JPH0955600A - Method and apparatus for inserting axial electronic component - Google Patents
Method and apparatus for inserting axial electronic componentInfo
- Publication number
- JPH0955600A JPH0955600A JP7287443A JP28744395A JPH0955600A JP H0955600 A JPH0955600 A JP H0955600A JP 7287443 A JP7287443 A JP 7287443A JP 28744395 A JP28744395 A JP 28744395A JP H0955600 A JPH0955600 A JP H0955600A
- Authority
- JP
- Japan
- Prior art keywords
- component
- electronic component
- axial
- chuck
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】
【課題】 アキシャル型電子部品の挿入効率を向上させ
ると共に、異なる仕様のアキシャル型電子部品であって
も容易に対応できるアキシャル型電子部品の挿入方法及
びその装置を提供する。
【解決手段】 アキシャル型電子部品1の縁部を挟持す
るチャック6a〜6dと、上記チャック6を均等な間隔
を隔てて円周状に複数配設してなり、各チャック6a〜
6dを少なくとも部品供給位置P及び部品受渡位置Qに
停止させるようにして間欠回転動作をおこなう部品移載
手段7と、アキシャル型電子部品1を部品供給位置Pに
位置するチャック6に供給する部品供給手段4と、アキ
シャル型電子部品1を部品受渡位置Qに位置するチャッ
ク6から受け取り、挿入位置Kへ移動させる部品受渡手
段12と、挿入位置Kで部品受渡手段12からアキシャ
ル型電子部品1を受け取り基板へ固定する部品挿入手段
11とを備える。
(57) An object of the present invention is to provide an axial electronic component insertion method and apparatus that can improve the insertion efficiency of axial electronic components and can easily cope with axial electronic components of different specifications. SOLUTION: A plurality of chucks 6a to 6d for holding an edge portion of an axial type electronic component 1 and a plurality of the chucks 6 are circumferentially arranged at equal intervals, and each chuck 6a to 6d.
6d is stopped at least at the component supply position P and the component delivery position Q, and the component transfer means 7 that performs the intermittent rotation operation and the component supply that supplies the axial electronic component 1 to the chuck 6 located at the component supply position P Means 4, a component delivery means 12 for receiving the axial electronic component 1 from the chuck 6 located at the component delivery position Q, and moving it to the insertion position K, and an axial electronic component 1 for the axial delivery at the insertion position K from the component delivery means 12. And a component insertion means 11 for fixing to the substrate.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、アキシャル型電子
部品を基板の所定孔へ自動で挿入する電子部品の挿入方
法及びその装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting method and apparatus for automatically inserting an axial electronic component into a predetermined hole of a substrate.
【0002】[0002]
【従来の技術】アキシャル型電子部品は、図11(a)
に示す電子部品本体1aから延出する一対のリード線2
a,2bを図のd1で示す一定間隔に配置して、リード
線2a,2bの両端をテープ3a,3bでテーピングさ
れている。このように一定間隔にテーピングされたアキ
シャル型電子部品1の集合体は、特開平1−30560
0号公報などで開示されている装置で挿入することが知
られている。2. Description of the Related Art FIG. 11A shows an axial type electronic component.
A pair of lead wires 2 extending from the electronic component body 1a shown in FIG.
The lead wires 2a and 2b are taped at both ends with tapes 3a and 3b, respectively, with a and 2b arranged at regular intervals as indicated by d1 in the figure. The assembly of the axial type electronic components 1 thus taped at regular intervals is disclosed in Japanese Patent Laid-Open No. 1-30560.
It is known to insert with the device disclosed in Japanese Patent No.
【0003】図12に示す部品供給装置4はアキシャル
型電子部品1の集合体を保持し、アキシャル型電子部品
1のリード線2a,2bをテーピングしたテープ3a,
3bを切断するカッタ5a,5bを備えている。A component supply device 4 shown in FIG. 12 holds a group of axial type electronic components 1 and has tapes 3a on which lead wires 2a and 2b of the axial type electronic component 1 are tapped.
Cutters 5a and 5b for cutting 3b are provided.
【0004】この部品供給装置4が保持するアキシャル
型電子部品1の集合体のリード線を含むテーピングされ
た縁部を部品移載装置7のチャック片6で挟持して引き
出し、部品供給装置4のカッタ5a,5bでテープ3
a,3b部を切断して、1つのアキシャル型電子部品1
を取り出している。The taped edge portion including the lead wire of the assembly of the axial type electronic components 1 held by the component feeding device 4 is sandwiched by the chuck piece 6 of the component transferring device 7 and pulled out, so that the component feeding device 4 is operated. Tape 3 with cutters 5a and 5b
Cut the parts a and 3b to form one axial electronic component 1
Has been taken out.
【0005】取り出されたアキシャル型電子部品1は縁
部をチャック片6で挟持されて、部品移載装置7で挿入
位置へ移載される。The taken-out axial electronic component 1 is clamped at its edge by a chuck piece 6 and is transferred to an insertion position by a component transfer device 7.
【0006】図13に示す部品挿入装置11はアキシャ
ル型電子部品1を挿入位置で部品移載装置7から受け取
って、アキシャル型電子部品1のリードテーピング部分
を含むリード線2a,2bの両端を切断し、延出する両
端のリード線2a,2bを所望幅に折曲して、リード線
先端を基板の所定孔へ挿入している。The component insertion device 11 shown in FIG. 13 receives the axial electronic component 1 from the component transfer device 7 at the insertion position, and cuts both ends of the lead wires 2a and 2b including the lead taping portion of the axial electronic component 1. Then, the extending lead wires 2a and 2b at both ends are bent to a desired width, and the leading ends of the lead wires are inserted into predetermined holes of the substrate.
【0007】図12及び図13に示す従来例はアキシャ
ル型電子部品1を保持する部品供給装置4とアキシャル
型電子部品1の挿入をおこなう部品挿入装置11間とを
1台の部品移載装置7の往復動作によって挿入作業が順
次おこなわれていた。In the conventional example shown in FIGS. 12 and 13, one component transfer device 7 is provided between the component supply device 4 for holding the axial electronic component 1 and the component insertion device 11 for inserting the axial electronic component 1. The insertion work was sequentially performed by the reciprocating motion of.
【0008】また、特開平1−305600号公報にお
いては、部品移載装置はアキシャル型電子部品に加えて
ラジアル型電子部品をも挟持するチャック片を別途搭載
可能なように構成されている。Further, in Japanese Patent Laid-Open No. 1-305600, the component transfer device is constructed so that a chuck piece for sandwiching a radial electronic component as well as an axial electronic component can be separately mounted.
【0009】[0009]
【発明が解決しようとする課題】上記従来の構成におい
ては、アキシャル型電子部品の供給と挿入の動作を1回
ずつ交互におこなうため挿入サイクルを短縮することは
極めて困難であった。すなわち、アキシャル型電子部品
1を1つ毎に取りにいくため、部品移載装置が空で戻る
工程が存在し、これが部品挿入のサイクルタイムの多く
を占めてしまい、短時間で大量生産を要求される今日に
あっては問題であった。In the above-mentioned conventional structure, it is extremely difficult to shorten the insertion cycle because the operations of supplying and inserting the axial type electronic component are alternately performed once. That is, since the axial electronic component 1 is picked up one by one, there is a process in which the component transfer device returns to an empty state, which occupies a large part of the cycle time of component insertion, which requires mass production in a short time. It was a problem today.
【0010】また、特開平1−305600号公報で開
示されるアキシャル型電子部品に加えてラジアル型電子
部品をも挟持する部品挟持手段においても、テープ幅の
異なるアキシャル型電子部品(例えば図11(a)のd
2で示すテープ幅が26mm幅や52mm幅など)のア
キシャル型電子部品には対応できないという問題を有し
ていた。Further, in the component clamping means for clamping a radial electronic component in addition to the axial electronic component disclosed in Japanese Patent Laid-Open No. 1-305600, axial electronic components having different tape widths (for example, FIG. 11 ( a) d
There is a problem that it cannot be applied to an axial type electronic component having a tape width shown by 2 in a width of 26 mm or a width of 52 mm.
【0011】本発明は上記問題点に鑑み、アキシャル型
電子部品の挿入効率を向上させると共に、異なるテープ
幅仕様のアキシャル型電子部品であっても容易に対応で
きるアキシャル型電子部品の挿入方法及びその装置を提
供することを目的とする。In view of the above-mentioned problems, the present invention improves the insertion efficiency of an axial electronic component and can easily cope with axial electronic components having different tape width specifications, and a method of inserting the same. The purpose is to provide a device.
【0012】[0012]
【課題を解決するための手段】本願の第1発明は上記従
来例の問題点を解決するため、一定間隔にテーピングし
て構成された電子部品の本体から延出する一対のリード
線を有するアキシャル型電子部品を基板の所定孔に挿入
する方法において、部品供給位置に停止するチャックが
アキシャル型電子部品集合体を保持する部品供給手段の
位置まで前進し、テープに連なるアキシャル型電子部品
集合体の縁部を挟持しながら後退して、部品ピッチ分引
き出されたアキシャル型電子部品に連なるテープを部品
供給手段に設けられたカッタで1つのアキシャル型電子
部品に切断する工程Aと、上記工程Aを経てアキシャル
型電子部品を挟持済の部品受渡位置に停止する別のチャ
ックが前進し、挟持しているアキシャル型電子部品を部
品受渡手段に渡して後退する工程Bと、上記工程Bを経
てアキシャル型電子部品を保持済の部品受渡手段が前進
して部品挿入手段にアキシャル型電子部品を渡して後退
する工程Cと、上記工程Cを経てアキシャル型電子部品
を受け入れ済の部品挿入手段がリード線の両端部を切断
して、アキシャル型電子部品本体から延出する両端のリ
ード線を所望幅に折曲し、リード線両先端を基板の所定
孔へ挿入して、基板下で折曲して固定する工程Dと、上
記チャックを含む複数のチャックを備えた部品移載手段
が、1ステーション分移動して各チャックを少なくとも
部品供給位置及び部品受渡位置に移動させる工程Eと、
部品移載手段が停止して、各チャックを少なくとも部品
供給位置及び部品受渡位置に停止させておく工程Fとを
有し、上記工程Eと工程Fとは交互に実行され、上記工
程F中に、上記工程Aが実行され、これと並行して同時
に工程Bが実行され、次のサイクルの工程Bにおいて部
品受渡位置にあるチャックが部品受渡手段にアキシャル
型電子部品を渡しうる状態になるまでに、工程Cが終了
し、次のサイクルの工程Cにおいて部品受渡手段が部品
挿入手段にアキシャル型電子部品を渡しうる状態になる
までに、工程Dが終了することを特徴とする。In order to solve the problems of the above-mentioned conventional example, the first invention of the present application has an axial structure having a pair of lead wires extending from the main body of an electronic component formed by taping at regular intervals. In a method of inserting a die electronic component into a predetermined hole of a substrate, a chuck that stops at a component supply position advances to a position of a component supply means that holds the axial electronic component assembly, and the chuck of the axial electronic component assembly that is continuous with the tape. The step A of cutting back the tape that is pulled back by the component pitch and connected to the axial type electronic component into one axial type electronic component by a cutter provided in the component supply means, and the above step A. After that, another chuck that stops the axial electronic component at the clamped component delivery position moves forward and passes the clamped axial electronic component to the component delivery means. A step B of retreating, a step C of passing the axial electronic component through the step B, and a step C of moving the axial electronic component to the component inserting means to move back, and a step C of passing the axial electronic component through the step C. The component insertion means that has received the electronic component cuts both ends of the lead wire, bends the lead wires at both ends extending from the axial type electronic component body to a desired width, and both ends of the lead wire are provided with predetermined holes in the substrate. Step D of inserting into the substrate and bending and fixing it under the substrate, and the component transfer means having a plurality of chucks including the above-mentioned chuck moves by one station to move each chuck at least the component supply position and component delivery. Step E of moving to a position,
And a step F of stopping the chucks at least at the component supply position and the component delivery position by stopping the component transfer means, and the process E and the process F are alternately executed. The above-mentioned step A is executed, and at the same time, step B is executed in parallel, and in step B of the next cycle, the chuck at the component delivery position becomes ready to deliver the axial electronic component to the component delivery means. The process C is finished, and the process D is finished until the component delivery means is ready to deliver the axial electronic component to the component insertion means in the process C of the next cycle.
【0013】また、工程Cで部品受渡手段がアキシャル
型電子部品の本体位置を両側から挟み込みセンタリング
をおこなうことが好適である。In step C, it is preferable that the component delivery means performs centering by sandwiching the body position of the axial type electronic component from both sides.
【0014】本願の第2発明は、一定間隔にテーピング
して構成された電子部品の本体から延出する一対のリー
ド線を有するアキシャル型電子部品を基板の所定孔に挿
入する装置において、前記アキシャル型電子部品の縁部
を挟持して前後動可能に構成されたチャックと、上記チ
ャックを均等な間隔を隔てて円周状に複数配設してな
り、各チャックを少なくとも部品供給位置及び部品受渡
位置に停止させるようにして間欠回転動作をおこなう部
品移載手段と、前記アキシャル型電子部品集合体に連な
るテープを切断するカッタを備えると共に、アキシャル
型電子部品集合体を保持して部品供給位置に位置するチ
ャックに供給する部品供給手段と、アキシャル型電子部
品を部品受渡位置に位置するチャックから受け取り、挿
入位置へ移動させる部品受渡手段と、上記挿入位置で部
品受渡手段からアキシャル型電子部品を受け取り、リー
ド線の両端部を切断し、延出するリード線を所望幅に折
曲して、リード線両先端を基板の所定孔へ挿入して基板
下で折曲して固定する部品挿入手段とを有することを特
徴とする。A second invention of the present application is an apparatus for inserting an axial type electronic component having a pair of lead wires extending from a main body of an electronic component which is formed by taping at a constant interval into a predetermined hole of a substrate. A chuck that is configured to be movable back and forth by sandwiching the edge of a die-type electronic component, and a plurality of the above-mentioned chucks are circumferentially arranged at equal intervals, and each chuck is at least the component supply position and component delivery. It is equipped with a component transfer means for performing an intermittent rotation operation so as to stop at a position, and a cutter for cutting a tape connected to the axial type electronic component assembly, and holds the axial type electronic component assembly to the component supply position. A component supply means for supplying to the chuck located and an axial electronic component are received from the chuck located at the component delivery position and moved to the insertion position. The product delivery means and the axial electronic component at the insertion position from the component delivery means are received, both ends of the lead wire are cut, the extending lead wire is bent to a desired width, and both ends of the lead wire are attached to the board. It has a component insertion means for inserting it into a predetermined hole and bending and fixing it under the substrate.
【0015】また、チャックの部品挟持手段が異なるテ
ーピング幅のアキシャル型電子部品のテープとリード線
とを同時に挟持するテーピング幅に合わせた複数対の挟
持突起片を備え、かつ部品受渡手段が部品挟持手段の挟
持突起片に対応した保持片を備え、更に部品受渡手段が
セットされたアキシャル型電子部品の部品本体を両側か
ら挟み込みセンタリングするセンタリング片を備えるこ
とが好適である。Further, the component holding means of the chuck is provided with a plurality of pairs of holding projection pieces corresponding to the taping width for simultaneously holding the tape and the lead wire of the axial type electronic component having different taping widths, and the component delivering means holds the component. It is preferable to provide a holding piece corresponding to the sandwiching projection piece of the means, and further to provide a centering piece for sandwiching and centering the component body of the axial type electronic component on which the component delivery means is set from both sides.
【0016】本願の第3発明は、第2発明の装置のセン
タリング片が、電子部品の本体両側と接する部分におい
て凹みを有することを特徴とする。A third invention of the present application is characterized in that the centering piece of the device of the second invention has a recess at a portion in contact with both sides of the main body of the electronic component.
【0017】本願の第4発明は、第2発明の装置のチャ
ックの挟持突起片において、大きなテーピング幅の電子
部品を挟持する挟持突起片の挟持溝が、小さなテーピン
グ幅の電子部品を挟持する挟持突起片の挟持溝より微小
量浅くなっていることを特徴とする。According to a fourth aspect of the present invention, in the holding protrusion of the chuck of the apparatus of the second aspect, the holding groove of the holding protrusion for holding an electronic component having a large taping width holds the electronic component having a small taping width. It is characterized in that it is slightly smaller than the holding groove of the projection piece.
【0018】[0018]
【作用】本願の第1発明は上記方法によって、次のよう
な作用を営むことができる。すなわち、上記複数のチャ
ックを備えた部品移載手段が移動する工程Eと部品移載
手段が少なくとも部品供給位置及び部品受渡位置にチャ
ックを停止させておく工程Fとは交互に実行され、上記
工程F中に部品供給位置に停止するチャックがアキシャ
ル型電子部品を部品供給手段から取出す工程Aが実行さ
れ、これと並行して同時に工程Aを経て挟持しているア
キシャル型電子部品を部品受渡手段に渡す工程Bが実行
される。又次のサイクルの工程Bにおいて部品受渡位置
にあるチャックが部品受渡手段にアキシャル型電子部品
を渡しうる状態になるまでに、工程Bを経て部品受渡手
段が部品挿入手段にアキシャル型電子部品を渡す工程C
が終了し、次のサイクルの工程Cにおいて部品受渡手段
が部品挿入手段にアキシャル型電子部品を渡しうる状態
になるまでに、工程Cを経てアキシャル型電子部品を基
板へ固定する工程Dが終了することとなる。従ってアキ
シャル型電子部品の取出しと受渡しとを異なるチャック
によって、同時に処理をおこなわせることができる。更
に部品受渡手段にアキシャル電子部品を渡してしまえば
工程Bは完了するため、部品挿入手段の挿入作業を待つ
ことなく、工程Aの完了と共に部品移載手段の動作を可
能として、空のチャックの移動と次の部品の移動を複数
のチャックでおこなうことができて、処理時間を大幅に
短縮できると共に、部品挿入手段は部品受渡手段でアキ
シャル型電子部品を渡す工程Cによりアキシャル型電子
部品を効率よく次々と受け取り工程Dを実行することが
できる。The first invention of the present application can perform the following operations by the above method. That is, the step E in which the component transfer means having the plurality of chucks moves and the step F in which the component transfer means stops the chucks at least at the component supply position and the component delivery position are alternately executed. A step A in which the chuck that stops at the component supply position during F takes out the axial electronic component from the component supply means is performed, and in parallel with this, the axial electronic component sandwiched through step A is simultaneously transferred to the component delivery means. The passing step B is executed. In step B of the next cycle, the component delivery means passes the axial electronic component to the component insertion means through step B until the chuck at the component delivery position becomes ready to deliver the axial electronic component to the component delivery means. Process C
Is completed, and in the process C of the next cycle, the process D of fixing the axial electronic component to the substrate is completed through the process C until the component delivery means is ready to pass the axial electronic component to the component insertion device. It will be. Therefore, it is possible to simultaneously perform the removal and delivery of the axial type electronic component by different chucks. Further, if the axial electronic component is handed over to the component delivery means, the process B is completed. Therefore, without waiting for the insertion work of the component insertion means, the operation of the component transfer means becomes possible upon completion of the process A, and the empty chuck The movement and the movement of the next component can be performed by a plurality of chucks, and the processing time can be significantly reduced, and the component insertion means can efficiently move the axial electronic component by the step C of delivering the axial electronic component by the component delivery means. The receiving process D can be executed well one after another.
【0019】また、チャックが挟持しているアキシャル
型電子部品を部品受渡手段に渡す前記工程Bで、部品受
渡手段に渡されたアキシャル型電子部品の本体位置を両
側から挟み込みセンタリングをおこなうものであれば、
部品本体の大きさに依存することなく、部品の中央位置
をとらえて確実にセンタリング補正をおこなうことがで
きる。Further, in the step B of delivering the axial electronic component held by the chuck to the component delivering means, centering is performed by sandwiching the main body position of the axial electronic component delivered to the component delivering means from both sides. If
The centering correction can be reliably performed by catching the center position of the component without depending on the size of the component body.
【0020】本願の第2発明は、アキシャル型電子部品
の縁部を挟持して前後動可能に構成されたチャックと、
上記チャックを均等な間隔を隔てて円周状に複数配設し
てなり、各チャックを少なくとも部品供給位置及び部品
受渡位置に停止させるようにして間欠回転動作をおこな
う部品移載手段と、アキシャル型電子部品を部品受渡位
置に位置するチャックから受け取り挿入位置へ移動させ
る部品受渡手段と、上記挿入位置で部品受渡手段からア
キシャル型電子部品を受け取り基板へ固定する部品挿入
手段とを有することから、部品移載手段の回転動作を受
けて少なくとも部品供給位置及び部品受渡位置に停止す
る複数の円周状に配されたチャックで部品の供給と受渡
の動作を同期しておこなうことができ、更に部品受渡手
段の存在は部品移載手段の間欠回転動作を効率よくおこ
なわせることが可能となり、第1発明と同様の作用を実
現することができる。A second invention of the present application is a chuck configured to sandwich an edge portion of an axial type electronic component so as to be movable back and forth,
A plurality of chucks are circumferentially arranged at equal intervals, and each chuck is stopped at least at a component supply position and a component delivery position to perform an intermittent rotation operation. Since the electronic component has the component delivery means for moving the electronic component from the chuck located at the component delivery position to the receiving insertion position, and the component insertion means for fixing the axial electronic component from the component delivery means to the receiving substrate at the insertion position, A plurality of circumferentially arranged chucks which stop at least at the component supply position and the component delivery position in response to the rotation operation of the transfer means can perform the component supply and delivery operations in synchronization, and further, the component delivery. The presence of the means makes it possible to efficiently perform the intermittent rotation operation of the component transfer means, and the same operation as that of the first invention can be realized. .
【0021】また、チャックの部品挟持手段が異なるテ
ーピング幅のアキシャル型電子部品のテープとリード線
とを同時に挟持するテーピング幅に合わせた複数対の挟
持突起片を備え、かつ部品受渡手段が部品挟持手段の挟
持突起片に対応した保持片を備え、更に部品受渡手段が
セットされたアキシャル型電子部品の部品本体を両側か
ら挟み込みセンタリングするセンタリング片を備えるも
のであれば、テーピング幅に合致した複数対の挟持突起
片と保持片によってテープ幅の異なるアキシャル型電子
部品の受渡しを容易におこなわせることができる。さら
に、センタリング片は受渡手段にセットされたアキシャ
ル型電子部品の本体を両側から挟み込みセンタリングす
ることから、電子部品の本体の大きさのバラ付きや異な
るテープ幅のアキシャル型電子部品であっても正確にセ
ンタリングができ、簡単な構成で安価に異なる仕様の部
品を挿入することができる。Further, the component holding means of the chuck is provided with a plurality of pairs of holding projection pieces corresponding to the taping width for simultaneously holding the tape and the lead wire of the axial type electronic component having different taping widths, and the component delivering means holds the component. If there is a holding piece corresponding to the sandwiching projection piece of the means, and further a centering piece for sandwiching and centering the component body of the axial type electronic component to which the component delivery means is set from both sides, a plurality of pairs matching the taping width will be provided. With the holding projection piece and the holding piece, it is possible to easily deliver the axial type electronic components having different tape widths. Furthermore, the centering piece centers the axial electronic component body set on the delivery means by sandwiching it from both sides, so even if the electronic component body size varies or the axial electronic component has a different tape width, it is accurate. Centering is possible, and parts of different specifications can be inserted at low cost with a simple structure.
【0022】本願の第3発明は、センタリング動作をす
るときに、アキシャル型電子部品の本体両端がセンタリ
ング片の凹みに案内されることにより、センタリングの
衝撃で電子部品がセンタリング片からはじき出されてし
まうのを防ぎ、確実にセンタリング補正を行うことがで
きる。In the third invention of the present application, when the centering operation is performed, both ends of the main body of the axial type electronic component are guided to the recesses of the centering piece, so that the electronic component is ejected from the centering piece by the impact of the centering. It is possible to prevent centering and perform centering correction reliably.
【0023】本願の第4発明は、チャックにてテーピン
グ幅の大きなアキシャル型電子部品の縁部を挟持する
際、その外側の挟持突起片の挟持溝が、内側の小さなテ
ーピング幅用の挟持突起片の挟持溝より微小量浅くなっ
ているため、電子部品の縁部を挟持溝が保持した状態で
電子部品のリード線部分はテーピング幅の小さな電子部
品用の挟持溝の間の空間に保持されることなくフリーな
状態でいられることになる。According to a fourth aspect of the present invention, when a chuck grips an edge portion of an axial type electronic component having a large taping width, the gripping groove of the gripping projection piece on the outer side has a gripping projection piece for a small taping width on the inner side. Since it is shallower than the holding groove by a small amount, the lead wire portion of the electronic component is held in the space between the holding grooves for the electronic component having a small taping width while the holding groove holds the edge of the electronic component. You will be able to stay free.
【0024】そのため、テーピング幅の大きな電子部品
のリード線部分が、テーピング幅の小さな電子部品用の
挟持溝から外れてしまう程度に曲がっていても、テーピ
ング幅の小さな部品用の突起片に挟み込まれることなく
確実に電子部品の縁部を保持することができる。Therefore, even if the lead wire portion of the electronic component having a large taping width is bent to such an extent that it is out of the holding groove for an electronic component having a small taping width, the lead wire portion is pinched by the projection piece for a component having a small taping width. It is possible to securely hold the edge of the electronic component without.
【0025】[0025]
【発明の実施の形態】以下本発明の実施形態について、
図面を参照しながら詳細に説明する。図1に示す本発明
の実施例のアキシャル型電子部品の挿入装置は、テープ
間隔が26mm幅のアキシャル型電子部品集合体を収納
し、アキシャル型電子部品1のリード線2a,2bをテ
ーピングしたテープ3a,3bを切断するカッタ5a,
5bを有する部品供給手段4を備えている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below.
A detailed description will be given with reference to the drawings. The axial type electronic component insertion device of the embodiment of the present invention shown in FIG. 1 is a tape in which an axial type electronic component assembly having a tape interval of 26 mm is accommodated and the lead wires 2a and 2b of the axial type electronic component 1 are taped. A cutter 5a for cutting 3a, 3b,
The component supply means 4 having 5b is provided.
【0026】この部品供給手段4が収納するアキシャル
型電子部品集合体のリード線を含むテーピング部分を挟
持溝15を有する挟持突起片19で挟持して、アキシャ
ル型電子部品1を部品間隔毎に引き出す4つのチャック
6a〜6dを備え、R方向の間欠回転によって各チャッ
ク6a〜6dを所定のステーション位置へ順次移動させ
る円形テーブル(部品移載手段)7が設けられている。The taping portion including the lead wire of the axial electronic component assembly housed by the component supply means 4 is clamped by the clamping projection piece 19 having the clamping groove 15, and the axial electronic component 1 is pulled out at intervals of components. A circular table (component transfer means) 7 is provided which is provided with four chucks 6a to 6d and which sequentially moves the chucks 6a to 6d to predetermined station positions by intermittent rotation in the R direction.
【0027】また部品挿入手段11は、円形テーブル7
上のチャック6a〜6dのいずれかに挟持されたアキシ
ャル型電子部品1を受け取る部品受渡手段12を有し
て、部品受渡手段12上にセットされたアキシャル型電
子部品1のリードテーピング部分を含むリード線2a,
2bの両端を切断して、更に電子部品本体1aから延出
する両端のリード線2a,2bを所望幅に折曲して、ア
キシャル型電子部品1のリード線先端を基板の所定孔へ
挿入する。The component insertion means 11 is a circular table 7
A lead having a component delivery means 12 for receiving the axial electronic component 1 held by any of the upper chucks 6a to 6d, and a lead including a lead taping portion of the axial electronic component 1 set on the component delivery means 12. Line 2a,
Both ends of 2b are cut, and the lead wires 2a and 2b at both ends extending from the electronic component body 1a are further bent to a desired width, and the tip ends of the lead wires of the axial type electronic component 1 are inserted into predetermined holes of the substrate. .
【0028】さらに、円形テーブル7上の4つのチャッ
ク6a〜6dのいずれかがACサーボモータ8による間
欠回転動作で部品供給手段4の部品供給ステーション位
置Pと部品受渡手段12の部品受渡ステーション位置Q
で同時に位置決めされるよう配設されていて、アキシャ
ル型電子部品1の供給と挿入の動作を同期しておこなわ
せるコントローラ18で上記部品供給手段4、円形テー
ブル7及び部品挿入手段11の各々が制御されている。Further, any one of the four chucks 6a to 6d on the circular table 7 is intermittently rotated by the AC servomotor 8 so that the position P of the component supplying station of the component supplying means 4 and the position Q of the component delivering station of the component transferring means 12 are obtained.
Each of the component supply means 4, the circular table 7 and the component insertion means 11 is controlled by the controller 18 which is arranged so as to be positioned simultaneously by the controller 18 and which synchronously performs the operation of supplying and inserting the axial type electronic component 1. Has been done.
【0029】なお、チャック6a〜6dには異なるテー
ピング幅のアキシャル型電子部品1を挟持できるよう、
4つの突起片(部品挟持手段)19a〜19dが設けら
れている。外側の1対の挟持突起片19a,19dは、
52mm幅のアキシャル型電子部品1を挟持するもので
あり、内側の1対の挟持突起片19b,19cは、26
mm幅のアキシャル型電子部品1を挟持するものであ
る。It should be noted that the chucks 6a to 6d can hold the axial type electronic parts 1 having different taping widths.
Four projecting pieces (component holding means) 19a to 19d are provided. The pair of clamping projection pieces 19a and 19d on the outer side are
The axial electronic component 1 having a width of 52 mm is clamped, and the pair of clamping protrusion pieces 19b and 19c on the inner side is 26
The axial electronic component 1 having a width of mm is sandwiched.
【0030】図14、図15に示すように外側(テーピ
ング幅52mmの電子部品用)の1対の挟持突起片19
a,19dの挟持溝15a,15dは、内側(テーピン
グ幅26mmの電子部品用)の1対の挟持突起片19
b,19cの挟持溝15b,15cより0.15mmだ
け浅くなっている。これら挟持突起片19a〜19d
は、いずれのテーピング幅のものでも挟持可能に構成さ
れている。またチャック6a〜6dは、部品供給ステー
ション位置Pと部品受渡ステーション位置Qで各々部品
供給手段4または部品受渡手段12に対して進退動X,
Yが可能に構成されている。As shown in FIGS. 14 and 15, a pair of clamping projection pieces 19 on the outside (for electronic parts having a taping width of 52 mm).
The sandwiching grooves 15a and 15d of a and 19d are provided on the inner side (for electronic parts having a taping width of 26 mm).
It is shallower by 0.15 mm than the holding grooves 15b and 15c of b and 19c. These clamping projection pieces 19a to 19d
Is configured to be able to be clamped with any taping width. The chucks 6a to 6d are moved back and forth with respect to the component supply means 4 or the component delivery means 12 at the component supply station position P and the component delivery station position Q, respectively.
Y is configured to be possible.
【0031】さらに部品受渡手段12には、セットされ
たアキシャル型電子部品1の部品本体位置をセンタリン
グする1対のセンタリングチャック(センタリング片)
13a,13bが設けられている。Further, a pair of centering chucks (centering pieces) for centering the position of the body of the axial type electronic component 1 that has been set in the component delivery means 12.
13a and 13b are provided.
【0032】このセンタリングチャック13a,13b
の電子部品1の本体1aの両端と接する部分においては
図16に示すように凹み30を有する。この中央部に設
けられた1対のセンタリングチャック13a,13b
は、部品受渡手段12に設けられた保持片9a,9bま
たは10a,10bに受け渡されたアキシャル型電子部
品1の本体1aを両端から挟み込み位置補正をおこなっ
ている。また外側の1対の保持片10a,10b及び内
側の1対の保持片9a,9bは、各々前記外側の1対の
挟持突起片19a,19d及び内側の1対の挟持突起片
19b,19cに対応するように配設され、アキシャル
型電子部品1を保持して挿入手段11まで進退動Zがで
きるように構成されている。The centering chucks 13a and 13b
16 has a recess 30 at a portion in contact with both ends of the main body 1a of the electronic component 1. A pair of centering chucks 13a, 13b provided in the central portion
Corrects the position of the main body 1a of the axial electronic component 1 delivered to the holding pieces 9a, 9b or 10a, 10b provided in the component delivery means 12 from both ends. Further, the pair of outer holding pieces 10a, 10b and the pair of inner holding pieces 9a, 9b respectively correspond to the pair of outer holding projection pieces 19a, 19d and the inner pair of holding projection pieces 19b, 19c. Correspondingly arranged, it is configured to hold the axial electronic component 1 and to move back and forth to the insertion means 11.
【0033】以上のように構成されたアキシャル型電子
部品の挿入装置を図2〜図10を参照しながらその動作
原理を説明する。The principle of operation of the axial type electronic component inserting apparatus configured as described above will be described with reference to FIGS.
【0034】今、図1に示すチャック6aが部品供給ス
テーション位置Pに停止して、チャック6bが部品受渡
ステーション位置Qに停止している場合(工程Fの状
態)についての動作を説明する。Now, the operation when the chuck 6a shown in FIG. 1 is stopped at the component supply station position P and the chuck 6b is stopped at the component delivery station position Q (state of step F) will be described.
【0035】部品供給ステーション位置Pでは図10に
示す第1ステップ〜第4ステップで示される部品取出工
程(工程A)が実施される。すなわち、チャック6aは
コントローラ18のスタート指令を受けて、部品供給手
段4内に保持されているアキシャル型電子部品1のリー
ド線2a,2bとそれを包むテープ3a,3bのテーピ
ング部分を挟持するため、図2(a),(b)で示すよ
うに挟持溝15を有する挟持突起片19の先端を開放し
たままチャック6aは、図1のXで示す方向へ前進する
(第1ステップ)。そして、部品供給手段4内の所定位
置まで前進した後、チャック6aは図3(a),(b)
のアキシャル型電子部品1の両端のテーピング部分3を
挟持する(第2ステップ)。At the parts supply station position P, the parts extraction process (process A) shown in the first to fourth steps shown in FIG. 10 is carried out. That is, the chuck 6a receives the start command from the controller 18 and holds the lead wires 2a and 2b of the axial type electronic component 1 held in the component supply means 4 and the taping portions of the tapes 3a and 3b that wrap them. As shown in FIGS. 2A and 2B, the chuck 6a advances in the direction indicated by X in FIG. 1 with the tip of the holding projection piece 19 having the holding groove 15 left open (first step). Then, after advancing to a predetermined position in the component supply means 4, the chuck 6a is moved to the position shown in FIGS.
The taping portions 3 at both ends of the axial electronic component 1 are clamped (second step).
【0036】次に、アキシャル型電子部品1の両端のテ
ーピング部分3を挟持したチャック6aはアキシャル型
電子部品1を挟持したまま後退し、図4(a),(b)
に示すアキシャル型電子部品1を部品の間隔分の所定ピ
ッチ引き出す(第3ステップ)。Next, the chuck 6a holding the taping portions 3 at both ends of the axial type electronic component 1 is retracted while holding the axial type electronic component 1 as shown in FIGS. 4 (a) and 4 (b).
The axial electronic component 1 shown in is drawn out by a predetermined pitch corresponding to the interval between the components (third step).
【0037】引き出されたアキシャル型電子部品1は、
図5(a),(b)に示すカッタ5a、5bによってテ
ープ3a,3bが切断される(第4ステップ)。この切
断によってチャック6aで挟持されているアキシャル型
電子部品1は、図11(a)に示すテープ3a,3bに
よって連なった状態から図11(b)に示す分離された
状態で取り出される。The axial type electronic component 1 that has been pulled out is
The tapes 3a and 3b are cut by the cutters 5a and 5b shown in FIGS. 5 (a) and 5 (b) (fourth step). By this cutting, the axial type electronic component 1 sandwiched by the chuck 6a is taken out in a separated state shown in FIG. 11 (b) from a state where it is connected by the tapes 3a and 3b shown in FIG. 11 (a).
【0038】ここで、テーピング幅が26mmの時と5
2mmの時の電子部品の挟持状態について説明する。Here, when the taping width is 26 mm and 5
The sandwiching state of the electronic component when it is 2 mm will be described.
【0039】テーピング幅52mmの電子部品1をチャ
ックするときは、外側の1対の挟持溝15a,15dに
より電子部品1のテーピング部分を挟持する。このとき
の電子部品1のリード線径を0.6mm、テーピングの
紙厚を各0.1mmとすると、図17に示すように外側
の1対の挟持突起片19a,19dのすき間は、0.5
mmであり、内側の1対の挟持突起片19b,19dの
すき間は0.8mmとなる。このときに、図19に示す
ようにリード線2a,2bが曲がっており、リード線2
a,2bが内側の挟持溝15b,15cから外れてしま
うような状態でも、内側の挟持突起片同士のすき間がリ
ード線径よりも大きいため、リード線2は挟持突起片1
9b,19cに挟み込まれることなく電子部品の両端の
テーピング部分を外側の挟持溝15a,15dで挟持す
ることができる。もし挟持突起片19a,19b,19
c,19dの内側面及び、挟持溝15a,15b,15
c,15dの溝位置がすべて同一面であったら、前記の
ようなリード線が曲がった状態においてはリード線が内
側の挟持突起片19b,19cに挟み込まれてしまい、
電子部品1のテーピング部分を外側の挟持溝15a,1
5dで挟持できなくなってしまうことになる。When chucking the electronic component 1 having a taping width of 52 mm, the taping portion of the electronic component 1 is clamped by the pair of outer clamping grooves 15a and 15d. At this time, assuming that the lead wire diameter of the electronic component 1 is 0.6 mm and the taping paper thickness is 0.1 mm, the gap between the pair of outer sandwiching projections 19a and 19d is 0. 5
mm, and the clearance between the pair of sandwiching projection pieces 19b and 19d on the inner side is 0.8 mm. At this time, the lead wires 2a and 2b are bent as shown in FIG.
Even when a and 2b are disengaged from the inner sandwiching grooves 15b and 15c, the lead wire 2 has a larger clearance than the lead wire diameter, so that the lead wire 2 has
The taping portions at both ends of the electronic component can be held by the outer holding grooves 15a, 15d without being sandwiched by 9b, 19c. If the clamping projection pieces 19a, 19b, 19
c, 19d inner side surfaces and the holding grooves 15a, 15b, 15
If the groove positions of c and 15d are all on the same plane, the lead wire will be sandwiched by the sandwiching projection pieces 19b and 19c on the inside when the lead wire is bent as described above.
The taping portion of the electronic component 1 is provided with the outer sandwiching grooves 15a, 1
You will not be able to pinch with 5d.
【0040】テーピング幅26mmの電子部品をチャッ
クするときは、内側の挟持溝15b,15cにより電子
部品のテーピング部分を挟持する。このときの電子部品
1のリード線径を0.6mm、テーピングの紙厚を各
0.1mmとすると、図18に示すように外側の1対の
挟持突起片19a,19dのすき間は0.2mmであ
り、内側の1対の挟持突起片19b,19cのすき間は
0.5mmとなる。When chucking an electronic component having a taping width of 26 mm, the taping portion of the electronic component is clamped by the inner clamping grooves 15b and 15c. At this time, if the lead wire diameter of the electronic component 1 is 0.6 mm and the taping paper thickness is 0.1 mm, the gap between the pair of outer sandwiching projections 19a and 19d is 0.2 mm as shown in FIG. Therefore, the clearance between the pair of sandwiching projection pieces 19b and 19c on the inner side is 0.5 mm.
【0041】一方、部品受渡ステーション位置Qでは第
5ステップ〜第7ステップで示される部品受渡工程(工
程B)が実施される。すなわち、チャック6bはすでに
上記第1〜第4ステップ(工程A)を終了しており、ア
キシャル型電子部品1を挟持した状態で、部品受渡ステ
ーション位置Qに移動してきたもので、部品の受渡しは
コントローラ18のスタート指令を受けて上記工程Aと
同時に並行して下記に示す部品受渡工程(工程B)の動
作を開始し始める。On the other hand, at the parts delivery station position Q, the parts delivery process (process B) shown in the fifth to seventh steps is carried out. That is, the chuck 6b has already completed the above first to fourth steps (process A), and has moved to the component delivery station position Q while holding the axial type electronic component 1, and the component delivery is not performed. In response to the start command from the controller 18, at the same time as the above process A, the operation of the component delivery process (process B) shown below is started in parallel.
【0042】すなわち、チャック6bは図1のYで示す
方向へ前進する(第5ステップ)。That is, the chuck 6b advances in the direction indicated by Y in FIG. 1 (fifth step).
【0043】部品受渡し位置まで移動すると、チャック
6bで挟持されているアキシャル型電子部品1は部品受
渡手段12に渡される。部品受渡手段12では図7に示
すアキシャル型電子部品1を受渡チャック9a,9bと
センタリングチャック13a,13bとでとらえて、チ
ャック6bの挟持の解除と後退移動を受けてアキシャル
型電子部品1を受け取る(第6ステップ)。When moved to the component delivery position, the axial electronic component 1 held by the chuck 6b is delivered to the component delivery means 12. In the component delivery means 12, the axial electronic component 1 shown in FIG. 7 is caught by the delivery chucks 9a and 9b and the centering chucks 13a and 13b, and the axial electronic component 1 is received by the release of the clamping of the chuck 6b and the backward movement. (Sixth step).
【0044】なお、ここで受渡チャック9a,9bで受
け取られたアキシャル型電子部品1は、下記に示す工程
Cでチャック6bの挟持の解除と同時にセンタリングチ
ャック13a,13bによってセンタリングの位置補正
がおこなわれる(第8ステップ)。The axial type electronic component 1 received by the delivery chucks 9a, 9b is subjected to centering position correction by the centering chucks 13a, 13b at the same time as the clamping of the chuck 6b is released in step C described below. (Eighth step).
【0045】ここで、電子部品1の本体1aの両端は、
図20に示すように様々である。図20の(a)に示す
ように両端が平面の場合は良いが、図20の(b)に示
すように両端が丸みを帯びている場合は、センタリング
チャック13a,13bによってセンタリング動作をす
る際に、電子部品1が図21に示すように斜め前方へず
れようとする。しかし、センタリングチャック13a、
13bの凹み30に案内されて電子部品1の両端を保持
できるため、安定したセンタリング動作を行うことがで
きる。Here, both ends of the main body 1a of the electronic component 1 are
There are various types as shown in FIG. When both ends are flat as shown in (a) of FIG. 20, it is preferable that both ends are rounded as shown in (b) of FIG. 20 when the centering chucks 13a and 13b perform centering operation. Then, the electronic component 1 tries to shift diagonally forward as shown in FIG. However, the centering chuck 13a,
Since both ends of the electronic component 1 can be held by being guided by the recess 30 of 13b, a stable centering operation can be performed.
【0046】チャック6bは部品受渡手段12の部品の
受取を確認すると、速やかに後退して元の位置へ戻る
(第7ステップ)。When the chuck 6b confirms the receipt of the component by the component delivery means 12, it quickly retracts and returns to its original position (seventh step).
【0047】コントローラ18は、上記部品受渡工程
(工程B)の完了を検出すると、次の第8ステップ〜第
10ステップで示される部品移動工程(工程C)の動作
指令を出力する。すなわち、第8ステップで上記示した
センタリングが行われ、部品受渡手段12はアキシャル
型電子部品1を受渡チャック9a,9bとセンタリング
チャック13a,13bとで保持しながら、図1のKで
示す挿入位置まで図のZ方向へ前進させる(第9ステッ
プ)。そして、第10ステップでアキシャル型電子部品
1を部品挿入手段11へ渡している。When the controller 18 detects the completion of the parts delivery process (process B), it outputs an operation command for the parts movement process (process C) shown in the following eighth to tenth steps. That is, the centering described above is performed in the eighth step, and the component delivery means 12 holds the axial type electronic component 1 by the delivery chucks 9a, 9b and the centering chucks 13a, 13b, and at the insertion position indicated by K in FIG. To the Z direction in the figure until (9th step). Then, in the tenth step, the axial electronic component 1 is delivered to the component insertion means 11.
【0048】ここでコントローラ18は、上記部品移動
工程(工程C)の第10ステップの完了を検出すると、
第12ステップ〜第13ステップで示される部品挿入工
程(工程D)の動作指令を出力する。すなわち、部品挿
入手段11は受渡チャック9a,9bとセンタリングチ
ャック13a,13bとで保持するアキシャル型電子部
品1を受け取り工程Dを開始する。Here, when the controller 18 detects the completion of the 10th step of the component moving step (step C),
The operation command of the component insertion step (step D) shown in the 12th to 13th steps is output. That is, the component insertion means 11 receives the axial electronic component 1 held by the delivery chucks 9a and 9b and the centering chucks 13a and 13b, and starts the process D.
【0049】この工程Dの開始を受けて上記受渡チャッ
ク10は元の位置へ戻る(第10ステップ)。Upon receipt of the start of this process D, the delivery chuck 10 returns to the original position (tenth step).
【0050】さらにコントローラ18は、上記示した工
程C及び工程Dと並行して、上記部品取出工程(工程
A)の第4ステップと上記部品受渡工程(工程B)の第
7ステップの両方の完了を検出すると、移載回転工程
(工程Eの状態)の動作指令を出力する。すなわちコン
トローラ18の回転指令がACサーボモータ8に出力さ
れて、円形テーブル7を図1のRで示す方向へ90度移
動させる(第15ステップ)。このことで、部品供給ス
テーション位置Pのチャック6aはアキシャル型電子部
品1を挟持しながら90度回転して部品受渡ステーショ
ン位置Qに停止する。また、部品受渡ステーション位置
Qにあったチャック6bも同様に90度回転して次のス
テーションに停止する。さらに、チャック6c及びチャ
ック6dも各々次のステーション位置へ移動すること
で、部品供給ステーション位置Pにはチャック6dが停
止することになる。Further, the controller 18 completes both the fourth step of the parts picking process (process A) and the seventh step of the parts delivery process (process B) in parallel with the above-mentioned processes C and D. When is detected, an operation command for the transfer rotation process (state of process E) is output. That is, the rotation command of the controller 18 is output to the AC servomotor 8 to move the circular table 7 by 90 degrees in the direction indicated by R in FIG. 1 (step 15). As a result, the chuck 6a at the component supply station position P rotates 90 degrees while holding the axial electronic component 1 and stops at the component delivery station position Q. Similarly, the chuck 6b located at the part delivery station position Q also rotates 90 degrees and stops at the next station. Further, the chucks 6c and 6d also move to the next station positions, so that the chucks 6d stop at the component supply station position P.
【0051】一方工程Dにおいても上記各工程に並行し
て、部品挿入手段11がアキシャル型電子部品1のリー
ド線2a,2bを図8のWで示す所定の長さに切断し
て、さらにリード線2a,2bを所定幅に折曲する(第
12ステップ)。このように加工されたアキシャル型電
子部品1は、図9の17a,17bで示す基板17の孔
に挿入される(第13ステップ)。続いて挿入されたア
キシャル型電子部品1は、基板17の裏面で更に折曲さ
れて基板17上に固定される(第14ステップ)。On the other hand, also in the process D, in parallel with the above respective processes, the component inserting means 11 cuts the lead wires 2a and 2b of the axial type electronic component 1 into a predetermined length shown by W in FIG. The lines 2a and 2b are bent into a predetermined width (twelfth step). The axial type electronic component 1 processed in this way is inserted into the holes of the substrate 17 shown by 17a and 17b in FIG. 9 (thirteenth step). Subsequently, the axial electronic component 1 inserted is further bent on the back surface of the substrate 17 and fixed on the substrate 17 (14th step).
【0052】このように、工程Fの状態で工程Aと並行
して工程Bの作業がおこなわれ、続いて工程Eの状態で
テーブル7の回転がおこなわれ、更にそれらの間に工程
Cまたは工程Dの作業が並行しておこなわれて上記に示
す1回のタクト動作が完了する。In this way, the work of the process B is performed in parallel with the process A in the state of the process F, the table 7 is subsequently rotated in the state of the process E, and the process C or the process is performed between them. The work of D is performed in parallel, and the above-described one tact operation is completed.
【0053】なお図10に示す上記一連の工程A〜工程
Dは上記説明したように、お互いの各工程の進行状況を
信号状態から確認しながら処理タイミングが図られてい
る。As described above, in the series of steps A to D shown in FIG. 10, the processing timing is achieved while confirming the progress of each step from the signal state.
【0054】以上のように上記実施例によれば、工程A
及び工程Bを終えて、工程Cの実行に依存することな
く、工程Eがおこなわれ、更に次のタクト動作を開始さ
せることが可能となる。これは複数のチャック6a〜6
dや部品受渡手段12の存在が、工程Cの動作に依存す
ることなく、工程A及び工程Bの動作や工程Eの動作を
おこなわせることができて、効率よく挿入手段11へ部
品を供給するものとなっている。したがって、部品挿入
手段11への部品の供給が余分な待時間なしにスムーズ
に次から次へとおこなわれるため、アキシャル型電子部
品1の挿入効率を大幅に向上させることができる。As described above, according to the above embodiment, the process A
Then, after the step B is completed, the step E is performed without depending on the execution of the step C, and the next tact operation can be started. This is a plurality of chucks 6a-6
The existence of d and the part delivery means 12 can perform the operations of the steps A and B and the step E without depending on the operation of the step C, and efficiently supplies the parts to the insertion means 11. It has become a thing. Therefore, the components are smoothly supplied to the component inserting means 11 one after another without extra waiting time, so that the insertion efficiency of the axial electronic component 1 can be greatly improved.
【0055】なお、本実施例においてはチャックを6a
〜6dの4個としたが、2個以上で部品供給手段4と部
品挿入手段11の両方に同時に位置決め可能であればい
ずれであってもかまわない。また、部品供給手段4と部
品挿入手段11は隣接ステーション位置である必要はな
く180度の対向した位置でもよい。さらに、テープ幅
は26mm幅と52mm幅に限定するものではなく、チ
ャック6へ2対以上の挟持突起片19を設けてもかまわ
ない。また、上記実施例の動作の説明においては、セン
タリングチャック13a,13bを動作させたが、セン
タリング不要な部品であれば動作させる必要はない。す
なわち本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づき種々の変形が可能であり、これら
を本発明の範囲から排除するものではない。In this embodiment, the chuck 6a is used.
However, any number may be used as long as two or more can be positioned simultaneously on both the component supply means 4 and the component insertion means 11. Further, the component supply means 4 and the component insertion means 11 do not have to be at the adjacent station positions but may be at 180-degree opposite positions. Furthermore, the tape width is not limited to the width of 26 mm and the width of 52 mm, and the chuck 6 may be provided with two or more pairs of the sandwiching projection pieces 19. Further, although the centering chucks 13a and 13b are operated in the description of the operation of the above-mentioned embodiment, it is not necessary to operate them if the parts do not require centering. That is, the present invention is not limited to the above embodiment,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
【0056】[0056]
【発明の効果】本発明によれば、複数のチャックや部品
受渡手段により無駄な空き時間を削減して、並行して同
時に複数の工程の処理をおこない、アキシャル型電子部
品の挿入効率を向上させると共に、チャックに設けられ
た複数の挟持突起片や部品受渡手段に設けられた複数の
保持片、またはセンタリングチャックによって、異なる
テープ幅仕様のアキシャル型電子部品であっても容易に
対応できるアキシャル型電子部品の挿入方法及びその装
置を提供することができる。According to the present invention, a plurality of chucks and component delivery means reduce wasteful idle time and simultaneously perform a plurality of process steps in parallel to improve the insertion efficiency of axial type electronic components. At the same time, by using a plurality of holding projections provided on the chuck, a plurality of holding pieces provided on the component delivery means, or a centering chuck, it is possible to easily deal with axial electronic components having different tape width specifications. It is possible to provide a method of inserting parts and an apparatus thereof.
【図1】本発明の実施例を示す構成図。FIG. 1 is a configuration diagram showing an embodiment of the present invention.
【図2】部品供給手段のチャック動作であって、(a)
は側面図、(b)は上面図を示す。FIG. 2 is a chucking operation of the component supply means, (a)
Shows a side view and (b) shows a top view.
【図3】部品供給手段のチャック動作であって、(a)
は側面図、(b)は上面図を示す。FIG. 3 is a chucking operation of the component supply means,
Shows a side view and (b) shows a top view.
【図4】部品供給手段のチャック動作であって、(a)
は側面図、(b)は上面図を示す。FIG. 4 is a chuck operation of the component supply means,
Shows a side view and (b) shows a top view.
【図5】部品供給手段のチャック動作であって、(a)
は側面図、(b)は上面図を示す。FIG. 5 is a chucking operation of the component supply means, (a)
Shows a side view and (b) shows a top view.
【図6】部品移載手段の回転移動を示す上面図。FIG. 6 is a top view showing the rotational movement of the component transfer means.
【図7】アキシャル型電子部品の受渡を示す側面図。FIG. 7 is a side view showing the delivery of the axial electronic component.
【図8】リードの切断を示す概念図。FIG. 8 is a conceptual diagram showing cutting of leads.
【図9】アキシャル型電子部品の固定を示す断面図。FIG. 9 is a cross-sectional view showing fixing of the axial type electronic component.
【図10】動作例を示すフローチャート。FIG. 10 is a flowchart showing an operation example.
【図11】アキシャル型電子部品を示すものであって、
(a)、(b)は各々構成図。FIG. 11 is a view showing an axial type electronic component,
(A), (b) is a block diagram, respectively.
【図12】従来例の供給装置を示す斜視図。FIG. 12 is a perspective view showing a conventional supply device.
【図13】従来例の挿入機を示す構成図。FIG. 13 is a configuration diagram showing a conventional insertion machine.
【図14】図1の部分詳細図。FIG. 14 is a partial detailed view of FIG.
【図15】図14のK及びL矢視図。15 is a view as seen from arrows K and L in FIG.
【図16】図1の部分詳細図。FIG. 16 is a partial detailed view of FIG.
【図17】テーピング幅52mm時の挟持状態図。FIG. 17 is a clamping state diagram when the taping width is 52 mm.
【図18】テーピング幅26mm時の挟持状態図。FIG. 18 is a pinching state diagram when the taping width is 26 mm.
【図19】テーピング幅52mm時の挟持状態図。FIG. 19 is a diagram showing a state where the taping width is 52 mm and the holding state is 52 mm.
【図20】電子部品の本体の形状図。FIG. 20 is a shape diagram of a main body of an electronic component.
【図21】センタリング動作時の状態図。FIG. 21 is a state diagram at the time of centering operation.
1 アキシャル型電子部品 1a 電子部品本体 2a、2b リード線 3a、3b テープ 4 部品供給手段 5a、5b カッタ 6a〜6d チャック 7 円形テーブル(部品移載手段) 9a、9b,10a、10b 受渡チャック(保持片) 11 部品挿入手段 12 部品受渡手段 13a、13b センタリングチャック(センタリング
片) 15 挟持溝 19a〜19d 挟持突起片(部品挟持手段) P 部品供給位置 Q 部品受渡位置 K 挿入位置1 Axial type electronic component 1a Electronic component main body 2a, 2b Lead wire 3a, 3b Tape 4 Component supply means 5a, 5b Cutter 6a-6d Chuck 7 Circular table (component transfer means) 9a, 9b, 10a, 10b Delivery chuck (holding) Pieces 11 Parts insertion means 12 Parts delivery means 13a, 13b Centering chucks (centering pieces) 15 Holding grooves 19a to 19d Holding projection pieces (parts holding means) P Parts supply position Q Parts delivery position K Insertion position
───────────────────────────────────────────────────── フロントページの続き (72)発明者 横山 大 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Dai Yokoyama 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (7)
子部品の本体から延出する一対のリード線を有するアキ
シャル型電子部品を基板の所定孔に挿入する方法におい
て、 部品供給位置に停止するチャックがアキシャル型電子部
品集合体を保持する部品供給手段の位置まで前進し、テ
ープに連なるアキシャル型電子部品集合体の縁部を挟持
しながら後退して、部品ピッチ分引き出されたアキシャ
ル型電子部品に連なるテープを部品供給手段に設けられ
たカッタで1つのアキシャル型電子部品に切断する工程
Aと、 上記工程Aを経てアキシャル型電子部品を挟持済の部品
受渡位置に停止する別のチャックが前進し、挟持してい
るアキシャル型電子部品を部品受渡手段に渡して後退す
る工程Bと、 上記工程Bを経てアキシャル型電子部品を保持済の部品
受渡手段が前進して部品挿入手段にアキシャル型電子部
品を渡して後退する工程Cと、 上記工程Cを経てアキシャル型電子部品を受け入れ済の
部品挿入手段がリード線の両端部を切断して、アキシャ
ル型電子部品本体から延出する両端のリード線を所望幅
に折曲し、リード線両先端を基板の所定孔へ挿入して、
基板下で折曲して固定する工程Dと、 上記チャックを含む複数のチャックを備えた部品移載手
段が、1ステーション分移動して各チャックを少なくと
も部品供給位置及び部品受渡位置に移動させる工程E
と、 部品移載手段が停止して、各チャックを少なくとも部品
供給位置及び部品受渡位置に停止させておく工程Fとを
有し、 上記工程Eと工程Fとは交互に実行され、 上記工程F中に、上記工程Aが実行され、これと並行し
て同時に工程Bが実行され、 次のサイクルの工程Bにおいて部品受渡位置にあるチャ
ックが部品受渡手段にアキシャル型電子部品を渡しうる
状態になるまでに、工程Cが終了し、 次のサイクルの工程Cにおいて部品受渡手段が部品挿入
手段にアキシャル型電子部品を渡しうる状態になるまで
に、工程Dが終了することを特徴とするアキシャル型電
子部品の挿入方法。1. A method of inserting an axial type electronic component having a pair of lead wires extending from a main body of an electronic component formed by taping at regular intervals into a predetermined hole of a substrate, and chucking at a component supply position. Moves forward to the position of the component supply means that holds the axial type electronic component assembly, retreats while pinching the edge of the axial type electronic component assembly that is continuous with the tape, and the axial type electronic component is pulled out by the component pitch. A step A of cutting the continuous tape into one axial electronic component by a cutter provided in the component supply means, and another chuck for stopping the axial electronic component at the sandwiched component delivery position advances through the above step A. , Step B of passing the sandwiched axial type electronic component to the component delivery means and retracting it, and holding the axial type electronic component through the above step B Step C in which the component delivery means moves forward to pass the axial electronic component to the component insertion means and retracts, and the component insertion means which has received the axial electronic component through step C cuts both ends of the lead wire. , Bend the lead wires at both ends extending from the main body of the axial type electronic component to a desired width, insert both ends of the lead wires into predetermined holes of the substrate,
Step D of bending and fixing under the substrate, and step of moving one chuck by at least one component transfer means having a plurality of chucks including the above chuck to move each chuck to the component supply position and the component delivery position. E
And a step F in which the component transfer means is stopped so as to stop each chuck at least at the component supply position and the component delivery position, and the process E and the process F are alternately executed. In the inside, the above-mentioned step A is executed, and at the same time, the step B is executed at the same time, and in the step B of the next cycle, the chuck at the component delivery position becomes ready to deliver the axial electronic component to the component delivery means. The process C is completed, and the process D is completed by the time that the component delivery means is ready to deliver the axial electronic component to the component insertion means in the process C of the next cycle. How to insert parts.
子部品の本体位置を両側から挟み込みセンタリングをお
こなう請求項1記載のアキシャル型電子部品の挿入方
法。2. The method of inserting an axial electronic component according to claim 1, wherein in step C, the component delivery means performs centering by sandwiching the main body position of the axial electronic component from both sides.
子部品の本体から延出する一対のリード線を有するアキ
シャル型電子部品を基板の所定孔に挿入する装置におい
て、 前記アキシャル型電子部品の縁部を挟持して前後動可能
に構成されたチャックと、 上記チャックを均等な間隔を隔てて円周状に複数配設し
てなり、各チャックを少なくとも部品供給位置及び部品
受渡位置に停止させるようにして間欠回転動作をおこな
う部品移載手段と、 前記アキシャル型電子部品集合体に連なるテープを切断
するカッタを備えると共に、アキシャル型電子部品集合
体を保持して部品供給位置に位置するチャックに供給す
る部品供給手段と、 アキシャル型電子部品を部品受渡位置に位置するチャッ
クから受け取り、挿入位置へ移動させる部品受渡手段
と、 上記挿入位置で部品受渡手段からアキシャル型電子部品
を受け取り、リード線の両端部を切断し、延出するリー
ド線を所望幅に折曲して、リード線両先端を基板の所定
孔へ挿入して基板下で折曲して固定する部品挿入手段と
を有することを特徴とするアキシャル型電子部品の挿入
装置。3. An apparatus for inserting an axial electronic component having a pair of lead wires extending from a main body of the electronic component formed by taping at regular intervals into a predetermined hole of a substrate, the edge of the axial electronic component. A chuck that is configured to be able to move back and forth by sandwiching a portion, and a plurality of chucks that are circumferentially arranged at equal intervals to stop each chuck at least at a component supply position and a component delivery position. And a cutter for cutting the tape connected to the axial type electronic component assembly and holding the axial type electronic component assembly and supplying it to the chuck located at the component supply position. And a component delivery means for receiving the axial electronic component from the chuck located at the component delivery position and moving it to the insertion position. At the insertion position, the axial electronic component is received from the component delivery means, both ends of the lead wire are cut, the extending lead wire is bent to a desired width, and both ends of the lead wire are inserted into predetermined holes of the board. And a component inserting means for bending and fixing the substrate under the substrate.
ング幅のアキシャル型電子部品のテープとリード線とを
同時に挟持するテーピング幅に合わせた複数対の挟持突
起片を備え、かつ部品受渡手段が部品挟持手段の挟持突
起片に対応した保持片を備えた請求項3記載のアキシャ
ル型電子部品の挿入装置。4. The chuck includes a plurality of pairs of holding projections corresponding to taping widths for simultaneously holding a tape and a lead wire of an axial type electronic component having different taping widths, and the component passing means holds the parts. The axial electronic component inserting device according to claim 3, further comprising a holding piece corresponding to the holding projection piece of the means.
型電子部品の本体を両側から挟み込みセンタリングする
センタリング片を備えた請求項3または4記載のアキシ
ャル型電子部品の挿入装置。5. The apparatus for inserting an axial electronic component according to claim 3, further comprising a centering piece for sandwiching and centering a main body of the axial electronic component on which the component delivery means is set from both sides.
と接する部分において凹みを有することを特徴とする請
求項5記載のアキシャル型電子部品の挿入装置。6. The apparatus for inserting an axial type electronic component according to claim 5, wherein the centering piece has a recess at a portion in contact with both sides of the main body of the electronic component.
電子部品のテーピング縁部を挟持する挟持溝を有し、大
きなテーピング幅の電子部品を挟持する挟持突起片の挟
持溝が、小さなテーピング幅の電子部品を挟持する挟持
突起片の挟持溝より微小量浅くなっていることを特徴と
する請求項4、5または6記載のアキシャル型電子部品
の挿入装置。7. The holding projection piece of the chuck has a holding groove for holding a taping edge portion of an axial type electronic component, and the holding groove of the holding projection piece for holding an electronic component having a large taping width has a small taping width. 7. The axial electronic component insertion device according to claim 4, wherein the clamping projection is configured to clamp the electronic component, and the clamping groove is slightly smaller than the clamping groove.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28744395A JP3296948B2 (en) | 1995-06-07 | 1995-11-06 | Axial electronic component insertion method and device |
| US08/740,993 US5701662A (en) | 1995-11-06 | 1996-11-05 | Axial type electronic component inserting apparatus |
| CN96121625A CN1074642C (en) | 1995-11-06 | 1996-11-06 | Axial type electronic component inserting method and apparatus |
| KR1019960052339A KR100237334B1 (en) | 1995-11-06 | 1996-11-06 | Axial type electronic component inserting method and apparatus |
| SG1996011048A SG67362A1 (en) | 1995-11-06 | 1996-11-06 | Axial type electronic component inserting method and apparatus |
| US08/932,962 US6205655B1 (en) | 1995-11-06 | 1997-09-18 | Axial-type electronic component inserting method |
| US09/772,929 US6477766B2 (en) | 1995-11-06 | 2001-01-31 | Axial-type electronic component inserting apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-139779 | 1995-06-07 | ||
| JP13977995 | 1995-06-07 | ||
| JP28744395A JP3296948B2 (en) | 1995-06-07 | 1995-11-06 | Axial electronic component insertion method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0955600A true JPH0955600A (en) | 1997-02-25 |
| JP3296948B2 JP3296948B2 (en) | 2002-07-02 |
Family
ID=26472479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28744395A Expired - Lifetime JP3296948B2 (en) | 1995-06-07 | 1995-11-06 | Axial electronic component insertion method and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3296948B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308573A (en) * | 2000-04-24 | 2001-11-02 | Kitagawa Ind Co Ltd | Covering case of electronic component and covering method thereof |
| JP2003110281A (en) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Electronic component insertion method and device |
| JP2014063938A (en) * | 2012-09-24 | 2014-04-10 | Panasonic Corp | Component supply apparatus |
| JP2014063939A (en) * | 2012-09-24 | 2014-04-10 | Panasonic Corp | Component conveyer pallet |
| JP2014063937A (en) * | 2012-09-24 | 2014-04-10 | Panasonic Corp | Component insertion apparatus and component insertion method |
| CN109648346A (en) * | 2018-12-28 | 2019-04-19 | 王飞 | A kind of data pin fixture and automatic cycle assembly line |
| CN111050539A (en) * | 2018-10-15 | 2020-04-21 | 松下知识产权经营株式会社 | Parts supply device |
| WO2026004443A1 (en) * | 2024-06-26 | 2026-01-02 | 矢崎総業株式会社 | Work set jig switching device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110788626B (en) * | 2019-09-27 | 2021-09-14 | 温州聚星科技股份有限公司 | Automatic welding and stamping integrated equipment for point contact type silver contacts |
-
1995
- 1995-11-06 JP JP28744395A patent/JP3296948B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308573A (en) * | 2000-04-24 | 2001-11-02 | Kitagawa Ind Co Ltd | Covering case of electronic component and covering method thereof |
| JP2003110281A (en) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Electronic component insertion method and device |
| JP2014063938A (en) * | 2012-09-24 | 2014-04-10 | Panasonic Corp | Component supply apparatus |
| JP2014063939A (en) * | 2012-09-24 | 2014-04-10 | Panasonic Corp | Component conveyer pallet |
| JP2014063937A (en) * | 2012-09-24 | 2014-04-10 | Panasonic Corp | Component insertion apparatus and component insertion method |
| CN111050539A (en) * | 2018-10-15 | 2020-04-21 | 松下知识产权经营株式会社 | Parts supply device |
| CN109648346A (en) * | 2018-12-28 | 2019-04-19 | 王飞 | A kind of data pin fixture and automatic cycle assembly line |
| WO2026004443A1 (en) * | 2024-06-26 | 2026-01-02 | 矢崎総業株式会社 | Work set jig switching device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3296948B2 (en) | 2002-07-02 |
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