JPH08203768A - Electronic component and its manufacture - Google Patents

Abstract

PURPOSE: To provide a good quality of multilayer ceramic capacitor which is mountable on small area, and is simple in process, and is low-cost, and is free of short circuit by preventing dislocation in stacking and inferiority in baking. CONSTITUTION: Two pieces of chamfered multilayer ceramic capacitor sintered substance A1 and multilayer ceramic capacitor sintered substance B2 just after baking are bonded with each other in two stages by baking glass liquid together on them, and external electrodes are applied and baked together to make them into one part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a method of manufacturing the same, and more particularly to a monolithic ceramic capacitor used as a passive component of electronic equipment and a method of manufacturing the same.

[0002]

2. Description of the Related Art Electronic parts such as monolithic ceramic parts have made remarkable progress toward miniaturization and large capacity, and have been applied to various consumer devices, converters, power supplies, etc., such as actuators, vibrators, ultrasonic motors, ceramic filters, etc. Widely used. An example of a monolithic ceramic component is a monolithic ceramic capacitor. The manufacturing of the monolithic ceramic capacitor is performed as follows. Disperse and knead using high dielectric ceramic powder, organic resin, and solvent, which are the materials,
Obtain a ceramic slurry, by a doctor blade method, etc., to form a film with a certain thickness on the film subjected to peeling treatment,
Make a green sheet.

A plurality of patterns are printed on the green sheet by screen printing an internal electrode paste kneaded with a low resistance metal powder, an organic resin and a solvent so that a plurality of laminated ceramic capacitor elements can be obtained later, and a mold is formed. After punching and stacking into green sheets and the like, the stacked green sheets are pressure-bonded by hot pressing to obtain a stack.

The laminated body thus obtained is cut into individual monolithic ceramic capacitor elements, subjected to binder removal processing for eliminating the organic resin component used at the time of formation, and then sintered and chamfered, and then laminated inside. A multilayer ceramic capacitor is manufactured by a process of forming external electrodes on both ends of the element so as to take out the formed internal electrode layers.

[0005]

Conventionally, in order to increase the capacitance of a monolithic ceramic capacitor, it has been necessary to increase the number of laminated internal electrodes or increase the area of the internal electrodes.

However, when the number of the internal electrodes is increased, the thickness of the component itself is increased, and there is a drawback that stacking misalignment and firing failure occur.

Further, there is a drawback that the advantage of the monolithic ceramic capacitor that can be mounted in a small space is offset when the area of the internal electrode is enlarged.

There is also a method of stacking two capacitors in two stages without changing the mounting space, but the manufacturing process is complicated by covering the same electrode with a metal cap, and the manufacturing cost is low. It had the drawback of being expensive.

Further, when the capacitors with electrodes are stacked in two stages, there is a drawback that a gap is generated between the chips and the conductive paste penetrates, resulting in a short circuit.

The present invention eliminates these drawbacks, prevents stacking deviations and firing defects, can be mounted in a small area, has a simple process, is low in cost, has no short circuit, and is of excellent quality. It is an object of the present invention to provide an electronic component such as the above and a manufacturing method thereof.

[0011]

SUMMARY OF THE INVENTION According to the present invention, a plurality of laminated ceramic capacitor sintered bodies are stacked and external electrodes are applied and baked so as to cover the end portions of the plurality of laminated ceramic capacitors. It is characterized in that the temperature cycle characteristics and the mounting area are the same as those of the single component, and that a larger capacitance can be obtained.

That is, the present invention is an electronic component characterized in that a plurality of laminated ceramic capacitor sintered bodies are stacked and adhered to each other to form external electrodes. A plurality of laminated ceramic capacitor sintered bodies are stacked and adhered, and external electrodes are applied.
It is a method of manufacturing an electronic component, which is characterized by baking.

[0013]

[Function] A plurality of monolithic ceramic capacitors after chamfering after firing are adhered by glass liquid baking, stacked in layers, coated with external electrodes and baked to produce a single component, which results in misalignment and firing failure. It is possible to provide a monolithic ceramic capacitor with a larger capacitance at a low cost by eliminating defects in the manufacturing process such as short-circuiting of both electrodes due to infiltration of conductive paste, and the mounting area remains the same as that of the monolithic ceramic capacitor alone. it can.

[0014]

Embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the laminated ceramic capacitor sintered body A1 and the laminated ceramic capacitor sintered body B2, which have been chamfered after firing, are stacked in two stages. At this time, for adhesion and insulation of both electrodes, glass liquid 3 is put in between,
The temperature is raised to 600 ° C. over 60 minutes and cooled to room temperature in 20 minutes.

As a result, the two chips are bonded (state shown in FIG. 2), and it is possible to prevent the silver paste from entering the gap between the chips.

Next, the external electrode outlet of this part is
Dip in a mixed paste of silver and lead borosilicate and pull up.

After this is dried, the electrode outlet on the opposite side is similarly manufactured and dried, the temperature is raised to 700 ° C. in 70 minutes, and the temperature is cooled to room temperature in 20 minutes.

Similarly, the external electrodes on both sides are dipped in a silver / platinum mixed paste and pulled up. After it is dried, the temperature is raised to 600 ° C. over 60 minutes and cooled to room temperature for 20 minutes. In this way, a monolithic ceramic capacitor as shown in FIG. 3 is obtained.

20 pieces of each of the sample of the present invention and the sample of the conventional article were taken, and as shown in Table 1, the capacitance and the mounting area were compared with the average value of 20 pieces.

[0021]

In addition, the product of the present invention and a two-tiered sample of a ceramic capacitor with a metal cap were similarly each prepared with two samples.
0 pieces are taken and the test conditions are 125 ° C., 2 WV (50
A high temperature load test was conducted in V). The results are shown in Table 2.

[0023]

Next, 20 pieces of each of the sample of the present invention and a two-layer sample of a ceramic capacitor provided with a metal cap were similarly taken, and the test conditions were 85 ° C. and 85 ° C., respectively.
A humidity resistance load test was conducted at% RH and WV (25V). Table 3 shows the results.

[0025]

Further, the product of the present invention and a two-tiered sample of a laminated ceramic capacitor having a metal cap are similarly prepared.
20 pieces of each were taken, and a temperature cycle test was performed at 55 ° C. to 125 ° C. as a test condition. The results are shown in Table 4.

[0027]

As described above, according to Table 1, Table 2, Table 3, and Table 4, the mounting area of the present invention product is smaller than that of the conventional product,
Further, it can be seen that in the product of the present invention, no defect is observed even in the high temperature load test, the moisture resistance load test, and the temperature cycle test.

The present invention is not limited to the embodiment, but various modifications can be made. For example, although the example of stacking two layers is shown in the embodiment, the number of stacks may be three or more, or may be stacked in two horizontal rows and two vertical rows to be integrated. It can also be applied to other laminated ceramic parts having the same shape.

[0030]

As described above, the present invention has the following advantages. B) It is possible to manufacture a monolithic ceramic capacitor having a larger capacitance with a mounting area equivalent to that of a single monolithic ceramic capacitor. B) By changing the combination of the electrostatic capacities of the two-stage stacked monolithic ceramic capacitor sintered bodies, monolithic ceramic capacitors having various electrostatic capacities can be easily manufactured. C) The reliability is improved as compared with the conventional type in which the chips are integrated by baking the chips together with the glass liquid. Therefore, according to the present invention, it is possible to prevent stacking misalignment and firing defects, to mount in a small area, the process is simple, and the cost is low.
It was possible to provide an electronic component such as a monolithic ceramic capacitor of excellent quality without a short circuit and a manufacturing method thereof.

[Brief description of drawings]

FIG. 1 is an assembled perspective view of a temporary bonding method for a laminated ceramic capacitor according to the present invention.

FIG. 2 is a perspective view of the laminated ceramic capacitor of the present invention after temporary adhesion.

FIG. 3 is a completed perspective view of the monolithic ceramic capacitor of the present invention.

[Explanation of symbols]

 1 Multilayer Ceramic Capacitor Sintered Body A 2 Multilayer Ceramic Capacitor Sintered Body B 3 Glass Liquid

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[Procedure amendment]

[Submission date] December 15, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0027

[Correction method] Change

[Correction content]

(Table 4)

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Claims (2)

[Claims] 1. An electronic component comprising a plurality of laminated ceramic capacitor sintered bodies stacked and adhered to each other to form external electrodes. 2. A method of manufacturing an electronic component, which comprises stacking a plurality of laminated ceramic capacitor sintered bodies, adhering the electrodes, and coating and baking external electrodes.