JPH08203706A - Electronic component manufacturing method - Google Patents

Abstract

(57) [Summary] [Purpose] In the method of manufacturing electronic components such as thermistors, the purpose is to reduce the number of man-hours required for work, labor costs, and equipment costs such as jigs and tools. [Structure] Element 1 having lead terminal portion 2 and lead wire 3
After being connected by the connecting portion 4, insulation coating is performed by the heat shrinkable tube 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component such as a thermistor element used as a sensor for changing a resistance value according to a change in water temperature, oil temperature or the like.

[0002]

2. Description of the Related Art A conventional thermistor element of this type is shown in FIG.
It was supposed to show the structural drawing. That is, the element 1 provided with the lead terminal portion 2 and the lead wire 3 are connected with the connection material 4 and then coated with the resin material 15 to be insulation-coated. When combined with the insulating coating of the element 1 itself, a double coating was formed.

[0003]

However, in the above-mentioned conventional manufacturing method, since it is necessary to immerse the resin material in the resin material and to cure the resin material, it is possible to increase the cost due to the man-hours required for the work, the labor cost, and the equipment cost such as jigs and tools. It was a problem.

The present invention solves the above-mentioned conventional problems, and provides a method of manufacturing an electronic component which reduces costs by reducing man-hours and indirect material costs.

[0005]

In order to achieve this object, the present invention is to provide insulation coating with a heat-shrinkable tube after connecting an element having a lead terminal and a lead wire.

[0006]

According to such a manufacturing method, the insulation coating can be performed only by heating the heat-shrinkable tube, and the work man-hours, the equipment cost, etc. can be reduced and the cost can be reduced.

[0007]

【Example】

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. In the structural diagram of FIG. 1, 1 is an element, in this case a thermistor. Reference numeral 2 is a pair of lead terminals extending in a radial type, 3 is a lead wire, 4 is a connecting portion of solder, and 6 is a heat-shrinkable tube. The heat-shrinkable tube 6 is bifurcated like a pair of pants, and one lead wire 3 is inserted into each of them and heat-shrinked.

The heat-shrinkable tube 6 covers the element 1 by almost half, and the element has a portion 1a exposed from the heat-shrinkable tube and a portion 1b covered. Exposed part 1
Since there is a, the thermistor can detect the external temperature with good responsiveness. On the other hand, since there is the covered portion 1b, the connecting portion 4 is fixed together with the element, which makes it durable.

(Embodiment 2) FIG. 2 is a structural diagram of a second embodiment of the present invention, and the same elements as those in FIG. 1 are represented by the same reference numerals.
In this embodiment, the heat shrink tube 7 has a simple cylindrical shape. After the heat-shrinkable tube 7 is covered, a metal fitting 8 by a stapler is provided between the front and back surfaces of the heat-shrinkable tube 7 in the middle of the two connecting portions 4. The heat-shrinkable tube 7 is in contact with the front and back surfaces at 9 and the connecting portions 4 are electrically insulated from each other. After that, heat is applied to shrink the heat shrink tube to obtain a finished product.

[0010]

As described above, according to the manufacturing method of the present invention, by using the heat shrinkable tube at the connecting portion between the element having the lead portion and the lead wire, it is possible to reduce the work man-hours, the equipment cost, etc. Since this can be achieved, it will lead to an improvement in cost efficiency.

[Brief description of drawings]

FIG. 1 is a plan view of a thermistor element according to a first embodiment of the present invention.

FIG. 2 is a plan view of a thermistor element according to a second embodiment of the present invention.

FIG. 3 is a plan view of a conventional thermistor element.

[Explanation of symbols]

 1 element 2 lead terminal part 3 lead wire 4 connection part 6 heat shrink tube

Claims (4)

[Claims] 1. A method of manufacturing an electronic component, comprising: connecting an element having a lead terminal portion to a lead wire; then covering the connection portion with a heat-shrinkable tube; 2. A device having a pair of radial type lead terminal portions and a pair of lead wires are connected to each other, and then the device and the lead wires are inserted into a heat-shrinkable tube, and the front and back surfaces between the lead wires are connected. A method of manufacturing an electronic component, wherein the heat-shrinkable tube is adhered and fixed to maintain electrical insulation between the lead wires, and the heat-shrinkable tube is contracted to insulate. 3. The method of manufacturing an electronic component according to claim 2, wherein the heat-shrinkable tubes on the front and back sides of the lead wires are bonded with a metal fitting. 4. A heat shrink tube covers approximately half of the element,
The method of manufacturing an electronic component according to claim 1, wherein the element is a thermistor element.