JPH09138978A - Production of optical recording medium - Google Patents
Production of optical recording mediumInfo
- Publication number
- JPH09138978A JPH09138978A JP29284495A JP29284495A JPH09138978A JP H09138978 A JPH09138978 A JP H09138978A JP 29284495 A JP29284495 A JP 29284495A JP 29284495 A JP29284495 A JP 29284495A JP H09138978 A JPH09138978 A JP H09138978A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- optical recording
- recording medium
- resin
- irradiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000007664 blowing Methods 0.000 claims abstract description 8
- 238000000016 photochemical curing Methods 0.000 claims description 15
- 238000004528 spin coating Methods 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 2
- 238000003848 UV Light-Curing Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 12
- 238000001723 curing Methods 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は光硬化型樹脂を塗布
し、光硬化させる光記録媒体の製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical recording medium in which a photocurable resin is applied and photocured.
【０００２】[0002]
【従来の技術】光記録媒体の製造工程において、光硬化
型樹脂は表面保護などを目的としたコーティング剤とし
て用いられたり、貼り合わせ光記録媒体の接着剤として
用いられている。2. Description of the Related Art In the process of manufacturing an optical recording medium, a photocurable resin is used as a coating agent for the purpose of surface protection or as an adhesive for a laminated optical recording medium.
【０００３】従来の硬化方法は光硬化型樹脂をスピンコ
ート法などによりある膜厚に塗布した後、塗布面に光を
照射し光硬化を行なっていた。この方法の場合、樹脂が
硬化した後、光記録媒体に変形や反りが生じる。この原
因は主に光硬化型樹脂の硬化に伴う収縮によるものと光
照射に伴う基板の熱変形によるものと考えられる。この
光記録媒体の変形や反りは、基板の厚みが厚い場合、例
えば、従来よく用いられている１．２ｍｍ厚の基板の場
合、強度的に強く、あまり問題にはならなかった。しか
し、光記録媒体の高密度化に伴い、従来の基板よりも薄
い基板を用いる必要性が生じて来つつあり、この場合、
強度的に弱いため、樹脂の光硬化にともない、光記録媒
体に変形や反りが生じる。In the conventional curing method, a photocurable resin was applied to a certain thickness by a spin coating method or the like, and then the coated surface was irradiated with light to perform photocuring. In this method, the optical recording medium is deformed or warped after the resin is cured. It is considered that this is mainly due to shrinkage due to curing of the photocurable resin and thermal deformation of the substrate due to light irradiation. This deformation or warpage of the optical recording medium is strong in terms of strength when the substrate has a large thickness, for example, a 1.2 mm-thick substrate which has been often used conventionally, and is not a serious problem. However, with the increasing density of optical recording media, it is becoming necessary to use a substrate thinner than the conventional substrate. In this case,
Since the strength is weak, the optical recording medium is deformed or warped with the photo-curing of the resin.
【０００４】光硬化型樹脂の硬化時の収縮が原因で生じ
る変形や反りは、樹脂の特性によるものであり、硬化時
の収縮率が小さい樹脂などの検討が行われている。Deformation and warpage caused by shrinkage of the photocurable resin during curing are due to the characteristics of the resin, and studies have been conducted on resins having a small shrinkage rate during curing.
【０００５】一方、光照射に伴って生じる熱変形は主
に、光を照射した面と基板の内部および照射面と反対の
面との間で熱膨張に差が生じるため、すなわち、光照射
時の基板の厚さ方向の不均一な熱膨張によるものである
から、光硬化後、数分間は特に基板が著しく変形してお
り、光記録媒体製造のコーティング工程においてチャッ
ク不良や搬送ミスなどのトラブルが生じるばかりでな
く、記録層部分に無理な内部応力がかかり、記録層と基
板との接着性に悪影響を与えたり、記録層の信頼性、耐
久性の低下をまねくことが懸念される。On the other hand, thermal deformation caused by light irradiation is mainly due to a difference in thermal expansion between the surface irradiated with light and the inside of the substrate and the surface opposite to the irradiated surface. Since it is due to uneven thermal expansion of the substrate in the thickness direction of the substrate, the substrate is significantly deformed especially for several minutes after photocuring, and troubles such as chuck failure and transport error in the coating process of optical recording medium manufacturing. In addition to the above, there is a concern that unreasonable internal stress may be applied to the recording layer portion, which may adversely affect the adhesiveness between the recording layer and the substrate, and may reduce the reliability and durability of the recording layer.
【０００６】[0006]
【発明が解決しようとする課題】本発明は光硬化型樹脂
を塗布し、光硬化させる光記録媒体製造工程において、
光照射に伴う熱変形を低減する方法を提供しようとする
ものである。DISCLOSURE OF THE INVENTION The present invention relates to an optical recording medium manufacturing process in which a photocurable resin is applied and photocured.
An object of the present invention is to provide a method of reducing thermal deformation due to light irradiation.
【０００７】[0007]
【課題を解決するための手段】前記課題を解決するため
に、本発明は下記の構成からなる。すなわち、光硬化型
樹脂を塗布し、光硬化させる光記録媒体製造工程におい
て、光硬化時に基板に気体を吹き付け冷却することを特
徴とする光記録媒体の製造方法に関するものである。Means for Solving the Problems To solve the above problems, the present invention comprises the following constitutions. That is, the present invention relates to a method for manufacturing an optical recording medium, characterized in that, in the optical recording medium manufacturing process in which a photocurable resin is applied and photocured, a gas is blown onto the substrate to cool it during the photocuring.
【０００８】また、本発明は光硬化型樹脂を塗布し、光
硬化させる光記録媒体製造工程において、光硬化時に基
板の表面と裏面の温度差が５０℃以下であることを特徴
とする光記録媒体の製造方法に関するものであるFurther, according to the present invention, in a process of manufacturing an optical recording medium in which a photocurable resin is applied and photocured, the temperature difference between the front surface and the back surface of the substrate during photocuring is 50 ° C. or less. It relates to a method of manufacturing a medium.
【０００９】[0009]
【発明の実施の形態】本発明者らは、光硬化型樹脂を塗
布し、光硬化させる光記録媒体製造工程において、基板
に気体を吹き付け、基板を冷却すること、あるいは基板
の表面と裏面の温度差が５０℃以下とすることで光照射
時の基板の熱変形を防ぎ、光照射時の基板の反りを大幅
に抑制することで製造工程におけるチャック不良や搬送
ミスなどのトラブルを防止するばかりでなく、記録層の
信頼性や記録層と基板との接着性に悪影響を与えること
なく光硬化型樹脂をコーティングすることができること
を見出した。BEST MODE FOR CARRYING OUT THE INVENTION In the process of manufacturing an optical recording medium in which a photo-curable resin is applied and photo-cured, the present inventors blow gas onto the substrate to cool the substrate, or The temperature difference of 50 ° C. or less prevents thermal deformation of the substrate during light irradiation, and greatly suppresses warpage of the substrate during light irradiation, thus preventing problems such as chuck failures and transport errors during the manufacturing process. Moreover, it was found that the photocurable resin can be coated without adversely affecting the reliability of the recording layer and the adhesiveness between the recording layer and the substrate.
【００１０】本発明において、基板に吹き付ける気体は
特に限定する必要はなく、空気、窒素、不活性ガス、そ
の他どんな気体でもよい。これらのガスの吹き付けは、
光照射時の基板の温度上昇あるいはこれに伴う不均一な
熱膨張による熱変形を防ぐことを目的に行うものである
から、気体は基板の温度以下、好ましくは３０℃以下に
冷却していることが効果的である。また、気体の吹き付
ける方向は特に限定するものではないが、塗布面側から
吹き付けた場合、吹き付ける気体の圧力が高いと、スピ
ンコートし、塗布した樹脂が硬化する前に吹き付けられ
た気体の圧力により、塗布表面が波うち、膜表面の平坦
性が劣りやすいことから、塗布面と反対側から吹き付け
る方が好ましい。さらに、基板温度は１００℃以下であ
ることが効果的である。基板の強度はその温度の上昇と
ともに低下するため、基板温度が１００℃よりも高い温
度では反り、変形が一層生じやすくなるため好ましくな
い。８０℃以下であるとより効果的である。また、前述
したように、この現象は基板の厚みが厚い場合、例えば
従来よく用いられている１．２ｍｍ厚の基板を用いた場
合、基板自体の強度が強く、光硬化時の熱による変形は
あまり起きないが、基板が薄くなるほど、基板自体の強
度が弱いため、光硬化時に熱変形が起こりやすくなる。
このことから、基板厚さが１．０ｍｍ以下の時により効
果的であり、０．８ｍｍ以下の時さらに効果的である。In the present invention, the gas sprayed on the substrate is not particularly limited, and may be air, nitrogen, an inert gas, or any other gas. The blowing of these gases is
The gas is cooled to the temperature of the substrate or lower, preferably 30 ° C. or lower, since the purpose is to prevent thermal deformation due to temperature rise of the substrate during light irradiation or non-uniform thermal expansion accompanying it. Is effective. The direction in which the gas is sprayed is not particularly limited, but when sprayed from the coating surface side, if the pressure of the sprayed gas is high, spin coating is performed, and the pressure of the sprayed gas before the applied resin cures Since the coated surface is wavy and the flatness of the film surface tends to be poor, it is preferable to spray from the side opposite to the coated surface. Further, it is effective that the substrate temperature is 100 ° C. or lower. Since the strength of the substrate decreases as the temperature rises, it is not preferable because the substrate temperature is higher than 100 ° C., warping and deformation are more likely to occur. It is more effective if the temperature is 80 ° C or lower. In addition, as described above, this phenomenon occurs when the thickness of the substrate is large, for example, when a conventionally used substrate having a thickness of 1.2 mm is used, the strength of the substrate itself is high, and deformation due to heat during photocuring does not occur. Although it rarely occurs, the thinner the substrate, the weaker the strength of the substrate itself, and thus the more easily thermal deformation occurs during photocuring.
From this, it is more effective when the substrate thickness is 1.0 mm or less, and is more effective when the substrate thickness is 0.8 mm or less.
【００１１】また、光照射に伴って生じる熱変形は、光
を照射した面と基板の内部および照射面と反対の面との
間で熱膨脹に差がでるためであることから、照射面と反
対面の表面温度差は５０℃以下にすることによっても抑
えることができる。光記録媒体における基板の変形は照
射面と反対の面の表面温度差が少ないほど良く、より好
ましくは３５℃以下である。The thermal deformation caused by the irradiation of light is due to the difference in thermal expansion between the surface irradiated with light, the inside of the substrate, and the surface opposite to the irradiation surface. The surface temperature difference between the surfaces can also be suppressed by setting the temperature to 50 ° C. or less. The deformation of the substrate in the optical recording medium is better as the surface temperature difference between the irradiation surface and the opposite surface is smaller, and more preferably 35 ° C. or lower.
【００１２】本発明で用いる光は紫外線や電子線などで
あり、それらの線源としては高圧水銀灯、キセノンラン
プ、メタルハライドランプや加速電子などが使用でき
る。また、光硬化型樹脂としては、従来一般に用いられ
ている（メタ）アクリル酸エステル誘導体などの光重合
性樹脂組成物などがあり、装置の簡便さおよび線源の取
扱いやすさの点から、特に紫外線硬化型樹脂が一般的に
用いられており、基板の表面保護コート剤、記録層保護
コート剤あるいは貼り合わせディスクの接着剤等として
用いることができる。The light used in the present invention is, for example, ultraviolet rays or electron beams, and as a source of these rays, a high pressure mercury lamp, a xenon lamp, a metal halide lamp, an accelerating electron or the like can be used. Further, as the photocurable resin, there are photopolymerizable resin compositions such as (meth) acrylic acid ester derivatives that have been commonly used in the past, and in particular, from the viewpoint of the simplicity of the device and the ease of handling the radiation source, An ultraviolet curable resin is generally used, and can be used as a surface protective coating agent for a substrate, a recording layer protective coating agent, an adhesive for a bonded disc, or the like.
【００１３】本発明は再生専用（ＲＯＭ）光記録媒体、
光磁気記録媒体や相変化光記録媒体などの書換型（ＲＡ
Ｍ）光記録媒体、部分再生専用型（ＰＲＯＭ）光記録媒
体、追記型（ＷＯＲＭ）光記録媒体などのいずれの光記
録媒体を製造する場合にも用いることができる。特に、
書き込み時に高い光エネルギーを用いる相変化型光記録
媒体では、基板の変形や反りによる光エネルギーの損失
が低減されることが望ましく、本製造法は効果的であ
る。The present invention is a read-only (ROM) optical recording medium,
Rewritable (RA) media such as magneto-optical recording media and phase-change optical recording media
M) The optical recording medium, the partial read-only type (PROM) optical recording medium, the write-once type (WORM) optical recording medium, and the like can be used for manufacturing any optical recording medium. Especially,
In a phase-change type optical recording medium that uses high optical energy during writing, it is desirable that the loss of optical energy due to the deformation and warpage of the substrate be reduced, and this manufacturing method is effective.
【００１４】[0014]
（実施例１）直径１２０ｍｍ、厚さ０．６ｍｍの基板に
スパッタ法により記録層を成膜した。次に記録層上に紫
外線硬化型樹脂をスピンコート法により塗布し、２３℃
の空気を２０Ｎｌ／ｍｉｎの流量で紫外線照射面とは反
対の面に吹き付けながら９００ｍＪ／ｃｍ2 の紫外線を
照射した。紫外線照射後の基板の反り量は５０．８μ
ｍ、照射面の基板表面温度は４９℃、照射面の反対面は
４０℃、その温度差は９℃であった。(Example 1) A recording layer was formed by a sputtering method on a substrate having a diameter of 120 mm and a thickness of 0.6 mm. Next, an ultraviolet curable resin is applied on the recording layer by spin coating, and the temperature is set to 23 °
Was blown onto the surface opposite to the surface irradiated with ultraviolet rays at a flow rate of 20 Nl / min to irradiate ultraviolet rays of 900 mJ / cm 2 . The amount of warpage of the substrate after UV irradiation is 50.8μ
m, the substrate surface temperature of the irradiation surface was 49 ° C., the surface opposite to the irradiation surface was 40 ° C., and the temperature difference was 9 ° C.
【００１５】（実施例２）実施例１と同様に、基板に５
℃の空気を吹き付けながら紫外線を照射した。紫外線照
射後の基板の反り量は２０．６μｍ、照射面の基板表面
温度は２１℃、照射面の反対面は１７℃、その温度差４
℃であった。(Embodiment 2) As in Embodiment 1, 5
It was irradiated with ultraviolet rays while blowing air at ℃. The amount of warpage of the substrate after ultraviolet irradiation is 20.6 μm, the substrate surface temperature of the irradiation surface is 21 ° C., the opposite surface of the irradiation surface is 17 ° C., and the temperature difference is 4
° C.
【００１６】（実施例３）実施例１と同様に、スピンコ
ート装置を用いて基板に２３℃の空気を２０Ｎｌ／ｍｉ
ｎの流量を吹き付けながら７５枚連続で流したが、チャ
ック不良や搬送ミスなどのトラブルは全く生じなかっ
た。(Embodiment 3) As in Embodiment 1, using a spin coater, air at 23 ° C. was applied to the substrate at 20 Nl / mi.
Although 75 sheets were continuously flowed while blowing a flow rate of n, no trouble such as a defective chuck or a conveyance error occurred.
【００１７】（比較例１）実施例１に同様に、空気を吹
き付けずに基板に９００ｍＪ／ｃｍ2 の紫外線を照射し
た。紫外線照射後の基板の反り量は１１０．６μｍ、照
射面の基板表面温度は１０３℃、照射面の反対面は４９
℃、その温度差は５４℃であった。Comparative Example 1 Similarly to Example 1, the substrate was irradiated with ultraviolet rays of 900 mJ / cm 2 without blowing air. The amount of warp of the substrate after ultraviolet irradiation was 110.6 μm, the substrate surface temperature of the irradiation surface was 103 ° C., and the surface opposite to the irradiation surface was 49 ° C.
The temperature difference was 54 ° C.
【００１８】[0018]
【表１】 （比較例２）比較例１と同様に、スピンコート装置を用
いて基板に気体を吹き付けずに紫外線を照射し連続で流
したところ、５枚に１枚の割合でチャック不良や搬送ミ
スなどのトラブルが生じた。[Table 1] (Comparative Example 2) Similar to Comparative Example 1, when a substrate was irradiated with ultraviolet rays without being blown with a gas by using a spin coater and was made to flow continuously, one out of every five wafers caused a chuck failure or a transport error. Trouble occurred.
【００１９】[0019]
【表２】 [Table 2]
【００２０】[0020]
【発明の効果】光硬型樹脂を光硬化する場合に、気体を
吹き付けながら光照射することにより基板の反り、表面
温度、表面温度差が大幅に抑制され、製造工程において
チャック不良や搬送ミスを防止できるばかりではなく、
記録層部分への内部応力が極めて抑えられるために記録
層の信頼性、耐久性の低下や記録層と基板との接着性に
悪影響を与えることなく光硬化することが可能となる。EFFECTS OF THE INVENTION When photo-curing a photo-curing resin, the warp of the substrate, the surface temperature, and the surface temperature difference are largely suppressed by irradiating the light while blowing a gas. Not only can it be prevented,
Since the internal stress to the recording layer portion is extremely suppressed, it is possible to perform photocuring without lowering the reliability and durability of the recording layer or adversely affecting the adhesiveness between the recording layer and the substrate.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成８年１１月５日[Submission date] November 5, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２０[Correction target item name] 0020
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００２０】[0020]
【発明の効果】光硬化型樹脂を光硬化する場合に、気体
を吹き付けながら光照射することにより基板の反り、表
面温度、表面温度差が大幅に抑制され、製造工程におい
てチャック不良や搬送ミスを防止できるばかりではな
く、記録層部分への内部応力が極めて抑えられるために
記録層の信頼性、耐久性の低下や記録層と基板との接着
性に悪影響を与えることなく光硬化することが可能とな
る。A light hardening resin according to the present invention in the case of light curing, warpage of the substrate by light irradiation while blowing gas, the surface temperature, the surface temperature difference is greatly suppressed, a chuck failure or mistake in transport in the manufacturing process Not only can it be prevented, but the internal stress to the recording layer can be extremely suppressed, so that it can be photocured without lowering the reliability and durability of the recording layer and without adversely affecting the adhesion between the recording layer and the substrate. It will be possible.
Claims (6)
記録媒体製造工程において、光硬化時に基板に気体を吹
き付け冷却することを特徴とする光記録媒体の製造方
法。1. A method of manufacturing an optical recording medium, which comprises applying a photo-curable resin and photo-curing the same in a step of manufacturing the optical recording medium, in which a gas is blown onto the substrate to cool it during the photo-curing.
記録媒体製造工程において、光硬化時に基板の表面と裏
面の温度差が５０℃以下であることを特徴とする光記録
媒体の製造方法。2. A process for producing an optical recording medium in which a photocurable resin is applied and photocured, wherein the temperature difference between the front and back surfaces of the substrate during photocuring is 50 ° C. or less. Method.
℃以下であることを特徴とする請求項１記載の光記録媒
体の製造方法。3. The gas sprayed on the substrate during photo-curing is 30
The method for producing an optical recording medium according to claim 1, wherein the temperature is not higher than ° C.
下であることを特徴とする請求項１または請求項２記載
の光記録媒体の製造方法。4. The method of manufacturing an optical recording medium according to claim 1, wherein the surface temperature of the substrate is 100 ° C. or lower during photocuring.
反対側からであることを特徴とする請求項１記載の光記
録媒体の製造方法。5. The method for producing an optical recording medium according to claim 1, wherein the direction of blowing the gas is from the side opposite to the coated surface.
を特徴とする請求項１または請求項２記載の光記録媒体
の製造方法。6. The method for producing an optical recording medium according to claim 1, wherein the substrate has a thickness of 1.0 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29284495A JPH09138978A (en) | 1995-11-10 | 1995-11-10 | Production of optical recording medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29284495A JPH09138978A (en) | 1995-11-10 | 1995-11-10 | Production of optical recording medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09138978A true JPH09138978A (en) | 1997-05-27 |
Family
ID=17787103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29284495A Pending JPH09138978A (en) | 1995-11-10 | 1995-11-10 | Production of optical recording medium |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09138978A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999024259A1 (en) * | 1997-11-12 | 1999-05-20 | First Light Technology, Inc. | System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation |
| US7168940B2 (en) | 2001-12-05 | 2007-01-30 | Origin Electric Company, Limited | Method and apparatus for treating a disc substrate |
-
1995
- 1995-11-10 JP JP29284495A patent/JPH09138978A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999024259A1 (en) * | 1997-11-12 | 1999-05-20 | First Light Technology, Inc. | System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation |
| US6355129B1 (en) * | 1997-11-12 | 2002-03-12 | Steag Hamatech, Inc. | System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation |
| US7168940B2 (en) | 2001-12-05 | 2007-01-30 | Origin Electric Company, Limited | Method and apparatus for treating a disc substrate |
| US7267790B2 (en) | 2001-12-05 | 2007-09-11 | Origin Electric Company | Method and apparatus for treating a disc substrate |
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