JPH09237801A - Electronic component storage package - Google Patents

Abstract

(57) Abstract: [PROBLEMS] To provide a package for storing electronic parts having a relatively simple structure. An electronic component mounting portion of an electronic component storage package 50 is formed of a conductor that constitutes a piezoelectric vibrator mounting electrode 74. Therefore, in effect, the package 50 includes electronic components such as the piezoelectric vibrator 60 on the substrate 5.
An electronic component in which a piezoelectric vibrator mounting electrode 74 connected to a surface electrode 66 for supporting at a predetermined height from the surface 54 of the second surface is formed in a predetermined thickness on the surface 54 of the substrate 52 by thick film printing. It is provided and configured on the mounting portion. Therefore, in the electronic component such as the piezoelectric vibrator 60, the substrate 52 is laminated to form the concave portion on the surface 54, or the separately manufactured supporting metal fitting is not fixed to the surface 54.
It is supported by the piezoelectric vibrator mounting electrode 74 provided on the electronic component mounting portion formed by the thick film printing method. Therefore, it is possible to obtain the electronic component storing package 50 having a relatively simple structure with low manufacturing cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package for storing electronic components such as piezoelectric vibrators.

[0002]

2. Description of the Related Art For example, a piezoelectric vibrator which obtains a predetermined vibration frequency needs to be housed in an airtight package and shut off from the outside air in order to prevent fluctuations in frequency due to adsorption of gas in the atmosphere. However, in order to vibrate stably, it is necessary to support it at a part of its peripheral edge and hold it in a state where other parts including the central part do not come into contact with the substrate or the like constituting the package.

[0003]

Therefore, a conventional electronic component storage package is disclosed in, for example, Japanese Patent Laid-Open No. 6-19188.
No. 7, JP-A-6-37195, etc., a supporting portion for supporting the piezoelectric vibrator is provided on the surface of the substrate, and a lid for forming an airtight space is provided on the surface side. It is formed by fixing. The flat package type piezoelectric component described in the above-mentioned Japanese Patent Laid-Open No. 6-191887 is, for example, as shown in FIG. 1, a case-shaped stem 12 having a housing recess 10 having a container shape opened upward. A flat plate-shaped lid member 14 is fixed to the opening end by glass, a brazing material, a resin, or the like. The storage recess 10 is formed in the shape of a two-step hole having a stepped portion 16, and the piezoelectric vibrator mounting electrode 18 provided on the upper surface of the stepped portion 16 is coated with a conductive adhesive 20 to form a piezoelectric vibrator. 22 is connected. Therefore, the piezoelectric vibrator 2
2 is supported at its peripheral portion, and a space having a sufficient size is formed in the lower portion thereof as shown in the figure to prevent contact with the housing-shaped stem 12.

The housing-shaped stem 12 is manufactured, for example, by the alumina green sheet laminating method. The case-shaped stem 12 has a through hole 26 penetrating from the upper surface of the stepped portion 16 to the back surface 24 and a back surface electrode 28 provided on the back surface 24, and a connection conductor is provided in the through hole 26. By being filled with 30, the piezoelectric vibrator mounting electrode 18 is connected to the back surface electrode 28 provided outside the package.

However, in the above flat package type piezoelectric component, a punching die or a laminating jig is formed for each alumina green sheet of each of the layers 32a to 32c shown by broken lines in the drawing for forming the stepped accommodating recess 10. There is a problem that the manufacturing cost becomes high because the tool is required.

Further, the electronic component storing package described in the above-mentioned Japanese Patent Laid-Open No. 6-37195 is provided on the surface of a substrate 34 formed by, for example, an alumina green sheet laminating method, as shown in FIG. A support metal fitting 38 for supporting the piezoelectric vibrator 22 at its peripheral portion is fixed to a part of the surface electrode 36 having a predetermined pattern by a conductive adhesive or the like, and a box for forming an airtight space on the surface side thereof. A mold-shaped lid body 40 is configured by being fixed by glass, a brazing material, a resin, or the like. However, this electronic component storage package has a problem in that the structure and the process are complicated and the manufacturing cost is increased because the support fitting 38 is required.

In order to reduce the manufacturing cost as much as possible,
It is conceivable to form the surface electrode 36 by a thick film screen printing method or the like using a thick film substrate instead of the alumina green sheet laminating method. However, even in that case, in order to support the piezoelectric vibrator 22, It is necessary to use the support metal fittings 38 as shown in FIG. 2, which complicates the structure and the manufacturing process and increases the manufacturing cost.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component storing package having a relatively simple structure.

[0009]

In order to achieve such an object, the gist of the present invention is that a lid having a predetermined box shape is provided on the surface side of a substrate provided with a surface electrode having a predetermined shape on the surface. A state in which a predetermined electronic component is provided in a predetermined height position from the surface of the substrate in an airtight space formed by fixing the body and is supported by an electronic component mounting electrode connected to the surface electrode An electronic component storing package for storing in, (a) the electronic component mounting electrode is provided on an electronic component mounting portion formed in a predetermined thickness on the surface of the substrate by thick film printing. To be there.

[0010]

As described above, the electronic component storing package is configured such that the electronic component mounting electrodes are provided on the electronic component mounting portion formed on the surface of the substrate to have a predetermined thickness by thick film printing. To be done. Therefore, an electronic component such as a piezoelectric vibrator is formed by a thick film printing method without forming a concave portion on the surface of a substrate and forming a concave portion on the surface of the substrate, or by fixing a separately prepared supporting metal member to the surface. It is supported by an electronic component mounting electrode provided on the component mounting portion. Therefore, it is possible to obtain a package for storing electronic components, which has a relatively simple structure and has a low manufacturing cost.

[0011]

Other Embodiments of the Invention Here, preferably, the electronic component mounting portion is formed of a conductor forming the electronic component mounting electrode. In this way, the conductor paste for forming the electronic component mounting electrodes is printed on the surface of the substrate with a predetermined thickness so as to be electrically connected to the surface electrodes. The part and the electronic component mounting electrode are integrally formed. Therefore, the manufacturing process is further simplified, and the electronic component storage package can be manufactured at a lower manufacturing cost.

Preferably, the electronic component mounting portion is made of an insulator, and the electronic component mounting electrode passes through the electronic component mounting portion and the surface electrode is formed by thick film printing. It is provided by. In this way, since the electronic component mounting portion is formed by thick-film printing the insulating paste that is relatively thick and easy to print, the manufacturing process is further simplified, and
Since the connection resistance between the electronic component mounting electrode and the surface electrode becomes low, the electronic component can be operated more stably.

Further, preferably, the electronic component storing package is provided with a concave portion for storing a chip-shaped component in the airtight space on the surface of the substrate. With this configuration, the silicon chip or the like can be mounted on the lower side of the electronic component such as the piezoelectric vibrator, so that the circuit board can be further downsized and the degree of freedom in circuit design can be increased.

Preferably, the surface electrode is provided so as to extend from the inside of the airtight space to the outside,
(b) a back electrode provided on the back surface of the substrate, and (c) the front surface electrode and the back surface electrode by being continuously formed in the thickness direction from the front surface to the back surface of the substrate outside the airtight space. And a connection electrode for connecting to each other. With this configuration, since the electrode for connecting to the circuit board or the like is provided on the back surface side of the electronic component storage package, the area required for mounting on the circuit board can be reduced.

Further, preferably, in the connection electrode, a conductor is formed inside a through hole penetrating from the front surface to the back surface of the substrate, and the substrate has individual electronic parts according to a dividing line passing through the through hole. It is formed on the end surface of the substrate by being separated for each storage package. By doing this, since the front surface electrode and the back surface electrode are electrically connected to each other on the side surface of the substrate, the area required for mounting is further reduced, and at the time of picking up a large number of electronic component storing packages, Since the connection electrodes of the electronic component storage package of 1 are provided by the conductors formed in the through holes common to the electronic component storage packages adjacent to each other, the through electrodes required for forming the connection electrodes are formed. Since the number of holes is reduced, the manufacturing cost can be further reduced.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 is a diagram showing a sectional structure of an electronic component storing package (hereinafter, simply referred to as a package) 50 according to an embodiment of the present invention. In the figure, the package 50
Is the surface 5 of the substrate 52 made of alumina ceramics or the like.
4, a box-shaped lid 56, which is also made of alumina ceramics and is similarly fixed, is formed. In the airtight space 58 formed by the substrate 52 and the lid 56, crystal vibration is generated. A piezoelectric vibrator 60 such as a child is provided in a state of being supported on the peripheral portion. In addition,
The figure shows a state before the lid body 56 is fixed in the manufacturing process of the package 50.
After the lid body 56 is fixed, the substrate 52 is divided along the break grooves 62 shown on both sides of the lid body 56 in the figure to separate the individual packages 50. In this embodiment, the break groove 62 corresponds to the dividing line.

A front surface electrode 66 and a back surface electrode 68 each made of, for example, an Ag--Pd-based conductor and having a thickness of about 15 μm are formed on the front surface 54 of the substrate 52 and the back surface 64 opposite to the front surface 54. The front surface electrode 66 and the back surface electrode 68 are formed on the inner wall surface of a through hole 70 having a diameter of about 0.25 mm and penetrating the substrate 52 in the thickness direction. Electrode 7
2 are connected. Therefore, the package 50
When mounting on various circuit boards not shown,
The back electrode 68 can be directly connected to the pad provided on the circuit board. Since the break groove 62 is formed through the through hole 70, the connection electrode 72 is formed on the end surface of the substrate 52 when the package 50 is individually divided. Become.

The surface electrode 66 is formed continuously from the inside to the outside of the airtight space 58 formed by the substrate 52 and the lid 56, and the inside surface electrode 66 is formed.
A piezoelectric vibrator mounting electrode 74 having a thickness of, for example, about 50 μm and made of an Ag—Pd 2 -based conductor containing alumina powder as a filler is formed on a part of the above. The piezoelectric vibrator 60 is supported by being adhered to the piezoelectric vibrator mounting electrode 74 at the peripheral portion by, for example, an aramid-based conductive adhesive 76. Therefore, the piezoelectric vibrator 60 is provided so as to be separated from the surface 54 of the substrate 52 by a distance sufficiently larger than the amplitude of the vibration, for example, about 50 μm or more. That is, in the present embodiment, an electronic component mounting portion for supporting the piezoelectric vibrator 60 at a predetermined height position of about 50 μm or more from the surface 54 of the substrate 52 is formed on the surface electrode 66 and the surface electrode 66 is provided. The piezoelectric vibrator mounting electrode 74 is electrically connected to the piezoelectric vibrator 66.

The package 50 constructed as described above
Is manufactured as follows, for example, according to the process shown in FIG. First, in the alumina substrate manufacturing process of process 1, a break groove 62 for dividing each package 50 and a through hole 7 having a diameter of about 0.25 mm.
A substrate 52 made of alumina ceramics having a size and shape of 0 is prepared. The substrate 52 is formed by, for example, cutting a green sheet formed by a doctor blade method, an extrusion molding method, or the like into a predetermined size by, for example, a pressing machine, punching a through hole 70, and forming a break groove 62. It is obtained by firing at a predetermined temperature. Next, in the step 2 of printing the surface electrode conductor paste, the substrate 5
A surface electrode 66 is formed by printing Ag-Pd-based thick film conductor paste on the surface 54 of No. 2 with a predetermined surface electrode pattern and baking it at a predetermined temperature in the baking step of step 3. By sucking through the through hole 70 from the back surface 64 side during the above printing, part of the conductor paste printed on the front surface 54 side spreads to the inside of the through hole 70.

In the subsequent step 4 of printing the back electrode conductor paste and step 5 of the firing step, the above step 2 is performed.
In the same manner as in and 3, the back electrode 68 is printed by printing Ag-Pd-based thick film conductor paste on the back surface 64 of the substrate 52 and firing it.
To form Also in this step 4, the conductor paste is spread in the through hole 70 by sucking from the surface 54 side through the through hole 70 as in the step 2. As a result, the conductor paste is continuously printed inside the through holes 70, and the connection electrodes 72 are formed after firing. The thickness of each of the front surface electrode 66 and the back surface electrode 68 formed on the front surface 54 and the back surface 64 is about 15 μm.

As described above, the front surface electrode 66 and the back surface electrode 6
8 and the connection electrode 72 are formed, in the step 6 of printing the conductor paste for electrodes for mounting the piezoelectric vibrator, for example, an alumina powder having a particle size of about 1 μm is used as a filler.
By adding about 10 wt%, the remaining amount of baking (baked film thickness / printed film thickness%) is adjusted to about 60%, and the Ag-Pd-based conductor paste is printed on a part of the surface electrode 66. For example, it is possible to perform firing at a predetermined temperature in the firing process of
Repeated times, the height from the surface 54 of the substrate 52 is 50 μm
The piezoelectric vibrator mounting electrode 74 having a predetermined height is formed. The piezoelectric vibrator mounting electrodes 74 are provided, for example, at three locations for each package 50.

As described above, since the electronic component mounting portion for supporting the piezoelectric vibrator 60 is constituted by the piezoelectric vibrator mounting electrode 74, the electronic component mounting portion is substantially provided in this embodiment. Is formed to a predetermined thickness on the surface of the substrate by thick film printing, and the electronic component mounting electrode is provided on the surface. The number of times of repeating the above steps 6 and 7 is appropriately set according to the characteristics of the conductor paste and the like so as to obtain the above-mentioned predetermined height.
For example, if the amount of alumina powder added to the above-mentioned conductor paste is set to about 20 wt%, the firing residual rate will be 80 wt%.
If it is about%, one printing is sufficient.

In the step 8 of printing the glass paste for sealing, for example, a glass paste made of glass having a glass transition point of about 250 ° C. is printed inside the break groove 62, and in the step 9 of firing. By heating at a predetermined temperature, the glass layer 78 for sealing is formed as shown in FIG. As a result, a package substrate that constitutes the package 50 for housing the piezoelectric oscillator 60 such as a crystal oscillator can be obtained.

In manufacturing the package 50 using the above-mentioned package substrate, first, in the piezoelectric vibrator bonding step of step 10, the piezoelectric vibrator 60 is attached to the piezoelectric vibrator mounting electrode 74 by an aramid conductive adhesive or the like. Glue. Then, in the lid sealing step of step 11, by placing the lid 56 on the glass layer 78 for sealing formed on the substrate 52, for example, by heat treatment in dry nitrogen at a predetermined temperature, The substrate 52 and the lid 56 are fixed to each other to form an airtight space 58. Then, in the separation step of step 12, the substrate 52 is divided along the break groove 62, whereby the individually separated packages 50 are obtained.
The package 50 thus obtained can be surface-mounted on various circuit boards and exhibits stable operation.

Here, according to the present embodiment, the electronic component mounting portion of the electronic component storage package 50 is formed of a conductor that constitutes the piezoelectric vibrator mounting electrode 74. Therefore, in effect, the package 50 includes a piezoelectric vibrator mounting electrode 74 connected to a surface electrode 66 for supporting an electronic component such as the piezoelectric vibrator 60 at a predetermined height from the surface 54 of the substrate 52. Is provided on the electronic component mounting portion formed on the surface 54 of the substrate 52 to have a predetermined thickness by thick film printing. Therefore, the electronic component such as the piezoelectric vibrator 60 is formed by the thick film printing method without forming the substrate 52 in a laminated manner and providing a concave portion on the surface 54 or fixing a separately prepared supporting metal member on the surface 54. It is supported by the piezoelectric vibrator mounting electrode 74 provided on the formed electronic component mounting portion. Therefore, the electronic component storage package 5 having a relatively simple structure with low manufacturing cost
0 is obtained.

Moreover, in this embodiment, since the electronic component mounting portion is constituted by the piezoelectric vibrator mounting electrode 74, the conductor paste for forming the piezoelectric vibrator mounting electrode 74 is replaced by the surface electrode 66. The surface 54 of the substrate 52 so as to be electrically connected to the top, ie to the surface electrode 66.
By performing thick film printing with a predetermined thickness, the electronic component mounting portion and the piezoelectric vibrator mounting electrode 74 are integrally formed.
Therefore, the manufacturing process is simplified and the package 50 can be manufactured at a lower manufacturing cost.

Further, in this embodiment, the surface electrode 66
Is provided so as to extend from the inside of the airtight space 58 to the outside, and the package 50 includes a backside electrode 68 provided on the backside 64 of the substrate 52 and a surface 54 to a backside 64 of the substrate 52 outside the airtight space 58. And a connection electrode 72 that connects the front surface electrode 66 and the back surface electrode 68 by being continuously formed in the thickness direction. With this configuration, the back surface 64 side of the package 50 is provided with the electrodes for connecting to the circuit board or the like, so that the area required for mounting on the circuit board can be reduced.

Further, in this embodiment, the connection electrode 74
Is a Ag-Pd based conductor is formed inside the through hole 70 that penetrates from the front surface 54 to the back surface 64 of the substrate 52.
The board 52 is formed on the end surface of the board 52 by separating the board 52 for each individual package 50 along the break groove 62 passing through the through hole 70. In this way, the surface electrode 6 is formed on the side surface of the substrate 52.
Since the electrical continuity between the backside electrode 6 and the backside electrode 68 is secured, the area required for mounting is further reduced and the package 5
When a large number of 0s are taken, the connection electrodes 74 of the individual packages 50 are provided by the conductors formed in the through holes 70 common to the packages 50 adjacent to each other, so that the connection electrodes 74 are formed. Therefore, the number of through holes required for the above is reduced, and the manufacturing cost can be further reduced.

Further, in this embodiment, since the electronic component storing package 50 can be manufactured by the thick film printing method, the size of the substrate 52 is appropriately changed and printing is performed in a multi-cavity pattern to achieve high mass production. Sex,
The package 50 can be manufactured at a lower cost.

Next, another embodiment of the present invention will be described. In the following embodiments, description of parts common to the above-described embodiments will be omitted.

In the above-described embodiments, the package 50 attached to the circuit board by soldering or the like has been described, but the present invention is applicable to the case where the electronic component package is integrally formed on a part of the thick film circuit board, for example. Also applies.

FIG. 5 is a process chart for explaining a manufacturing method in the case where a part of the thick film circuit board is provided with a package for housing electronic components. First, in the alumina substrate manufacturing step of step 1, an alumina green sheet is molded by, for example, a doctor blade method or an extrusion molding method, cut into a predetermined size, and baked at a predetermined temperature to manufacture a circuit board. . Next, in the conductor pattern conductor paste printing step of step 2, for example, an Ag-Pd based conductor paste is printed on the surface of the circuit board in a predetermined pattern, and is baked at a predetermined temperature in step 3 of the baking step. , Forming a conductor pattern. In this embodiment, this conductor pattern corresponds to the surface electrode. And step 4
In the conductor paste printing process for the vibrator mounting electrode of
A similar Ag-Pd based conductor paste is printed at a predetermined position on this conductor pattern, and is baked at a predetermined temperature in the baking step of step 5, so that the same piezoelectric vibrator mounting electrode 74 as that of the above-described embodiment is obtained. Form. At this time, the height of the piezoelectric vibrator mounting electrode 74 from the surface of the circuit board is, for example,
It is about 30 μm.

In the subsequent step 6 of printing the resistor paste and step 7 of the firing step, the resistor paste is thick-film printed at a predetermined position on the surface of the circuit board and fired at a predetermined temperature to form the circuit board. A thick film resistor is formed on the surface. In order to protect this thick-film resistor by thick-film printing a predetermined glass paste on it and baking it in the over-coating glass paste printing step of step 8 and the baking step of step 9. Overcoat glass layer is formed. In the step 10 of printing glass paste for sealing and the step of baking 11 in the same manner as in steps 8 and 9 shown in FIG. 4, the same glass paste is printed at the position where the lid 56 is sealed, By firing, a similar glass layer 78 for sealing is formed.

Then, in the piezoelectric vibrator bonding step of step 12, as in step 10 shown in FIG. 4, the piezoelectric vibrator 6 such as a crystal vibrator is attached to the piezoelectric vibrator mounting electrode 74.
0 is bonded with an aramid-based conductive adhesive or the like, and in the lid sealing step of the following step 13, the lid 56 is placed on the glass layer 78 for sealing and heated under the same conditions as in step 11 of FIG. By processing, a circuit board partially including an electronic component storage package can be obtained.

Also in this embodiment, the piezoelectric vibrator mounting electrode 74 is formed by printing the conductor paste on a part of the conductor pattern corresponding to the surface electrode. The electronic component mounting portion is formed by. Therefore, substantially, the piezoelectric vibrator 6
A piezoelectric vibrator mounting electrode 74 connected to a conductor pattern for supporting an electronic component such as 0 at a predetermined height position from the surface of the circuit board is formed in a predetermined thickness on the surface of the circuit board by thick film printing. It is provided on the electronic component mounting part. Therefore, an electronic component such as the piezoelectric vibrator 60 is formed by the thick film printing method without forming a circuit board in a laminated manner and providing a concave portion on the surface of the circuit board or fixing a separately prepared supporting metal member on the surface. It is supported by the piezoelectric vibrator mounting electrode 74 provided on the electronic component mounting portion. Therefore, it is possible to obtain a thick film circuit board including the electronic component storing package 50 having a relatively simple structure and having a low manufacturing cost.

Further, in this embodiment, since the electronic component storing package is integrally formed on a part of the thick film circuit board, when it is formed separately as shown in the above embodiment. By comparison, the height of the thick film circuit board after mounting various components is lower than that of the conventional one.

FIG. 6 is a process chart for explaining a method of manufacturing an electronic component storing package of still another embodiment.
First, in the alumina substrate manufacturing step of step 1, the substrate 52 having the break groove 62 and the through hole 70 is manufactured similarly to the embodiment shown in FIG. Next, in the glass paste printing step of step 2, the substrate 52
A glass paste is printed in a dot shape at a predetermined position on the surface 54 and is baked at a predetermined temperature in the baking process of step 3 to form an insulating glass layer having a thickness of, for example, about 40 μm. Then, in the step 4 to 7 of printing the conductor paste for front surface electrode to the step of firing, the front surface electrode 66 and the back surface electrode 68 are formed by thick film printing of the conductor paste in the same manner as in steps 2 to 5 shown in FIG. At the same time, the connection electrode 72 is formed in the through hole 70.

At this time, as shown in FIG. 7, on the surface 54 of the substrate 52 on which the surface electrode conductor paste is printed,
Insulating glass layer 8 formed in dots in Step 2 above
0 is provided, and the conductor paste is printed at a position passing over the insulating glass layer 80. Therefore, the surface electrode 66 is formed on the surface 54 of the substrate 52 and the insulating glass layer 8.
Insulating glass layer 80 formed so as to be continuous on
The surface electrode 66 formed above constitutes a piezoelectric vibrator mounting electrode 82 for supporting the piezoelectric vibrator 60. As a result, the piezoelectric vibrator mounting electrode 82 is provided at a predetermined height position from the surface 54 while being connected to the surface electrode 66. Therefore, in this embodiment, the insulating glass layer 80 corresponds to the electronic component mounting portion. In this embodiment, since the surface electrode 66 is formed to have a thickness of about 15 μm, the predetermined height position is about 50 μm like the package 50 shown in FIG.

Steps 8 to 12 after thick-film printing and firing of the conductor paste on the front surface 54 and the back surface 64 as described above
Is the same as steps 8 to 12 in FIG.

In this embodiment, the insulating glass layer 80 corresponding to the electronic component mounting portion is made of an insulator, and the electronic component mounting electrode 82 passes over the insulating glass layer 80 and the surface electrode 66 is thick-film printed. It is provided by being formed. By doing so, the electronic component mounting portion (insulating glass layer 80) is formed by thick-film printing a glass paste that is relatively thick and easy to print, and thus the manufacturing process is further simplified and the Since the connection resistance between the component mounting electrode 82 and the surface electrode 66 becomes substantially zero, the electronic component such as the piezoelectric vibrator 60 can be operated more stably.

FIG. 8 is a view showing a sectional structure of an oscillator 84 which is another example of the electronic component storing package of still another example. In this embodiment, a concave portion 86 having a depth of, for example, about 500 μm is provided in the central portion of the surface 54 of the substrate 52, and a silicon chip 88 having a predetermined circuit formed therein is fixed therein. A wire bonding pad 90 made of, for example, an Au-based conductor is provided around the concave portion 86, and bumps (not shown) provided on the silicon chip 88 and the pad 90 are connected to each other by a gold wire 92. ing. The structure of the other parts is the same as that of the package 50 of FIG.

In manufacturing the oscillator 84 described above,
First, an alumina green sheet having a recessed portion 86 is formed by, for example, powder press molding, and baked to produce a substrate 52, and the front surface 54 and the back surface 66 of the substrate 52 are formed on the front surface 54 and the back surface 66 by the steps 2 to 5 in FIG. According to Au-Pd
The surface electrode 6 by printing and firing the system conductor paste
6 and the back surface electrode 68 are formed. Then, the pad 90 is produced by printing and firing the Au-based conductor paste, and then the piezoelectric vibrator 60 is adhered and the lid 56 is sealed according to steps 6 to 12 of FIG. can get. However, in this embodiment, the process 10
Prior to adhering the piezoelectric vibrator 60, the silicon chip 88 is adhered to the inside of the recess 86 by resin or the like,
A step of wire-bonding the silicon chip 88 and the pad 90 with a gold wire 92 is performed.

Also in this embodiment, the piezoelectric vibrator mounting electrode 74 is formed at a predetermined height by printing a thick film of the conductive paste on the surface 54 of the substrate 52 as in the above-described embodiments. The structure of the oscillator 84 is simplified and can be manufactured at low cost.

Moreover, in this embodiment, since the concave portion 86 for accommodating the silicon chip 88 is provided on the surface 54 of the substrate 52, the silicon chip is provided below the electronic component such as the piezoelectric vibrator 60. By mounting 88 or the like, the silicon chip 88 is provided in the electronic component storage package to configure the oscillator 84. Therefore, the circuit board including the oscillator 84 can be further downsized, and the degree of freedom in circuit design can be increased.

Although one embodiment of the present invention has been described in detail with reference to the drawings, the present invention can be carried out in still another mode.

For example, in the above-described embodiment, the case where the break groove 62 and the through hole 70 are formed by the press machine has been described, but they may be formed by, for example, laser processing. In this way, since a mold is not required, the pattern shape can be easily changed.

Although the substrate 52 and the lid 56 are fixed to each other by the glass layer 78 for sealing in the embodiment, they may be sealed by, for example, an epoxy type sealing agent. In that case, the sealing property in the vicinity of the surface electrode 66 can be further improved by printing and baking glass on the sealing portion in advance to reduce the step difference due to the surface electrode 66.

In the embodiment, Ag-P is used as the conductor paste for forming the piezoelectric vibrator mounting electrode 74.
Although a mixture of d-type conductor paste and alumina powder was used, various inorganic materials such as mullite and zircon other than alumina powder may be used as the filler to be mixed. In order to increase the adhesive strength between the piezoelectric vibrator mounting electrode 74 and the substrate 52 as much as possible, it is desirable that the difference in the coefficient of thermal expansion between them be as small as possible. Large Ag-Pd conductors and A
Since a g-Pt-based conductor or the like is used, the filler having a low coefficient of thermal expansion such as alumina or mullite is preferable.

A sufficient thickness (about 50 μm in this embodiment) is obtained without mixing a filler such as alumina powder.
The filler does not necessarily have to be mixed as long as the conductor can be formed.

Further, in the examples, the amount of alumina powder mixed with the conductor paste was such that the residual baking rate was 60% or
Although it was determined to be about 80%, the firing residual rate depends on the required thickness and conductivity of the piezoelectric vibrator mounting electrode 74,
Alternatively, the amount of alumina powder is appropriately changed in consideration of the degree of complexity of the process by repeating steps 6 and 7 in FIG. 4, and the amount of alumina powder mixed is set accordingly. In addition,
The firing residual rate should be 60% or more in steps 6 and 7.
It is desirable to minimize the number of repetitions of.

Further, in the embodiment, the through hole 7
By forming the break groove 62 so as to pass through 0, the connection electrode 72 for connecting the front surface electrode 66 and the back surface electrode 68 is formed on the end face of the substrate 52 separated along the break groove 62. Although provided, the break groove 62 may be formed so as not to interfere with the through hole 70.

Further, in the embodiment, the case where the present invention is applied to the package 50 in which the piezoelectric vibrator 60 is housed is explained, but the present invention is applied to the package in which other electronic parts such as semiconductors are housed. The invention applies as well.

Further, in the embodiment, the height of the piezoelectric vibrator mounting electrodes 74 and 82 is set to about 50 μm from the surface 54 of the substrate 52, but the height of the electronic component mounting electrodes is housed inside. Depending on the characteristics of the electronic component to be formed, such as the amplitude, it is appropriately set so as not to come into contact with the surface 54 in any case.

Further, in the embodiment, the through hole 7
The diameter of 0 was set to about 0.25 mm, but the diameter can be changed as appropriate, and may be set to about 0.20 to 1.0 mm, for example.
However, the break groove 62 is formed so as to pass through the through hole 70.
When the substrate 52 is separated along the break groove 62, the connection electrode formed inside the through hole 70 may be peeled off when the through hole 70 is separated. The diameter is preferably 0.25 mm or more. On the other hand, in order to ensure the airtightness of the airtight space 58 formed by the substrate 52 and the lid 56, the lid 56 needs to be positioned on the inner peripheral side of the through hole 70. When the substrate 52 is separated along the break groove 62, the outer peripheral portion of the substrate 52 projects outside the lid 56 by the radius of the through hole 70. Therefore, in order to make the size of the package 50 as small as possible and to make the internal airtight space 58 large, it is desirable that the radius of the through hole 70 is small.
Therefore, the diameter of the through hole 70 is most preferably 0.25 mm.

Although not illustrated one by one, the present invention can be variously modified without departing from the spirit thereof.

[Brief description of drawings]

FIG. 1 is a diagram showing a cross-sectional structure of a conventional electronic component storage package.

FIG. 2 is a view showing a cross-sectional structure of another conventional electronic component storage package.

FIG. 3 is a diagram showing a sectional structure of an electronic component storing package according to an embodiment of the present invention.

FIG. 4 is a process drawing showing the method of manufacturing the electronic component storing package of FIG.

FIG. 5 is a process drawing showing a method of manufacturing an electronic component storing package according to another embodiment of the present invention.

FIG. 6 is a process drawing showing a method for manufacturing an electronic component storing package according to still another embodiment of the present invention.

FIG. 7 is a diagram for explaining an electronic component mounting electrode formed by the manufacturing method of FIG.

FIG. 8 is a view showing a cross-sectional structure of a package for housing an electronic component according to still another embodiment of the present invention.

[Explanation of symbols]

 50: Package for storing electronic parts 52: Substrate 54: Surface 56: Lid 58: Airtight space 60: Piezoelectric vibrator 66: Surface electrode 74: Electrode for mounting piezoelectric vibrator (electrode for mounting electronic parts)

Claims (6)

[Claims] 1. A predetermined electronic component is placed in an airtight space formed by fixing a predetermined box-shaped lid to a front surface side of a substrate having a predetermined surface electrode provided on the surface thereof. An electronic component housing package for housing in a state of being supported by an electronic component mounting electrode connected to the surface electrode at a predetermined height from the surface of the substrate, wherein the electronic component mounting electrode is An electronic component storage package, which is provided on an electronic component mounting portion formed on the surface of the substrate to a predetermined thickness by thick film printing. 2. The electronic component storage package according to claim 1, wherein the electronic component mounting portion is formed of a conductor forming the electronic component mounting electrode. 3. The electronic component mounting portion is made of an insulator, and the electronic component mounting electrode is provided by passing through the electronic component mounting portion and forming the surface electrode by thick film printing. The package for storing electronic components according to claim 1, which is a package. 4. The package for storing electronic components according to claim 1, wherein a recessed portion for storing a chip-shaped component in the airtight space is provided on the surface of the substrate. 5. The front surface electrode is provided so as to extend from the inside of the airtight space to the outside, and the back surface electrode provided on the back surface of the substrate and from the surface of the substrate outside the airtight space. 5. The electronic component storage package according to claim 1, further comprising a connection electrode that connects the front surface electrode and the back surface electrode by being formed continuously on the back surface in the thickness direction. 6. The connection electrode has a conductor formed inside a through hole penetrating from the front surface to the back surface of the board, and the board is formed for each electronic component storage package according to a dividing line passing through the through hole. 6. The substrate is formed on the end surface of the substrate by being separated.
Package for storing electronic components.