JPH086058A - Liquid crystal display - Google Patents

Abstract

PURPOSE:To make it possible to reduce the size of the above device and to simplify the structure of a flexible wiring board. CONSTITUTION:Four pieces of wirings for connecting power source input sides 37 connect power source input side connecting electrodes 34c, 34b corresponding to each other of a semiconductor chip mounted at a semiconductor chip mounting area 8 on the left side and a semiconductor chip mounted at a semiconductor chip mounting area 9 of a right side to each other and connect two sets of the power source input side connecting electrodes 34b, 34c corresponding to each other of the semiconductor chip mounted at the semiconductor chip mounting area 9 of the right side to each other. The wirings described above are formed continuously across the respective semiconductor chip mounting areas 8, 9. The respective right ends are integrally arranged at the right end of the projecting part of the transparent substrate 7 on the lower side. Then, the size is made smaller than in the case of conducting and connecting the flexible wiring board having the wirings for connection on both surfaces to the plural semiconductor chips; in addition, the structure of the flexible wiring board is simplified.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device.

[0002]

2. Description of the Related Art FIG. 4 (A) shows an example of a conventional liquid crystal display device, and FIG. 4 (B) shows its wiring structure. This liquid crystal display device includes a liquid crystal display panel 1, three semiconductor chips 2 to 4, a flexible wiring board 5, a control circuit circuit board (not shown), and the like. Of these, the liquid crystal display panel 1 is composed of two transparent substrates 6, 7 each having a display electrode (not shown) provided on opposite surfaces thereof, and a liquid crystal (not shown) sealed between the two transparent substrates 6, 7.
The lower and right sides of the lower transparent substrate 7 are the upper transparent substrate 6
Are projected from the corresponding lower and right sides, respectively. Two semiconductor chip mounting areas 8 and 9 shown by chain lines are provided on the upper surface of the lower side protruding portion of the lower transparent substrate 7, and a plurality of output lines are provided at the respective upper ends of the semiconductor chip mounting areas 8 and 9. Side connection wirings 10 and 11 are provided, and a plurality of input side connection wirings 12 and 13 are provided at the lower ends of the semiconductor chip mounting areas 8 and 9, respectively. One end of each of the output side connecting wirings 10 and 11 is connected to the drive element of the lower display electrode, and the other end thereof is projected into the semiconductor chip mounting areas 8 and 9. Input side connection wiring 1
One end of each of 2 and 13 is projected into the semiconductor chip mounting areas 8 and 9, and the other end of each is located at the lower end of the lower transparent substrate 7. Further, one semiconductor chip mounting area 14 shown by a chain line is provided on the upper surface of the right side protruding portion of the lower transparent substrate 7, and a plurality of output side connecting wirings are provided at the left end portion of the semiconductor chip mounting area 14. 15 is provided, a plurality of input side connection wirings 16 are provided at the right end of the semiconductor chip mounting area 14, and one common electrode side connection wiring 17 is provided at a predetermined position. Output side connection wiring 1
Each one end of 5 is connected to the driving element of the lower display electrode,
Each other end is projected into the semiconductor chip mounting area 14. Each one end of the input side connection wiring 16 is projected into the semiconductor chip mounting area 14, and each other end is arranged at the right end of the lower transparent substrate 7. One end of the common electrode side connection wiring 17 is connected to the upper display electrode via the cross member 18, and the other end is arranged at the right end of the lower transparent substrate 7.

On the lower surfaces of the semiconductor chips 2 to 4, a plurality of output side connecting electrodes (bump electrodes) 19 are provided just inside the upper side and a plurality of input side connecting electrodes are provided just inside the lower side, as shown in FIG. Electrodes (bump electrodes) 20 are provided. Of these, the predetermined two semiconductor chips 2 and 3 are mounted in the respective semiconductor chip mounting areas 8 and 9 on the upper surface of the lower side protruding portion of the lower transparent substrate 7. In this case, each input side connection electrode 20 and each output side connection electrode 19
Are conductively connected to the respective input side connecting wirings 12 and 13 and the respective output side connecting wirings 10 and 11 in the respective semiconductor chip mounting areas 8 and 9 through an anisotropic conductive adhesive or the like. Similarly, the remaining one semiconductor chip 4 is mounted on the semiconductor chip mounting area 14 on the upper surface of the protrusion on the right side of the lower transparent substrate 7.

The flexible wiring board 5 is substantially L-shaped, and each input side connection wiring 1 provided on the lower surface of the lower transparent substrate 7 on the lower surface of one end 5a thereof is provided on the upper surface of the projecting portion.
Two sets of connection wirings 21 and 22 corresponding to Nos. 2 and 13 are provided, and an input side connection wiring provided on the upper surface of the right side protrusion of the lower transparent substrate 7 on the lower surface of the other end side 5b. 16
And the connection wirings 23 and 24 corresponding to the common electrode side connection wiring 17 are provided. In this case, on one end side 5a of the flexible wiring board 5, the connecting wiring 21 is double-sided via a group of through-hole conducting portions 25, and is connected via another group of through-hole conducting portions 26.
The pair of connecting wires 21 and 22 are conductively connected as a common wire. Then, one end side 5 of the flexible wiring board 5
The connection wirings 21 and 22 of a and the connection wirings 23 and 24 of the other end side 5b corresponding to the connection wirings 12 and 13 and the connection wirings through a connection member such as an anisotropic conductive adhesive. Flexible wiring board 5 that is conductively connected to 16 and 17
Is conductively connected to a predetermined portion of the control circuit circuit board.

[0005]

However, in such a conventional liquid crystal display device, the substantially L-shaped flexible wiring substrate 5 having the connection wirings 21 to 24 is used to form the semiconductor chips 2 to 2 of the liquid crystal display panel 1. Since they are electrically conductively connected to each of the wirings 4, there is a problem that the area occupied by the flexible wiring board 5 becomes large and the size becomes large. Further, since the connection wirings 21 and 22 for the two semiconductor chips 2 and 3 are conductively connected as a common wiring, the flexible wiring board 5 has a double-sided wiring structure via the through-hole conducting portions 25 and 26, and therefore flexible wiring. There is a problem that the structure of the substrate 5 is complicated and the cost is high. This is because as the number of semiconductor chips 2 and 3 increases,
It is remarkable. An object of the present invention is to provide a liquid crystal display device which can be downsized and which can simplify the structure of a flexible wiring board.

[0006]

According to the first aspect of the present invention,
At least one substrate of the two substrates facing each other is projected from at least one side of the other substrate to form a protrusion, and a plurality of semiconductor chips are mounted on one surface of the protrusion along one side of the other substrate. In a liquid crystal display device in which an area is provided and a plurality of semiconductor chips are mounted in each of the semiconductor chip mounting areas, the plurality of semiconductors mounted on one surface of the protrusion along one side of the other substrate A plurality of non-intersecting connection wirings for conductively connecting corresponding input side connection electrodes of the chip are continuously provided over the respective semiconductor chip mounting areas, and one end of each of the connection wirings is provided on one surface of the projecting portion. It is arranged in one place. The invention according to claim 2 is
The plurality of connecting wirings pass through the plurality of semiconductor chip mounting areas. According to a third aspect of the present invention, the semiconductor chip has two sets of input side connection electrodes corresponding to each other, and the two sets of input side connection electrodes are conductively connected to corresponding connection wirings. According to a fourth aspect of the present invention, two semiconductor chips corresponding to each other are provided.
The input side connection electrodes of the set are connected inside the chip.

[0007]

According to the first aspect of the invention, a plurality of connecting wirings which do not intersect each other for conductively connecting the corresponding input side connecting electrodes of the plurality of semiconductor chips mounted in each semiconductor chip mounting area are provided. The flexible wiring board having the connection wirings on both sides is provided in a plurality of semiconductor chips because the connection wirings are continuously provided over the semiconductor chip mounting area and one end of each of the connection wirings is collectively arranged on one surface of the protruding portion. The size of the flexible wiring board can be reduced and the structure of the flexible wiring board can be simplified as compared with the case of conductive connection. According to the second aspect of the present invention, since the plurality of connecting wirings pass through the plurality of semiconductor chip mounting areas, the width of the protruding portion can be narrowed correspondingly, and as a result, the size can be reduced. . According to the inventions of claims 3 and 4, the semiconductor chip has two sets of input-side connection electrodes corresponding to each other, and the two sets of input-side connection electrodes are conductively connected to the corresponding connection wirings, respectively, and the semiconductor Since the two sets of input side connection electrodes corresponding to each other of the chip are connected inside the chip, the connection of the semiconductor chip and the connection wiring are arranged in parallel between the two sets of input side connection electrodes corresponding to each other of the semiconductor chip, As a result, the wiring resistance of the connection wiring can be reduced.

[0008]

FIG. 1 shows an embodiment of the liquid crystal display device according to the present invention, and FIGS. 2A and 2B show the wiring structure thereof. In these figures, parts having the same names as those in FIGS. 4A and 4B are designated by the same reference numerals, and the description thereof will be appropriately omitted. The semiconductor chip mounting areas 8 and 9 are provided on the upper surface of the protruding portion on the lower side of the transparent substrate 7 on the lower side of the liquid crystal display device as in the conventional case.
In the semiconductor chip mounting areas 8 and 9, semiconductor chips 31 and 32 are mounted instead of the conventional semiconductor chips 2 and 3. The bottom surface of the semiconductor chips 31 and 32 is shown in FIG.
As shown in (A), a plurality of output side connecting electrodes 33 are provided immediately inside the upper side, four signal input side connecting electrodes 34a are provided immediately inside the right side, and four output side connecting electrodes 34a are provided immediately inside the lower side. Two power supply input side connection electrodes 34b and 34c are provided, respectively. In this case, the power source input side connecting electrode 34b on the left side and the power source input side connecting electrode 3 on the right side corresponding to each other
4c is connected inside the chip. Further, the semiconductor chip mounting area 14 is provided on the upper surface of the right side protruding portion of the lower transparent substrate 7 as in the conventional case. In the semiconductor chip mounting area 14, a semiconductor chip 35 is mounted instead of the conventional semiconductor chip 4. On the lower surface of the semiconductor chip 35, as shown in FIG. 3B, a plurality of output side connection electrodes 33 are provided immediately inside the upper side, and four signal input side connection electrodes 34a are provided immediately inside the left side. Therefore, four power supply input side connection electrodes 34b and 34c are provided at two positions just inside the lower side. In this case as well, the power supply input side connection electrode 34b on the left side and the power supply input side connection electrode 34c on the right side corresponding to each other are connected inside the chip.

On the upper surface of the projecting portion on the lower side of the lower transparent substrate 7, instead of the conventional input side connecting wirings 12 and 13, four signal input side connecting wirings 36 and 4 which do not intersect each other are provided. A power supply input side connection wiring 37 is provided. Four
The signal input side connection wiring 36 of the book includes a semiconductor chip 31 mounted on the left semiconductor chip mounting area 8 and a semiconductor chip 32 mounted on the right semiconductor chip mounting area 9.
Signal input side connection electrodes 34a, 34a corresponding to
Connected to each other, both semiconductor chip mounting area 8,
9 are continuously provided, and the respective right ends thereof are collectively arranged at the right ends of the protruding portions of the lower transparent substrate 7. Four
The power supply input side connection wiring 37 of the book includes a semiconductor chip 31 mounted in the semiconductor chip mounting area 8 on the left side and a semiconductor chip 32 mounted in the semiconductor chip mounting area 9 on the right side.
And power supply input side connection electrodes 34c, 34b corresponding to
The semiconductor chips 32 mounted on the right side semiconductor chip mounting area 9 are connected to each other, and the power supply input side connecting electrodes 34b and 34c corresponding to each other are connected to each other, and the semiconductor chip mounting areas 8 and 9 are continuously connected. The right end portions are collectively arranged at the right end portions of the protruding portions of the lower transparent substrate 7. Further, on the upper surface of the right side protruding portion of the lower transparent substrate 7, instead of the conventional input side connecting wiring 16, four signal input side connecting wirings 38 and four power input side which do not intersect each other are provided. Connection wiring 39 is provided. Each of the four signal input side connecting wirings 38 has its upper end connected to the signal input side connecting electrode 34a of the semiconductor chip 35 mounted in the semiconductor chip mounting area 14, and each lower end of the lower transparent substrate 7. They are collectively arranged at the right end of the protrusion. Each of the four power supply input side connection wirings 39 has its upper end portion connected to the power supply input side connection electrode 34 of the semiconductor chip 35 mounted in the semiconductor chip mounting area 14.
The lower ends of the transparent substrates 7 are connected together to the right end of the protruding portion of the lower transparent substrate 7. 2A and 2B, the connection electrodes 33, 34a to 34c of the semiconductor chips 31, 32, 35 are shown by black circles.

Then, two predetermined semiconductor chips 31,
32 is mounted on each of the two semiconductor chip mounting areas 8 and 9 provided on the projecting portion on the lower side of the lower transparent substrate 7. In this case, the signal input side connecting electrodes 34a of the semiconductor chips 31 and 32 are connected to the corresponding signal input side connecting wirings 36 of the semiconductor chip mounting areas 8 and 9 via a connecting member such as an anisotropic conductive adhesive. Each of the power source input side connecting electrodes 34b and 34c is electrically conductively connected to the corresponding power source input side connecting wiring 37 of the semiconductor chip mounting areas 8 and 9 through a connecting member such as an anisotropic conductive adhesive. Each of the output side connection electrodes 33 is connected to the corresponding output side connection wirings 10 and 11 of the semiconductor chip mounting areas 8 and 9 through a connection member such as an anisotropic conductive adhesive as in the conventional case. Conductive connection. Further, the remaining one semiconductor chip 4 is similarly mounted in the predetermined one semiconductor chip mounting area 14.

As described above, in this liquid crystal display device, the input side connection electrodes 34a to 34 corresponding to the semiconductor chips 31 and 32 mounted in the semiconductor chip mounting areas 8 and 9 are provided.
A plurality of non-intersecting connecting wirings 36 and 37 for conductively connecting c to each other are continuously provided over the respective semiconductor chip mounting areas 8 and 9, and one end of each of the connecting wirings 36 and 37 is provided on the lower transparent substrate 7 Since they are collectively arranged on the right end of one surface of the projecting portion, the flexible wiring board 5 having the connection wirings 21 on both surfaces of the related art as shown in FIG. 4 is conductively connected to the plurality of semiconductor chips 2 and 3. In comparison, the size can be reduced and the structure of the flexible wiring board 5 can be simplified. Further, since the plurality of signal input side connection wirings 36 pass through the inside of the semiconductor chip mounting area 9 on the right side, the width of the lower side protruding portion of the transparent substrate 7 on the lower side can be narrowed by that amount. It can be miniaturized. Further, since the two sets of power supply input side connection electrodes 34b and 34c corresponding to each other of the semiconductor chips 31 and 32 are conductively connected to the corresponding power supply input side connection wirings 37, the power supply input side connection electrodes 34b and 34c are not connected to each other. Even if assembled, conductive connection can be made without increasing the number of wires.
Further, since two sets of power supply input side connection electrodes 34b, 34c of the semiconductor chips 31, 32 corresponding to each other are connected inside the chip, two sets of power supply input side connection electrodes 34b of the semiconductor chips 31, 32 corresponding to each other are connected. , 34c, the wiring of the semiconductor chip 32 and the power input side connecting wiring 37 are arranged in parallel, and as a result, the semiconductor chip 31 mounted on the semiconductor chip mounting area 8 on the left side far from the flexible wiring board 5 is Wiring resistance can be reduced, and both power supply input side connection electrodes 34 of the semiconductor chip 31 mounted in the semiconductor chip mounting area 8 on the left side can be reduced.
It is possible to omit the power supply input side connection wiring 37 that connects between b and 34c.

In the above embodiment, the lower transparent substrate 7
Two semiconductor chips 31 and 3 are provided on the upper surface of the protrusion on the lower side.
2 has been mounted and the corresponding input side connection electrodes 34a to 34c of these two semiconductor chips 31 and 32 are conductively connected via the input side connection wirings 36 and 37, but the present invention is not limited to this. For example, three semiconductor chips 31 and 32 are mounted on the upper surface of the lower side protruding portion of the lower transparent substrate 7, and the input side connection electrodes 34a corresponding to the three semiconductor chips 31 and 32, respectively. 34c may be conductively connected to each other through the input side connecting wirings 36 and 37. Further, in the above embodiment, the case where one set of signal input side connecting electrodes 34a is provided on the lower surface of the semiconductor chips 31, 32, 35 has been described, but the present invention is not limited to this, and the power input side connecting electrodes 34b, 3 are provided.
Similar to 4c, two sets of signal input side connection electrodes 34a corresponding to each other are provided on the semiconductor chips 31, 32, 35, and the two sets of signal input side connection electrodes 34a are electrically connected to the corresponding signal input side connection wirings 36, respectively. Connected and semiconductor chip 3
Two sets of signal input side connecting electrodes 3 corresponding to 1, 32 and 35
4a may be internally connected to each other.

[0013]

As described above, according to the first aspect of the present invention, the corresponding input side connection electrodes of the plurality of semiconductor chips mounted in each semiconductor chip mounting area are conductively connected and do not intersect each other. Since a plurality of connecting wirings are continuously provided over each semiconductor chip mounting area and one end portion of each connecting wiring is arranged in one place on one surface of the projecting portion, a flexible wiring having connecting wirings on both sides is provided. As compared with the case where the wiring board is conductively connected to the plurality of semiconductor chips, the size can be reduced and the structure of the flexible wiring board can be simplified. Claim 2
According to the invention described above, since the plurality of connecting wirings pass through the plurality of semiconductor chip mounting areas, the width of the protruding portion can be narrowed by that much, and as a result, the size can be reduced. According to the invention described in claims 3 and 4, the semiconductor chip has two sets of input-side connection electrodes corresponding to each other.
Since two sets of input side connecting electrodes are conductively connected to corresponding connecting wirings and two sets of corresponding input side connecting electrodes of the semiconductor chip are connected inside the chip, two sets of semiconductor chip corresponding to each other are connected. The connection of the semiconductor chip and the connection wiring are arranged in parallel between the input-side connection electrodes, and as a result, the wiring resistance of the connection wiring can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of a liquid crystal display device according to the present invention.

FIG. 2A is a plan view of a wiring structure of the liquid crystal display device,
(B) is a plan view of the main part thereof.

FIG. 3A is a plan view of two predetermined semiconductor chips used in this liquid crystal display device, and FIG. 3B is a plan view of the remaining one semiconductor chip used in the same liquid crystal display device.

FIG. 4A is a plan view of an example of a conventional liquid crystal display device,
(B) is a plan view of the wiring structure.

FIG. 5 is a plan view of a semiconductor chip used in the liquid crystal display device.

[Explanation of symbols]

 1 liquid crystal display panel 5 flexible wiring substrate 6, 7 transparent substrate 8, 9, 14 semiconductor chip mounting area 31, 32, 35 semiconductor chip 34a signal input side connecting electrode 34b, 34c power input side connecting electrode 36, 38 signal input side connection Wiring 37, 39 Wiring for power supply input side connection

Claims (4)

[Claims] 1. A projection is formed by projecting at least one substrate of two substrates facing each other from at least one side of the other substrate, and one surface of the projection is provided along one side of the other substrate. A liquid crystal display device having a plurality of semiconductor chip mounting areas, wherein a plurality of semiconductor chips are mounted in each of the semiconductor chip mounting areas, wherein the semiconductor chip mounting area is mounted on one surface of the protrusion along one side of the other substrate. A plurality of non-intersecting connection wirings for conductively connecting corresponding input side connection electrodes of the plurality of semiconductor chips are continuously provided over the respective semiconductor chip mounting areas, and each one end of the connection wirings is provided. A liquid crystal display device, characterized in that the protrusions are collectively arranged on one surface. 2. The liquid crystal display device according to claim 1, wherein the plurality of connection wirings pass through the plurality of semiconductor chip mounting areas. 3. The semiconductor chip has two sets of input side connection electrodes corresponding to each other, and the two sets of input side connection electrodes are conductively connected to the corresponding connection wirings. 3. The liquid crystal display device according to 1 or 2. 4. The liquid crystal display device according to claim 3, wherein two sets of input side connection electrodes corresponding to each other of the semiconductor chip are connected inside the chip.