JPH088296A - Semiconductor package - Google Patents

Abstract

(57) [Summary] [Purpose] Ensure the inspection of the electrical characteristics of semiconductor elements,
A semiconductor package capable of reducing the mounting area on a substrate or the like is provided. [Structure] The semiconductor package 40 includes the semiconductor element 1 and
The lead 2 has a film carrier 30 formed on the film substrate 3, and the semiconductor element 1 and the inner lead 2b are electrically connected to each other via the metal sphere 20 '.
The metal ball 20 is electrically connected to the surface of the inner lead 2b opposite to the surface of the inner lead 2b connected to 0 ', and mainly the circuit surface of the semiconductor element 1, a part of the lead 2 and the metal ball 20. The metal sphere 20 'and the metal sphere 20' are sealed with the resin 4, and the metal sphere 20 is always exposed from the resin 4. After inspecting the electrical characteristics using the test pad on the film carrier 30, the extra tape portion can be cut and connected to the substrate using the metal balls 20, so that not only the mounting area can be reduced but also
Only fully qualified packages can be used.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a TAB (Tape Automat).
ed Bonding) semiconductor package.

[0002]

2. Description of the Related Art Conventionally, when mounting a semiconductor device on a substrate, as shown in FIG. 7, the semiconductor device 1 is electrically connected through a metal piece or a metal ball 20b so that the substrate 9 can be electrically connected.
The circuit surface of the semiconductor element 1, the metal piece or the metal ball 20b, and the terminal of the substrate 90 are sealed with the resin 4 by directly mounting the semiconductor chip on the semiconductor chip 1.

FIG. 8 shows a case in which a semiconductor package using the conventional TAB method is mounted on a substrate. In the conventional semiconductor package 100, the bump 10 is formed on the film substrate on which the lead pattern is formed, that is, the TAB tape 103.
The semiconductor element 1 is connected via 1 and is resin-sealed by a mold (not shown), and the outer lead 20 of the lead 200 is connected.
The part 1 is formed in a gull wing shape. Then, the outer lead 20 of the semiconductor package 100.
The end of No. 1 was mounted on the substrate 90 using the solder 102 or the like.

[0004]

By the way, as shown in FIG. 7, when the semiconductor element 1 is mounted on the substrate 90, the semiconductor element 1 is directly mounted on the substrate 90 via a metal piece or a metal ball 20b. However, the electrical characteristics of the semiconductor element 1 cannot be reliably inspected, and a defective product may be mounted on the substrate 90, resulting in poor yield.

Further, as shown in FIG. 8, the conventional semiconductor package 100 has a problem in that the package size increases with the increase in the number of pins, which increases the mounting area on the substrate 90. Further, there is a problem that the thickness of the lead 200 becomes thin due to the increase in the number of pins and the pitch becomes narrower, the lead 200 is deformed due to insufficient strength, and a connection failure occurs in mounting on the substrate 90 or the like.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor package capable of reliably inspecting the electrical characteristics of a semiconductor element and reducing the mounting area on a substrate or the like. And

[0007]

In order to solve the above-mentioned problems, the present invention forms a conductor lead electrically connected to a semiconductor element on an insulating film base material, and the conductor lead is tested for electrical characteristics. In a semiconductor package in which the semiconductor element is connected to the inner lead of the conductor lead, which has a test pad portion, the surface opposite to the surface of the inner lead connecting the semiconductor element and the inner lead. A conductive member is provided.

Further, at least the circuit surface of the semiconductor element, the inner lead and a part of the conductive member are resin-sealed, and a part of the conductive member is exposed to the outside of the resin. .

Further, it is preferable that the semiconductor element and the inner lead are connected via a bump, the bump is a metal member made of metal, and the metal member is a metal ball.

The conductive member is preferably a metal member made of metal, and the metal member is preferably a metal ball.

[0011]

According to the present invention, with the above structure, the electrical characteristics of the semiconductor element can be reliably inspected using the test pad portion of the lead. In addition, a conductive member such as a metal ball for extracting an electric signal from the semiconductor element to the outside,
Since the connection is made to the surface of the inner lead opposite to the surface connected to the terminal of the semiconductor element, the connection to the substrate or the like can be made without using the outer lead, and the mounting area on the substrate or the like can be reduced.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor package which is a first embodiment of the present invention will be described with reference to FIGS. 1 is a cross-sectional view of a semiconductor package according to a first embodiment of the present invention, and FIG. 2 is a plan view showing the top and back surfaces of the semiconductor package of FIG. 1 at the same time.

As shown in FIG. 1, a semiconductor package 40
Then, the semiconductor element 1 and the film carrier 30 having the film base material 3 in which the leads 2 are patterned are provided, and the semiconductor element 1 and the inner lead 2b of the film carrier 30 are electrically connected via the metal sphere 20 '. It is connected to the. The metal ball 20 is electrically connected to the surface of the inner lead 2b opposite to the surface of the inner lead 2b connected to the metal ball 20 '. Mainly the circuit surface of the semiconductor element 1, a part of the lead 2, the metal sphere 20 and the metal sphere 20 ′ are sealed with a resin 4 by a potting method or the like. It is preferable to use gold for the metal balls 20 and 20 '. Further, as shown in FIG. 2, the leads 2 formed on the film base material 3 in the film carrier 30 have test pads 2a formed at the respective tips.

In this embodiment, the metal sphere 20 is connected to the surface of the inner lead 2b opposite to the surface where the metal sphere 20 'and the inner lead 2b are connected. 20 'may be electrically connected via the inner lead 2b. Further, as shown in the upper surface of FIG. 2, the metal sphere 20 is resin-sealed so as to be exposed from the resin 4 without fail. Further, as shown on the back surface of FIG. 2, the bottom surface of the semiconductor element 1 may be exposed without being resin-sealed.

FIG. 3 shows a method of manufacturing a semiconductor package according to the first embodiment of the present invention.

First, as shown in FIG. 3A, the metal balls 20 'arranged on the array plate 60 so as to match the positions of the electrode portions (not shown) of the semiconductor element 1 are used as electrodes of the semiconductor element 1. Connect to the department. The array plate 60 may fix the metal balls 20 'by vacuum suction. Here, the array plate 6
In No. 0, holes for vacuum suction are provided at positions on the surface of the array plate 60 where the metal balls 20 'are arranged in order to arrange and fix the metal balls 20' at desired positions.

Next, as shown in FIG. 3B, the inner lead 2b of the lead 2 formed on the film carrier 30 and the metal ball 20 'are pressure-bonded by thermocompression or the like using the bonding tool 50.

Then, as shown in FIG. 3C, the metal balls 20 are arranged at desired positions by using the arrangement plate 60, and the inner surface of the metal balls 20 'opposite to the surface connected to the inner leads 2b is arranged. The metal ball 20 is connected to the surface of the lead 2b.
The metal ball 20 may be connected to the lead 2 so as to face the metal ball 20 '.

Next, as shown in FIG. 3D, the semiconductor element 1, a part of the lead 2, the metal sphere 20, and the metal sphere 2 are exposed by a potting method or the like so that the metal sphere 20 is exposed to the outside.
0 ′ is sealed with resin 4.

FIG. 4 shows a method of mounting the semiconductor package on the substrate according to the first embodiment of the present invention.

Test pad 2 on film carrier 30
After the electrical characteristics are inspected using a, the package 40 which is recognized as a non-defective product has a punch 70 in the film carrier 30 of the package 40 as shown in FIG. As shown, the excess tape is cut and molded into a size to be mounted on the substrate. And FIG.
As shown in (C), the metal sphere 2 exposed from the resin 4
0 and the solder 80 provided on the substrate 90 are bonded, and the package 40 is mounted on the substrate 90.

According to the present embodiment configured as described above, after the electrical characteristics are inspected using the test pad 2a on the film carrier 30 of the package 40, the excess tape portion is cut and the metal ball 20 is removed. Since it can be connected to the substrate 90 by using it, not only the mounting area can be reduced, but also a completely good package can be used.

Next, a semiconductor package which is a second embodiment of the present invention will be described with reference to FIG.

This embodiment is different from the above-mentioned first embodiment in that the semiconductor package 40 is mounted on the substrate 90 as shown in FIG.
As shown in FIG. 5B, the resin 4 is used for sealing. Since other configurations are the same as those in the first embodiment,
Components having the same functions as those in the first embodiment are designated by the same or corresponding reference numerals, and detailed description thereof will be omitted.

According to the present embodiment constructed as described above, after the metal ball 20 is pressure-bonded to the surface of the inner lead 2b opposite to the surface where the metal ball 20 'is connected to the inner lead 2b, the electrical characteristics To inspect. After the inspection, only the non-defective package 40 is mounted on the substrate 90 using the solder 80 provided in advance, and then the circuit surface of the semiconductor element 1, a part of the leads 2, the metal balls 20, and the metal balls 2 are formed by the potting method or the like.
Since 0'is sealed with the resin 4, the resin sealing step for exposing the metal sphere 20 is not required, and the mounting on the substrate 90 can be facilitated. The metal ball 20 and the metal ball 20 'may be connected to the inner lead 2b so as to face the inner lead 2b.

Next, a semiconductor package which is a third embodiment of the present invention will be described with reference to FIG.

This embodiment is different from the first embodiment described above in that there is no metal ball 20 'for connecting the electrode of the semiconductor element 1 and the inner lead 2b, and the semiconductor element 1 and the inner lead 2b are directly connected. It is that. Since other configurations are similar to those of the first embodiment, those having the same functions as those of the first embodiment are designated by the same or corresponding reference numerals, and detailed description thereof will be omitted.

According to the present embodiment configured as described above, after the electrical characteristics are inspected by using the test pad 2a on the film carrier 30 of the package 40, the excess tape portion is cut and the metal ball 20 is removed. Since it can be connected to the substrate 90 by using it, not only the mounting area can be reduced, but also a completely good package can be used. Further, the step of connecting the metal sphere 20 'to the electrode portion of the semiconductor element 1 is not necessary.

The present invention is not limited to the above embodiments, but various modifications can be made within the scope of the invention. For example, in each of the above-described embodiments, the metal ball is used to connect the inner lead and the external terminal, but the invention is not limited to this, and a metal member such as a metal piece or a conductive member other than metal may be used. Further, the metal ball used for connecting the semiconductor element and the inner lead may be another metal member or a bump.

[0030]

As described above, according to the present invention,
The test pad is used when inspecting the electrical characteristics by providing the semiconductor package with a conductive member, such as a metal ball, that electrically connects to the outside, on the inner lead that is connected to the terminals of the semiconductor element. In addition, a reliable electrical characteristic inspection can be performed, and the yield is improved. In addition, since a conductive member such as a metal ball is used when mounting on a substrate or the like, it is not necessary to use external leads, and the mounting area on the substrate or the like can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a semiconductor package that is a first embodiment of the present invention.

FIG. 2 is a plan view of a semiconductor package that is a first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing the method of manufacturing the semiconductor package.

FIG. 4 is a cross-sectional view showing a method of mounting the semiconductor package on a substrate.

FIG. 5 is a sectional view of a semiconductor package that is a second embodiment of the present invention.

FIG. 6 is a sectional view of a semiconductor package according to a third embodiment of the present invention.

FIG. 7 is a sectional view showing an example in which a conventional semiconductor element is directly mounted on a substrate.

FIG. 8 is a sectional view showing an example in which a conventional semiconductor package is mounted on a substrate.

[Explanation of symbols]

 1 Semiconductor Element 2 Lead 2a Test Pad 2b Inner Lead 3 Film Base Material 4 Resin 20 Metal Ball 20 'Metal Ball 30 Film Carrier 40 Semiconductor Package 50 Bonding Tool 60 Metal Ball Arrangement Board 70 Cut Punch 80 Solder 90 Substrate

Claims (7)

[Claims] 1. A conductor lead, which is electrically connected to a semiconductor element, is formed on an insulating film substrate, and the conductor lead has a test pad portion for inspecting electrical characteristics. A semiconductor package to which the semiconductor element is connected, wherein a conductive member is provided on a surface opposite to a surface of the inner lead connecting the semiconductor element and the inner lead. 2. At least a circuit surface of the semiconductor element, the inner lead, and a part of the conductive member are resin-sealed, and a part of the conductive member is exposed to the outside of the resin. The semiconductor package according to claim 1. 3. The semiconductor package according to claim 1, wherein the semiconductor element and the inner lead are connected via a bump. 4. The semiconductor package according to claim 3, wherein the bump is a metal member made of metal. 5. The semiconductor package according to claim 4, wherein the metal member is a metal sphere. 6. The semiconductor package according to claim 1, wherein the conductive member is a metal member made of metal. 7. The semiconductor package according to claim 6, wherein the metal member is a metal sphere.