JPH09162268A - Method and apparatus for adjusting mounting angle of sensor of wafer position detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jig for accurately adjusting the mounting angle of a sensor, which has a window corresponding to an optical detection region of an optical position sensor aligned in the direction of the center of a rotary table. SOLUTION: A jig 11A for adjusting the mounting angle of a sensor has a window 12 similar in shape to an optical detection region 16a of an edge sensor 16. If the edge sensor 16 is mounted correctly, i.e., aligned with a radius of a wafer, an ineffective area Ds does not occur and the edge sensor 16 produces the maximum output. Such a simple jig allows the mounting angle of an optical position sensor to be adjusted quickly, precisely and safely only by finding the maximum output.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor mounting angle adjusting jig for adjusting the mounting angle of a position detecting sensor for detecting the position of a substantially disk-shaped substrate, and a sensor mounting angle adjusting method for a substrate position detecting device. Regarding

[0002]

2. Description of the Related Art As a device for holding a substantially disk-shaped substrate on a spin chuck for processing, there is an edge exposure device, a rotation processing device such as a spin coater or a developer. In these rotation processing devices, the substrate to be processed is transferred by a transfer means such as a so-called transfer robot and transferred to the spin chuck. However, if the center of the substrate and the center of rotation of the spin chuck are eccentric (positional deviation) at this time, problems will occur in each process. For example, in a coater or a developer, if there is eccentricity, the centrifugal force becomes non-uniform, and the problem that the chemical liquid cannot be applied uniformly occurs, and in the edge exposure apparatus, there is a problem that the edge exposure cannot be performed at an accurate position. Therefore, it is important to align the substrates in order to minimize such eccentricity. In such a case, first, the eccentricity amount of the substrate needs to be accurately obtained, but for that purpose, it is necessary to improve the accuracy of the position detection of the substrate.

Generally, when detecting the position of the substrate, FIG.
As described above, the semiconductor substrate (hereinafter referred to as a wafer) 1 is placed on the spin chuck 2 and rotated around the vertical axis 2a, and the edge position of the wafer 1 is detected by the edge detection sensor 3. An optical position detection sensor such as a photoconductive element (photosensor) or a one-dimensional CCD is usually used as the edge detection sensor.

Among them, the photosensor utilizes that electron-hole pairs are generated in a region irradiated with light having an energy larger than the band gap, and electric conductivity increases (that is, electric resistance decreases). To do. When a photosensor is used, its optical detection region is arranged so as to be long in the radial direction of the wafer 1, and the optical detection region is irradiated with light from the projector 4 so that it is shielded by the wafer 1 as a light shield. Instead, the output voltage proportional to the area of the region where the light is incident is output as the position information. As the photosensor, there is a CdS photoconductive cell in which polycrystalline CdS is applied between opposed electrodes.

On the other hand, in a one-dimensional CCD, charges generated by incident light are stored in a potential well formed in a semiconductor, a transfer voltage is applied from the outside, and the potential well is sequentially moved, so that the charges are transferred to the semiconductor surface. It is an element that transfers along the line, and is a device in which the sensor and the scanning unit are integrated. When a one-dimensional CCD is used, its optical detection area is arranged so as to be elongated in the radial direction of the wafer 1, and the area is shielded by the wafer 1 by irradiating the optical detection area with light from the projector 4. Then, the boundary address of the region that is not light-shielded and is light-transmitted is found and used as position information.

When the edge detection of the wafer is performed by using the edge detection sensor described above, the longitudinal direction of the optical detection area of the edge detection sensor is the direction toward the rotation center of the spin chuck 2 (hereinafter referred to as the rotation radius direction). It is necessary to be in an exact match. If, as shown in FIG. 15, there is an error in the mounting angle of the edge detection sensor (deviation angle QPR).
If there is a line, the edge detection sensor should originally take the value of | PQ |
Value is taken in, and an edge detection error is caused by (| PR | − | PQ |), and the measurement accuracy is significantly reduced. Therefore, the mounting angle of the edge detection sensor must be adjusted accurately.

[0007]

Conventionally, the adjustment of the mounting angle of the edge detection sensor has been performed by a method of using a jig of some kind. However, in those methods, for example, the jig is attached to a spin chuck and the adjustment is performed. It is a trial-and-error work that involves monitoring the output of the edge detection sensor on the tool and fine-adjusting the mounting of that sensor, then replacing the jig and repeating the same work. In addition, the workability was extremely poor, such as requiring skilled workers.

In view of the above problems, the present invention provides a sensor mounting angle adjusting jig and a substrate position detecting device which can accurately and easily adjust the mounting angle of an edge detecting sensor by using a low cost jig. , And a method for adjusting a sensor mounting angle of a substrate position detecting device.

[0009]

According to a first aspect of the present invention, an optical detection area having a length in at least one direction is formed so as to detect an edge position of a substantially disc-shaped light shield on a rotary table. The optical position detecting sensor is used to adjust the mounting angle of the optical position detecting sensor, and corresponds to the optical detecting area of the optical position detecting sensor when the rotation center point is aligned with the rotary table. A transparent hole having a shape corresponding to the optical detection region when the optical position detection sensor is attached at an optimum attachment angle is formed at the position.

According to a second aspect of the present invention, there is provided an optical position detecting sensor in which an optical detecting area having a length in at least one direction is formed so as to detect the edge position of the substantially disc-shaped light shield on the rotary table. A ring which is a locus of an optical detection area of the optical position detection sensor when the rotation center point is rotated with respect to the rotary table. In the area
At least a pair of light transmitting holes having different distances from the center of rotation are formed.

According to a third aspect of the present invention, as a sensor mounting angle adjusting method for a substrate position detecting device for detecting the position of a substrate held on a turntable, (a) an optical table is mounted on a turntable which holds the substrate rotatably. A sensor mounting angle adjusting jig having a light transmitting hole having a shape corresponding to the optical detection area of the static position detecting sensor is mounted, and (b) the rotation mounting the sensor mounting angle adjusting jig. A step of monitoring the detection signal of the optical position detection sensor while rotating the table and matching the position of the light transmitting hole viewed from the rotation center of the rotary table with the mounting position of the optical position detection sensor, c) monitoring the detection signal of the optical position detection sensor while rotating the direction of the optical detection region of the optical position detection sensor within the substrate rotation plane by the turntable, and detecting the optical position detection sensor. Of the orientation of the optical detection region and a step to match the radial direction of the rotary table.

According to a fourth aspect of the present invention, there is provided a method of adjusting a sensor mounting angle of a substrate position detecting device for detecting a position of a substrate held on a turntable, comprising: (d) a turntable holding a substrate rotatably, A step of mounting a sensor mounting angle adjusting jig having at least a pair of light transmitting holes having different distances from the rotation center point, and (e) a rotary table on which the sensor mounting angle adjusting jig is mounted. While rotating
A step of calculating a rotation angle difference of the rotary table when each of the at least one pair of light transmitting holes is monitored by a detection signal of the optical position detection sensor, and (f) from the calculated rotation angle difference, A step of calculating a deviation angle of a direction of an optical detection area of the optical position detection sensor with respect to a rotation radius direction of the turntable, and (g) a deviation angle of a direction of the calculated optical detection area, Rotating the optical position detection sensor to change the mounting angle of the optical position detection sensor.

According to the first and third aspects of the present invention, first, a jig for adjusting a sensor mounting angle is formed in the rotary table, in which a light transmitting hole having a shape corresponding to an optical detection area of the optical position detecting sensor is formed. While mounting the table and rotating the rotary table, the detection signal from the optical position detection sensor is monitored to match the position of the light transmitting hole viewed from the center of rotation of the rotary table with the mounting position of the optical position detection sensor. . Then, while the orientation of the optical detection area of the optical position detection sensor is rotated within the substrate rotation plane by the turntable, the detection signal of the optical position detection sensor is monitored to detect the optical position of the optical position detection sensor. The direction of the area is made to coincide with the radial direction of rotation of the rotary table. Thus, the mounting angle of the optical position detecting sensor can be adjusted accurately and safely in a short time by using a simple jig. Moreover, according to the third aspect, since the mounting angle adjustment can be automatically processed, the labor can be greatly reduced.

According to the second and fourth aspects of the invention, first, the sensor mounting angle adjusting jig having at least a pair of light transmitting holes having different distances from the center of rotation is formed on the rotary table. Then, while rotating the turntable, the detection signal of the optical position detection sensor is monitored to calculate the rotation angle difference of the turntable at the time of passing through each light transmitting hole. Then, the deviation angle in the direction of the optical detection area of the optical position detection sensor with respect to the rotation radius direction of the turntable is calculated from the calculated rotation angle difference, and the deviation angle in the direction of the calculated optical detection area is calculated according to the calculated deviation angle. Then, the optical position detection sensor is rotated so as to change the mounting angle of the optical position detection sensor. Thus, the mounting angle of the optical position detecting sensor can be adjusted accurately and safely in a short time by using a simple jig. Moreover, according to the fourth aspect, since the mounting angle adjustment can be automatically performed, the labor can be greatly reduced.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION

{First Embodiment} A substrate position detecting apparatus according to a first embodiment of the present invention is applied to a silicon wafer in a process of forming a fine pattern in a process of manufacturing an electronic component such as an IC, an LSI or a liquid crystal display device. The position of the substrate, such as a semiconductor substrate, a dielectric, a metal or an insulator, which is a substantially disk-shaped substrate, is rotated to perform processing such as coating and developing a photoresist solution and exposing the peripheral area of the substrate. It is intended to adjust the mounting angle of the optical sensor for detection.
Hereinafter, this embodiment will be described.

<Structure of Sensor Mounting Angle Adjusting Jig> FIG. 1 is a plan view showing the sensor mounting angle adjusting jig of this embodiment. The sensor mounting angle adjusting jig 11A (hereinafter, simply referred to as a jig 11A) is a perfect circular light-shielding plate made of aluminum or the like, and an edge detecting sensor described later at a position separated from the center point Po by a predetermined distance. 16 optical detection areas 1
A single rectangular light-transmitting hole 12 having substantially the same shape as 6a is formed by punching. That is, the light transmitting hole 12 is formed in a rectangular shape having a predetermined length in the radial direction of the jig 11A. In FIG. 1, the area of the light transmitting hole 12 is set to be slightly smaller than the area of the optical detection region 16a of the edge detecting sensor 16, but conversely, the area of the light transmitting hole 12 is set to be smaller than that of the edge detecting sensor 16. The area may be larger than the target detection area 16a, or may be set to the same area.

<Device Configuration> FIG. 2 is a diagram showing a substrate position detecting device of this embodiment. The substrate position detecting device rotates a spin chuck (rotary table) 14 for rotatably holding a wafer or a jig (hereinafter, generally referred to as a wafer) 11 to be subjected to position detection, and a spin chuck 14. Chuck rotation driving means (table rotation driving means) 15 to be driven, and chuck rotation driving means 15
An edge detection sensor (optical position detection sensor) 16 that outputs a detection signal corresponding to the edge position of the wafer 11 or the like each time the wafer 11 or the like rotates, and the edge detection sensor 1
The sensor rotation driving means 17 for rotationally driving 6 and the control section CE for controlling each of these sections are provided.

The chuck rotation driving means 15 includes a first motor 21 connected to the vertical shaft 20 of the spin chuck 14.
And a first drive circuit 21A for driving the first motor 21.
Consists of

A photo sensor is used as the edge detection sensor 16. As shown in FIG. 3, the photosensor has a rectangular optical detection region 16a elongated in one direction, and outputs an electric signal proportional to the incident area of light to the optical detection region 16a. As shown in FIG. 3, the edge detection sensor 16 is supported by a vertical shaft 25 so that its optical detection region 16a can rotate in a horizontal plane, and its longitudinal direction is the rotation center direction of the spin chuck 14. That is, it is provided so that it can be directed in the radial direction of rotation. The incident area information of the light detected by the edge detection sensor 16 is shown in FIG.
As described above, after being converted into a digital signal by the A / D converter 24, it is transmitted to the control unit CE.

The sensor rotation driving means 17 is a second shaft connected to the lower end of the vertical shaft 25 supporting the edge detection sensor 16.
Motor 26 and a second drive circuit 26A for driving the second motor 26.

As the control unit CE, a central processing unit (CPU) of a general computer having a RAM, a ROM and an interface is used, and software stored in advance in a storage device (RAM) 18 as an externally connected device. The control operation is performed according to a program, and an operation panel 19 for inputting instructions from an operator is connected.
The control unit CE has a function of adjusting the mounting angle of the edge detection sensor 16 based on the detection result of the edge detection sensor 16.

Here, the concept of adjusting the mounting angle of the edge detection sensor 16 by the control unit CE will be described. FIG.
[Fig. 6] is a diagram showing a case where the mounting angle of the edge detection sensor 16 is displaced with respect to the radial direction of rotation. In the case of FIG. 4, the optical detection area 16a of the edge detection sensor 16 and the light transmitting hole 12 of the jig 11A do not completely overlap each other. Then, a region (non-detection region) Ds which is not detected by the edge detection sensor 16 in the light passing through the light transmitting hole 12 is generated. That is, when the non-detection area Ds is generated, it can be said that the mounting angle of the edge detection sensor 16 is deviated. Therefore, the edge detection sensor 16 moves in the direction in which the non-detection area Ds does not occur.
It suffices to match the optical detection areas 16a of.
The control unit CE of this embodiment adjusts the mounting angle by using such a concept, and the jig 11A on the spin chuck 14 is centered on the vertical axis 20 as shown in FIG. First rotation instructing means 31 for instructing the first drive circuit 21A to rotate to
The position of the light transmitting hole 12 viewed from the rotation center of the spin chuck 14 and the edge detection sensor 16 during the rotation of the jig 11A.
Edge detection sensor 1 to determine whether it matches the mounting position of
6 and the position coincidence determining means 32 for detecting the rotational position where the output from the A / D converter 24 shows the maximum value, and the jig 11A.
The chuck rotation position adjusting means (table rotation position adjusting means) 33 for controlling the first drive circuit 21A so that the position is arranged at the rotation position detected by the position coincidence determining means 32, and the edge detection sensor 16 is centered on the vertical axis 25. The second rotation instructing means 34 for instructing the second drive circuit 26A to rotate the edge detection sensor 16, the orientation of the optical detection region 16a of the edge detection sensor 16 during rotation of the edge detection sensor 16, and the radius of rotation of the spin chuck 14. Arranged at the rotational position detected by the direction coincidence determining means 35 by the direction coincidence determining means 35 for detecting the rotational position at which the output from the edge detection sensor 16 shows the maximum value so as to determine the coincidence with the direction. And a sensor mounting angle determining means 36 for controlling the second drive circuit 26A so as to determine.

<Operation> A method for adjusting the sensor mounting angle of the substrate position detecting device will be described below with reference to the flowchart of FIG.

First, in step S1, the jig 11A is used.
Is placed and held such that its rotation center point Po coincides with the center of the vertical axis 20 of the spin chuck 14. And
In step S2, the detection data from the edge detection sensor 16 is read and stored in the storage device 18 (RAM). Then, in step S3, the first rotation instruction means 31 gives an instruction to the first drive circuit 21A to rotate the vertical shaft 20 of the spin chuck 14 through the first motor 21 by a predetermined minute angle. Then, the phase angle θ ₁ of the spin chuck 14 at this time is transmitted to the position coincidence determination means 32.

In step S4, it is determined whether or not the phase angle θ ₁ of the spin chuck 14 has reached 360 ° (whether or not it has made one rotation). When it is determined that the angle is less than 360 °, steps S2 to S4 are repeated. When it is determined that the angle reaches 360 °, the process proceeds to step S5.

In step S5, the position coincidence determination means 32
The maximum value among the detection values of the edge detection sensor 16 stored in the storage device 18 is searched by. Then, the phase angle θ _1S at that time is transmitted to the chuck rotation position adjusting means 33. Then, under the control of the chuck rotation position adjusting means 33, the first drive circuit 21A causes the jig 11A to move to the position of the phase angle θ _1S detected by the position coincidence determining means 32 through the first motor 21. The vertical shaft 20 of the spin chuck 14 is rotated. Then, step S6
Then, the detection data from the edge detection sensor 16 is read and stored in the storage device 18 (RAM). Then, the second rotation instruction means 34 causes the second drive circuit 26A.
To the vertical axis 25 of the edge detection sensor 16 through the second motor 26 (step S7). Then, the phase angle θ ₂ of the spin chuck 14 at this time is transmitted to the direction coincidence determining means 35.

In step S8, the edge detection sensor 16
It is determined whether or not the phase angle θ _{2 of} has reached a predetermined maximum angle (for example, about 90 °). If it is determined that the angle is less than the maximum angle, the processes of steps S6 to S8 are repeated. If it is determined that the maximum angle has been reached, the process proceeds to step S9.

In step S9, the transparent hole 1 of the jig 11A
2 and the optical detection region 16a of the edge detection sensor 16 have substantially the same shape, the edge detection sensor 16
When the installation angle of is normal, that is, the edge detection sensor 16
When the mounting angle is correctly in the rotation radius direction of the substrate, the non-detection area Ds described above does not occur, and it can be considered that the output signal of the edge detection sensor 16 has the maximum value. It is detected by the direction coincidence determination means 35. That is, the maximum value of the detection values of the edge detection sensor 16 is searched. Then, the phase angle θ _2S of the edge detection sensor 16 at that time is transmitted to the sensor mounting angle determining means 36. Then, the second drive circuit 26A causes the edge detection sensor 1 to operate under the control of the sensor mounting angle determination means 36.
The vertical shaft 25 of the edge detection sensor 16 is rotated through the second motor 26 so that 6 is arranged at the position of the phase angle θ _2S detected by the direction coincidence determination means 35. Then, the edge detection sensor 16 is adjusted to the most desirable mounting angle as shown in FIG.

By using a simple jig in this way,
The mounting angle of the edge detection sensor can be adjusted accurately and safely in a short time. Therefore, it is possible to perform accurate measurement when detecting the position of the substrate.

{Second Embodiment} <Structure of Sensor Mounting Angle Adjusting Jig> FIG. 7 is a plan view showing a sensor mounting angle adjusting jig used in the second embodiment of the present invention. The sensor mounting angle adjusting jig 11B (hereinafter, simply referred to as a jig 11B) is the jig 11 in the first embodiment.
Similar to A, a light-shielding plate made of aluminum or the like is punched and formed into a substantially perfect circle, but a point that a pair of light-transmitting holes (apertures) 12a and 12b are formed is the same as the first embodiment. different. The distances R ₁ and R ₂ between the light transmitting holes 12a and 12b from the center point Po of the jig 11B are set to different values, for example, for an apparatus for processing a wafer having a diameter of 8 inches. Regarding the jig 11B, the separation distance R ₁ from the center point Po of the center point of the first light transmitting hole 12a is 100 mm, and the center point Po of the center point of the second light transmitting hole 12b is Po.
The separation distance R ₂ from each is set to 90 mm.

Both the light transmitting holes 12a and 12b are arranged so as to be located at a rotationally symmetrical position of 180 ° about the rotation center point Po. In addition, both of the light transmitting holes 12a, 12
The perforation areas S _a and S _b of _b may be set to the same area,
In order to distinguish between the two light transmitting holes 12a and 12b, they are set to be different from each other in this embodiment. Specifically, S _a <S _b is set.

<Structure of Device> The substrate position detecting device of this embodiment is similar to that of the first embodiment in outline, but the light transmitting holes 12a and 12b of the sensor mounting angle adjusting jig 11B to be handled are two. The difference is that the control unit CE is configured to correspond to the number of individual units.

That is, the control unit CE, as shown in FIG. 8, the rotation instructing means 41 for instructing the first drive circuit 21A to rotate the jig 11B on the spin chuck 14 about the vertical axis 20, and the cure. While the tool 11B is rotating, the jig 1
The first rotation position detecting means 42 for detecting the first rotation position θa when the edge detection sensor 16 detects the first light transmitting hole 12a of 1B, and the first rotation position detecting means 42 of the jig 11B during the rotation of the jig 11B. Second rotational position detecting means 43 for detecting the second rotational position θb when the edge detection sensor 16 detects the second light transmitting hole 12b, and the detected first rotational position θa.
Angle difference calculation means 44 for calculating the rotation angle difference between the second rotation position θb and the second rotation position θb, and the direction of the optical detection region 16a of the edge detection sensor 16 with respect to the rotation radius direction of the spin chuck 14 from the calculated rotation angle difference. Deviation angle calculation means 45 for calculating the deviation angle of the edge detection sensor 16 and the sensor attachment angle determination means 4 for controlling the second drive circuit 26A so as to change the attachment angle of the edge detection sensor 16 according to the calculated deviation angle of the attachment angle.
6 and.

The control unit CE is similar to that of the first embodiment in that a central processing unit (CPU) of a general computer having a RAM, a ROM, an interface and the like is used. In addition, the spin chuck 14,
The structures of the chuck rotation driving means 15, the edge detection sensor 16, the sensor rotation driving means 17, and the like are the same as those in the first embodiment, and therefore their explanations are omitted.

<Operation> The method for adjusting the sensor mounting angle of the substrate position detecting device will be described below with reference to the flowchart of FIG.

First, in step T1, the sensor mounting angle adjusting jig 11B is set so that its center point Po coincides with the center of the vertical axis 20 of the spin chuck 14. Then, in step T2, the detection data from the edge detection sensor 16 is read and stored in the storage device 18 (RAM). Then, in step T3, the rotation instruction means 41 gives an instruction to the first drive circuit 21A,
The vertical shaft 20 of the spin chuck 14 is rotated through the first motor 21. In step T4, it is determined whether or not the phase angle θ ₁ of the spin chuck 14 has reached 360 ° (whether or not it has made one rotation). When it is determined that the angle is less than 360 °, steps T2 to T4 are repeated. When it is determined that the angle reaches 360 °, the process proceeds to step T5.

Here, when a photo sensor is used as the edge detection sensor 16, the relationship between the phase angle θ ₁ of the spin chuck 14 and the read detection data at the time of step T5 is as shown in FIG. There is. That is, FIG.
The edge detection sensor 16 has the transparent holes 12a, 12
When b is detected, both transparent holes 12a,
A sensor output distribution having a pair of substantially trapezoidal peaks Ma and Mb corresponding to 12b can be seen. Therefore, in step T5, the phase angle θ at the center point of the tops (upper side) of both mountains Ma, Mb
₁ is detected by the first rotational position detecting means 42 and the second rotational position detecting means 43, and the first rotational position θ is detected.
It is stored in the storage device 18 as a and the second rotation position θb. Here, since S _a <S _b , Mb having a higher output at the top of the two peaks corresponds to _Sb having a larger area.

Then, in step T6, the deviation angle calculation means 45 calculates the deviation angle of the mounting angle of the edge detection sensor 16. Here, the calculation method by the deviation angle calculation means 45 will be described. Originally, the edge detection sensor 1
If the mounting angle of 6 is desirable, that is, if the longitudinal direction of the detection region is correctly in the radial direction of rotation of the substrate, the angular difference between the first rotational position θa and the second rotational position θb is 180 °. Should be. Therefore, assuming that the first light transmitting hole 12a is at the position shown in FIG. 12, when the jig 11B is rotated 180 ° about the center point Po, the second light transmitting hole 12b is shown in FIG. Will be moved to the position.

However, when the mounting angle of the edge detection sensor 16 is tilted, the difference between the first rotational position θa and the second rotational position θb is 180 °, as shown in FIG. α occurs. The error α can be expressed by the following equation 1.

[0040]

[Equation 1]

In this case, the center point of the first light transmitting hole 12a is A and the center point of the second light transmitting hole 12b is B, and the distance α between the error α and the sides OA and OB is L _OA and L _OB. Therefore, the deviation angle of the mounting angle of the edge detection sensor 16 is as shown in Formula 2.

[0042]

(Equation 2)

In step T7, the sensor mounting angle determining means 46 controls the second drive circuit 26A based on the calculation result of the deviation angle calculating means 45, and the vertical axis of the edge detecting sensor 16 is controlled through the second motor 26. 25 is rotated and the edge detection sensor 16 is adjusted to the most desirable mounting angle.

Thus, by using a simple jig,
The mounting angle of the edge detection sensor can be adjusted accurately and safely in a short time. Therefore, it is possible to perform accurate measurement when detecting the position of the substrate.

{Modification} (1) In the second embodiment, a pair of both transparent holes 12 are provided.
180 around the center point Po of the jig 11B.
Although they are arranged so as to be located at rotational symmetry positions of °, they are not limited to this. For example, the difference (= R ₁ −R ₂ ) between the separation distances R ₁ and R ₂ from the center point Po is punched out. If the size is sufficient for maintaining the strength of processing, both transparent holes 12
You may arrange | position a and 12b in the position of the same direction from the rotation center point Po. Alternatively, the phase angles may be set in any manner as long as they are arranged in phase in a direction rotated by a predetermined angle such as 120 ° or 90 °.

(2) As the edge detection sensor 16,
A sensor other than the photo sensor may be used. It should be noted that in the above-described embodiment, since the one that outputs an electric signal according to the incident area of light is used, the light transmitting holes 12 and 12 are used.
The positions of a and 12b can be easily detected by detecting the peaks of the output electric signal.

(3) In Embodiments 1 and 2, the edge detection sensor 16 is rotated by the second motor 26 to adjust the mounting angle of the edge detection sensor 16, but the present invention is not limited to this, and for example, a micrometer. The method of the present invention can be carried out with a device configuration in which the mounting angle is manually adjusted by using a reduction machine such as a gear.

[0048]

According to the first and third aspects of the present invention, first, a sensor in which a light-transmitting hole having a shape corresponding to an optical detection area of an optical position detection sensor is formed on a rotary table. While mounting the mounting angle adjustment jig and rotating the rotary table, monitor the detection signal from the optical position detection sensor and attach the optical position detection sensor to the position of the light transmitting hole as seen from the center of rotation of the rotary table. The position of the optical position detection sensor is matched with the position of the optical position detection sensor while the direction of the optical detection area of the optical position detection sensor is rotated in the plane of rotation of the substrate by the rotary table, and the detection signal of the optical position detection sensor is monitored. Since the direction of the optical detection area of is aligned with the rotation radius direction of the rotary table, the mounting angle of the optical position detection sensor can be adjusted accurately and safely in a short time by using a simple jig. It becomes possible way. Moreover, according to the third aspect, since the mounting angle adjustment can be automatically processed, there is an effect that the labor can be significantly reduced.

According to the second and fourth aspects of the invention, first, the sensor mounting angle adjusting jig having at least a pair of light transmitting holes having different distances from the center of rotation is formed on the rotary table. While mounting and rotating the rotary table, the detection signal of the optical position detection sensor is monitored to calculate the rotation angle difference of the rotary table when passing through each light transmitting hole, and the rotation angle difference is calculated from the calculated rotation angle difference. The misalignment angle of the direction of the optical detection area of the optical position detection sensor with respect to the rotation radius direction of the table is calculated, and the mounting angle of the optical position detection sensor is determined according to the calculated misalignment angle of the direction of the optical detection area. Since the optical position detection sensor is configured to rotate so that it can be changed, the mounting angle of the optical position detection sensor can be adjusted accurately and safely in a short time by using a simple jig. . Moreover, according to the fourth aspect, since the mounting angle adjustment can be automatically processed, there is an effect that the labor can be significantly reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of a sensor mounting angle adjusting jig used in a first embodiment of the present invention.

FIG. 2 is a control block diagram showing a substrate position detection device according to the first embodiment of the present invention.

FIG. 3 is a schematic diagram showing a relationship between a wafer and an edge detection sensor of the substrate position detection device according to the first embodiment of the present invention.

FIG. 4 is a diagram showing an attachment angle adjusting operation of the edge detection sensor in the substrate position detecting device according to the first embodiment of the present invention.

FIG. 5 is a block diagram showing a control unit in the substrate position detecting device according to the first embodiment of the present invention.

FIG. 6 is a flowchart showing a sensor mounting angle adjusting method for the board position detecting device according to the first embodiment of the present invention.

FIG. 7 is a plan view of a sensor mounting angle adjusting jig used in the second embodiment of the present invention.

FIG. 8 is a block diagram showing a control unit in a substrate position detecting device according to a second embodiment of the present invention.

FIG. 9 is a flowchart showing a sensor mounting angle adjusting method for a substrate position detecting device according to a second embodiment of the present invention.

FIG. 10 is an enlarged view showing a sensor mounting angle adjusting operation according to the second embodiment of the present invention.

FIG. 11 is a diagram showing a relationship between a phase angle of a spin chuck and detection data read in a substrate position detecting device according to a second embodiment of the present invention.

FIG. 12 is a diagram showing a light-transmitting hole detecting operation in the substrate position detecting device according to the second embodiment of the present invention.

FIG. 13 is a diagram showing a light-transmitting hole detecting operation in the substrate position detecting device according to the second embodiment of the present invention.

FIG. 14 is a schematic view showing a substrate position detecting device of a conventional example.

FIG. 15 is a diagram showing a state in which a deviation angle occurs in an edge detection sensor in a substrate position detection device of a conventional example.

[Explanation of symbols]

 11 Wafers, etc. 11A, 11B Sensor mounting angle adjustment jigs 12, 12a, 12b Light transmitting hole 14 Spin chuck 15 Chuck rotation driving means 16 Edge detection sensor 16a Optical detection area 17 Sensor rotation driving means 18 Storage device 19 Operation panel 20 Vertical Shaft 21 1st motor 21A 1st drive circuit 24 A / D converter 25 Vertical shaft 26 2nd motor 26A 2nd drive circuit 31 1st rotation instruction means 32 Position coincidence determination means 33 Chuck rotation position adjustment means 34 second rotation instructing means 35 direction matching determining means 36 sensor mounting angle determining means 41 rotation instructing means 42 first rotational position detecting means 43 second rotational position detecting means 44 angle difference calculating means 45 deviation angle calculating means 46 sensor Mounting angle determining means CE control unit

Claims (4)

[Claims] 1. An attachment angle of an optical position detecting sensor having an optical detecting region having a length in at least one direction is formed so as to detect an edge position of a substantially disc-shaped light shield on a rotary table. The optical position detection sensor is optimally mounted at a position corresponding to the optical detection area of the optical position detection sensor when the rotation center point is aligned with the rotary table. A sensor mounting angle adjusting jig, wherein a transparent hole having a shape corresponding to an optical detection region when mounted at a corner is formed. 2. The mounting angle of an optical position detecting sensor having an optical detecting region having a length in at least one direction is formed so as to detect an edge position of a substantially disc-shaped light shield on a rotary table. The rotation center point is in the ring area which is the locus of the optical detection area of the optical position detection sensor when the rotation center point is rotated with respect to the rotary table. A jig for adjusting a sensor mounting angle, characterized in that at least a pair of light transmitting holes having different distances from each other are formed. 3. A sensor mounting angle adjusting method for a substrate position detecting device for detecting the position of a substrate held on a rotary table, comprising: (a) an optical position detecting sensor on a rotary table for rotatably holding the substrate. The step of placing a sensor mounting angle adjusting jig having a light transmitting hole having a shape corresponding to the optical detection area of (b), and rotating the rotary table on which the sensor mounting angle adjusting jig is mounted. Meanwhile, the step of monitoring the detection signal of the optical position detection sensor and matching the position of the light transmitting hole viewed from the rotation center of the rotary table with the mounting position of the optical position detection sensor, (c) Optical direction detection of the optical position detection sensor by monitoring the detection signal of the optical position detection sensor while rotating the direction of the optical detection region of the optical position detection sensor in the substrate rotation plane by the turntable. A step of causing the direction of the area to coincide with the rotation radius direction of the rotary table, and a method of adjusting a sensor mounting angle of a substrate position detecting device. 4. A sensor mounting angle adjusting method for a substrate position detecting device for detecting the position of a substrate held on a rotary table, comprising: (d) a rotary table holding a substrate rotatably from a rotation center point. A step of mounting a sensor mounting angle adjusting jig having at least a pair of light-transmitting holes having different distances from each other, and (e) rotating the rotary table on which the sensor mounting angle adjusting jig is mounted, Calculating a rotation angle difference of the rotary table at the time of passing through each of the at least one pair of light transmitting holes by monitoring a detection signal of an optical position detection sensor, and (f) from the calculated rotation angle difference, Calculating a shift angle of the direction of the optical detection area of the optical position detection sensor with respect to a rotation radius direction of the rotary table; and (g) depending on the calculated shift angle of the direction of the optical detection area, the optical Position Sensor mounting angle adjusting method of a substrate position detection apparatus characterized by comprising the steps of rotating the optical position detecting sensor to change the mounting angle of the detection sensor.