JPH09124892A - Polyacetal resin composition and method for producing the same - Google Patents

Abstract

(57) Abstract: A polyacetal resin composition is used, and it is possible to obtain a member capable of suppressing the generation of sliding noise such as squeaking noise and having high moldability and friction and wear characteristics. SOLUTION: The resin composition is polyacetal (A) 1.
1 to 100 parts by weight of an epoxy group-containing polyacetal (B), a melting point of 60 to 125 ° C., and a modified olefin resin (C) 1 to 1 having a functional group reactive with an epoxy group. 50 parts by weight and 0.01 to 2 parts by weight of the epoxy reaction accelerator (D) are included. The resin (C) includes an olefin resin having a functional group such as a carboxyl group and an acid anhydride group (such as low density polyethylene). As the component (C), tertiary amines, quaternary amine salts, imidazoles, phosphonium salts and the like can be used.

Description

Detailed Description of the Invention

[0001]

The present invention relates to audio equipment,
The present invention relates to a polyacetal resin composition useful for obtaining sliding members for office automation equipment and the like, and a method for producing the same.

[0002]

2. Description of the Related Art Polyacetal is a well-balanced mechanical strength, slidability, heat resistance, chemical resistance, moldability,
Because of its electrical properties, it is widely used as an engineering plastic. However, with the expansion of the market, the required performance has become more sophisticated, and it is required to dramatically improve specific performance such as friction and wear characteristics while maintaining high characteristics. For example, parts that compose a drive mechanism typified by the fields of audio equipment and office automation equipment are made of materials that reduce the load on the motor, reduce operating noise, and reduce manufacturing costs by eliminating grease in the grease application section. It is desired to improve various sliding characteristics such as friction and wear characteristics and low sliding noise. In order to improve sliding properties, a sliding improver such as a fluororesin or a polyolefin resin has been added to polyacetal. However, such a method cannot sufficiently improve the sliding noise represented by the squeaking noise. In addition, the addition of a fluororesin or a polyolefin resin having poor compatibility with polyacetal causes peeling on the surface of the molded body or causes a deposit on the surface of the molding die to sufficiently improve the original performance of the resin composition. Cannot be expressed.

JP-A-59-204652 discloses that the compatibility between polyolefin and polyacetal is improved,
In order to improve moldability and impact resistance, a modified polyolefin obtained by graft-copolymerizing 0.01 to 10 parts by weight of a unit of an unsaturated carboxylic acid or its derivative component with 100 parts by weight of an olefin-based polymer is added to 100 parts by weight of a polyacetal. There has been proposed a polyacetal resin composition in which 1 to 200 parts by weight is blended per part. However, this composition is still not sufficient in terms of not only friction and wear characteristics but also moldability including peeling of the surface of a molded article.

On the other hand, in order to improve the affinity of the polyacetal, it is effective to introduce an appropriate modifying group into the polyacetal to modify it. Conventionally, a method of modifying the polyacetal by introducing various modifying groups has been proposed. (For example, Japanese Patent Publication No. 43-23467 and Japanese Patent Publication No. 47-19).
425, JP-A-3-21618, JP-A-3
-21619 publication). However, these methods
In both cases, in the polymerization process, formaldehyde or trioxane and comonomers having various modifying groups as substituents (for example, aminoaldehyde, nitro group, nitrile group,
In this method, a modifying group is directly introduced by copolymerizing with a cyclic ether or cyclic acetal having a carboxyl group or an amide group. Therefore, in either method, the polymerization reactivity decreases, and it is difficult to obtain a high molecular weight copolymer in a high yield. Furthermore, even when combined with polyolefin, it is difficult to greatly improve the friction properties, wear properties and moldability.

[0005]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a polyacetal resin composition which can suppress the generation of sliding noise typified by squeaking noise and which has high friction and abrasion characteristics. Another object of the present invention is to provide a polyacetal resin composition which is useful for obtaining a uniform molded product without peeling off the surface of the molded product. Still another object of the present invention is to provide a method for producing a polyacetal resin composition, which enables a resin composition having the above-mentioned excellent properties to be efficiently obtained by a simple operation.

[0006]

Means for Solving the Problems As a result of intensive studies for achieving the above object, the present inventors have found that polyacetal, epoxy group-containing polyacetal, polyolefin having a functional group reactive with an epoxy group, and epoxy reaction promotion. By combining the agents, it was found that not only there is no peeling of the surface of the molded body, but also sliding noise such as squeaking noise can be significantly suppressed, and a polyacetal resin composition having high friction and abrasion properties is obtained, and the present invention was completed. did.

That is, the polyacetal resin composition of the present invention comprises (A) a polyacetal, (B) an epoxy group-containing polyacetal, (C) a melting point of 60 to 125 ° C., and a functional group reactive with an epoxy group. And a modified olefin resin having (d) and (D) an epoxy reaction accelerator. The (C) modified olefin resin may be an olefin resin having a carboxyl group or an acid anhydride group. The polyacetal resin composition is (A)
A polyacetal, (B) a polyacetal having an epoxy group, (C) a modified olefin resin having a melting point of 60 to 125 ° C. and a functional group reactive with an epoxy group, and (D) an epoxy reaction accelerator are mixed. It can be prepared by Furthermore, the present invention also provides a sliding member composed of a molded product of the polyacetal resin composition.

In the present specification, the term "polyacetal" means an unmodified polyacetal homopolymer or polyacetal copolymer, unless otherwise specified. Further, the “residue of the polymerizable compound” means not only the monomer unit of the polymerizable compound but also a polymer thereof (for example, a dimer, trimer, tetramer or polymer component produced by polymerization). In addition, "non-self-condensable functional group"
Means a functional group capable of condensing without intervening reaction components, such as a methylol group. Further, unless otherwise specified, acrylic monomers and methacrylic monomers are collectively referred to as “(meth) acrylic monomers”. Furthermore, the “functional group reactive with epoxy group” may be simply referred to as “reactive functional group”. "Melting point" means a differential scanning calorimeter (DSC)
It means the melting peak temperature when measured at a temperature rising rate of 10 ° C./min according to the method specified in K7121. "Melting point"
For the measurement of, for example, "Polymer Experimental Studies 12, Thermodynamic, Electrical, and Optical Properties," Shu Kanbara, Kyoritsu Shuppan Co., Ltd., 1984, etc. can be referred to.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION (A) Polyacetal, (B) Epoxy group-containing polyacetal, (C) Modified olefin resin and (D) constituting the resin composition of the present invention.
The contents of the epoxy reaction accelerator are as follows.

[Polyacetal (A)] The unmodified polyacetal (A) is a polymer compound containing an oxymethylene group (—CH ₂ O—) as a main constituent unit. Polyacetals include polyoxymethylene homopolymers and polyacetal copolymers. In addition to the oxymethylene group, this copolymer has an oxyalkylene unit having about 2 to 6 carbon atoms, preferably about 2 to 4 carbon atoms (for example, oxyethylene group (—CH ₂ CH ₂ O—), oxypropylene group, oxyethylene group, (Such as a tetramethylene group) as a constitutional unit. The ratio of the oxyalkylene group having about 2 to 6 carbon atoms can be appropriately selected according to the application of the polyacetal, and for example, with respect to the entire polyacetal,
It is 0.1 to 30 mol%, preferably about 1 to 20 mol%.

The polyacetal copolymer may be composed of a plurality of components such as a copolymer composed of two components and a terpolymer composed of three components, and may be a block copolymer. Further, the polyacetal may have not only a linear structure but also a branched structure and a crosslinked structure. Furthermore, the terminal of the polyacetal may be stabilized by, for example, esterification with a carboxylic acid such as acetic acid, propionic acid or butyric acid.
The degree of polymerization, the degree of branching and the degree of crosslinking of the polyacetal are not particularly limited as long as they can be melt-molded. Preferred polyacetals include polyoxymethylene, polyacetal copolymers (eg, copolymers composed of at least oxymethylene units and oxyethylene units).
From the viewpoint of thermal stability, a polyacetal copolymer is preferred. The molecular weight of the polyacetal is not particularly limited,
For example, 5,000 to 500,000, preferably 1
It is about 10,000 to 400,000.

The polyacetal can be produced, for example, by polymerizing aldehydes such as formaldehyde, paraformaldehyde and acetaldehyde, and cyclic ethers such as trioxane, ethylene oxide, propylene oxide and 1,3-dioxolane.

[Epoxy Group-Containing Polyacetal (B)]
The polyacetal (B) having an epoxy group is obtained by modifying the polyacetal (that is, the polyacetal homopolymer and the polyacetal copolymer) described in the section of the polyacetal (A) or the polymerizable polyacetal with a polymerizable compound having an epoxy group. Obtainable. Hereinafter, the “polyacetal” and the “polymerizable polyacetal” may be simply referred to as “(1) polyacetal component”.

The above-mentioned polymerizable polyacetal is a polymer compound having an oxymethylene group (—CH ₂ O—) as a main constituent unit and having a polymerizable functional group in the molecule. The polymerizable functional group includes, for example, a functional group having an ethylenic double bond or an acetylene bond, and a functional group having an ethylenically unsaturated bond is particularly preferable.

The polymerizable polyacetal is a polymerizable unsaturated compound obtained by copolymerizing formaldehyde or trioxane as a main monomer and a cyclic ether or cyclic formal having an ethylenically unsaturated bond as a substituent as a comonomer in the presence of a cationic active catalyst. Polyacetal copolymer having bond, formaldehyde or trioxane as main monomer, polymerized or copolymerized by cationic polymerization catalyst in the presence of linear formal compound having polymerizable unsaturated bond as chain transfer agent, polymerizable unsaturated at terminal A polyacetal copolymer having a bond, a polyacetal having a polymerizable unsaturated bond which is polymerized by anionic polymerization in the presence of a chain transfer agent having a main monomer of formaldehyde and further having a polymerizable functional group such as a polymerizable unsaturated bond is included. In the above-mentioned polymerization step, a cyclic ether or cyclic formal having no polymerizable unsaturated bond may coexist as a comonomer, if necessary. Further, the polymerizable polyacetal may be a polyacetal obtained by a method of using a carboxylic acid having a polymerizable unsaturated bond or an acid anhydride thereof as a terminal esterifying agent for the polyacetal after the polymerization reaction.

In the above-mentioned polymerizable polyacetal,
Examples of the cyclic ether or cyclic formal having a polymerizable unsaturated bond include allyl glycidyl ether and 2
-Chloroallyl glycidyl ether, 2-bromoallyl glycidyl ether, 2-methylallyl glycidyl ether, 2-vinylethyl glycidyl ether, 4-vinylphenyl glycidyl ether, vinylbenzyl glycidyl ether (2-vinylbenzyl glycidyl ether, 3-vinylbenzyl) Glycidyl ether, 4-vinylbenzyl glycidyl ether, etc., 2- (4-vinylphenyl) ethyl glycidyl ether, and the like. Examples of the linear formal compound as a chain transfer agent in the above method include divinyl formal. , Diethylene glycol divinyl ether, trimethylene glycol divinyl ether, methylene glycol monovinyl ether, dimethylene glycol monovinyl ether, etc. . Further, in the above-mentioned polymerizable polyacetal, the chain transfer agent having a polymerizable functional group, for example, allyl alcohol, crotonyl alcohol, alcohol having an ethylenically unsaturated bond such as α-vinyl ethyl alcohol, propargyl alcohol, etc. An alcohol having an acetylene bond is included. Further, in the above method, as the carboxylic acid having a polymerizable functional group or an acid anhydride thereof, for example, acrylic acid, methacrylic acid, crotonic acid, vinyl glycolic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid. A mono- or dicarboxylic acid having an ethylenically unsaturated bond such as itaconic anhydride and a carboxylic acid having an acetylene bond such as propiolic acid can be used. Acrylic acid or methacrylic acid is often used as the carboxylic acid having a polymerizable functional group.

In the polymerizable polyacetal, the content of the polymerizable functional group such as ethylenic unsaturated bond is, for example,
The amount is 0.001 to 5 mol / kg (for example, 0.02 to 3 mol / kg), preferably about 0.01 to 2 mol / kg, and often about 0.01 to 1 mol / kg. It is preferable to use the above-mentioned polymerizable polyacetal because the introduction efficiency of the polymerizable compound described later becomes high.

The polyacetal (B) having an epoxy group can be obtained by introducing a residue of a polymerizable compound having an epoxy group into (1) a polyacetal component (that is, a polyacetal or a polymerizable polyacetal). The epoxy group is useful in increasing the affinity with the polyacetal (A), the modified olefin resin (C), and additives such as a reinforcing agent and a filler. These polymerizable compounds can be used alone or in combination of two or more.

The polymerizable compound having an epoxy group must have at least one polymerizable group in one molecule.
By adding a small amount of a compound having a plurality of polymerizable groups for modification, suppressing excessive crosslinking and suppressing melt viscosity,
It is effective for obtaining a resin composition suitable for blow molding and film molding. When fluidity is required as in injection molding materials, the polymerizable compound contains one polymerizable group (for example, an ethylenic double bond or acetylene) in one molecule in order to suppress crosslinking and enhance molding processability. Bond), especially a compound having an ethylenically unsaturated bond.

Examples of the polymerizable compound having an epoxy group include glycidyl ethers such as allyl glycidyl ether and chalcone glycidyl ether; glycidyl (meth) acrylate, vinyl benzoic acid glycidyl ester, allyl benzoic acid glycidyl ester, and cinnamic acid glycidyl ester. , Glycidyl acetic acid glycidyl ester, dimer acid glycidyl ester, glycidyl or epoxy ester such as ester of epoxidized stearyl alcohol and acrylic acid or methacrylic acid; epoxidized unsaturated chain or cyclic olefin such as epoxyhexene and limonene oxide And so on. The glycidyl ether type polymerizable compound may be a compound represented by the formula (I) (for example, N-, as described later).
[4- (2,3-epoxypropoxy) -3,5-dimethylbenzyl] acrylamide etc.) are also included. Preferred polymerizable compounds having an epoxy group include glycidyl ether type or glycidyl ester type epoxy compounds having a (meth) acryloyl group.

Particularly preferred are ester compounds having an epoxy group and an ethylenically polymerizing group such as glycidyl (meth) acrylate, and amide compounds having an amide bond and an epoxy group and an ethylenically polymerizing group. The compound represented by the following formula (I) is included in the ester compound and the amide compound having an epoxy group and an ethylenically polymerizable group.

[0022]

Embedded image (Wherein, R ¹ is a hydrogen atom or a methyl group, R ^{2 to} R ⁵ are the same or different and are a hydrogen atom, a halogen atom, an alkyl group,
It represents an alkoxy group, an alkoxycarbonyl group, an acyl group, or an acyloxy group. n is 0 or 1) The halogen atom includes fluorine, chlorine, bromine and iodine atoms, and the alkyl group includes, for example, methyl, ethyl, propyl, isopropyl, butyl, isobutyl and s.
It includes alkyl groups having about 1 to 10 carbon atoms such as ec-butyl, t-butyl, pentyl, hexyl and octyl groups. Preferred alkyl groups include lower alkyl groups having about 1 to 6 carbon atoms, particularly about 1 to 4 carbon atoms. Alkoxy groups include, for example, methoxy, ethoxy, propoxy,
A lower alkoxy group having about 1 to 6 carbon atoms such as butoxy, t-butoxy, pentyloxy, hexyloxy group is included. The alkoxycarbonyl group includes, for example, a lower alkoxycarbonyl group having about 1 to 6 carbon atoms in the alkoxy moiety such as methoxycarbonyl, ethoxycarbonyl, propoxycarbonyl, butoxycarbonyl, t-butoxycarbonyl, pentyloxycarbonyl and hexyloxycarbonyl groups. Is often the case. Acyl groups include formyl, acetyl, propionyl, butyryl,
A lower acyl group having about 1 to 6 carbon atoms such as valeryl and pivaloyl group is included. Examples of the acyloxy group include acetyloxy, propionyloxy, butyryloxy, valeryloxy and pivaloyloxy groups. R ^{2 to} R ⁵ are often the same or different and each represents a hydrogen atom, a halogen atom, or a lower alkyl group. Especially R ²
In many cases, R ⁵ is the same or different and is a hydrogen atom or a lower alkyl group.

The compound in which n is 0 includes the glycidyl (meth) acrylate. Specific examples of the compound in which n is 1 include, for example, N- [4- (2,3-epoxypropoxy) phenylmethyl] acrylamide and N- [4-
(2,3-Epoxypropoxy) -3,5-dimethylbenzyl] acrylamide, N- [4- (2,3-epoxypropoxy) -3,5-diethylbenzyl] acrylamide, N- [4- (2,3) -Epoxy propoxy)-
N-, such as 3,5-dibutylbenzyl] acrylamide
[4- (2,3-epoxypropoxy) -3,5-dialkylbenzyl] acrylamide, N- [4- (2,3
-Epoxypropoxy) -2,6-dimethylbenzyl]
Acrylamide, N- [4- (2,3-epoxypropoxy) -2,5-dimethylbenzyl] acrylamide,
N- [4- (2,3-epoxypropoxy) -2,3
Examples include 5,6-tetramethylbenzyl] acrylamide.

The polymerizable compound having an epoxy group is often liquid or solid (non-gaseous) at room temperature and atmospheric pressure. Of these polymerizable compounds, a compound having a boiling point of 70 ° C. or higher at normal pressure, preferably 100 ° C. or higher, more preferably 120 ° C. or higher is often used, and the preferable boiling point of the polymerizable compound is maleic anhydride or (meth). ) Acrylic acid, glycidyl (meth) acrylate, a compound represented by the formula (I) (for example, N- [4- (2,3
-Epoxypropoxy) -3,5-dimethylbenzyl]
In many cases, the temperature is 140 ° C. or higher under normal pressure, such as acrylamide).

In order to improve the introduction rate of the epoxy group and the utilization efficiency of the epoxy group-containing polyacetal and the molded article, the epoxy group-containing polyacetal is a polyacetal modified with the above-mentioned polymerizable compound in the absence of a filler or a reinforcing agent. Is preferred. When the epoxy group-containing polyacetal modified in the absence of a filler or a reinforcing agent is used, a resin composition can be prepared by simply mixing the polyacetal and at least one thermoplastic resin according to the application, and alloying or The degree of freedom in compounding increases. The introduction amount of the epoxy group can be selected within a range in which the affinity with the thermoplastic resin and the additive can be improved, and for example, is 0.1 to 30% by weight in terms of the polymerizable compound with respect to (1) the polyacetal component.
(For example, about 0.1 to 20% by weight), preferably 0.2
-25% by weight (for example, about 0.2-15% by weight), more preferably 0.3-20% by weight (for example, 0.3-10%).
% By weight), and often about 0.2 to 10% by weight.

The polyacetal (B) having an epoxy group is prepared by heating (1) a polyacetal component and (2) a polymerizable compound having an epoxy group to introduce the residue of the polymerizable compound into the polyacetal component. Can be manufactured by (1) The polyacetal component and (2) the polymerizable compound having an epoxy group may be heated in the absence of (3) a radical generator (polymerization initiator), but (3)
By heating in the presence of a radical generator, the residue of the polymerizable compound can be efficiently introduced.

The type of the radical generator (3) is not particularly limited as long as it is a compound that functions as a polymerization initiator that generates free radicals and initiates the polymerization of the polymerizable compound. As the radical generator, peroxides such as organic peroxides, azo compounds and other radical polymerization initiators can be used.

Examples of the peroxide include t-butyl hydroperoxide, p-menthane hydroperoxide,
Cumene hydroperoxide, diisopropylbenzene hydroperoxide, 2,5-dimethylhexane-2,5
-Alkyl hydroperoxides such as dihydroperoxide; di-t-butyl peroxide, t-butyl cumyl peroxide, dicumyl peroxide, t-butyl peroxycumene, 2,5-dimethyl-2,5-di (t- Butyl peroxy) hexane, 2,5-dimethyl-2,5
-Di (t-butylperoxy) hexyne-3, α, α '
-Dialkyl peroxide such as bis (t-butylperoxy-m-isopropyl) benzene; diacyl peroxide such as benzoyl peroxide, lauroyl peroxide, p-chlorobenzoyl peroxide; methyl ethyl ketone peroxide, 1,1-bis ( t-butylperoxy)
Alkylidene peroxide such as -3,3,5-trimethylcyclohexane and 1,1-bis (t-butylperoxy) cyclododecane; n-butyl-4,4-bis (t
-Butyl peroxy) valerate, peroxide esters such as t-butyl peroxy benzoate, and the like.

Examples of the azo compound include 1-[(1
-Cyano-1-methylethyl) azo] formamide,
Azoamide compounds such as 2,2′-azobis {2-methyl-N- [1,1-bis (hydroxymethyl) ethyl] propionamide}; 1,1-azobis (cyclohexane-1-carbonitrile), 2- Phenylazo-4-
Methoxy-2,4-dimethylvaleronitrile, 2,2 '
-Azobis [2- (hydroxymethyl) propionitrile], azobisisobutyronitrile and other azonitrile compounds; and 2,2'-azobis (2,4,4-trimethylpentane) and other alkylazo compounds. .

As other radical generators, for example, persulfates such as potassium persulfate, sodium persulfate and ammonium persulfate can be used. These radical generators may be used alone or in combination of the same kind or different kinds.

In order to efficiently introduce the epoxy group of the polymerizable compound (2) into the polyacetal component (1), a preferable radical generator has a temperature corresponding to a half-life of 1 minute of 13
Compounds at 0 ° C or higher, preferably 150 ° C or higher, more preferably 160 ° C or higher are included. Such radical generators are often alkyl hydroperoxides, dialkyl peroxides, peroxide esters and azo compounds.

(2) The proportion of the polymerizable compound having an epoxy group can be selected according to the desired degree of modification and the intended use of the modified polyacetal, and is, for example, 0.1 per 100 parts by weight of the polyacetal component. -30 parts by weight, preferably 0.3-25 parts by weight, more preferably 0.5-
It is about 20 parts by weight, and often about 1 to 20 parts by weight. (2) When the proportion of the polymerizable compound having an epoxy group is small, the degree of modification of the polyacetal is small, and when it is excessive, the mechanical properties of the polyacetal may deteriorate depending on the type of the polymerizable compound.

(1) With respect to the polyacetal component (3)
The proportion of the radical generator can be selected from a range capable of suppressing excessive reduction in molecular weight of the polyacetal component and not impairing the modification efficiency. For example, (1) polyacetal component 100
3.5 parts by weight or less with respect to parts by weight (for example, 0.01 to
3.5 parts by weight), preferably 0.01 to 3 parts by weight,
More preferably about 0.01 to 1.5 parts by weight,
It is often about 0.05 to 0.5 parts by weight. Also,
The ratio of the radical generator (3) to the total amount of (1) the polyacetal component and (2) the polymerizable compound having an epoxy group is the half-life at the processing temperature of the radical generator,
The amount can be selected according to the amount of the polymerizable compound, the processing temperature, the processing time, etc., and is 2.5 parts by weight or less based on 100 parts by weight of the total of (1) the polyacetal component and (2) the polymerizable compound having an epoxy group ( For example, about 0.01 to 2.5 parts by weight), preferably 0.01 to 2 parts by weight, more preferably about 0.01 to 1 part by weight, and about 0.05 to 0.5 parts by weight. In many cases. If the amount of the radical generator (3) used is too small, the degree of modification by the polymerizable compound (2) having an epoxy group tends to decrease, and even if it is too large, the degree of modification does not improve so much. Further, if the amount of the radical generator used is too large, the polyacetal component may be excessively decomposed depending on the type of the radical generator. In addition,
(2) The ratio of the radical generator (3) to 100 parts by weight of the polymerizable compound having an epoxy group is 0.1 to 25 parts by weight, preferably 0.5 to 15 parts by weight, and more preferably 1 to 10 parts by weight. It is often a degree.

As a method for easily modifying the polyacetal component, (3) in the presence of a radical generator, (1) the polyacetal component and (2) a polymerizable compound having an epoxy group are mixed in a molten state of the polyacetal component. The method of doing, especially the method of melt-kneading is included. For the melt-mixing and melt-kneading treatment, a conventional mixer or kneader such as an extruder, a Brabender, a kneader, a Banbury mixer, a roll mill can be used. The preferred melt mixing or kneading machine,
Included are closed equipment such as extruders, kneaders and the like. The kneading temperature can be selected in the range of the melting point of the polyacetal to the decomposition temperature, and is preferably 5 to 7 than the melting point of the polyacetal component.
It is a high temperature of 0 ° C (preferably about 10 to 50 ° C).
The treatment time can be selected according to the mixing or kneading temperature, and is, for example, 20 seconds to 2 hours, preferably 30 seconds to 1 hour, and often 30 seconds to 30 minutes. The melt mixing or melt kneading process is performed by (1) polyacetal component,
(2) The polymerizable compound having an epoxy group, and optionally (3) the radical generator, are individually and sequentially supplied to the mixer or kneader, or the two components (1), (2) or three components ( The mixture of 1), 2) and 3) may be simultaneously provided by using the above mixer or kneader. The melt mixing or melt kneading treatment may be carried out in the presence of an antioxidant.

Incidentally, (2) in the absence of the polymerizable compound having an epoxy group, (1) the polyacetal component and (3)
When the radical generator is melt-mixed or melt-kneaded, the radical generator causes the polyacetal component to have a significantly low molecular weight. On the other hand, when (1) a polyacetal component and (3) a radical generator are melt-mixed or melt-kneaded in the presence of (2) a polymerizable compound having an epoxy group, the polymerizable compound can be modified and radical generation can be performed. Although it depends on the amount of the agent, it is possible to prevent the polyacetal component from having an excessively low molecular weight. Therefore, (2) a polymerizable compound having an epoxy group is added to a molten mixture of (1) polyacetal component and (3) radical generator,
When the polyacetal component is mixed in the molten state, a modified polyacetal having a relatively low molecular weight modified with a polymerizable compound can be obtained. Such a modified polyacetal can be used as a compatibilizing agent, an adhesiveness improving agent with resins, metals, adhesives, paints and the like.

While suppressing the decomposition of the polyacetal component,
In order to effectively use the radical generator for modification and to enhance the modification efficiency of the polymerizable compound, three components of (1) polyacetal component, (2) polymerizable compound having functional group and (3) radical generator are used. Is mixed or kneaded in a molten state of the polyacetal component, or (3) a radical generator is added in the coexistence of (1) the polyacetal component and (2) a polymerizable compound to mix or knead in the molten state of the polyacetal component. Method of kneading, mixture of (1) polyacetal component and (2) polymerizable compound having functional group, particularly homogeneous mixture (preferably compound or melt mixture)
The method of (3) adding a radical generator and mixing or kneading the polyacetal component in a molten state is useful. In such a method, the functional group of the polymerizable compound can be efficiently introduced while maintaining the high molecular weight and the excellent properties of the polyacetal. In particular, the above method has an advantage over the first method in that (1) it is possible to enhance the modification efficiency while suppressing lowering of the molecular weight of the polyacetal component.

Such a method includes, for example, supplying the three components and the compound to an apparatus such as the extruder,
This can be carried out by melting and mixing the polyacetal and the polymerizable compound in the device, then adding or injecting the radical generator into the device, and mixing or kneading. Further, a mixture of the compound and the radical generator may be supplied to the device and mixed or kneaded. The compound is often used in the form of powder or pellets.

Further, in order to improve the degree of modification by the polymerizable compound having an epoxy group and the utilization efficiency of the radical generator, the above-mentioned melt mixing or melt kneading is carried out in the absence of a filler such as a reinforcing filler. Is preferred. That is, when melt mixing or melt kneading is performed in the presence of a filler, it is often difficult to control the modification efficiency and melt viscosity of the polymerizable compound with respect to the polyacetal component. On the other hand, when modified in the absence of a filler and a reinforcing agent, the polymerizable compound having a radical generator and an epoxy group can be effectively used for modification of polyacetal, and a filler and a relatively large amount used. Since it is not modified with a reinforcing agent, a wide range of compositions can be obtained by combining the modified polyacetal with various thermoplastic resins.

If necessary, an additive, for example, a resin composition containing a stabilizer such as an antioxidant may be subjected to the above melt mixing or melt kneading operation. At that time, in order to enhance the modification efficiency of the polyacetal component by the polymerizable compound having an epoxy group, and the utilization efficiency of the radical generator, the addition amount of the additive is preferably small, for example, the total of the polyacetal component and the polymerizable compound. 10 parts by weight or less, preferably 0.001 to 100 parts by weight
5 parts by weight, more preferably about 0.01 to 3 parts by weight.

Of the above additives, the addition of an antioxidant is useful for increasing the stability of the modified polyacetal. The antioxidant, for example, hindered phenols,
Includes hindered amines and other compounds. Hindered phenols include, for example, 2,6-di-t-butyl-p-cresol and 2,2'-methylenebis (4-
Methyl-6-t-butylphenol), 4,4'-methylenebis (2,6-di-t-butylphenol), 4,
4'-butylidene bis (3-methyl-6-t-butylphenol), 1,6-hexanediol-bis [3-
(3,5-di-t-butyl-4-hydroxyphenyl)
Propionate], pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], triethylene glycol-bis [3- (3-t-butyl-5-methyl-4-hydroxy) Phenyl) propionate], 1,3,5-trimethyl-2,4,6-tris (3,5-di-t-butyl-4)
-Hydroxybenzyl) benzene, n-octadecyl-
3- (4 ', 5'-di-t-butylphenol) propionate, stearyl-β- (3,5-di-t-butyl-4-hydroxyphenol) propionate, distearyl-3,5-di-t- Butyl-4-hydroxybenzylphosphonate, 2-t-butyl-6- (3-t-butyl-5-methyl-2-hydroxybenzyl-4-methylphenyl acrylate, N, N'-hexamethylenebis (3,5 -Di-t-butyl-4-hydroxy-hydrocinnamamide), 3,9-bis {2- [3- (3-t-
Butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl} -2,4
8,10-tetraoxaspiro [5,5] undecane,
4,4'-thiobis (3-methyl-6-t-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-t-butylphenol) butane, etc. are included.

Hindered amines include, for example, 4-acetoxy-2,2,6,6-tetramethylpiperidine,
4-stearoyloxy-2,2,6,6-tetramethylpiperidine, 4-acryloyloxy-2,2,6
6-tetramethylpiperidine, 4-methoxy-2,2
6,6-Tetramethylpiperidine, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine, 4-cyclohexyloxy-2,2,6,6-tetramethylpiperidine, 4-phenoxy-2,2 6,6-Tetramethylpiperidine, 4-benzyloxy-2,2,6,6
-Tetramethylpiperidine, 4- (phenylcarbamoyloxy) -2,2,6,6-tetramethylpiperidine, bis (2,2,6,6-tetramethyl-4-piperidyl) oxalate, bis (2,2,2 6,6-Tetramethyl-4-piperidyl) malonate, bis (2,2,2
6,6-tetramethyl-4-piperidyl) adipate,
Bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, Bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, Bis (1,2,2)
2,6,6-Pentamethyl-4-piperidyl) adipate, bis (2,2,6,6-tetramethyl-4-piperidyl) terephthalate, 1,2-bis (2,2,6,6)
-Tetramethyl-4-piperidyloxy) ethane, bis (2,2,6,6-tetramethyl-4-piperidyl) hexamethylene-1,6-dicarbamate, tris (2,2
2,6,6-Tetramethyl-4-piperidyl) benzene-1,3,5-tricarboxylate, phenyl-α-
Naphthylamine, phenyl-β-naphthylamine, N,
Examples thereof include N'-diphenyl-p-phenylenediamine, N-phenyl-N'-cyclohexyl-p-phenylenediamine, N-isopropyl-N'-phenyl-p-phenylenediamine.

Other antioxidants include, for example, sulfur type antioxidants such as dimyristyl thiodipropionate, dilauryl thiodipropionate and distearyl thiodipropionate; triisodecyl phosphite and triphenylphosphine. Phosphorus antioxidants such as fighting; 2,5
-Hydroquinone antioxidants such as di-t-butylhydroquinone and 2,5-diamylhydroquinone; quinoline antioxidants such as 6-ethoxy-2,2,4-trimethyl-1,2-dihydroquinoline; Includes mercapto-henzoimidazole and the like. These antioxidants can be used alone or in combination of two or more. Preferred antioxidants include hindered phenols (phenolic antioxidants) and hindered amines (amine antioxidants).

When the polyacetal component is modified in the presence of an antioxidant, the antioxidant may be added to (1) the polyacetal component or in the modification process. The amount of the antioxidant used is 0.001 to 2 parts by weight, preferably 0.01 to 1 part by weight, based on 100 parts by weight of the (1) polyacetal component. The modified polyacetal thus obtained may be pelletized if necessary.

The amount of the epoxy-containing polyacetal (B) used can be selected from a wide range depending on the amount of the epoxy group introduced in the epoxy-containing polyacetal (B) and the type of the modified olefin resin (C). The amount of the epoxy-containing polyacetal (B) used is, for example, 1 to 100 parts by weight, preferably 1 to 80 parts by weight (for example, 2 to 50 parts by weight), based on 100 parts by weight of the unmodified polyacetal (A), Preferably 5 to 50 parts by weight (eg 5
.About.30 parts by weight).

[Modified Olefin Resin (C)] The modified olefin resin (C) having a functional group reactive with an epoxy group has a specific melting point and a functional group reactive with an epoxy group. There is no particular limitation as long as it has a group. The melting point of the modified olefin resin (C) is 6
0 to 125 ° C, preferably about 70 to 125 ° C,
Modified olefin resin (C) having a melting point of about 75 to 120 ° C
Is often used.

The unmodified olefin resin as a base polymer of the modified olefin resin includes ethylene, propylene, 1-butene, 1-hexene, 1-octene,
Homopolymers or copolymers of α-C _2-14 olefins (preferably α-C _2-10 olefins) such as 4-methyl-1-pentene, nonene, decene and dodecene (for example, random copolymers, blocks) Copolymer, graft copolymer),
Random copolymers, block copolymers, graft copolymers and the like containing the above α-olefin as the main component and at least one comonomer component are also included. Examples of the comonomer component include non-conjugated dienes (1,4-hexadiene, dicyclopentadiene, 5-ethylidene-2-
Norbornene, 2,5-norbonadiene, etc.), conjugated diene (eg, butadiene, isoprene, piperylene, etc.), derivative of polymerizable unsaturated carboxylic acid (eg, (meth) acrylic acid alkyl ester), acrylonitrile, aromatic vinyl compound (For example, styrene, α-methylstyrene and the like), vinyl ester (for example, vinyl acetate and the like), vinyl ether (for example, vinyl methyl ether and the like), derivatives of these vinyl compounds and the like are included. The degree of polymerization of the olefin resin, the presence or absence of side chains or branches, the degree of branching, the copolymer composition ratio, etc. are not particularly limited. Preferred olefin-based resins include ethylene-based resins containing ethylene as a main component, such as polyethylene (for example, low-density polyethylene, linear low-density polyethylene,
Ultra low density polyethylene, medium density polyethylene, etc.), ethylene-based copolymers [for example, ethylene and α-C _3-10 olefin (preferably α-C _4-10 olefin), non-conjugated diene, polymerizable unsaturated carvone) A copolymer with an acid derivative and at least one comonomer component selected from a vinyl ester, wherein the ethylene content is about 60 to 90 mol% (preferably 75 to 90 mol%), etc.] Is included. In addition, in polyethylene,
Not only ethylene homopolymer but also ethylene and several mol%
(For example, 0.1 to 10 mol%, preferably 0.1 to 5
Mol%) α-C _3-10 olefin (preferably 1-
It is a copolymer with an α-C _4-10 olefin such as butene, and includes an ethylene-based copolymer commercially available as polyethylene.

More specifically, the olefin resin is
For example, low-density polyethylene such as high-pressure low-density polyethylene, medium-low pressure low-density polyethylene, linear low-density polyethylene, and ultra-low-density polyethylene, polybutene, ethylene-α-olefin copolymer (for example, ethylene-1
-Butene copolymer, etc.), ethylene-vinyl acetate copolymer such as ethylene-vinyl ester copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer (for example, ethylene-ethyl acrylate copolymer) Polymer, etc.) are included. Preferred olefin-based resins include low-density polyethylene (such as high-pressure low-density polyethylene), ultra-low density polyethylene, linear low-density polyethylene, ethylene and α-olefin (for example, 1-butene,
1-hexene, 1-octene, 4-methyl-1-pentene, etc.) are included in the ethylene copolymer.
The density of low-density polyethylene is, for example, 0.90-0.
It is often 935, preferably about 0.90 to 0.925.

The functional group having reactivity with an epoxy group includes not only a functional group having a free active hydrogen atom,
A precursor functional group that produces an active hydrogen atom (for example, an acid anhydride group or a lower alkoxycarbonyl group when the functional group having an active hydrogen atom is a carboxyl group) is also included. Examples of the functional group having reactivity with an epoxy group include a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, a mercapto group, an imino group, an amide group, a urethane bond and a urea bond. Preferred functional groups have a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, a mercapto group, particularly a carboxyl group or an acid anhydride group. Furthermore, an acid anhydride group is preferable in order to further improve the sliding characteristics and the friction and abrasion characteristics.

The olefin resin having a reactive functional group introduced in the polymerization step can be directly used as a component of the composition of the present invention without modification treatment. In addition, by modifying the unmodified olefin resin and introducing a reactive functional group, it can be used as a component of the resin composition of the present invention. The modification treatment of the resin is a method of introducing a reactive functional group by utilizing a polymer reaction (for example, “Chemical reaction of polymer” written by Shin Okawara, Kagaku Dojin, February 20, 1976). Etc.), treatment of the resin with a polymerizable compound having a reactive functional group, or a method such as grafting.

When a reactive functional group is introduced into an olefin resin by copolymerization, treatment or grafting, the polymerizable compound having a carboxyl group is, for example, a fatty acid such as acrylic acid, methacrylic acid, propiolic acid or crotonic acid. Group unsaturated monocarboxylic acids; aromatic unsaturated monocarboxylic acids such as cinnamic acid; aliphatic unsaturated dicarboxylic acids such as maleic acid, fumaric acid, itaconic acid, citraconic acid; monomethyl maleate, monoethyl maleate, maleic acid Examples thereof include maleic acid monoesters such as monobutyl, monohexyl maleate, monooctyl maleate and mono-2-ethylhexyl maleate, and unsaturated dicarboxylic acid monoesters such as fumaric acid monoesters corresponding thereto. Preferred compounds having a carboxyl group include (meth) acrylic acid, maleic acid, and maleic acid monoalkyl ester.

The polymerizable compound having an acid anhydride group includes, for example, maleic anhydride, itaconic anhydride, citraconic anhydride, hymic acid anhydride, nadic acid anhydride, allyl succinic anhydride and the like. Preferred compounds having an acid anhydride group include maleic anhydride.

As the compound having a hydroxyl group,
For example, allyl alcohol, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, butanediol mono (meth) acrylate, hexanediol mono (meth) acrylate, neopentyl glycol mono (meth) acrylate, glycerin mono. (Meth) acrylate, diethylene glycol mono (meth) acrylate, triethylene glycol mono (meth) acrylate, polyethylene glycol mono (meth) acrylate, dipropylene glycol mono (meth) acrylate, tripropylene glycol mono (meth) acrylate, polypropylene glycol mono Examples thereof include (meth) acrylate, polytetramethylene glycol mono (meth) acrylate, and vinylphenol. Preferred polymerizable compounds having a hydroxyl group include hydroxyalkyl (meth) acrylate and the like.

Examples of the compound having an amino group include allyl compounds such as allylamine and diallylamine; vinyl compounds such as 4-vinylaniline and N-vinyldiphenylamine; aminoethyl (meth) acrylate and N-methylaminoethyl (meth). Acrylate, N
-Meth) acrylates such as ethylaminoethyl (meth) acrylate.

The olefin resin having a reactive functional group is obtained by adding a polymerizable compound having a carboxyl group (eg acrylic acid, methacrylic acid,
Polymerizable compounds having reactive functional groups such as itaconic acid), polymerizable compounds having acid anhydride groups (eg maleic anhydride), polymerizable compounds having hydroxyl groups (eg 2-hydroxyethyl methacrylate) It can be obtained by polymerizing a compound by copolymerization, graft polymerization or the like. Further, when the base polymer is a copolymer with a polymerizable compound having an ester group, the olefin resin having a reactive functional group can also be obtained by a hydrolysis reaction. More specifically, as the olefin-based resin having a reactive functional group, for example, a carboxyl group-modified polyolefin (for example, ethylene- (meth) acrylic acid copolymer, ionomer, (meth) acrylic acid-modified polyethylene, etc.), acid Anhydride group-modified polyolefin (eg, maleic anhydride-modified polyethylene), hydroxyl group-containing polyolefin (eg, 2
-Hydroxyethyl methacrylate modified polyethylene,
Ethylene-vinyl alcohol copolymer) and the like. Particularly, an olefin resin modified with a polymerizable compound having a carboxyl group or an acid anhydride group (carboxyl group-modified olefin resin or acid anhydride group-modified olefin resin) is preferable. In particular, an acid anhydride group-modified olefin resin such as an acid anhydride group-modified low density polyethylene is preferable in terms of sliding properties and friction / wear properties.

In the modified olefin resin (C), the introduction amount of the reactive functional group can be selected within a range that does not impair the sliding property and the friction and abrasion property. For example, in terms of the polymerizable compound having the reactive functional group, 0.1-20 parts by weight, preferably 0.2-15, relative to 100 parts by weight of the olefin resin
It is about 0.3 to 10 parts by weight (more preferably 0.5 to 7 parts by weight).

These modified olefin resins (C) can be used alone or in combination of two or more. If necessary, the modified olefin resin (C) can be used in combination with an unmodified olefin resin having no reactive functional group.

The amount of the modified olefin resin (C) used is
Selectable within the range that does not impair sliding characteristics and friction and wear characteristics,
For example, with respect to 100 parts by weight of the unmodified polyacetal (A), 1 to 50 parts by weight, preferably 2 to 40 parts by weight (eg, 3 to 35 parts by weight), more preferably 5 to 35 parts by weight (eg, 5 parts by weight). .About.30 parts by weight). Further, the ratio of the epoxy group-containing polyacetal (B) and the modified olefin resin (C) can be selected within a wide range, and for example,
Component (B) / Component (C) = 1/99 to 99/1 (weight ratio), preferably 2/98 to 97/3 (weight ratio), more preferably 2/98 to 95/5 (weight ratio) ) Is about. The ratio of the components (B) and (C) is often about component (B) / component (C) = 10/90 to 90/10 (weight ratio).

(A) polyacetal and (C)
The ratio of the modified olefin resin and the (B) epoxy group-containing polyacetal is within a range that does not impair the sliding characteristics and the friction and abrasion characteristics, for example, the total amount of the above components (A) and (C) / component (B) = 50 / 50-99.9 / 0.1 (weight ratio), preferably 60 / 40-99.8 / 0.2 (weight ratio), more preferably 70 / 30-99.5 / 0.5 (weight ratio). It is often a degree.

[Epoxy Reaction Accelerator (D)] As the epoxy reaction accelerator (D), a conventional reaction accelerator, for example,
Although amine-based curing agents and organic acid-based curing agents can be used, basic active hydrogen compounds such as dicyandiamide and organic acid dihydrazide, tertiary amines, quaternary amine salts,
In many cases, imidazoles, phosphonium salts and organometallic complexes are used. These reaction accelerators can be used alone or in combination of two or more. Of these reaction accelerators, tertiary amines, quaternary amine salts, imidazoles, phosphonium salts and organometallic complexes are preferably used.

The tertiary amines include, for example, trialkylamines such as triethylamine, tributylamine, trihexylamine and triamylamine, alkanolamines such as triethanolamine and dimethylaminoethanol, aliphatic or non-aliphatic substances such as triethylenediamine. Aromatic cyclic amines, dimethylphenylamine, dimethylbenzylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol, aromatic amines such as dimethylaniline, pyridine, picoline, 1, 8-diazabicyclo (5,4,0)
Included are cycloaliphatic amines such as undecene-1 (DBU), and salts of these tertiary amines with organic or inorganic acids.

Examples of the quaternary amine salt include tetraalkylammonium halides (eg, tetramethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium bromide and other tetra C _1-6 alkylammonium halides), trialkylaralkylammonium halides ( For example, tri C _1-6 alkyl-C such as trimethylbenzylammonium chloride, triethylbenzylammonium chloride and tripropylbenzylammonium chloride.
_7-10 aralkylammonium halide), N-alkylpyridinium halide (for example, N-methylpyridinium chloride, etc.) and the like.

Examples of imidazoles include 2-C _1-18 alkylimidazoles such as 2-methylimidazole, 2-ethylimidazole and 2-isopropylimidazole,
2-Arylimidazole such as 2-phenylimidazole, 2-ethyl-4-methylimidazole, imidazole compound having an alkyl group or an aryl group at the 2-position and / or 4-position such as 4-phenyl-2-methylimidazole, cyaniethyl Imidazole (Curezol C
N, manufactured by Shikoku Kasei Co., Ltd., a compound obtained by triazine conversion of cyaniethylated imidazole (CUREZOL AZINE,
Imidazole compounds such as Shikoku Kasei Co., Ltd., and salts of these imidazole compounds [eg, salts with trimellitic acid or isocyanuric acid (Curezol CNS, Curezol OK, Shikoku Kasei Co., Ltd.) and the like]. .

The phosphonium salt has the formula [R ₄ P] ⁺
A compound represented by X ⁻ (R represents a hydrocarbon group such as an alkyl group, an aryl group, a cycloalkyl group and an aralkyl group, and X represents a halogen atom or an acid group). The halogen atom represented by X is often a bromine atom or an iodine atom. Phosphonium salts include, for example, tetraalkylphosphanium halides (eg, tetramethylphosphonium bromide, tetrabutylphosphonium bromide and other tetra C _1-6 alkylphosphanium halides), tetrabutylphosphonium. Benzotriazalate, tetraarylphosphanium halide (eg, tetraphenylphosphonium bromide, etc.), ethyltriphenylphosphonium bromide, triphenylbenzylphosphonium bromide, etc. are included. Examples of the organometallic complex include organometallic complexes such as tin compounds (eg, dibutyltin dilaurate) and titanium compounds (triisopropoxymethyl titanate).

Among these epoxy reaction promoters, tertiary amines such as dimethylphenylamine, quaternary amine salts such as triethylbenzylammonium chloride, tetrabutylphosphonium bromide, phosphonates such as tetraphenylphosphonium bromide, etc. A tin compound such as a sodium salt or dibutyltin dilaurate is preferably used. The addition amount of the epoxy reaction accelerator (D) is, for example, 0.01 to 2 parts by weight, preferably 0.02-1 to 100 parts by weight of the polyacetal (A).
It is about part by weight, and often about 0.02 to 0.5 part by weight.

The resin composition of the present invention can be produced by various methods, for example, (A) polyacetal, (B) epoxy group-containing polyacetal, (C) modified olefin resin, and (D) epoxy reaction accelerator in the form of powder. The resin composition may be produced by mixing, but the resin composition is often produced by mixing in a molten state or a solution state. When the epoxy group-containing polyacetal (B) is produced by melt mixing as described above, the modified olefin resin (C) is added to the melt mixing system of the polyacetal and the polymerizable compound.
It is also possible to obtain the polyacetal resin composition of the present invention by coexisting the epoxy reaction accelerator (D) with the polyacetal (A) if necessary.

When mixing in a molten state, a conventional mixer or kneader, for example, extruder, Brabender, kneader,
A Banbury mixer or roll mixer can be used. Preferred melt mixing or kneading machines include closed type equipment such as extruders, kneaders and the like. The mixing temperatures overlap in the temperature range from the lower limit (eg, melting point) of the melting temperature of each of the polyacetal (A), the epoxy group-containing polyacetal (B), and the modified olefin resin (C) to the decomposition temperature. Temperature range, for example 100-
It can be appropriately selected from the range of 240 ° C, preferably 130 to 230 ° C, more preferably 160 to 220 ° C.

In the case of mixing in a solution state, the polyacetal (A), the epoxy group-containing polyacetal (B), the modified olefin resin (C) and the epoxy reaction accelerator (D) are dissolved or dispersed in a common solvent. After mixing, the composition can be obtained by, for example, a method of removing the solvent by means such as heating or decompression, a method of injecting the solution or dispersion into a poor solvent for both resins to cause precipitation.

The polyacetal resin composition of the present invention may be compounded with a reinforcing agent, a filler, etc. within a range that does not impair moldability, sliding characteristics, frictional wear characteristics and the like. Examples of the reinforcing agent include organic fibers (eg, polypropylene fibers, vinylon fibers, polyacrylonitrile fibers, polyamide fibers, aramid fibers, polyester fibers, etc.), inorganic fibers (glass fibers, alumina fibers, carbon fibers, metal fibers, etc.), , Whiskers (for example, whiskers of alumina, beryllium oxide, boron carbide, silicon carbide, silicon nitride, etc.) and the like. These reinforcing agents may be used alone or in combination of two or more. Examples of the filler include alumina, silica, kaolin, clay, glass, zinc oxide,
Examples include magnesium oxide, zirconium oxide, titanium oxide, aluminum hydroxide, calcium carbonate, magnesium carbonate, barium sulfate, potassium titanate, molybdenum disulfide, carbon, graphite and metal powder. These fillers may be used alone or in combination of two or more. The amount of the reinforcing agent and the filler used can be selected within a range that does not impair properties such as moldability, and is, for example, 1 to 250 parts by weight, preferably 10 to 100 parts by weight with respect to 100 parts by weight of the polyacetal (A).
It can be selected from a range of about parts by weight.

Further, the polyacetal resin composition may optionally contain additives such as antioxidants, stabilizers such as ultraviolet absorbers, antistatic agents, lubricants, flame retardants and colorants. . The antioxidant may be added to the epoxy group-containing polyacetal as described above. The polyacetal resin composition of the present invention is useful for obtaining various molded products by molding. The molded product can be obtained by a conventional method such as injection molding or extrusion molding. INDUSTRIAL APPLICABILITY The polyacetal resin composition of the present invention has high moldability, and a uniform molded product can be obtained even at a high molding speed. Further, it has a high resistance to friction and wear, and the amount of wear can be reduced including the dynamic friction coefficient and the mating material. Furthermore, sliding noise represented by squeaking noise can be significantly reduced. Therefore, it is useful for obtaining a component (transmission member) that constitutes a mechanical movement mechanism (or a drive mechanism), particularly a sliding member, for example, a molded body such as a gear, a lever, a slider, a bearing, a reel, a guide member, and a cam. Is. Especially audio equipment,
When applied to sliding members in office automation equipment (copiers, laser printers, etc.), it can ensure quietness over a long period of time. Such a member can be obtained by a conventional method such as injection molding.

[0070]

EFFECT OF THE INVENTION The resin composition of the present invention comprises a polyacetal, an epoxy group-containing polyacetal, a modified olefin resin and an epoxy reaction accelerator, and therefore, the polyacetal and the olefin resin have only an affinity and a compatibility. In addition, the friction and wear characteristics can be greatly improved, and the generation of sliding noise represented by squeaking noise can be greatly reduced. Further, it has excellent moldability, and even if the molding speed is high, the surface of the molded product is not peeled off, and a uniform molded product can be obtained. Therefore, the sliding member and the like can be continuously and efficiently molded. According to the method of the present invention, a polyacetal resin composition having the above-mentioned high properties can be efficiently obtained by a simple operation of mixing the above components.

[0071]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited by these examples. [Preparation of Epoxy Group-Containing Polyacetal] Preparation Example 1 (Preparation of Epoxy Group-Containing Polyacetal B-1) (1) Polyacetal [manufactured by Polyplastics Co., Ltd.,
Trade name DURACON M25, polyacetal copolymer,
Melt flow rate 2.5 g / 10 minutes (190 ° C., 2.
16 kg)] 95 parts by weight and (2) polymerizable compound [N
-[4- (2,3-epoxypropoxy) -3,5-dimethylbenzyl] acrylamide (Kanefuchi Chemical Industry Co., Ltd.)
Made, trade name AXE]] 5 parts by weight (polyacetal 100
After dry blending (5.3 parts by weight with respect to parts by weight), the mixture was melt-kneaded with a twin-screw extruder at a temperature of 190 ° C. for about 2 minutes to obtain pellets. The obtained pellets and (3) radical generator [α, α'-bis (t-butylperoxy-m
-Isopropyl) benzene (produced by NOF CORPORATION, trade name Perbutyl P)] 0.1 part by weight (polyacetal 100
(0.11 parts by weight with respect to parts by weight) was dry blended, and then melt-kneaded again at a temperature of 190 ° C. for about 2 minutes by a twin-screw extruder to obtain modified polyacetal pellets.

The modification amount (introduction amount) by the polymerizable compound is
It was 1.9% by weight. The amount of modification was measured as follows. The modified polyacetal was purified by the reprecipitation method in order to remove the (2) polymerizable compound that did not bind to the polyacetal, and the (2) polymerizable compound introduced into the polyacetal was quantified by proton NMR, and The modification amount was expressed as a weight% as a ratio to the polyacetal component. In addition, reprecipitation was carried out by using 150 mg of modified polyacetal and 4 of hexafluoroisopropanol.
The solution with ml is added dropwise to the reprecipitation solvent (acetone),
The precipitated polymer was collected by filtration. This operation 3
The modified polyacetal was purified by repeating the process more than once.

Preparation Example 2 (Preparation of epoxy group-containing polyacetal B-2) (1) 90 parts by weight of polyacetal and (2) polymerizable compound [N- [4- (2,3-epoxypropoxy)-
A modified polyacetal was obtained in the same manner as in Preparation Example 1 except that 10 parts by weight of 3,5-dimethylbenzyl] acrylamide was used. The amount of modification by the polymerizable compound is 3.3% by weight
Met.

Preparation Example 3 (Preparation of epoxy group-containing polyacetal B-3) In Preparation Example 1, 5.3 parts by weight of the polymerizable compound [glycidyl methacrylate (Tokyo Chemical Industry Co., Ltd.)] was added to 100 parts by weight of the polyacetal. Preparation Example 1 other than using
A modified polyacetal was obtained in the same manner as in. The amount of modification with the polymerizable compound was 1.5% by weight. In purification by reprecipitation, chloroform was used as a solvent for reprecipitation.

[Modified Olefin Resin (C)] As the modified olefin resin (C), acid anhydride-modified polyethylenes C-1 to C-5, C'-1 and unmodified polyethylene C'-2 shown in Table 1 are shown. ~ C'-3 was used. In Table 1, the amount of modification with maleic anhydride shows the weight ratio with respect to 100 parts by weight of the base polymer (polyethylene) having a specific melting point.

[0076]

[Table 1] Examples 1 to 13 and Comparative Examples 1 to 22 With respect to 100 parts by weight of polyacetal (manufactured by Polyplastics Co., Ltd., DURACON M90), the epoxy group-containing polyacetals B-1 to B-3 obtained in the above preparation example were added. ,
Maleic anhydride modified polyethylene C-1 to C-5, C '
-1, and unmodified polyethylene C'-2 to C'-3,
After dry-blending with tetra-n-butylphosphonium bromide (D-1) or dibutyltin laurate (D-2) as an epoxy reaction accelerator at a ratio shown in Table 1 and Table 2, a screw outer diameter of 30 mm was measured. It was melt-kneaded at a screw rotation speed of 100 rpm and a temperature of 190 ° C. by a twin-screw extruder to be pelletized. 2 this pellet at 80 ℃
After drying for more than an hour, a test piece was prepared by molding with an injection molding machine. Then, the moldability, sliding characteristics, and squeaking noise were evaluated as follows.

[Surface condition of molded product] Test piece (50 mm x
(50 mm × thickness 1 mm: φ0.3 mm center pin gate) was molded by changing the injection speed, and the surface peeling of the molded product and the condition of jetting marks around the gate were evaluated according to the following 5 grades. 1: Remarkable peeling at the gate part (defective) 2: Whitening-like peeling at the gate part 3: No peeling, but large jetting mark on the gate part 4: No peeling, but jetting on the gate part There is a marking 5: No peeling and jetting (good) [Sliding characteristics] Using a Suzuki type friction and wear tester, under constant load (1N), linear velocity 5 cm / sec, running condition for 16 hours,
The dynamic friction coefficient and wear amount of a cylindrical test piece made of polyacetal (manufactured by Polyplastics Co., Ltd., trade name DURACON M90-44) as a mating material and a Suzuki type cylindrical test piece made of the test material were measured.

[Squeak] Using a Suzuki type friction and wear tester,
The surface pressure was sequentially increased by 1 Pa every 30 seconds, and the minimum surface pressure at which a squeaking noise was generated was measured (linear velocity 1.0 cm / s).
Therefore, the larger the surface pressure value is, the less the squeaking noise is generated.

The results are shown in Tables 2-4.

[0080]

[Table 2]

[0081]

[Table 3]

[0082]

[Table 4] As is clear from Tables 2 to 4, the resin compositions of the Examples have higher moldability, a smaller dynamic friction coefficient, and a smaller degree of wear than the resin compositions of the Comparative Examples, regardless of the injection speed. Not only that, the generation of squeaking noise can be significantly reduced.

Preparation Example 4 (Preparation of Polyacetal B-4 Containing Epoxy Group) 3.3 wt% of 1,3-dioxolane, 0.8 wt% of allyl glycidyl ether and trioxane containing 100 ppm of methylal were added to trifluoride. Boron bromide is added to trioxane at 60 ppm to perform cationic polymerization,
A polymerizable polyacetal was prepared. A modified polyacetal was obtained in the same manner as in Preparation Example 1 except that the polymerizable polyacetal was used instead of the polyacetal in Preparation Example 1. The amount of modification with the polymerizable compound was 3.1% by weight.

Example 14 A test piece was prepared in the same manner as in Example 2 except that the epoxy group-containing polyacetal B-4 obtained in Preparation Example 4 was used instead of the epoxy group-containing polyacetal used in Example 2. . When the moldability, sliding characteristics, and squeaking noise of the test piece were evaluated in the same manner as above, the same results as in Example 2 were obtained, as shown in Table 2.

Claims (15)

[Claims] 1. A polyacetal (A), a polyacetal having an epoxy group (B), and a melting point of 60 to 125 (C).
A polyacetal resin composition containing a modified olefin resin having a functional group that is at a temperature of 0 ° C. and has a functional group reactive with an epoxy group, and (D) an epoxy reaction accelerator. 2. The epoxy group-containing polyacetal (B) is an epoxy group-containing polyacetal in which a residue of a polymerizable compound having an ethylenic double bond and an epoxy group in a molecule is introduced into a polyacetal component. The polyacetal resin composition according to 1. 3. The epoxy group-containing polyacetal (B) is an epoxy group-containing polyacetal in which 0.1 to 30% by weight of the residue of the polymerizable compound having an epoxy group is introduced into the polyacetal component. The polyacetal resin composition according to 1. 4. The polymerizable compound having an epoxy group is 1
The polyacetal resin composition according to claim 2, which is a compound having one ethylenic double bond in the molecule and having a boiling point of 70 ° C or higher at normal pressure. 5. The polymerizable compound having an epoxy group is represented by the formula (I): (In the formula, R ¹ is a hydrogen atom or methyl groups R ^{2 to} R ⁵ are the same or different and each represents a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an acyl group or an acyloxy group. N is 0 or 3. The polyacetal resin composition according to claim 2, which is a compound represented by 1. 6. A polyacetal (B) having an epoxy group has one ethylenically unsaturated bond and an epoxy group in the molecule, and a residue of a polymerizable compound having a boiling point of 120 ° C. or higher is contained in the polyacetal component. The polyacetal resin composition according to claim 1 or 2, which is an epoxy group-containing polyacetal introduced in an amount of 0.3 to 20% by weight. 7. The polyacetal resin composition according to claim 1, wherein the modified olefin resin (C) is an olefin resin having a carboxyl group or an acid anhydride group. 8. The (C) modified olefin resin is 0.1 parts by weight of maleic anhydride with respect to 100 parts by weight of the olefin resin.
The polyacetal resin composition according to claim 1, which is an olefin resin modified with 20 to 20 parts by weight. 9. The polyacetal resin composition according to claim 7, wherein the olefin resin is a homo- or copolymer of an α-olefin having 2 to 14 carbon atoms. 10. The polyacetal resin composition according to claim 7, wherein the olefin resin is at least one selected from low-density polyethylene, ultra-low-density polyethylene, and linear low-density polyethylene. 11. The epoxy reaction accelerator (D) is at least one compound selected from the group consisting of tertiary amines, quaternary amine salts, imidazoles, phosphonium salts and organometallic complexes. The polyacetal resin composition described. 12. 1 to 100 parts by weight of (A) polyacetal, (B) 1 to 1 of polyacetal having an epoxy group.
2. 100 parts by weight, (C) 1 to 50 parts by weight of a modified olefin resin having a functional group reactive with an epoxy group, and (D) 0.01 to 2 parts by weight of an epoxy reaction accelerator. Polyacetal resin composition of. 13. The ratio of (B) a polyacetal having an epoxy group to (C) a modified olefin resin having a functional group reactive with an epoxy group is the same as that of the component (B) /
The polyacetal resin composition according to claim 1, wherein the component (C) is 1/99 to 99/1 (weight ratio). 14. A polyacetal (A), a polyacetal having an epoxy group (B), and a melting point of 60 to 12 (C).
A method for producing a polyacetal resin composition, which comprises: a modified olefin resin having a functional group that is 5 ° C. and is reactive with an epoxy group; and (D) an epoxy reaction accelerator. 15. A sliding member comprising a molded product of the polyacetal resin composition according to claim 1.