JPH09153277A - Information recording / reproducing device - Google Patents

Abstract

(57) An object of the present invention is to provide a structure of an information recording device which is excellent in vibration resistance against external vibration of which size and type increase by being mounted on a portable device and which does not sacrifice the cooling performance of the device. Vibration from the outside is transmitted to a mounting member. Since the device body 7 including the head positioning mechanism system 3 is coupled to the mounting member 11 via the flexible heat insulating support member 16, it is possible to prevent external vibrations from being transmitted to the device body 7. Further, the heat generated by the circuit board 6 is easily conducted to the mounting member 11 via the heat transfer support member 10 having high thermal conductivity, and the circuit board 6 is cooled. Further, the heat insulating support member 16 prevents heat conduction to the apparatus main body 7. According to the present invention, it is possible to obtain an information recording apparatus which is excellent in vibration resistance and does not sacrifice the cooling performance of the apparatus. Moreover, even if this device is incorporated into a portable device and used, the deterioration of the head positioning accuracy due to heat and vibration can be solved at the same time, so that the reliability of the device can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information recording / reproducing apparatus for computer information or video, audio, etc., and is particularly suitable and effective for a disk recording apparatus such as a magnetic disk or an optical disk used in a portable device. The present invention relates to an information recording / reproducing device having a vibration resistant structure and a cooling structure.

[0002]

2. Description of the Related Art Conventionally, an auxiliary storage device typified by a magnetic disk device or an optical disk device, which has been used for storing computer information, has been used by being housed in a dedicated case and placed stationary. Further, in a small computer, it may be used by being housed in the same housing together with other computer parts such as a CPU and a memory. However, even in that case, most of them are fixedly used.

However, in recent years, the demand for portable computer devices has increased, and these auxiliary storage devices have been housed and used in a very small housing.
Under such conditions of use, the amplitude of the vibration input applied to the device is even greater and contains various frequency components.

On the other hand, for example, in the case of a magnetic disk device or an optical disk device, in these devices, information is recorded in a large number of concentric recording areas (tracks and tracks) on a disk which is a recording medium. Be called). In order to record / reproduce this information with a signal converter (hereinafter also referred to as a head), the head is positioned on a predetermined track on the disk, and the track is not followed during recording / reproduction. Don't The above device is provided with a head positioning mechanism system for that purpose, but in particular, in recent years, the track width tends to become narrower and higher tracking accuracy is required for the purpose of improving the recording density.

The frequency band in which such follow-up control is possible is designed based on the vibration characteristics of the positioning mechanism system, and it can exhibit sufficient follow-up performance with respect to vibration of an expected frequency. Even if it is possible, on the other hand, there are frequencies that cannot be effectively tracked. Therefore, if there is such a frequency component in the excitation input from the outside,
The head goes off the track, which seriously affects recording / reproduction.

Therefore, while the vibration input to the apparatus becomes more severe, the tracking accuracy required for the head positioning mechanism system including the control system has already become extremely severe. , Media and head and support
There is a serious demand for improving the vibration resistance performance of the main part including the drive mechanism system (hereinafter this part is also referred to as the main body of the device).

Regarding the structure of a disk device having improved vibration resistance or impact resistance, see Japanese Patent Laid-Open No. 6-15.
As disclosed in Japanese Laid-Open Patent Publication No. 0619, there is a method of providing a cushioning member between a main portion of a disk and head positioning mechanism system and a case covering the same to prevent external vibration transmission.

Further, in the information recording apparatus, it is necessary to cool the apparatus in order to prevent the temperature rise of the apparatus body. The reason why such a temperature rise of the apparatus main body becomes a problem is that thermal deformation of the head support member or the medium support member causes a decrease in positioning accuracy between the head and the medium, each structural member, or a lubricant or an adhesive. Deterioration. At the same time, in the circuit board, deterioration of each component due to temperature rise and increase in electrical resistance become problems, and it is necessary to cool the circuit board.

In order to solve these problems, in the conventional stationary type information recording apparatus, an electric fan or the like is provided in a part of the casing to forcibly generate air convection.
So-called forced cooling has been used which lowers the temperature of the device by removing the heat generated by the device. There are many examples of this, such as Japanese Patent Laid-Open No. 4-69888. Further, Japanese Patent Application Laid-Open No. 7-93964 describes an example in which a radiant heat transfer is blocked by using a heat shield plate.

[0010]

However, in order to cool an information recording device used in a portable device, it is difficult to use forced cooling by the electric fan or the like from the viewpoints of space restrictions, power saving, and the like. Is required. Therefore, in the case of such a device, natural convection of air around the device,
Cooling by heat conduction is required.

In particular, in the pursuit of spatial efficiency, the space around the information recording device is narrowed and it becomes difficult to secure an air flow path. Further, due to the miniaturization of the information recording apparatus, the heat dissipation area of the apparatus body is reduced, so that the cooling performance by natural convection is deteriorated. Therefore, cooling of the device by heat conduction is important.

However, in the conventional device, in order to improve the vibration resistance, a viscoelastic body such as rubber is arranged as a cushioning material on the heat conduction path from the device body to the outside, so that the vibration to the outside can be improved. There is a problem that the thermal conductivity is impaired.

By the way, a main heat source in the apparatus is a circuit board on which a signal processing circuit and a control circuit for a medium or a head drive system are mounted. If the circuit board becomes more highly integrated with the miniaturization of the device, the amount of heat generated will increase, while the cooling area will decrease, so the heat will be further concentrated on the circuit board, and the deviation of the temperature distribution inside the device will be large. Become.

Other heat sources include a drive motor for a medium such as a disk and a head drive device. However, the head is driven only when necessary, and with respect to the medium, for example, in the case of a flexible disk device, there is also a device that stops rotation when information is not transferred for the purpose of power saving. Therefore, of these, the disk drive motor in the magnetic disk device has the largest amount of heat generation. Because in the case of such a device,
By the dynamic pressure effect of air accompanying the disk rotation of the head,
This is because the principle of flying over the disk is used, and if the number of times of starting and stopping the disk rotation is large, the possibility of occurrence of a failure increases, so that the disk rotation cannot be stopped.

Further, in order to further increase the information transfer speed, for example, in a disk device, the disk rotation speed is increased. However, in this case, the driving force of the motor is only required to compensate for the very small friction loss of the bearing portion and the loss due to the friction with the air to rotate the disk at a constant speed. Moreover, since these losses tend to decrease with the miniaturization of the device, as the miniaturization of the device progresses, the heat generated by the disk drive motor will generate more heat than the heat generated by the circuit board. The proportion of the quantity decreases.

However, in the conventional apparatus, the circuit board, which is the main heat source, is directly fixed to the apparatus body with screws or the like, so that the heat generated in the circuit board of the apparatus including the head and the medium. There was a problem that it was transmitted to the main body.

In addition, in recent years, along with the increase in storage capacity and the increase in data transfer rate, the applications of disk devices have been expanding in addition to portable computers. For example, as disclosed in Japanese Patent Laid-Open No. 6-131181, a video camera that uses a magnetic disk device for recording an image or a flexible disk as disclosed in Japanese Patent Laid-Open No. 6-112276 is used. There are still cameras. Since such a device is subjected to more severe operating conditions than a portable computer, it requires more severe vibration resistance and cooling performance.

Therefore, an object of the present invention is to have excellent vibration resistance against external vibrations of which size and type increase by being installed in a portable device, and thereby the cooling performance of the device. An object of the present invention is to provide an information recording / reproducing apparatus having a structure that does not sacrifice.

[0019]

In order to achieve the above object, the present invention provides a case in which a recording medium, a signal recording / reproducing means for reading / writing information at an arbitrary position of the recording medium, and a positioning means are incorporated, and the positioning control circuit or A circuit board on which at least one of the signal processing circuits is mounted, and mounting means made of a material having high thermal conductivity for mounting to an external member, the case being coupled to the mounting means by adiabatic elastic supporting means, and The structure is characterized in that the circuit boards are connected by a heat transfer supporting means made of a material having a high thermal conductivity.

A recording medium, signal recording / reproducing means for reading / writing information signals recorded on the recording medium, positioning means for positioning the signal recording / reproducing means at an arbitrary position on the recording medium, and these. With a built-in case,
An information recording / reproducing apparatus, comprising: a circuit board on which at least one of the positioning control circuit and the signal processing circuit is mounted, and mounting means for mounting to an external structural member, wherein the mounting means has a thermal conductivity. A material having a high thermal conductivity, the case being coupled to the mounting means by adiabatic elastic supporting means, and the circuit board being coupled by a heat transfer supporting means made of a material having a high thermal conductivity. To do.

A disc-shaped recording medium for recording information, a signal recording / reproducing means for reading / writing an information signal recorded on the recording medium, and the signal recording / reproducing means are positioned at arbitrary positions on the recording medium. An information recording / reproducing apparatus provided with positioning means, a case containing these, and a circuit board on which at least one of the positioning control circuit and the signal processing circuit is mounted, and which is provided with mounting means for mounting to an external structural member. There, the mounting means is
It has a material with high thermal conductivity, the case is connected to the mounting means by adiabatic elastic support means, and the circuit board is connected by heat transfer support means made of a material with high thermal conductivity. It is characterized by.

Further, the case is joined to the circuit board by adiabatic elastic support means, and the circuit board is joined to the mounting means by heat transfer support means made of a material having a high thermal conductivity. And The disc-shaped recording medium has a diameter of 65 mm or less, and the external dimensions of the information recording / reproducing apparatus are
Width 71.4 mm, depth 101.6 mm, height 25.4 m
m or less.

The adiabatic elastic support means is a combination of an adiabatic means made of a heat insulating material having a thermal conductivity of 0.25 W / (mK) or less and an elastic support means having a flexible structure, Further, the adiabatic elastic supporting means is a heat insulating rubber having a thermal conductivity of 0.25 W / (mK) or less, and the adiabatic elastic supporting means has a thermal conductivity of 0.25 W / (mK). ) Using the following heat insulating rubber as a material,
It is characterized in that it is a vibration-proof rubber having a closed space in which gas is enclosed.

The heat transfer supporting means has a thermal conductivity of 7
It is a flexible structure support made of a metal of 0 W / (mK) or more, and the heat transfer supporting means includes viscoelasticity containing a metal powder having a thermal conductivity of 70 W / (mK) or more. Characterized by being a body.

Further, the thermal conductivity is 70 on the circuit board.
A plurality of joints made of a material having a W / (mK) or more is provided, and the heat transfer support means is made of a material having a thermal conductivity of 70 W / (mK) or more so as to be engaged with the joints. It is characterized by a large number of flexible structure supports.

A recording medium, signal recording / reproducing means for reading / writing information signals recorded on the recording medium, positioning means for positioning the signal recording / reproducing means at an arbitrary position on the recording medium, and these. With a built-in case,
An information recording / reproducing apparatus comprising: a circuit board on which at least one of a positioning control circuit and a signal processing circuit is mounted, and an adiabatic elastic support means for directly mounting the case to an external structural member. The circuit board is provided with heat transfer supporting means made of a material having a high thermal conductivity for directly mounting the board to the external structural member, and for transmitting signals between the signal recording / reproducing means and the positioning means in the case and the circuit board. And a signal line for performing.

By adopting the above-mentioned structure, the following operation is achieved. Vibrations including various frequency components given from the outside are first transmitted to the mounting means directly coupled to the external structural material. However, since the case including main parts such as the medium and the head is connected to the mounting means by the elastic supporting means, the vibration having a frequency equal to or higher than the natural frequency of the vibration system including the supporting means and the apparatus main body is generated. The components do not transfer to the recording device body in the case.

This is explained as follows. FIG. 14 shows a diagram schematically showing the structure of the present invention. FIG.
As shown in FIG. 4, the device body 7 is fixed to the external structural member 13 by the mounting member 11. Therefore, when the external structure 13 receives the forced displacement excitation x (t) as shown in FIG. 14, the external displacement of the amplitude y ₀ of the relative displacement y (t) with respect to the mounting member 11 of the apparatus body 7 is received. The ratio y ₀ / a (displacement transmissibility) with respect to the amplitude a of excitation is expressed by Equation 1. In addition, the phase difference θ is expressed by Equation 2. Also, in FIG.
The frequency characteristics of ₀ / a are shown.

[0029]

(Equation 1)

[0030]

(Equation 2)

Here, Ω is expressed by Equation 3 using the mass m of the apparatus main body 7 and the spring constant k of the spring simulating the elastic supporting means 16.

[0032]

(Equation 3)

That is, the apparatus main body 7 and the elastic supporting means 16
The natural frequency fn of the vibration system composed of a spring simulating
It is calculated by fn = Ω / 2π. Also, the elastic support means 16
The damping ratio ζ can be obtained from ζ = c / 2mΩ from the damping c of Here, the natural frequency fn is smaller than the input excitation frequency f (= ω / 2π) (f >>
In the case of fn), the numerical formula 1 is y ₀ / a≈1, and the phase difference θ = 180 degrees, so the relative displacement y of the apparatus main body is
The magnitude of the excitation displacement x is always the same, and the vibration state is in the opposite phase. By the way, since the absolute displacement z (t) of the device body 7 in the space is expressed by Formula 4, in the above-mentioned state, the absolute displacement of the device body 7 becomes zero, and the device body 7 is spatially stationary. Is not affected by the excitation from.

[0034]

(Equation 4)

Here, although the mass m of the apparatus main body cannot be easily changed, if the elastic supporting means is made to have a very soft structure and the spring constant k is made small, the above-mentioned natural frequency fn becomes very large. Therefore, most of the frequency components included in the input vibration are not transmitted to the device body. However, in reality, there is a limit to reducing the spring constant. Therefore, with respect to low-frequency vibrations, the head positioning accuracy can be ensured by following the head positioning system within the apparatus body, so that the natural frequency fn is lower than the upper limit value of this control band. By designing the spring constant as described above, it is possible to configure a device that is not easily affected by vibration input in the entire frequency range.

Further, in this way, even with the above-mentioned constitution which is effective for most vibration inputs, the above-mentioned natural frequency f
By resonating for the same frequency as n, on the contrary,
Since it vibrates with a large amplitude, it is necessary to add damping c to reduce the resonance amplitude. Specifically, a viscoelastic body such as silicon rubber is provided so as to be engaged with the supporting means, and thereby acts to damp vibrations having the same frequency as the natural frequency. The larger the damping ratio at this time is, the more effective it is. However, as can be seen from FIG. 15, if the damping ratio is at least 0.4, the amplitude at resonance should be suppressed to the same level as when there is another vibration input. Is possible.

On the other hand, the heat generated in the circuit board is easily conducted to the mounting means made of a material having a high thermal conductivity via the heat transfer supporting member made of a material having a high thermal conductivity. However, since the device body is thermally insulated from the attaching means by the heat insulating means provided together with the elastic supporting member, heat is not transmitted. On the other hand, since the mounting means is directly engaged with the external structural member, heat is conducted in this direction, and as a result,
The mounting means and thus the circuit board can be cooled. With such a configuration, the vibration resistance can be improved without impairing the cooling performance, and the above object can be achieved.

It is also possible to use only heat insulating rubber as the elastic supporting means between the attaching means and the apparatus main body. In this case, due to the internal damping of the rubber, it is possible to damp the vibration transmitted from the outside through the mounting means. At the same time, it is possible to prevent heat conduction from the circuit board to the main body of the apparatus via the mounting means.

At this time, if a closed space capable of enclosing a gas such as air is provided inside the elastic supporting means made of heat insulating rubber, the heat conductivity of these gases is lower than that of rubber, so that the heat insulating effect is further enhanced. be able to. Furthermore, a soft air spring can be formed by the gas enclosed in this closed space.

On the other hand, as the heat transfer supporting means between the mounting means and the circuit board, if a flexible structure support such as a spring made of a metal having a high thermal conductivity such as copper or aluminum is used,
Since heat can be easily conducted from the circuit board to the mounting means and vibrations from the mounting means can be prevented from being transmitted to the circuit board, vibration resistance protection of the circuit board is also possible.

The same effect can be obtained with a viscoelastic body such as rubber impregnated with a metal powder having a high thermal conductivity. With such a configuration, vibrations in this portion are likely to be attenuated and the vibration transmission to the circuit board can be further reduced, but the heat conduction is slightly lower than that in the above configuration.

Further, a plurality of joints made of a material having high thermal conductivity are provided on the circuit board, and the heat transfer supporting means is
By adopting a structure in which each of these joints is engaged, the heat conduction path from the circuit board to the mounting means can be increased, and the heat transfer effect from the circuit board can be enhanced.

In the case of the construction in which the apparatus main body is connected to the circuit board by the adiabatic elastic support means, and the circuit board is connected to the mounting means by the heat transfer support means made of a material having a high thermal conductivity. Is also the same. In this case, the circuit board and the apparatus main body are connected to each other without interposing the attaching means, but since the heat insulating supporting means is interposed, the heat generated in the circuit board is not transferred to the apparatus main body and the heat transfer supporting is performed. It is easily conducted by the means to the attachment means. Further, the vibration from the outside is first transmitted to the mounting means, and then, while being transmitted to the circuit board, is first damped by the heat transfer supporting means having the flexible structure. Next, it is further attenuated by the heat insulating support means having a flexible structure from the circuit board to the main body of the apparatus. In this way, the double vibration-proof structure further improves the vibration resistance.

[0044]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of a magnetic disk device realized by the present invention. 2 and 3 are a sectional view and a perspective view of the device of FIG. As shown in FIGS. 1, 2 and 3, the conventional magnetic disk device positions the disk 1 as a recording medium, the signal converter (hereinafter referred to as head) 2, and the head 2 in the radial direction of the disk. Of the positioning mechanism system 3, a case 4 covering the same, a cover 5, a signal processing device, a disk drive motor, and a circuit board 6 on which a controller for the head positioning mechanism system is integrated.

In the case of this device using the magnetic-electric conversion principle, the distance between the head 2 and the recording surface of the disk 1 is 0.1 μm.
Since it is m or less, and dust in the air adheres to the recording surface to cause a serious recording trouble, the case 1 and the cover 5 covering the disk 1 and the head positioning mechanism system 3 need to have a closed structure. Here is the main part of the device,
The assembly of the disk 1, the head 2, the positioning mechanism system 3, the case 4 and the cover 5 covering the disk 1, is called the apparatus main body 7.

The main heat sources of the disk device are the circuit board 6, the constantly rotating disk drive motor 8 and the head positioning system drive section 9. Of these, the heat generated by the disk drive motor 8 and the positioning system drive unit 9 is conducted to the case 4 and the cover 5. Case 4,
Since the cover 5 has a large heat dissipation area, it can be dissipated by heat dissipation from this part to the outside air.

In the first embodiment, the circuit board 6 which generates a large amount of heat is connected to the mounting member 11 by the elastic supporting member 10 made of a material having a high thermal conductivity.
The heat generated here can be easily conducted to the mounting member 11. Details of the elastic support member 10 will be described later.

In FIG. 1, for the sake of clarity, the circuit 15 on the circuit board 6 is drawn so as to be on the side facing the apparatus main body 7, but in reality, as shown in FIG. It is mounted on the surface on the side of the mounting member 11 (the back side in FIG. 1). This is to prevent the heat dissipated from the surface of the circuit 15 from being transmitted to the device body 7 through the air, and to reduce the temperature rise of the device body 7 as much as possible.

The mounting member 11 is connected by screws 12 to the structural member 13 of the portable device on which the device is mounted. Further, the mounting member 11 itself is made of aluminum or iron having high thermal conductivity, and a recess 14 is formed in a part thereof by press working so as to contact the structural member 13 outside the device in a wider area. . This hollow 14 is
At the same time, the circuit board 6 and the mounting member 1 are reduced by making the device thinner
Since the space between the mounting member 11 and the circuit board 1 is narrow, the circuit 15 on the circuit board 6 and the mounting member 11 are prevented from interfering with each other. Further, by doing so, it is possible to secure a flow path for air even with a slight amount and to provide a cooling effect by natural convection. With such a structure, the heat generated in the circuit board 6 is transferred to the external structural member 13 to cool the circuit board 6.

On the other hand, the apparatus body 7 and the mounting member 11 are connected by the heat insulating support member 16. Details of the heat insulating support member 16 will be described later. The circuit board 6 is provided with a notch 17 to avoid interference with the heat insulating support member 16. Therefore, the device main body 7 has no direct contact portion with the circuit board 6, and the heat indirectly transmitted to the case 4 via the mounting member 11 is blocked by the heat insulating support member 16, so that the temperature rise of the device main body is prevented. Can be lowered.

Signal transmission between the circuit board 6 and the apparatus main body 7 is performed by the flexible cable 18. However, in order to reduce conduction heat from the circuit board 6 to the apparatus main body 7, the cable 18 has an area. To increase the heat dissipation area. Further, it is desirable that the terminals 19 on the circuit board 6 for connecting the cables 18 be mounted on the surface opposite to the circuit mounting surface of the board, and the heat transfer support member 10 be coupled in the vicinity thereof. The signal terminal 2 is provided on one side of the circuit board 6.
0 is provided.

Further, in the present apparatus, since only the mounting member 11 is coupled to the structural member 13 of the equipment on which the present apparatus is mounted, the vibration applied to the equipment is always transmitted from the mounting member 11. However, the apparatus main body 7 including the main parts such as the head positioning mechanism system 3 in which vibration is a problem
Is coupled to the mounting member 11 via the flexible heat insulating support member 16, it is possible to prevent the applied vibration from being transmitted to the apparatus main body 7.

FIG. 4 shows a detailed structural example of the heat insulating support member 16. This member is formed by molding a viscoelastic body such as silicon rubber having a very high damping effect into a hollow cylindrical shape to form a damping member 23.
And a flexible support member 27 having a structure in which the coil spring 22 is surrounded and the pressing metal fittings 25 and 26 are bonded to the upper and lower surfaces,
The heat insulating member 24 is made of heat insulating rubber. The flexible support member 27 has heat conduction by the coil spring 22, but the heat insulation member 24 prevents heat conduction to the case 4 which is a part of the apparatus main body 7. The spring constant of the coil spring 22 is
For example, it can be determined by the following procedure. First, a natural frequency lower than the control band of the tracking control system of this device is set, and from this and the mass of the device main body 7, using Equation 3,
The spring constant of the coil spring 22 can be determined.

In this example, the coil spring 22 is used, but other elastically deformable members can have the same structure. A metal is often used as the elastic member like the coil spring 22 shown in this example. In that case, heat is generated by sandwiching the heat insulating member 24 between the elastic member and the case 4 or the mounting member 11. It is desirable not to conduct electricity. Such a heat insulating member is preferably made of a material having low thermal conductivity.

For example, when a general rubber is used as a heat insulating material, a soft rubber obtained by vulcanizing 2% of raw rubber is
The thermal conductivity is about 0.14 W / (mK), and synthetic rubber may be about 0.25 W / (mK), and various rubbers can be selected. Among them, the one with the lowest thermal conductivity is selected as much as possible while taking into consideration other conditions such as durability. Polyurethane or the like has a lower thermal conductivity, but it is necessary to consider durability and the like. Although some of these materials can be used in combination, even in that case, it is preferable that at least the thermal conductivity of rubber can be suppressed. Further, in FIG. 4, the mounting member 11 and the external structural member 13
In the example, and are shown to be fastened together by the screws 12, but they may be fastened separately.

Further, as shown in FIG. 5, when a viscoelastic body which is very soft and has a high heat insulating property such as soft heat insulating rubber can be used, it can be easily used by using it as the heat insulating support member 16. Can have a different structure.
At this time, if a closed space 33 capable of enclosing a gas such as air is provided inside the heat insulating support member 16 made of heat insulating rubber, the heat conductivity of these gases is lower than that of rubber, so that the heat insulating effect is further enhanced. You can Furthermore, in such a structure, a soft air spring can be formed by the gas enclosed in the closed space 33.

In such an air spring, a hole capable of exchanging gas with the outside or with another closed space is provided in the closed space inside the elastic support member made of the heat insulating rubber. It is also possible to provide a structure in which this hole is provided and the aperture is reduced to form a diaphragm to enhance the damping effect. Although FIG. 5 shows the case where there is one closed space 33 in which air is enclosed, a plurality of closed spaces 33 can achieve the same effect. For example, in the molding process of this rubber, many closed spaces can be formed by mixing air bubbles inside.

Further, as shown in FIG. 1, in order to obtain a vibration resistant effect even when an exciting input (moment) for rotating the device is applied, the heat insulating support member 16 is provided at all four corners of the device body 7. It is desirable to provide it.

Since the apparatus of the embodiment shown in these figures is mounted and used in a portable device, it is desirable that the size is small, and the maximum disc diameter is 2.5 inches (65 mm). For example, when a 2.5-inch disk is used, the standard specifications are that the external dimensions of the device are a width of 71.4 mm and a depth of 101.6 mm, and the maximum height is 1 inch (25.4 mm). Is.

As shown in FIG. 6, in order to make the apparatus thinner, the mounting height of the heat insulating support member 16 to the case 4 can be made closer to the upper surface of the case 4 to make the apparatus thinner. In this case, since the height of the heat insulating support member 16 itself can be afforded, its movable amount can be increased.
This makes it possible to deal with an excitation input having a larger amplitude.

Further, as shown in FIG. 6, the four corners of the case 4 are
By molding so that the heat insulating support member 16 fits,
The width and depth dimensions can be kept within the same standard as in FIG. As described above, according to the present invention, it is possible to improve the vibration resistance without increasing the external dimensions of the device as compared with the conventional device.

Further, as shown in FIG. 7, the heat insulating support member 1
It is also possible to attach 6 so that the movable direction is parallel to the disk surface. With such an attachment method, the sensitivity can be increased particularly for an excitation input from the outside in the head positioning direction, and therefore it is suitable for the purpose of further improving the head positioning accuracy. However, in order to keep the external dimensions of the device in the width and depth directions below the standard values, the movable range of the heat insulating support member 16 may be limited as compared with the case shown in FIG. It is desirable to design so that the movable range is as large as possible while avoiding interference.

FIG. 8, FIG. 9 and FIG. 10 show detailed structures of different heat transfer supporting members 10. The example shown in FIG. 8 has a structure in which the circuit board 6 and the mounting member 11 are fastened with metallic screws 28 with a damping material 29 made of hollow cylindrical rubber sandwiched therebetween. On the circuit board 6, there is a hole 21 covered with a metal having a high thermal conductivity, and a metallic screw 28 comes into contact with this portion to conduct heat to the mounting member 11. Further, the damping member 29 absorbs the vibration from the mounting member 11.

The example shown in FIG. 9 is a case where a leaf spring 32 having a structure in which a metallic thin plate is bent in a U shape is used as the heat transfer supporting member 10. Further, the example shown in FIG. 10 is a case where the soft rubber 31 containing the metal powder 30 having a high thermal conductivity is used as the heat transfer support material. As described above, various structures can be considered as the heat transfer support member 10. However, if the rigidity is lowered too much in pursuit of vibration resistance, the circuit 15 may possibly collide with the mounting member and be damaged. The spring 32 and the rubber 31 need to have a certain degree of rigidity. In the case of the circuit board 6, since there is no moving part like the device body 7, it is only necessary to consider fatigue durability. In the case of this embodiment, a vibration-proof design is used rather than the heat insulating support member 16 that supports the device body 7. You don't have to be strict. As the number of the heat transfer support members 10 increases, the heat conduction to the mounting member 11 can be increased and the temperature distribution on the circuit board 6 can be made uniform. Therefore, a large number of heat transfer support members 10 can be provided on the circuit board. desirable.

The heat transfer support member 10 used here includes
Since the amount of heat conducted from the circuit board 6 to the mounting member 11 can be increased by using a material having a high thermal conductivity,
The cooling efficiency can be increased. A metal is mentioned as a material having such a high thermal conductivity. For example, the thermal conductivity of iron such as spring steel is about 70 W / (mK), but the thermal conductivity of copper is about 400 W / (mK).
Therefore, even when spring steel is used as the material of the heat transfer support member 10, it is desirable to increase the overall thermal conductivity by, for example, treating the surface with copper plating or the like. It is possible to combine with other non-metallic materials, but it is desirable that the overall thermal conductivity is equal to or higher than that of iron.

FIG. 11 shows another configuration of the embodiment shown in FIG. In the above-described embodiment, the circuit board 6 is arranged between the device main body 7 and the mounting member 11, but as shown in FIG.
Can be connected to the side opposite to the device body 7. In this case, since the circuit board 6 is open to the outside, the structure is such that heat is easily dissipated. However, regarding heat conduction through the mounting member 11, the mounting member 11 and the external structural member 13 It is disadvantageous because there is only the area of the connecting part. Therefore, it is desirable to use it in an environment where cooling by natural convection can be performed efficiently.

Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the device main body 7 is coupled to the circuit board 6 by the heat insulating support member 16 as shown in FIGS.
Through the heat transfer support member 10 as shown in FIG. 8, the structure is connected to the mounting member 11. In this case, the circuit board 6 and the device body 7 are coupled without the mounting member 11, but the heat generated in the circuit board 6 by the heat insulating support member 16 is not transferred to the device body 7 and is transferred. The thermal support member 10 easily conducts to the mounting member 11. As a result, the circuit board 6 can be cooled.

Further, the vibration from the outside is transmitted to the mounting member 11 and is attenuated in the heat transfer supporting member 10 while being transmitted to the circuit board 6. Further, since the heat insulating support member 16 attenuates the circuit board 6 to reach the apparatus main body 7, a double vibration-proof structure is provided, so that vibration resistance can be enhanced.

In this case, since a part of the vibration transmitted from the mounting member 11 to the circuit board 6 is further transmitted to the apparatus main body 7, the heat transfer support member located first in the vibration transmission path. It is effective to raise the vibration resistance of No. 10. Therefore, it is necessary to more strictly design the vibration resistance of the heat transfer support member 10 than in the first embodiment. Therefore,
The structure of the heat transfer support member 10 is shown in FIG.
It is desirable to have a structure in which a metal spring and a viscoelastic body are combined, such as the flexible support member 27, which is a part of 6.

FIG. 13 shows an example of a video camera using the magnetic disk device having the structure of this embodiment. In this camera, the captured video information and audio information are converted into digital signals and recorded in the magnetic disk device 34. The magnetic disk device 34 is an upper lid 35 provided on the top of the camera.
It is fixed by a mounting member 11. Therefore, in this example, the upper lid 35 corresponds to the external structural member 13 described above, and the heat generated from the circuit board or the like is transferred to the upper lid 35 and dissipated into the outside air. Therefore, the lid 3
5 is preferably made of a material having high thermal conductivity.

From this example, in order to further simplify the structure, the circuit board 6 is directly attached to the upper lid 35 by the heat transfer supporting member 10.
Is to have a structure in which the apparatus main body 7 is joined by the heat insulating support member 16. In this case, the upper lid 35 serves also as the above-mentioned mounting member 11 although it is an external structural member. As described above, it is possible to use a part of the external structural member as the mounting member, but in that case, since the circuit board and the device main body must be fixed to each other, the disk device is frequently attached and detached. Such a usage tends to be complicated.

In the above, the case of the magnetic disk device is shown, but as the device excellent in the vibration resistance and the cooling performance that can be provided by the present invention, for example, recording / reproducing such as an optical disk device or a device using a flexible disk is performed. In principle, the present invention can be applied to a recording device in which the converter needs to be positioned at a predetermined position on the recording medium, and which needs to dissipate heat generated from its drive system and signal processing unit. Will be equally understood by those skilled in the art.

[0073]

According to the present invention, excellent vibration resistance and
As a result, it is possible to provide an information recording device that does not sacrifice the cooling performance of the device. Further, even when this device is incorporated into a portable device for use, deterioration of head positioning accuracy due to heat and vibration can be solved at the same time, and the reliability of the device can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration according to a first embodiment of the present invention.

2 is a cross-sectional view of the embodiment of FIG.

3 is a perspective view of the embodiment of FIG.

FIG. 4 is a detailed structural view of a heat insulating support member.

FIG. 5 is a detailed view of another structure of the heat insulating support member.

FIG. 6 is a diagram of an example in which the device height of the embodiment of FIG. 1 is lowered.

FIG. 7 is a diagram of an example in which the mounting direction of the heat insulating support member is changed.

FIG. 8 is a detailed structural diagram of a heat transfer support member.

FIG. 9 is a detailed view of another structure of the heat transfer support member.

FIG. 10 is a detailed view of another structure of the heat transfer support member.

11 is a diagram showing another configuration of the embodiment of FIG.

FIG. 12 is a diagram showing a configuration according to a second embodiment of the present invention.

FIG. 13 is a perspective view of a video camera incorporating the device of the present invention.

FIG. 14 is a schematic diagram of a vibration resistant structure.

FIG. 15 is a diagram showing frequency characteristics of relative amplitude.

[Explanation of symbols]

 1 Disk 2 Signal Converter (Head) 3 Head Positioning Mechanism System 4 Case 5 Cover 6 Circuit Board 7 Device Main Body 8 Drive Motor 9 Positioning System Drive Section 10 Heat Transfer Support Member 11 Mounting Member 12 Screw 13 External Structural Member 14 Recess 15 Circuit 16 Heat Insulation Support Member 17 Notch 18 Flexible Cable 19 Terminal 20 Signal Terminal 21 Hole 22 Coil Spring 23 Damping Material 24 Heat Insulation Member 25, 26 Holding Metal Fitting 27 Flexible Support Member 28 Metal Screw 29 Damping Material 30 Metal Powder 31 Soft Rubber 32 Leaf spring 33 closed space 34 magnetic disk device 35 top lid

Front page continued (72) Inventor Takashi Kono 502 Jinritsucho, Tsuchiura-shi, Ibaraki Machinery Research Institute, Hiritsu Seisakusho Co., Ltd. Within the business unit

Claims (14)

[Claims] 1. A case containing a recording medium and a signal recording / reproducing means for reading / writing information at an arbitrary position and a positioning means, and a circuit board on which at least one of the positioning control circuit and the signal processing circuit is mounted, Equipped with attachment means of material with high thermal conductivity to attach to external members,
An information recording / reproducing apparatus having a structure in which the case is connected to the mounting means by adiabatic elastic support means, and the circuit board is connected by a heat transfer support means made of a material having a high thermal conductivity. 2. A recording medium, a signal recording / reproducing means for reading / writing information signals recorded on the recording medium, a positioning means for positioning the signal recording / reproducing means at an arbitrary position on the recording medium, and these. An information recording / reproducing apparatus provided with a mounting case and a circuit board on which at least one of the positioning control circuit and the signal processing circuit is mounted, and mounting means for mounting to an external structural member. Is made of a material having a high thermal conductivity, the case is coupled to the mounting means by adiabatic elastic supporting means, and the circuit board is coupled by a heat transfer supporting means made of a material having a high thermal conductivity. An information recording / reproducing apparatus characterized in that 3. A disc-shaped recording medium for recording information,
A signal recording / reproducing means for reading / writing an information signal recorded on the recording medium, a positioning means for positioning the signal recording / reproducing means at an arbitrary position on the recording medium, a case containing these, and a positioning means for positioning. An information recording / reproducing apparatus comprising: a circuit board on which at least one of a control circuit and a signal processing circuit is mounted, and mounting means for mounting to an external structural member, wherein the mounting means is made of a material having high thermal conductivity. Information recording / reproducing, characterized in that the case is coupled to the mounting means by adiabatic elastic support means, and the circuit board is coupled by heat transfer support means made of a material having high thermal conductivity. apparatus. 4. A recording medium, signal recording / reproducing means for reading / writing information signals recorded on the recording medium, positioning means for positioning the signal recording / reproducing means at an arbitrary position on the recording medium, and these. An information recording / reproducing apparatus provided with a mounting case and a circuit board on which at least one of the positioning control circuit and the signal processing circuit is mounted, and mounting means for mounting to an external structural member. Has a material with high thermal conductivity, the case is coupled to the circuit board by adiabatic elastic support means, and the circuit board is attached to the mounting means by heat transfer support means made of a material with high thermal conductivity. An information recording / reproducing apparatus characterized by being combined. 5. A disc-shaped recording medium for recording information,
A signal recording / reproducing means for reading / writing an information signal recorded on the recording medium, a positioning means for positioning the signal recording / reproducing means at an arbitrary position on the recording medium, a case containing these, and a positioning means for positioning. An information recording / reproducing apparatus comprising: a circuit board on which at least one of a control circuit and a signal processing circuit is mounted, and mounting means for mounting to an external structural member, wherein the mounting means is made of a material having high thermal conductivity. And the case is coupled to the circuit board by adiabatic elastic support means, and the circuit board is
An information recording / reproducing apparatus, characterized in that the information recording / reproducing apparatus is connected to the mounting means by a heat transfer supporting means made of a material having a high thermal conductivity. 6. The disk-shaped recording medium has a diameter of 65.
The information recording / reproducing apparatus according to claim 3 or 5, wherein the information recording / reproducing apparatus is less than or equal to mm. 7. The external dimensions of the information recording / reproducing apparatus are: width 71.4 mm, depth 101.6 mm, height 25.4 mm.
The information recording / reproducing apparatus according to any one of claims 1 to 6, wherein: 8. The heat insulating elastic supporting means is a combination of a heat insulating means made of a heat insulating material having a thermal conductivity of 0.25 W / (mK) or less and an elastic supporting means having a flexible structure. The information recording / reproducing apparatus according to claim 1. 9. The information recording / reproducing apparatus according to claim 1, wherein the adiabatic elastic support means is an adiabatic rubber having a thermal conductivity of 0.25 W / (mK) or less. . 10. The adiabatic elastic support means is a rubber vibration isolating rubber having a heat conductivity of 0.25 W / (mK) or less and having a closed space in which a gas is enclosed. The information recording / reproducing apparatus according to any one of claims 1 to 5, wherein 11. The heat transfer support means has a thermal conductivity of 70.
6. The information recording / reproducing apparatus according to claim 1, wherein the information recording / reproducing apparatus is a flexible structure support made of a metal having a W / (mK) or more. 12. The heat transfer supporting means has a thermal conductivity of 70.
The information recording / reproducing apparatus according to any one of claims 1 to 5, wherein the information recording / reproducing apparatus is a viscoelastic body containing a metal powder of W / (mK) or more. 13. The circuit board has a thermal conductivity of 70 W.
A plurality of joints made of a material having a thermal conductivity of 70 W / (mK) or more are provided so that the heat transfer supporting means engages with the joints. 6. The information recording / reproducing apparatus according to claim 1, which is a flexible structure support. 14. A recording medium, a signal recording / reproducing unit for reading / writing information signals recorded on the recording medium, a positioning unit for positioning the signal recording / reproducing unit at an arbitrary position on the recording medium, and these. An information recording / reproducing apparatus provided with a built-in case and a circuit board on which at least one of the positioning control circuit and the signal processing circuit is mounted, and provided with adiabatic elastic support means for directly attaching the case to an external structural member. A heat transfer supporting means made of a material having a high thermal conductivity for directly mounting the circuit board to the external structural member, and further comprising a signal recording / reproducing means and a positioning means in the case, An information recording / reproducing apparatus, comprising: a signal line for transmitting a signal.