JPH08203956A - Electronic component and manufacture - Google Patents

Abstract

PURPOSE: To facilitate the positioning of an electronic component element to case material without requiring an expensive positioning equipment, and cope with electronic component elements having various kinds of sizes. CONSTITUTION: When an SAW element 24 is positioned and fixed in a package composed of a case substratum 41 and a metal cap 45, a guide 47 for positioning is previously formed on the case substratum 41. The guide 47 has an inner surface separated from the side surface of the SAW element 24, via a clearance smaller than the diameter of a solder bump. In the region surrounded by the guide 47 for positioning, the SAW element 24 is mounted on the solder bump. By the effect of surface tension of solder fused by heating, the SAW element 24 is horizontally moved, positioned, and joined to electrode lands 42, 43 with solder.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component in which an electronic component element is housed in a package consisting of first and second case members and fixed by soldering.

[0002]

2. Description of the Related Art Conventionally, various methods have been adopted for packaging a surface acoustic wave (hereinafter, SAW) element to obtain a SAW device. An example of a method of packaging such a SAW element will be described with reference to FIGS.

FIG. 1 is a plan view showing an example of a SAW element. The SAW element 1 is a transversal type surface acoustic wave filter having a structure in which interdigital transducers (hereinafter, IDTs) 3 and 4 are formed on an upper surface of a surface acoustic wave substrate 2 with a predetermined distance therebetween. Terminal electrodes 1a to 1d for external connection are formed on the SAW element 1.

When packaging the SAW element 1, the case substrate 5 and the cap 6 shown in FIG. 2 are used. That is, the electrode lands 7 and 8 are formed on the upper surface of the case substrate 5. On the other hand, the SAW element 1 has an ID
It is mounted on the case substrate 5 with the surface on which the T3 and T4 are formed as the lower surface, that is, in a face-down manner.

As is apparent from FIG. 2, the terminal electrodes 1a,
1b is electrically connected to the electrode lands 7 and 8 by solders 9 and 10. Further, the SAW element 1 is fixed on the case substrate 5 by joining the terminal electrodes 1 a and 1 b to the electrode lands 7 and 8 with the solders 9 and 10.
Similarly, the terminal electrodes 1c and 1d in FIG. 1 are also joined to the electrode lands (not shown) on the case substrate 5 by solder (not shown).

The cap 6 is made of a conductive material such as metal and has an opening opened downward. The lower end of the cap 6 is joined to the metal pad 5a formed in a square ring shape on the case substrate 5 with the solder 11 to form the case substrate 5
And the cap 6 are integrated. Therefore, the SAW element 1 is sealed in the internal space of the package including the case substrate 5 and the cap 6.

When the electrode lands 7 and 8 and the terminal electrodes 1a and 1b are joined by the solders 9 and 10, first, solder bumps of a predetermined size are provided on the electrode lands 7 and 8. After that, as shown in FIG. 3, the solder bump 9
The SAW element 1 is arranged so that the terminal electrodes 1a and 1b are accurately positioned on the a and 10a. Next, solder bump 9
The a and 10a are melted by heating by the reflow soldering method and then cooled, and the SAW element 1 and the case substrate 5 are joined by the solders 9 and 10.

In the above joining method, unless the centers of the terminal electrodes 1a and 1b are accurately located at the centers of the solder bumps 9a and 10a, it is difficult to reliably join the terminal electrodes 1a and 1b to the electrode lands 7 and 8. . Therefore, conventionally, the expensive positioning device 13 has been used to position the SAW element 1.

Next, after the SAW element 1 is bonded to the case substrate 5, the cap 6 shown in FIG. 2 is covered on the case substrate 5, and the cap 6 and the case substrate 5 are joined again by the reflow soldering method. Join.

[0010]

As described above, when manufacturing the conventional SAW device 12 (FIG. 2), the expensive positioning device 13 must be used to position the SAW element 1 with respect to the case substrate 5. However, there is a problem that not only the operation is complicated but also the cost is high.

Moreover, the cap 6 must be joined after the SAW element 1 is soldered on the case substrate 5, and therefore the joining work with the solders 9 and 10 and the solder 11 are required.
It was necessary to carry out a two-step joining work including the joining work according to.

An object of the present invention is to easily position a SAW element on a case material without requiring an expensive positioning device, and to bond the case materials to each other by S.
S that can be performed in the same process as the joining of the AW element to the case material
An object of the present invention is to provide a method for manufacturing an AW device and such a SAW device.

Another object of the present invention is to provide a method of manufacturing a SAW device which can form a package structure suitable for each SAW device without unifying the size of the SAW device, and a SAW device such as this. It is in.

[0014]

In order to achieve the above-mentioned object, the inventors of the present invention use the surface tension of the molten solder to position the SAW element on the case material, thereby making an expensive positioning device. I have proposed a method that can omit the use of. This method will be described with reference to FIGS. 4 and 5.

In this method, the electrode lands 22 and 23 for connecting to the SAW element and the rectangular metal pad 26 for joining the cap 25 are formed on the upper surface of the case substrate 21 made of insulating ceramics.

Next, solder bumps 28a and 29a are formed on the electrode lands 22 and 23, and the solder bumps 28a and 29a are formed.
The SAW element 24 is mounted face down from above a. In this case, at least a part of the terminal electrodes 27a and 27b of the SAW element 24 is positioned so that the solder bump 2
It is performed so that it is located above 8a and 29a.

Next, the solder bumps 3 are formed on the metal pads 26.
0 is applied and the cap 25 is covered. Further, by heating the whole, the solder bumps 28a, 29a, 30a
Is melted and then cooled to perform soldering. In this case, when the solder bumps 28a and 29a are melted, the SAW element 24 moves in the direction of arrow A in FIG. 4 due to the surface tension thereof. That is, the terminal electrode 2
The SAW element 24 is moved so that the centers of 7a and 27b are accurately positioned with respect to the electrode lands 22 and 23.

As a result, the SAW element 24 is attached to the case substrate 2
Even when the positioning is roughly performed with respect to No. 1, as shown in FIG. 5, accurate positioning of the terminal electrodes 27a and 27b of the SAW element 24 with respect to the electrode lands 22 and 23 is achieved, and the solder 28 and 29 are used for joining. To be done. Also, solder 30
The bonding of the metal cap 25 to the case substrate 21 by means of the above can be performed in the same step as the bonding of the SAW element 24 to the case substrate 21.

However, in the above method, the SAW element 24 is positioned by the so-called self-alignment effect by utilizing the surface tension of the solder, but in the case of utilizing the above effect, the side surface 24b of the SAW element 24 is used. And the clearance between the inner wall 25a of the cap 25 and the solder bumps 28a, 29a must be equal to or less than the diameter of the solder bumps 28a, 29a.

On the other hand, the size of the SAW element 24 greatly differs depending on the target SAW device. Therefore, when the above method is used, the case substrate 21 and the cap 25
In order to keep the clearance between the inner side wall of the package formed by and the side surface of the SAW element 24 to be equal to or less than the diameter of the solder bumps 28a, 29a, cases of various sizes depending on various sizes of SAW elements. Substrate 21 and cap 25
Had to prepare. Therefore, there has been a problem that a die cost for constructing the package is high and various manufacturing facilities must be prepared according to the size of the SAW element.

However, regardless of the number of IDTs or the number of electrode fingers forming the IDTs, if the surface acoustic wave substrate of the largest size SAW element is used, the substrate size of all SAW elements is unified. The above problems can be solved. However, in that case, the SAW element that can be configured with a small surface wave substrate also needs to have a large chip size, which causes a problem that the surface wave substrate material is expensive.

Therefore, the inventor of the present invention, in the method capable of performing the positioning of the SAW element by utilizing the self-alignment effect of the molten solder described above, does not require packages of various various sizes and manufacturing equipments of various sizes. S
The present invention has been accomplished in an attempt to provide a method applicable to an AW element.

That is, the method of manufacturing an electronic component of the present invention comprises the steps of preparing a first case member having a plurality of electrode lands formed on the upper surface thereof, and providing solder bumps on the plurality of electrode lands. , On the upper surface of the first case material,
A step of placing an electronic component element having an electrode for external electrode connection so that at least a part of the electrode for external connection is located above the solder bump; and the electronic component bonded to the first case member. A step of combining a second case member, which constitutes a package having an internal space for accommodating the element, with the first case member; and an internal component for restricting a lateral movement of the electronic component element in the package. The step of arranging the positioning guide so that the clearance between the side surface and the side surface of the electronic component element is equal to or smaller than the diameter of the solder bump, and the solder bump is melted by heating, and the electrode land of the first case member is melted. And a step of soldering the electrode for external connection of the electronic component element, the method for manufacturing an electronic component.

The lateral direction is a direction parallel to the main surface of the SAW element, and in the case of a rectangular electronic component element,
Long-side direction or short-side direction. Further, in the expressions of the lateral dimension of the electronic component element and the lateral dimension of the package internal space, the both lateral directions are the same direction.

The step of arranging the positioning guide for regulating the lateral movement of the electronic component element may be carried out at any stage as long as possible.
That is, the positioning guide may be fixed to the upper surface of the first case material prepared in advance, or the positioning guide may be integrally formed of the same material as the first case material. Further, the positioning guide may be fixed to the second case material in advance, or the positioning guide may be integrally formed of the same material as the second case material. Furthermore, a positioning guide, which is a member separate from the first and second case members, may be arranged in the internal space of the package when the first and second case members are combined. However, the positioning guide needs to be arranged in the internal space of the package before the step of mounting the electronic component element on the upper surface of the first case member.

Further, in a specific aspect of the present invention, the electronic component element has a rectangular plate-like shape having a first opposing two side surface and a second opposing two side surface, and the positioning guide includes: The inner side surface of the positioning guide is arranged so that the movement of the electronic component element in both the first direction connecting the first opposing two side surfaces and the second direction orthogonal to the first direction is restricted.
The clearance is arranged so as to be separated from one of the first opposite two side surfaces and one of the second opposite two side surfaces.

Further, the positioning guide may be composed of a single rectangular annular guide member. Alternatively, the positioning guide may be configured to have at least first and second guide members, and in that case, the first and second guide members are opposed to the rectangular plate-shaped electronic component element. It is arranged in a distributed manner at a pair of corners that meet each other.

The positioning guide may be fixed to at least one of the first case member and the second case member. In this case, when the positioning guide is composed of a plurality of members, the positioning guides may be dispersed and fixed to the first and second case members.

The positioning guide may be integrally formed of at least one of the first and second case members with the same material. Also in this case, when the positioning guide is composed of a plurality of guide members, the positioning guides may be dispersed in the first and second case members.

Further, according to a specific aspect of the present invention, the electronic component element is a SAW element, and the SAW element is mounted on the first case member in a face-down manner. The electronic component of the present invention is obtained by the method of manufacturing an electronic component of the present invention, and includes a first case member having a plurality of electrode lands formed on its upper surface, and an electrode land of the first case member. An electronic component element having an external connection electrode joined by solder to the second case member, and a second case member that is joined to the first case member to form a package having a space for accommodating the electronic component element inside; In order to regulate the lateral movement of the electronic component element in the internal space of the package, the clearance between the inner side surface and the side surface of the electronic component element is arranged to be equal to or smaller than the diameter of the solder bump. An electronic component including a positioning guide.

[0031]

In the manufacturing method of the present invention, the electronic component element is placed on the upper surface of the first case member after the positioning guide is arranged. In this case, since the clearance between the inner side surface of the positioning guide and the side surface of the electronic component element is configured to be equal to or smaller than the diameter of the solder bump, at least a part of the external connection electrode of the electronic component element is formed. , Surely located above the solder bumps. Therefore, due to the surface tension of the solder when the solder is melted by heating, the electronic component element is moved so that the external connection electrode is located directly above the solder, and by extension, the electrode land of the first case material. That is, the external connection electrode of the electronic component element is accurately positioned with respect to the electrode land on the first case material by utilizing the self-alignment effect due to the surface tension of the solder.

Therefore, the external connection electrode of the electronic component element can be reliably bonded to the electrode land without accurately and uniquely plating the electronic component element in advance by using an expensive positioning device.

Further, in the manufacturing method of the present invention, since the positioning guide is arranged in the internal space of the package, the solder can be used as long as the electronic component element is inserted into the area surrounded by the positioning guide. The positioning is performed so that at least a part of the external connection electrode is located above the bump.

Also, an outer surface of the positioning guide,
As long as the positioning guide is configured so that the clearance between the side surface of the electronic component element and the diameter of the solder bump can be set to be equal to or smaller than the diameter of the solder bump, the electronic component element of various sizes can be accommodated. That is, since it is possible to deal with electronic component elements of various sizes simply by changing the dimension of the positioning guide without changing the dimension of the package, it is possible to configure various types of packages for various types of packages. There is no need to prepare a mold. Further, since it is not necessary to make the sizes of the electronic component elements uniform, it is possible to reduce the material cost of the piezoelectric substrate or the like which constitutes the electronic component element.

In the manufacturing method of the present invention, since the electronic component element can be positioned by the surface tension of the solder, the first and second case members are joined to the first case member of the electronic component element. It can also be performed in the same step as the joining. That is, in a state in which the electronic component element is placed on the first case member, the second case member is further combined with the first case member through solder or thermosetting resin adhesive, and the electronic component is heated. It is also possible to perform both the joining of the element and the first case material and the joining of the first and second case materials in the same step.

Further, in the electronic component of the present invention, since the positioning guide having the inner side surface having a predetermined clearance with respect to the side surface of the electronic component element is arranged in the package inner space, the first case member top The external connection electrodes of the electronic component element are reliably positioned and soldered to the electrode lands. Therefore, it is possible to provide an electronic component having excellent reliability of electrical connection with the outside.

[0037]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be clarified by describing embodiments with reference to the drawings.

In the manufacturing method of one embodiment of the present invention, first,
The case substrate 41 shown in FIG. 6 is prepared as a first case material. As the case substrate 41, an insulating ceramic such as alumina or a material having an appropriate insulating surface such as a metal plate having an insulating surface coated can be used.

On the upper surface of the case substrate 41, the SAW element 2
Electrode lands 42 and 43 for joining 4 are formed. Further, near the outer peripheral edge of the upper surface of the case substrate 41,
A metal pad 46 for joining the cap 45 as the second case member is formed in a square ring shape.

The SAW element 24 constitutes the electronic component element of the present invention, and has the same configuration as the SAW element 1 shown in FIG. That is, the SAW element 24 includes a pair of IDTs on the lower surface side of the surface acoustic wave substrate 24a shown in FIG.
And a structure in which four terminal electrodes as external connection electrodes are formed. However, in FIG. 6, among the four terminal electrodes, only the terminal electrodes 27a and 27b are shown.
Therefore, the SAW element 24 is fixed to the case substrate 41 by the face-down method as described above.

Further, in this embodiment, a positioning guide 47 is formed integrally with the case substrate 41 on the upper surface of the case substrate 41. The positioning guide 47 is formed so as to project upward on the upper surface of the case substrate 41. Also,
The planar shape of the positioning guide 47 is a square ring shape, as is clear from FIG. 7, which is a plan view of the case substrate 41.

As described above, when the positioning guide is composed of a single annular member, it can be formed in a square ring shape or a circular ring shape depending on the shape of the corner outer circumference of the electronic component element.

An inner surface 47a of the positioning guide 47,
The clearance between the inner side surface 47a and the side surface 24b of the SAW element 24 facing each other is set to a diameter φ or less of a solder bump described later. In this case, the lateral clearance between the positioning guide 47 and the side surface 24b of the SAW element 24 is the inner side surface of the positioning guide 47 and the SAW element 2 facing the inner side surface.
4 It is the clearance between the sides. Therefore, the inner side surface 47b on the long side of the positioning guide 47 shown in FIG.
The clearance between the SAW element 24 and the side surface 24b on the long side is smaller than the diameter φ of the solder bump described later.

In the present embodiment, the SAW element 24 is fixed to the case substrate 41 as follows. First,
Solder bumps 28a and 29a are provided on the electrode lands 42 and 43 of the case substrate 41 as shown in FIG. In the present embodiment, the solder bumps 28a, 29a have a hemispherical shape and have a diameter of φ. Solder bumps 28a, 2
The diameter φ of 9a is made substantially equal to the diameter of the electrode lands 42 and 43.

Further, the solder bump 3 is formed on the metal pad 46.
Apply 0a. The solder bump 30 is formed on the metal pad 4
It is provided so as to cover the entire upper surface of 6, that is, in the shape of a square ring.

Next, as shown in FIG. 6, the SAW element 24
Is inserted and arranged in the area surrounded by the positioning guide 47. In this case, the accurate positioning of the SAW element 24 is not necessary, and it is sufficient if the SAW element 24 is arranged within the area surrounded by the positioning guide 47. That is, the inner side surface 47a of the positioning guide 47 is a SAW that faces the inner side surface.
Since the side surface of the element 24 and the clearance are arranged apart from each other, the SAW element 24 is simply inserted into the area surrounded by the positioning guide 47, so that the terminal electrodes 27a, 27 are formed.
The SAW element 24 is positioned so that at least a part of b is located above the solder bumps 48 and 49.

In the state shown in FIG. 6, the terminal electrodes 27a,
The center of 27b is displaced to the left from the centers of the solder bumps 48 and 49, as in the case shown in FIG. Then the second
The metal cap 45 as the case material of the case substrate 41
Cover. In this case, the metal cap 45 is covered on the case substrate 41 so that the lower end surface of the metal cap 45 contacts the solder bump 30a.

After that, the solder bumps 48a, 49a, 30 are melted by the reflow soldering method, and then cooled to perform soldering. In this case, when the solder bumps 48a and 49a are melted, the surface tension of the solder causes the terminal electrodes 27a and 27b to move to the solder bumps 48a and 49a.
so as to be located immediately above a, that is, the electrode lands 42,
The SAW element 24 is moved so as to be located directly above 43.

As a result, as shown in FIG. 8, the terminal electrodes 27a and 27b of the SAW element 24 become the electrode lands 22 and 2.
The SAW element 24 is fixed to the case substrate 41 by the solders 48 and 49 while being positioned so that the centers thereof are substantially aligned with each other. Also, the solder 48,
49, the terminal electrodes 27a and 27b and the electrode land 4
The electrical connection between 2, 43 will be established.

Further, the metal cap 45 is also joined to the case substrate 41 by the solder 30 by the above soldering. As described above, according to the manufacturing method of this embodiment, the SAW is set in the area surrounded by the positioning guide 47.
Just by mounting the element 24, the surface tension of the solder causes S
Since the AW element 24 moves, the accurate positioning of the terminal electrodes 27a and 27b of the SAW element 24 with respect to the electrode lands 42 and 43 is achieved.

Moreover, when SAW elements 24 having different sizes of the surface acoustic wave substrate 24a are used, it is only necessary to change the dimension of the positioning guide 47 according to the dimension of the surface acoustic wave substrate. That is, the positioning guide 4
The dimension of the positioning guide 47 is simply changed so that the clearance between the inner side surface 47b of No. 7 and the side surface of the newly prepared SAW element facing the inner side surface is equal to or less than the diameter φ of the solder bump. Can respond. Therefore,
By changing the positioning guide 47, SAW elements of various sizes can be dealt with.

Further, even when the size or forming position of the positioning guide 47 is changed, the outer size of the case substrate 41 does not have to be changed. Therefore, it is not necessary to greatly change the dies for obtaining the case substrate 41 and the cap 45 as the first and second case materials.

Modifications In the above embodiment, the positioning guide 47 is configured to have a rectangular ring shape and is integrated with the case substrate 41, but the positioning guide of the present invention is variously modified. You can

FIG. 9 is a plan view of a case substrate showing a first modification of the positioning guide. Here, the guide members 51 to 54 are arranged on the upper surface of the case substrate 41 inside the corners. Each guide member 51-54
Are fixed to the upper surface of the case substrate 41 so as to project upward from the upper surface of the case substrate 41. In addition, each of the guide members 51 to 54 has a substantially L-shaped planar shape, and therefore, is orthogonal to the first direction and the first direction connecting the first two opposite side surfaces of the rectangular SAW element 24. It is configured to regulate the movement of the SAW element 24 in both the first and second directions. That is, each guide member 51 to
The inner side surface of 54 is one of the first opposing two side surfaces and the second side surface.
Is arranged so as to be separated from one of the two opposite side surfaces of the above-mentioned clearance.

In the example shown in FIG. 9, the case substrate 4
Although the guide members 51 to 54 are arranged at the corners of No. 1, only the guide members 51 and 54 or only the guide members 52 and 53 may be provided. That is, only one set of the guide members 51, 54 or another set of the guide members 52, 53 dispersedly arranged at a pair of facing corner portions of the rectangular plate-shaped SAW element may be formed. .

FIG. 10 is a sectional view of a SAW device for explaining a second modification of the positioning guide. Figure 10
In the modification shown in (1), the positioning guide 55 is formed on the lower surface of the metal cap 45 as the second case member. That is, the positioning guide of the present invention may be configured on the side of the second case member that constitutes the package.

FIG. 11 is an exploded sectional view for explaining still another example of the positioning guide of the present invention. In this embodiment, a positioning guide 56 made of insulating ceramics, synthetic resin or an appropriate synthetic material is prepared as a separate member on the case substrate 41, and is fixed on the case substrate 41 using an insulating adhesive. It The other points are similar to those of the embodiment shown in FIG. in this way,
The positioning guide of the present invention may be composed of a member different from the first and second case members.

In the above-described embodiment, the first and second case members are joined by soldering, but the first and second case members are joined by using an adhesive made of a thermosetting resin such as epoxy resin. You may join case materials. Even in that case,
In the heat treatment for curing the adhesive made of the thermosetting resin, the step of joining the SAW element to the first case member with solder can be simultaneously performed.

Further, in the above embodiment, the case where the SAW element 24 is used as the electronic component element has been described, but the present invention also has a structure in which the electronic component element other than the SAW element is housed in the package. Generally applicable.

[0060]

As described above, in the production method of the present invention,
By placing the electronic component element on the first case material in a region surrounded by the positioning guide and performing heat treatment, the external connection electrode of the electronic component element is formed on the first case material. It can be reliably bonded to the land. Therefore, an expensive positioning device which has been required in the past is not required, so that the manufacturing cost of electronic components can be reduced.

Moreover, it is also possible to carry out the joining of the electronic component element to the first case member by soldering and the joining of the first and second case members by heating in the same step. Therefore, it is possible to simplify the manufacturing process of the electronic component having a structure in which the electronic component element is sealed in the package formed of the first and second case materials.

In addition, the present invention can be applied to the manufacture of electronic parts using electronic part elements of various sizes simply by preparing a positioning guide according to the size of the electronic part element.

Therefore, it is possible to deal with electronic component elements of various sizes without changing the outer dimensions of the first and second case members for forming the package. Therefore, the die cost for obtaining the package constituent member can be reduced.

In the electronic component of the present invention, since the electronic component element is accurately positioned on the electrode land on the first case member as described above, the reliability of the electrical connection between the electronic component element and the outside is improved. Therefore, it is possible to provide a highly reliable packaged electronic component at low cost.

[Brief description of drawings]

FIG. 1 is a plan view of a SAW element.

FIG. 2 is a sectional view for explaining the structure of a conventional electronic component.

FIG. 3 is a sectional view for explaining a step of positioning an electronic component element in a conventional manufacturing method.

FIG. 4 is a manufacturing method based on which the present invention is made,
Sectional drawing which shows the state which combined the SAW element and the cap with the case substrate.

5 is a cross-sectional view showing a SAW device as an electronic component obtained after the step shown in FIG.

FIG. 6 is a sectional view showing a state in which the SAW element and the cap are combined with the case substrate in the first embodiment of the present invention.

FIG. 7 is a plan view of a case substrate.

FIG. 8 is a sectional view showing a SAW device as an electronic component obtained according to the first embodiment of the present invention.

FIG. 9 is a plan view of a case substrate for explaining a first modified example of the positioning guide.

FIG. 10 is a sectional view of a SAW device for explaining a second modification of the positioning guide.

FIG. 11 is an exploded cross-sectional view of a SAW device for explaining a third modification of the positioning guide.

[Explanation of symbols]

 24 ... SAW element (electronic component element) 27a, 27b ... Terminal electrode (external connection electrode) 41 ... Case substrate (first case material) 42, 43 ... Electrode land 45 ... Metal cap (second case material) 46 ... Metal pad 47 ... Positioning guide 48a, 49a ... Solder bump 48, 49 ... Solder 51-54 ... Guide member 55 ... Positioning guide 56 ... Positioning guide

Claims (8)

[Claims] 1. A step of preparing a first case material having a plurality of electrode lands formed on an upper surface thereof, a step of applying a solder bump on the plurality of electrode lands, and a step of providing a first case material on the upper surface of the first case material. A step of placing an electronic component element having an electrode for external electrode connection so that at least a part of the electrode for external connection is located above the solder bump, and the electronic component bonded to the first case member A step of combining a second case member constituting a package having an internal space for accommodating a component element on the first case element, and for restricting lateral movement of the electronic component element in the package, A step of arranging a positioning guide so that a clearance between the inner side surface and the side surface of the electronic component element is equal to or smaller than a diameter of the solder bump; And the electrode lands of the case member, characterized in that it comprises the step of soldering the external connection electrode of the electronic component element, the method of manufacturing an electronic component. 2. The electronic component element has a rectangular plate shape having a first two opposite side surfaces and a second two opposite side surfaces, and the positioning guide connects the first two opposite side surfaces. In order to restrict the movement of the electronic component element in the first direction and the second direction orthogonal to the first direction, the inner side surface of the positioning guide has one of the first opposing two side surfaces and the second side surface. The method of manufacturing an electronic component according to claim 1, wherein the clearance is disposed so as to be separated from one of the two opposite side surfaces. 3. The method of manufacturing an electronic component according to claim 2, wherein the positioning guide is configured by a rectangular guide. 4. The positioning guide includes at least first and second guide members, and the first and second guide members are a pair of corners of the rectangular plate-shaped electronic component element facing each other. The method for manufacturing an electronic component according to claim 2, wherein the electronic components are arranged so as to be dispersed in parts. 5. The method of manufacturing an electronic component according to claim 1, wherein the positioning guide is fixed to at least one of the first case member and the second case member. 6. The method of manufacturing an electronic component according to claim 1, wherein the positioning guide is integrally formed with at least one of the first and second case members. 7. The electronic component element is a surface acoustic wave element, and the surface acoustic wave element is mounted on a first case member by a face-down method. Electronic component manufacturing method. 8. An electronic component element having a first case member having a plurality of electrode lands formed on an upper surface thereof, an external connection electrode joined to the electrode lands of the first case member by soldering, and A second case member that is joined to one case member to form a package having a space for accommodating the electronic component element inside; and a lateral movement of the electronic component element within the internal space of the package. Therefore, according to the method of manufacturing an electronic component according to claim 1, further comprising: a positioning guide arranged such that a clearance between an inner surface of the electronic component element and a side surface of the electronic component element is equal to or smaller than a diameter of the solder bump. Electronic components obtained.