JPH08236878A - Body structure of machine screw hole for circuit board - Google Patents
Body structure of machine screw hole for circuit boardInfo
- Publication number
- JPH08236878A JPH08236878A JP6208495A JP6208495A JPH08236878A JP H08236878 A JPH08236878 A JP H08236878A JP 6208495 A JP6208495 A JP 6208495A JP 6208495 A JP6208495 A JP 6208495A JP H08236878 A JPH08236878 A JP H08236878A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- screw hole
- screw
- conductive portion
- machine screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】回路基板の機器筐体への固定に使
用する回路基板のビス穴構体に関し、特に、半田付け工
程においてビス穴が半田で塞がれるのを防止できる回路
基板のビス穴構体に関する。BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a screw hole structure of a circuit board used for fixing a circuit board to a device case, and particularly to a screw hole of a circuit board capable of preventing the screw hole from being blocked by solder in a soldering process Regarding the structure.
【０００２】[0002]
【従来の技術】電子機器の回路は、印刷技術により配線
が印刷された回路基板（プリント基板）上に電子部品を
乗せ、半田付けして製造される。現在では半田付けの工
程が自動化されつつあり、機械による流れ作業によって
半田付けが行われる。この工程では、溶融した半田の入
った半田漕に電子部品の乗った回路基板を浸し、回路基
板の金属部分に半田を付着させ、これによって電子部品
を基板に半田付けする。2. Description of the Related Art A circuit of an electronic device is manufactured by mounting an electronic component on a circuit board (printed circuit board) on which wiring is printed by a printing technique and soldering it. At present, the soldering process is being automated, and the soldering is performed by a machine-based flow operation. In this step, the circuit board on which the electronic component is mounted is dipped in a solder bath containing molten solder, and the solder is attached to the metal portion of the circuit board, whereby the electronic component is soldered to the substrate.
【０００３】完成した回路基板は、電子機器の筐体にビ
スでねじ作用により固定される。このため、回路基板に
はビスを通すビス穴が設けられる。このとき、回路基板
のグランドは、電子機器の筐体と電気的に接続される。The completed circuit board is fixed to the housing of the electronic device with screws by a screw action. Therefore, the circuit board is provided with a screw hole for passing a screw. At this time, the ground of the circuit board is electrically connected to the housing of the electronic device.
【０００４】図３は、従来の回路基板のビス穴構体の例
の部分断面斜視図である。以下図中において、斜線部分
は断面であることを示す。回路基板１０は、非導電性の
樹脂で形成される。回路基板１０には、グランド層２８
が設けられる。回路基板１０には、その第１主面１２か
ら第２主面１４へと貫通するビス穴４０が設けられる。
ビス穴４０の内壁には導電性の金属層が形成され、ま
た、回路基板１０の第１主面１２及び第２主面１４のビ
ス穴４０の周囲にも周知の回路基板製造技術により第１
及び第２導電面４２及び４４が夫々形成される。これら
導電部分は、通常銅箔で一体に形成される。回路基板１
０は、例えば、第１主面１２側からビス５０をビス穴４
０に通し、ねじ作用により筐体（図示せず）にある対応
する固定柱６０のねじ穴６２と螺合させることにより機
器筐体へ固定される。FIG. 3 is a partial cross-sectional perspective view of an example of a screw hole structure of a conventional circuit board. In the following figures, the hatched portion indicates a cross section. The circuit board 10 is formed of a non-conductive resin. The circuit board 10 includes a ground layer 28.
Is provided. The circuit board 10 is provided with a screw hole 40 penetrating from the first main surface 12 to the second main surface 14.
A conductive metal layer is formed on the inner wall of the screw hole 40, and the periphery of the screw hole 40 of the first main surface 12 and the second main surface 14 of the circuit board 10 is formed by a well-known circuit board manufacturing technique.
And second conductive surfaces 42 and 44 are formed, respectively. These conductive parts are usually integrally formed of copper foil. Circuit board 1
0 is, for example, a screw 50 from the first main surface 12 side to the screw hole 4
It is fixed to the device housing by threading it through 0 and screwing it into the screw hole 62 of the corresponding fixed column 60 in the housing (not shown) by a screw action.
【０００５】第２導電面４４と接触する固定柱６０の接
触面６４は導電性であり、ビス５０をねじ穴６２に螺合
させることによって、第２導電面４４を介して回路基板
１０のグランド層２８が筐体と電気的に接続される。ま
た、ビス５０も導電性なので、ビス５０のヘッド部５２
の下部５４が第１接触面４２と接触することでビス５０
もグランドされており、このビス５０がねじ穴６２を介
してグランド層２８を筐体に電気的に接続する。The contact surface 64 of the fixed column 60 that comes into contact with the second conductive surface 44 is conductive, and by screwing the screw 50 into the screw hole 62, the ground of the circuit board 10 is inserted through the second conductive surface 44. Layer 28 is electrically connected to the housing. Since the screw 50 is also conductive, the head portion 52 of the screw 50
When the lower part 54 of the screw contacts the first contact surface 42, the screw 50
Is also grounded, and the screw 50 electrically connects the ground layer 28 to the housing through the screw hole 62.
【０００６】[0006]
【発明が解決しようとする課題】回路基板のビス穴は、
ビスを用いて回路基板を機器の筐体に固定するために必
要である。しかし、従来の回路基板のビス穴構体では、
半田付け工程においてビス穴が半田による塞がってしま
うことがあった。即ち、自動化された半田付け工程では
回路基板を半田漕に浸して行うので、溶融した高温の半
田がビス穴に侵入する。このとき、ビス穴の内壁には銅
箔などの導電層が形成されているため、溶融した半田が
付着して膜を形成し、温度が冷えるに従って固体となっ
てビス穴を塞いでしまう。このため、ビス穴が塞がるの
を防止するために、従来はビス穴部分にマスキング処理
を施してから半田付け工程を行い、ビス穴部分の導電層
に半田が付着するのを防止していた。The screw holes in the circuit board are
It is necessary to fix the circuit board to the housing of the device using screws. However, in the conventional circuit board screw hole structure,
In some cases, the screw holes were blocked by the solder in the soldering process. That is, since the circuit board is immersed in the solder bath in the automated soldering process, the molten high temperature solder enters the screw holes. At this time, since a conductive layer such as a copper foil is formed on the inner wall of the screw hole, the molten solder adheres to form a film and becomes solid as the temperature cools, closing the screw hole. Therefore, in order to prevent the screw holes from being blocked, conventionally, a masking process is performed on the screw holes and then a soldering process is performed to prevent the solder from adhering to the conductive layer in the screw holes.
【０００７】そこで本発明の目的は、半田付け工程にお
いて特別な処理なしでも半田でビス穴が塞がれることの
ない回路基板のビス穴構体を提供することにある。Therefore, an object of the present invention is to provide a screw hole structure for a circuit board in which the screw holes are not blocked by the solder without any special treatment in the soldering process.
【０００８】[0008]
【課題を解決するための手段及び作用】本発明の回路基
板のビス穴構体は、回路基板にビスを通過させるビス穴
を形成し、回路基板の第１主面上のビス穴の周囲に第１
導電部を形成する。この第１導電部は、ビスをビス穴に
通して締め付けたときにビスのヘッドと電気的に接続さ
れる。結線手段は、回路基板のグランド及び第１導電部
を電気的に接続する。第１導電部はビスと接触して電気
的に接続され、ビスは筐体に螺合されるので、回路基板
のグランドは筐体と電気的に接続される。また、回路基
板の第２主面上に第２導電部を更に設け、第２導電部を
結線手段と電気的に接続するようにしても良い。回路基
板をビスで固定するときに、第２主面上の第２導電部を
筐体と接触させれば、ここでも回路基板のグランドと筐
体が電気的に接続される。加えて、回路基板の第１主面
上において第１導電部の内側境界エッジをビス穴の開口
エッジから離間させるようにすれば、半田付け工程にお
いてビス穴に溶融した半田が侵入した場合にも第１導電
部の内側境界エッジに半田が付着するのを防止し、ビス
穴が塞がれるのを防止できる。A screw hole structure for a circuit board according to the present invention forms a screw hole for allowing a screw to pass through the circuit board, and a screw hole structure is formed around the screw hole on the first main surface of the circuit board. 1
A conductive portion is formed. The first conductive portion is electrically connected to the head of the screw when the screw is passed through the screw hole and tightened. The wire connecting means electrically connects the ground of the circuit board and the first conductive portion. The first conductive portion is in contact with and electrically connected to the screw, and the screw is screwed into the housing, so that the ground of the circuit board is electrically connected to the housing. Further, a second conductive portion may be further provided on the second main surface of the circuit board, and the second conductive portion may be electrically connected to the wire connecting means. If the second conductive portion on the second main surface is brought into contact with the housing when fixing the circuit board with screws, the ground of the circuit board and the housing are also electrically connected here. In addition, if the inner boundary edge of the first conductive portion is separated from the opening edge of the screw hole on the first main surface of the circuit board, even when molten solder enters the screw hole in the soldering process. It is possible to prevent the solder from adhering to the inner boundary edge of the first conductive portion and prevent the screw hole from being blocked.
【０００９】[0009]
【実施例】図１は、本発明の一好適実施例の部分断面斜
視図である。本発明の回路基板のビス穴構体におけるビ
ス穴１６は、その内壁に特に銅などの導電材料による層
又は膜が形成されず、単に非導電性回路基板１０に、ビ
ス５０を通すことが可能な穴として形成される。回路基
板１０の第１主面１２上のビス穴１６の周囲には第１導
電部２０が形成される。第１導電部２０は、ビス５０を
ビス穴１６に通して筐体（図示せず）の固定柱６０のね
じ穴６２に螺合させたときに、ビス５０のヘッド５２の
下部５４と接触し電気的に接続される。このとき、ヘッ
ド下部５４と第１接続部２０の間にナットを挟んでも良
い。また、ビス穴１６の周囲に、回路基板１０の第１主
面１２から第２主面１４へと貫通するスルーホール１８
を形成する。スルーホール１８は、その内壁に周知の従
来技術により銅などの導電性の層が形成され、回路基板
１０の内層にあるグランド層２８と第１導電部２０とを
結線する結線手段として機能する。1 is a partial cross-sectional perspective view of a preferred embodiment of the present invention. The screw hole 16 in the screw hole structure of the circuit board of the present invention does not have a layer or film made of a conductive material such as copper formed on its inner wall, and the screw 50 can be simply passed through the non-conductive circuit board 10. Formed as a hole. A first conductive portion 20 is formed around the screw hole 16 on the first main surface 12 of the circuit board 10. The first conductive portion 20 contacts the lower portion 54 of the head 52 of the screw 50 when the screw 50 is passed through the screw hole 16 and screwed into the screw hole 62 of the fixed column 60 of the housing (not shown). It is electrically connected. At this time, a nut may be sandwiched between the lower head portion 54 and the first connecting portion 20. In addition, a through hole 18 penetrating from the first main surface 12 of the circuit board 10 to the second main surface 14 around the screw hole 16.
To form. The through hole 18 has a conductive layer of copper or the like formed on its inner wall by a well-known conventional technique, and functions as a connecting means for connecting the ground layer 28 in the inner layer of the circuit board 10 and the first conductive portion 20.
【００１０】回路基板１０を第１主面１２から第２主面
１４へと貫通したスルーホール１８は、更に第２主面１
４上に設けた第２導電部２２と電気的に接続されるよう
にしても良い。第２導電部２２は、ビス５０をビス穴１
６に通して筐体の固定柱６０のねじ穴６２に螺合させた
ときに、機器の筐体から突き出ている固定柱６０の接触
面６４と接触し筐体と電気的に接続される。これによっ
ても、回路基板１０のグランド層２８が筐体と電気的に
接続される。The through hole 18 penetrating the circuit board 10 from the first main surface 12 to the second main surface 14 further includes the second main surface 1.
4 may be electrically connected to the second conductive portion 22 provided on the upper surface of the wiring 4. The second conductive portion 22 has a screw 50 and a screw hole 1
When it is screwed into the screw hole 62 of the fixed pillar 60 of the housing through the housing 6, it comes into contact with the contact surface 64 of the fixed pillar 60 protruding from the housing of the device and is electrically connected to the housing. This also electrically connects the ground layer 28 of the circuit board 10 to the housing.
【００１１】第１導電部２０には、半田付け工程のとき
に高熱がかかり、また、ビス５０を締め付けるときに応
力がかかる。これらにより、第１導電部２０が単に第１
主面１２上に張り付いているだけでは、第１主面１２か
らはがれてしまう恐れが大きい。しかし、スルーホール
１８は、第１導電部２０が第１主面１２上からはがれる
のを防止する止め金の役割をも果たしている。よって、
スルーホール１８は、複数設ければ上述の機能を効果的
に果たす。図１及び図２は、スルーホール１８が合計４
つの例（ただし、断面斜視図のため、図中では３つだけ
しか描かれていない）を示している。High heat is applied to the first conductive portion 20 during the soldering process, and stress is applied when the screw 50 is tightened. By these, the first conductive portion 20 is simply the first
There is a great risk that it will peel off from the first major surface 12 if it is only stuck to the major surface 12. However, the through hole 18 also plays the role of a stopper that prevents the first conductive portion 20 from peeling off from the first main surface 12. Therefore,
If a plurality of through holes 18 are provided, the above-mentioned function can be effectively achieved. 1 and 2, the total number of through holes 18 is 4
Two examples (however, only three are drawn in the figure because of a cross-sectional perspective view) are shown.
【００１２】図２は、本発明の他の実施例の部分断面斜
視図である。図１の実施例と比較すると、スルーホール
１８に代わって結線ホール１９が設けられる。結線ホー
ル１９は、その内壁に導電性の層が形成され回路基板１
０のグランド層２８と第１導電部２０とを結線し電気的
に接続する。なお、この実施例では、第２主面１４上に
第２導電部を設けていない。しかし、回路基板１０のグ
ランド層２８と筐体との電気的接続は、上述したように
ビス５０と固定柱６０のねじ穴６２と螺合させることに
より行われる。FIG. 2 is a partial sectional perspective view of another embodiment of the present invention. Compared with the embodiment of FIG. 1, a connection hole 19 is provided instead of the through hole 18. The connection hole 19 has a conductive layer formed on the inner wall thereof.
The ground layer 28 of 0 and the first conductive portion 20 are connected and electrically connected. In this embodiment, the second conductive portion is not provided on the second main surface 14. However, the electrical connection between the ground layer 28 of the circuit board 10 and the housing is performed by screwing the screws 50 into the screw holes 62 of the fixed column 60 as described above.
【００１３】図１及び図２に示した実施例において、自
動化された半田付け工程においては、上述したように溶
融した半田がビス穴１６に侵入するので、第１導電部１
０の内側境界エッジ２６とビス穴１６の開口エッジ２４
が一致しているか又は非常に近接していると、第１導電
部１０の内側境界エッジ２６のために溶融した半田の膜
ができ、その結果ビス穴１６が半田で塞がれるという事
態が発生する恐れある。そこで、回路基板１０の第１主
面１２上において第１導電部１０の内側境界エッジ２６
は、ビス穴１６の開口エッジ２４から離間させる。これ
によって、第１導電部１０の内側境界エッジ２６よる半
田の付着を更に効果的に防止できる。In the embodiment shown in FIGS. 1 and 2, in the automated soldering process, the molten solder enters the screw holes 16 as described above, so that the first conductive portion 1
0 inner boundary edge 26 and opening edge 24 of screw hole 16
If they match or are very close to each other, a film of molten solder is formed due to the inner boundary edge 26 of the first conductive portion 10, and as a result, the screw hole 16 is blocked with solder. There is a risk of Therefore, the inner boundary edge 26 of the first conductive portion 10 is formed on the first main surface 12 of the circuit board 10.
Are separated from the opening edge 24 of the screw hole 16. As a result, it is possible to more effectively prevent the adhesion of solder due to the inner boundary edge 26 of the first conductive portion 10.
【００１４】以上本発明の好適実施例について説明した
が、本発明はここに説明した実施例のみに限定されるも
のではなく、本発明の要旨を逸脱することなく必要に応
じて種々の変形及び変更を実施し得ることは当業者には
明らかである。例えば、第１導電部の形状は、図１及び
図２に示した形状でなくとも良く、例えばビスの形状に
合わせてろうと状になっていても良い。Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the embodiments described herein, and various modifications and modifications can be made as necessary without departing from the gist of the present invention. It will be apparent to those skilled in the art that changes can be made. For example, the shape of the first conductive portion does not have to be the shape shown in FIGS. 1 and 2, and may be, for example, a funnel shape in accordance with the shape of the screw.
【００１５】[0015]
【発明の効果】本発明の回路基板のビス穴構体によれ
ば、半田付け工程の前にビス穴部分にマスキングなどの
特別な処理をしなくともビス穴が半田で塞がれることが
ない。よって、製造工程が簡略化され、製造コストを低
減することができる。According to the screw hole structure of the circuit board of the present invention, the screw hole is not closed by the solder without special treatment such as masking on the screw hole portion before the soldering step. Therefore, the manufacturing process can be simplified and the manufacturing cost can be reduced.
【図１】本発明の一好適実施例の部分断面斜視図であ
る。FIG. 1 is a partial cross-sectional perspective view of a preferred embodiment of the present invention.
【図２】本発明の他の好適実施例の部分断面斜視図であ
る。FIG. 2 is a partial cross-sectional perspective view of another preferred embodiment of the present invention.
【図３】従来の回路基板のビス穴構体の例の部分断面斜
視図である。FIG. 3 is a partial cross-sectional perspective view of an example of a screw hole structure of a conventional circuit board.
１０ 回路基板 １２ 第１主面 １４ 第２主面 １６ ビス穴 １８ スルーホール（結線手段） １９ 結線ホール（結線手段） ２０ 第１導電部 ２２ 第２導電部 ２４ ビス穴の開口エッジ ２６ 第１導電部の内側境界エッジ ２８ グランド層 ４０ ビス穴 ４２ 第１導電面 ４４ 第２導電面 ５０ ビス ５２ ビスのヘッド ５４ ビスのヘッド下部 ６０ 機器筐体の固定柱 ６２ ねじ穴 ６４ 接触面 DESCRIPTION OF SYMBOLS 10 circuit board 12 1st main surface 14 2nd main surface 16 screw hole 18 through hole (connection means) 19 connection hole (connection means) 20 1st conductive part 22 2nd conductive part 24 opening edge of screw hole 26 1st conductivity Inner boundary edge 28 Ground layer 40 Screw hole 42 First conductive surface 44 Second conductive surface 50 Screw 52 Screw head 54 Lower head of screw 60 Fixing column of device housing 62 Screw hole 64 Contact surface
───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉田 和彰 東京都品川区北品川５丁目９番31号 ソニ ー・テクトロニクス株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuaki Yoshida 5-9-31 Kitashinagawa, Shinagawa-ku, Tokyo Inside Sony Tektronix Co., Ltd.
Claims (3)
路基板と、 該回路基板の第１主面上の上記ビス穴の周囲に形成さ
れ、上記ビスのヘッドと電気的に接続される第１導電部
と、 上記回路基板のグランド及び上記第１導電部を電気的に
接続する結線手段とを具える回路基板のビス穴構体。1. A circuit board having a screw hole for allowing a screw to pass therethrough, and a first circuit board formed on the first main surface of the circuit board around the screw hole and electrically connected to a head of the screw. A screw hole structure for a circuit board, comprising one conductive portion and a connecting means for electrically connecting the ground of the circuit board and the first conductive portion.
段と電気的に接続された第２導電部を更に具える請求項
１記載の回路基板のビス穴構体。2. The screw hole structure for a circuit board according to claim 1, further comprising a second conductive portion electrically connected to the connection means on the second main surface of the circuit board.
上記第１導電部の内側境界エッジを上記ビス穴の開口エ
ッジから離間させたことを特徴とする請求項１又は２記
載の回路基板のビス穴構体。3. The circuit board according to claim 1, wherein an inner boundary edge of the first conductive portion is separated from an opening edge of the screw hole on the first main surface of the circuit board. Screw hole structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6208495A JPH08236878A (en) | 1995-02-24 | 1995-02-24 | Body structure of machine screw hole for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6208495A JPH08236878A (en) | 1995-02-24 | 1995-02-24 | Body structure of machine screw hole for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08236878A true JPH08236878A (en) | 1996-09-13 |
Family
ID=13189846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6208495A Pending JPH08236878A (en) | 1995-02-24 | 1995-02-24 | Body structure of machine screw hole for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08236878A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1015101C2 (en) * | 2000-05-03 | 2001-11-06 | Ericsson Telefon Ab L M | Printed circuit board has blind holes for conducting passages between middle and upper conducting layers to prevent solder protrusions from interfering with head of screw fastener |
| KR100625971B1 (en) * | 2003-10-10 | 2006-09-20 | 삼성에스디아이 주식회사 | Plasma display device with improved coupling and grounding structure of circuit board |
| KR100730135B1 (en) * | 2004-12-09 | 2007-06-19 | 삼성에스디아이 주식회사 | Plasma display apparatus |
| EP2288241A1 (en) * | 2009-08-04 | 2011-02-23 | Siemens Aktiengesellschaft | Electric attachment assembly, method for its manufacture and usage |
| JP2014090018A (en) * | 2012-10-29 | 2014-05-15 | Tdk Corp | Print circuit board |
| CN104185360A (en) * | 2014-08-18 | 2014-12-03 | 深圳市华星光电技术有限公司 | Printed circuit board and design method thereof |
| JP2016122787A (en) * | 2014-12-25 | 2016-07-07 | 株式会社デンソー | Electronic device and substrate |
| CN109244687A (en) * | 2018-09-21 | 2019-01-18 | 国网山东省电力公司龙口市供电公司 | A kind of carbon fiber earthing or grounding means |
| US11493889B2 (en) | 2017-01-13 | 2022-11-08 | Huawei Technologies Co., Ltd. | Wearable device |
| WO2024014569A1 (en) * | 2022-07-12 | 2024-01-18 | 엘지전자 주식회사 | Display device |
| KR20250073937A (en) | 2023-11-20 | 2025-05-27 | 주식회사 엘지에너지솔루션 | PCB comprising Current Lines Around the Boss Hole |
-
1995
- 1995-02-24 JP JP6208495A patent/JPH08236878A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1015101C2 (en) * | 2000-05-03 | 2001-11-06 | Ericsson Telefon Ab L M | Printed circuit board has blind holes for conducting passages between middle and upper conducting layers to prevent solder protrusions from interfering with head of screw fastener |
| KR100625971B1 (en) * | 2003-10-10 | 2006-09-20 | 삼성에스디아이 주식회사 | Plasma display device with improved coupling and grounding structure of circuit board |
| KR100730135B1 (en) * | 2004-12-09 | 2007-06-19 | 삼성에스디아이 주식회사 | Plasma display apparatus |
| EP2288241A1 (en) * | 2009-08-04 | 2011-02-23 | Siemens Aktiengesellschaft | Electric attachment assembly, method for its manufacture and usage |
| JP2014090018A (en) * | 2012-10-29 | 2014-05-15 | Tdk Corp | Print circuit board |
| GB2543987A (en) * | 2014-08-18 | 2017-05-03 | Shenzhen China Star Optoelect | Printed circuit board and method for designing same |
| GB2543987B (en) * | 2014-08-18 | 2021-01-06 | Shenzhen China Star Optoelect | Printed circuit board and design method thereof |
| WO2016026161A1 (en) * | 2014-08-18 | 2016-02-25 | 深圳市华星光电技术有限公司 | Printed circuit board and method for designing same |
| CN104185360A (en) * | 2014-08-18 | 2014-12-03 | 深圳市华星光电技术有限公司 | Printed circuit board and design method thereof |
| JP2017526182A (en) * | 2014-08-18 | 2017-09-07 | 深▲セン▼市華星光電技術有限公司 | Printed circuit board and layout method thereof |
| RU2663185C1 (en) * | 2014-08-18 | 2018-08-02 | Шэньчжэнь Чайна Стар Оптоэлектроникс Текнолоджи Ко., Лтд. | Circuit board and method of its designing |
| JP2016122787A (en) * | 2014-12-25 | 2016-07-07 | 株式会社デンソー | Electronic device and substrate |
| US11493889B2 (en) | 2017-01-13 | 2022-11-08 | Huawei Technologies Co., Ltd. | Wearable device |
| EP3556282B1 (en) * | 2017-01-13 | 2023-08-02 | Huawei Technologies Co., Ltd. | Wearable device |
| CN109244687A (en) * | 2018-09-21 | 2019-01-18 | 国网山东省电力公司龙口市供电公司 | A kind of carbon fiber earthing or grounding means |
| WO2024014569A1 (en) * | 2022-07-12 | 2024-01-18 | 엘지전자 주식회사 | Display device |
| KR20250073937A (en) | 2023-11-20 | 2025-05-27 | 주식회사 엘지에너지솔루션 | PCB comprising Current Lines Around the Boss Hole |
| WO2025110650A1 (en) | 2023-11-20 | 2025-05-30 | 주식회사 엘지에너지솔루션 | Pcb comprising current line adjacent to boss hole |
| EP4683436A1 (en) | 2023-11-20 | 2026-01-21 | LG Energy Solution, Ltd. | Pcb comprising current line adjacent to boss hole |
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