JPH0830168B2 - Non-combustible cement for electronic parts - Google Patents
Non-combustible cement for electronic partsInfo
- Publication number
- JPH0830168B2 JPH0830168B2 JP21930990A JP21930990A JPH0830168B2 JP H0830168 B2 JPH0830168 B2 JP H0830168B2 JP 21930990 A JP21930990 A JP 21930990A JP 21930990 A JP21930990 A JP 21930990A JP H0830168 B2 JPH0830168 B2 JP H0830168B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- cement
- electronic parts
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004568 cement Substances 0.000 title claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000008119 colloidal silica Substances 0.000 claims description 4
- IBKNSIPMTGYUNZ-UHFFFAOYSA-N ethenyl(methoxy)silane Chemical compound CO[SiH2]C=C IBKNSIPMTGYUNZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000003301 hydrolyzing effect Effects 0.000 claims description 2
- -1 aluminum alkoxy compound Chemical class 0.000 claims 1
- 239000002904 solvent Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 229910052845 zircon Inorganic materials 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は発熱を伴う電子部品の充填セメント材として
使用される電子部品用セメントに関するものである。Description: TECHNICAL FIELD The present invention relates to a cement for electronic components used as a filling cement material for electronic components that generate heat.
従来の技術 従来の電子部品用セメントは、無機質系ではアルミナ
セメントおよびジルコンセメント、有機質系ではシリコ
ーンワニスをベースとしたセメントが、主に用いられて
いる。2. Description of the Related Art As conventional cement for electronic parts, alumina-based cement and zircon cement are mainly used in inorganic type, and silicone varnish-based cement is mainly used in organic type.
発明が解決しようとする課題 このような従来の電子部品用セメントは、無機質系の
アルミナセメントでは、常温硬化だが硬化時間が長くし
かも絶縁性に劣る。また、ジルコンセメントでは短時間
硬化だが硬化温度が約280℃と高すぎる。そして、最も
多く用いられている有機質系のシリコーンワニスベース
のセメントは、高温で発煙し、約400℃で劣化分解を生
ずる。また、耐溶剤性に乏しく溶剤洗浄には注意を要
す。さらに、このセメントはキシレン等の有機溶剤が必
要である。SUMMARY OF THE INVENTION Problems to be Solved by the Invention Such conventional cement for electronic parts is an inorganic alumina cement, which has a long curing time at room temperature but a poor curing property. In addition, the curing temperature of zircon cement is short, but the curing temperature is too high at about 280 ℃. The most commonly used organic silicone varnish-based cement smokes at high temperatures and deteriorates and decomposes at about 400 ° C. In addition, the solvent resistance is poor and care must be taken when cleaning the solvent. Furthermore, this cement requires an organic solvent such as xylene.
本発明はかかる点に鑑みてなされたもので、無機質系
で無煙，高耐熱，高絶縁性，高溶剤性，低温短時間硬
化、および労働衛生上安定なセメントを提供することを
目的としている。The present invention has been made in view of the above points, and an object thereof is to provide a cement which is inorganic and has no smoke, high heat resistance, high insulation, high solvent resistance, low temperature short time curing, and stable in occupational hygiene.
課題を解決するための手段 本発明は上記目的を達成するため、シリカ固形成分１
％〜50％を有する水性コロイダルシリカ１重量部〜40重
量部およびエチルシリケート単量体１重量部〜10重量部
の混合物に、ビニールメトキシシラン１重量部〜２重量
部およびアルミニウムアルコキシ化合物１重量部〜20重
量部を触媒として加水分解せしめた組成物に、無機質フ
ィラー100重量部〜200重量部を混合してなるものであ
る。Means for Solving the Problems In order to achieve the above object, the present invention provides a silica solid component 1
% To 50% aqueous colloidal silica 1 to 40 parts by weight and a mixture of ethyl silicate monomer 1 to 10 parts by weight, vinyl methoxysilane 1 to 2 parts by weight and aluminum alkoxy compound 1 part by weight. The composition is obtained by mixing 100 parts by weight to 200 parts by weight of an inorganic filler with a composition hydrolyzed by using 20 parts by weight as a catalyst.
作用 本発明によれば上記の構成により、架橋密度の大きい
セラミック状シロキサンを形成するセメントが得られ、
無煙，高耐熱，高絶縁性，耐溶剤性、および低温短時間
硬化が実現できる。Action According to the present invention, with the above configuration, a cement forming a ceramic siloxane having a large crosslink density is obtained,
Smokeless, high heat resistance, high insulation, solvent resistance, and low temperature short time curing can be realized.
実施例 以下、本発明の一実施例について説明する。Example One example of the present invention will be described below.
第１表は本発明の電子部品用不燃セメントの一実施例
である。第２表は本実施例のセメントを電子部品に用い
て100℃,20分で硬化させた場合の性能である。Table 1 is an example of the non-combustible cement for electronic parts of the present invention. Table 2 shows the performance when the cement of this example was used for an electronic component and cured at 100 ° C. for 20 minutes.
第１表に示した組成のように、シリカ固形分20％水性
コロイダルシリカ40重量部とエチルシリケート単量体10
重量部の混合体に、ビニールメトキシシラン２重量部と
アルミニウムアルコキシ１重量部を触媒として加水分解
した組成物（バインダー）に、60ミクロンシリカ100重
量部と150ミクロンシリカ100重量部を無機質フィラーと
して加え、均一に混合したスラリーは、第２表に示すよ
うに電子部品用のセメントとして十分なる性能を有す
る。 As shown in Table 1, 40 parts by weight of aqueous colloidal silica having a solid content of silica of 20% and ethyl silicate monomer 10
100 parts by weight of 60 micron silica and 100 parts by weight of 150 micron silica were added as an inorganic filler to a composition (binder) obtained by hydrolyzing 2 parts by weight of vinyl methoxysilane and 1 part by weight of aluminum alkoxy as a catalyst to a mixture of parts by weight. The homogeneously mixed slurry has sufficient performance as a cement for electronic parts as shown in Table 2.
ただし、次の配合部数では満足なセメントは得られな
かった。水性コロイダルシリカを加えなければシラノー
ル形成能に劣り、40重量部以上では瞬時にしてゲル化す
る。エチルシリケート単量体を加えなければ加水分解が
遅く、20重量部を超えるとゲル化が生ずる。アルミニウ
ムアルコキシを加えなければ硬化特性が悪く実用化でき
ず、一方30重量部では、２〜３週間は安定であるが、経
時変化によりバインダー成分が分離し、やがてゲル化す
る。無機質フィラーについては、性能的には特に限定し
なくてもよく、用途とコストにより決めればよい。However, satisfactory cement could not be obtained with the following compounding parts. If aqueous colloidal silica is not added, the ability to form silanol is inferior, and at 40 parts by weight or more, it instantly gels. Hydrolysis is slow unless ethyl silicate monomer is added, and gelation occurs when the amount exceeds 20 parts by weight. Unless aluminum alkoxy is added, the curing property is poor and it cannot be put to practical use. On the other hand, at 30 parts by weight, it is stable for 2 to 3 weeks, but the binder component separates due to aging, and eventually gels. There is no particular limitation on the performance of the inorganic filler, and it may be determined depending on the application and cost.
またビニールメトキシシランは高価であり経済性の面
からできるだけ低く押さえる必要がある。Also, vinyl methoxysilane is expensive and it is necessary to keep it as low as possible in terms of economy.
発明の効果 以上のように、本発明によれば、架橋密度大なるシロ
キサン結合のセメントのため、電子部品の素体構成物の
金属、ガラス及びセラミックの表面に対し、密度性がよ
く、無煙，高耐熱，高絶縁性，耐溶剤性であり、しかも
低温短時間硬化が可能なため、電子部品用のセメントと
してきわめて有用である。また、キシレンなどの規制の
強い溶剤を使用しないので、労働衛生上きわめて安全な
セメントである。EFFECTS OF THE INVENTION As described above, according to the present invention, because of the siloxane-bonded cement having a high cross-linking density, the density is good with respect to the surfaces of the metal, glass and ceramic of the element body component of the electronic component, and there is no smoke, It is extremely useful as a cement for electronic parts because it has high heat resistance, high insulation, solvent resistance, and can be cured at low temperature for a short time. In addition, since it does not use strongly regulated solvents such as xylene, it is an extremely safe cement for industrial hygiene.
フロントページの続き (72)発明者 石田 英基 兵庫県尼崎市塚口町３丁目38番の43 株式 会社石田化学研究所内 (56)参考文献 特開 平１−11074（ＪＰ，Ａ)Front page continuation (72) Inventor Hideki Ishida 43-3 Tsukaguchi-cho, Amagasaki-shi, Hyogo 43-38 Ishida Chemical Research Institute Co., Ltd. (56) Reference JP-A-1-11074 (JP, A)
Claims (1)
ロイダルシリカ１重量部〜40重量部およびエチルシリケ
ート単量体１重量部〜10重量部の混合物に、ビニールメ
トキシシラン１重量部〜２重量部およびアルミニウムア
ルコキシ化合物１重量部〜20重量部を触媒として加水分
解せしめた組成物に、無機質フィラー10重量部〜200重
量部を混合してなる電子部品用不燃セメント。1. A mixture of 1 to 40 parts by weight of aqueous colloidal silica having a solid content of 1 to 50% silica and 1 to 10 parts by weight of an ethyl silicate monomer, and 1 to 2 parts by weight of vinyl methoxysilane. A non-combustible cement for electronic parts, which is obtained by mixing 10 parts by weight to 200 parts by weight of an inorganic filler with a composition obtained by hydrolyzing 1 part by weight to 20 parts by weight of an aluminum alkoxy compound as a catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21930990A JPH0830168B2 (en) | 1990-08-20 | 1990-08-20 | Non-combustible cement for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21930990A JPH0830168B2 (en) | 1990-08-20 | 1990-08-20 | Non-combustible cement for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04100883A JPH04100883A (en) | 1992-04-02 |
| JPH0830168B2 true JPH0830168B2 (en) | 1996-03-27 |
Family
ID=16733472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21930990A Expired - Fee Related JPH0830168B2 (en) | 1990-08-20 | 1990-08-20 | Non-combustible cement for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0830168B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9176468B2 (en) | 2006-12-22 | 2015-11-03 | Canon Kabushiki Kaisha | Rotational force transmitting part |
| US12298704B2 (en) | 2007-03-23 | 2025-05-13 | Canon Kabushiki Kaisha | Electrophotographic image forming apparatus, developing apparatus, and coupling member |
-
1990
- 1990-08-20 JP JP21930990A patent/JPH0830168B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9176468B2 (en) | 2006-12-22 | 2015-11-03 | Canon Kabushiki Kaisha | Rotational force transmitting part |
| US12298704B2 (en) | 2007-03-23 | 2025-05-13 | Canon Kabushiki Kaisha | Electrophotographic image forming apparatus, developing apparatus, and coupling member |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04100883A (en) | 1992-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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| R250 | Receipt of annual fees |
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| FPAY | Renewal fee payment (prs date is renewal date of database) |
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| LAPS | Cancellation because of no payment of annual fees |