fixing the light emitting chip to the lead frame, wire bonding is performed. Then, in a transparent epoxy resin put in the mold,
The wire-bonded light emitting chip is put in and solidified.
【００１３】このようにして透明な樹脂でモールドされ
たＬＥＤランプ１２を、図４に示したように、支持体１
３である白色のポリカーボネート枠に形成された貫通孔
１４に挿入し、挿入後、白色のシリコン樹脂を貫通孔１
４内に充填してＬＥＤランプ１２のリードフレーム１１
突出側に反射層５を形成してＬＥＤ光源を得た。このよ
うにして得られたＬＥＤ光源を発光させたところ、反射
層５が設けられているためＬＥＤランプ１２のリードフ
レーム１１突出側へ光が漏れず、発光観測面側からは輝
度の向上した発光を観測できた。As shown in FIG. 4, the LED lamp 12 molded with the transparent resin in this manner is used as the support 1
3 is inserted into the through hole 14 formed in the white polycarbonate frame, and after the insertion, the white silicone resin is inserted into the through hole 1
The lead frame 11 of the LED lamp 12 is filled with 4
The reflective layer 5 was formed on the protruding side to obtain an LED light source. When the LED light source obtained in this manner was made to emit light, light was not leaked to the protruding side of the lead frame 11 of the LED lamp 12 because the reflection layer 5 was provided, and the emission from the emission observation surface side was improved. I was able to observe.
【００１４】ＬＥＤランプに反射層を設けるには、実施
例１のように支持体の貫通孔にＬＥＤランプを挿入する
前に反射層を形成しても良いし、あるいは実施例２のよ
うに支持体の貫通孔にＬＥＤランプを挿入した後、貫通
孔を充填するようにして反射層を形成しても良い。To provide the reflective layer on the LED lamp, the reflective layer may be formed before the LED lamp is inserted into the through hole of the support as in the first embodiment, or the support may be provided as in the second embodiment. After inserting the LED lamp into the through hole of the body, the reflective layer may be formed so as to fill the through hole.
【００１５】[0015]
【発明の効果】本発明のＬＥＤ光源は、ＬＥＤランプの
リードフレーム突出側に反射層が設けられているので、
従来のようにＬＥＤランプのリードフレーム突出側に光
が漏れる心配がない。従って、発光チップからの発光を
効率よく外部に取り出すことができるため、ＬＥＤ光源
の発光輝度が上がる。Since the LED light source of the present invention is provided with the reflection layer on the lead frame protruding side of the LED lamp,
There is no need to worry about light leaking to the protruding side of the LED lamp lead frame as in the conventional case. Therefore, since the light emitted from the light emitting chip can be efficiently taken out to the outside, the emission brightness of the LED light source is increased.
【００１６】従って、本発明のＬＥＤ光源を用いれば、
発光効率の良い優れた面状光源を得ることができる。Therefore, using the LED light source of the present invention,
It is possible to obtain an excellent planar light source with good luminous efficiency.
【図１】 従来のＬＥＤランプを支持体に挿着する状態
を示す斜視図。FIG. 1 is a perspective view showing a state in which a conventional LED lamp is inserted and attached to a support body.
【図２】 従来のＬＥＤ光源の構造を示す模式断面図。FIG. 2 is a schematic cross-sectional view showing the structure of a conventional LED light source.
【図３】 本発明の一実施例を説明する模式断面図。FIG. 3 is a schematic cross-sectional view illustrating an embodiment of the present invention.
【図４】 本発明のＬＥＤ光源の構造を示す模式断面
図。FIG. 4 is a schematic cross-sectional view showing the structure of the LED light source of the present invention.
１１・・・・リードフレーム １２・・・・ＬＥＤランプ １３・・・・支持体 １４・・・・貫通孔 ５・・・・反射層 11 ... Lead frame 12 ... LED lamp 13 ... Support 14 ... Through hole 5 ... Reflective layer
Claims (1)
プが樹脂モールドで封止されてなるＬＥＤランプを、白
色の支持体に形成された貫通孔に挿入して固定されてな
るＬＥＤ光源において、前記ＬＥＤランプのリードフレ
ーム突出側には発光チップの発光を反射する反射層が設
けられていることを特徴とするＬＥＤ光源。1. An LED light source in which an LED lamp, in which a light emitting chip mounted on a lead frame is sealed with a resin mold, is inserted and fixed in a through hole formed in a white support, The LED light source is characterized in that a reflection layer for reflecting the light emitted from the light emitting chip is provided on the protruding side of the lead frame of the LED lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7228830A JPH0974225A (en) | 1995-09-06 | 1995-09-06 | LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7228830A JPH0974225A (en) | 1995-09-06 | 1995-09-06 | LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0974225A true JPH0974225A (en) | 1997-03-18 |
Family
ID=16882533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7228830A Pending JPH0974225A (en) | 1995-09-06 | 1995-09-06 | LED light source |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0974225A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218610A (en) * | 2007-03-02 | 2008-09-18 | Citizen Electronics Co Ltd | Light emitting diode |
| JP2009538531A (en) * | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | LIGHTING DEVICE AND MANUFACTURING METHOD |
-
1995
- 1995-09-06 JP JP7228830A patent/JPH0974225A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009538531A (en) * | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | LIGHTING DEVICE AND MANUFACTURING METHOD |
| JP2008218610A (en) * | 2007-03-02 | 2008-09-18 | Citizen Electronics Co Ltd | Light emitting diode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104040382B (en) | Optical sheet and display device and light emitting device having same | |
| KR101635650B1 (en) | Light emitting device | |
| CN102147080B (en) | The display device of back light unit and this back light unit of use | |
| JPH07235207A (en) | Back light | |
| KR20060121701A (en) | LED die device and surface lighting method | |
| JP2006301645A (en) | Optical system with attachment structure that is insert molded to light guide | |
| TW200905925A (en) | Side-view light-emitting diode package and fabrication method thereof | |
| JPH10125959A (en) | Side emitting chip LED | |
| CN114220899A (en) | Mini LED lamp bead, backlight module and display device | |
| CN116169231B (en) | Light-emitting device, display device, and manufacturing method of light-emitting device | |
| JP2008305714A (en) | Light source device and flat illumination device | |
| CN101846251A (en) | Semiconductor light-emitting device, manufacturing method thereof, and backlight for liquid crystal display device | |
| JP3028465B2 (en) | Surface-emitting lighting device | |
| JP2006086408A (en) | Led device | |
| JPH0974225A (en) | LED light source | |
| KR200228373Y1 (en) | Backlight for liquid crystal display | |
| KR100890950B1 (en) | Back light emitting device | |
| EP1873444A1 (en) | Planar lighting apparatus | |
| JP2007311253A (en) | Light source device and plane lighting system | |
| JP2007324451A (en) | Semiconductor light emitting apparatus | |
| KR100839122B1 (en) | A side emitting type LED lamp, a manufacturing method thereof, and a light emitting device including the LED lamp | |
| JP3920372B2 (en) | Back lighting device | |
| JP2001297617A (en) | Front light type lighting system | |
| CN222967353U (en) | LED packaging structure, backlight assembly and liquid crystal display | |
| JPH1022528A (en) | LED backlight |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040126 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040316 |