JPH08186382A - Lamination electronic component - Google Patents

Abstract

PURPOSE: To provide lamination electronic component where a part where a solid wiring and a land overlap can be secured even if sheet forming bodies constituting a lamination body slightly deviate, desired characteristics can be obtained by positively connecting both, and a space for arranging a circuit wiring and a circuit element can be secured on the sheet forming body. CONSTITUTION: A lamination electronic component is provided with solid wirings 3 and 4, a capacitor part formed between electrodes 5, and a land 6 formed by covering the exposed parts of the solid wirings 3 and 4 and the surrounding inside a lamination body 10 which is formed by laminating a plurality of ceramic sheets 2. Then, the area of the land 6 continuously increases from an upper layer 8 to a lower layer 9 of the lamination body 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component used in electronic equipment, for example, a module for a mobile communication device,
The present invention relates to a semiconductor package, a laminated electronic component mounted on a hybrid IC or the like.

[0002]

2. Description of the Related Art The structure of a conventional laminated electronic component will be described with reference to FIGS. 4 and 5, taking as an example a circuit element having a capacitor section. In FIGS. 4 and 5, reference numeral 31 denotes a laminated electronic component, which is provided with a laminated body 10 formed by laminating a plurality of ceramic sheets 2 as a sheet molded body. The laminated body 10 has two main surfaces 10a. Have. Here, through holes are formed in each ceramic sheet 2 along the thickness direction, and conductors provided inside the through holes by a method such as filling are continuously arranged in the stacking direction of the ceramic sheets 2. By doing so, the three-dimensional wirings 3 and 4 are formed. Also, on one main surface of each ceramic sheet 2,
Electrodes 5 made of a conductor provided by printing or the like are arranged, and a capacitor portion is formed between a plurality of electrodes 5 that are laminated facing each other in the stacking direction of the ceramic sheets 2. Further, a conductor is provided by a method such as printing on the exposed portions 3a, 4a exposed on one main surface of the ceramic sheet 2 of the three-dimensional wiring 3, 4, and around the exposed portions 3a, 4a, and the land 6 is formed. It is formed. The land 6 is connected to the electrode 5 via the lead wire 7. At this time, in the two ceramic sheets 2 facing each other, the land 6 formed on the exposed portion 3a is connected to the electrode 5 on one of the ceramic sheets 2 and the exposed portion 4a on the other ceramic sheet 2. The land 6 formed above is connected to the electrode 5. In addition, one end of each of the three-dimensional wirings 3 and 4 has a laminated body 10
It is drawn out to one main surface 10a and is connected to a surface circuit (not shown) composed of wiring and resistors on the main surface 10a.
The multilayer electronic component 31 thus configured is mounted on a printed wiring board (not shown), and the capacitor portion formed between the electrodes 5 is connected to the circuit wiring (not shown) on the printed wiring board. It

[0003]

However, in the laminated electronic component 31 configured as described above, when the ceramic sheets 2 are laminated in the manufacturing process, a displacement occurs between the two ceramic sheets 2 facing each other. was there. Further, when firing the laminated body 10, due to the difference in the shrinkage amount of the ceramics forming the two ceramic sheets 2 facing each other,
After firing, the three-dimensional wiring 3, between these ceramic sheets 2,
The positions of the land 4 and the land 6 sometimes deviated. As a result, as shown in FIG. 6, the exposed portions 3b, 4b of the three-dimensional wiring 3, 4 on the facing surface of the one ceramic sheet 2 are exposed.
And the land 6 on the opposite surface of the other ceramic sheet 2 does not overlap with each other or becomes extremely small, so that the two are not connected, and as a result, the desired capacitance cannot be obtained in the capacitor section. I was afraid. In particular, the main surface 10a from which the three-dimensional wirings 3 and 4 are drawn out
When a displacement occurs between the ceramic sheets 2 arranged on the side, the circuit wiring on the printed wiring board on which the laminated electronic component 31 is mounted and the capacitor portion are not connected,
There was a risk that the capacity could hardly be expected.

The exposed portions 3b, 4b of the three-dimensional wiring 3, 4 are also provided.
If the area of the land 6 is increased in order to secure a portion where the land and the land 6 overlap with each other, the space on the ceramic sheet 2 in which other circuit elements such as a resistor and a coil and circuit wiring can be arranged is reduced. , Which has hindered the densification of laminated electronic components.

Therefore, in the present invention, even if a slight displacement occurs between the sheet molded bodies (ceramic sheets) forming the laminated body, a portion where the exposed portion of the three-dimensional wiring and the land overlap each other is secured, and both of them are secured. Providing a laminated electronic component that achieves the desired characteristics by being securely connected, and that secures a space on the ceramic sheet in which circuit elements and circuit wiring can be placed, thereby achieving high density The purpose is to do.

[0006]

In order to achieve the above object, in the present invention, a laminate formed by laminating a plurality of sheet moldings, a circuit element provided between the sheet moldings, and the sheet. A three-dimensional wiring formed of a conductor provided inside a through-hole penetrating the molded body along the thickness direction and drawn out to at least one main surface of the laminate, and an exposure of the three-dimensional wiring on the sheet molded body. And a periphery of the exposed part, or a land provided with a conductor provided on either side and connected to the circuit element, in a laminated electronic component, from one main surface side of the laminated body. It is characterized in that the area of the land is changed continuously or stepwise toward the other main surface side.

[0007]

According to the present invention, the land area is continuously or stepwise increased from one main surface side to the other main surface side of the laminated body constituting the laminated electronic component. Therefore, on one of the main surface sides of the laminated body, even if there is some misalignment between the two sheet molded bodies facing each other, the exposed portion of the three-dimensional wiring and the land of these sheet molded bodies are not separated from each other. The overlapping portion is always formed, and the three-dimensional wiring and the land are surely connected. As a result, the circuit element in the laminated electronic component and the circuit wiring on the printed wiring board on which the laminated electronic component is mounted are securely connected, and desired characteristics can be obtained in the laminated electronic component.

Further, according to the present invention, since the area of the land on the sheet molded body is relatively small on either one of the main surfaces of the laminated body constituting the laminated electronic component, the circuit element and the circuit wiring are The space that can be arranged is not reduced, and the degree of freedom in design is not impaired. Therefore, high density of the laminated electronic component is realized.

[0009]

EXAMPLE The structure of a laminated electronic component according to an example of the present invention will be described with reference to FIGS. The same or corresponding parts as those of the conventional laminated electronic component are designated by the same reference numerals, and the description thereof will be omitted.

1 and 2, reference numeral 1 denotes a laminated electronic component, which is a layer on the one main surface 10a side of a laminated body 10 formed by laminating a plurality of ceramic sheets 2, that is, an upper layer 8.
The area of the land 6 continuously increases in the layer on the other main surface 10a side, that is, in the lower layer 9.

According to the laminated electronic component 1 having the above-described structure, in the lower layer 9, the land 6 has a relatively large area, and between the two ceramic sheets 2 facing each other, the facing surfaces of the three-dimensional wirings 3 and 4 are opposed. The exposed portions 3b and 4b (FIG. 6) on the upper side and the land 6 overlap with each other in a large area, and when the ceramic sheets 2 are laminated in the manufacturing process,
Even if some displacement occurs between the ceramic sheets 2 or the three-dimensional wirings 3 and 4 and the lands 6 are displaced between the ceramic sheets 2 due to the difference in the shrinkage amount of the ceramics during firing, The wirings 3 and 4 and the land 6 are securely connected. Therefore, the capacitor portion formed between the electrodes 5 has a surface circuit (not shown) on the main surface 10a of the laminated body 10 via the land 6 and the three-dimensional wirings 3 and 4.
Securely connected to. Then, when the laminated electronic component 1 is mounted on the printed wiring board, the capacitor section is securely connected to the circuit wiring (not shown) on the printed wiring board via the surface circuit. Capacity is obtained.

Further, on the ceramic sheet 2 which constitutes the upper layer 8, the area of the land 6 is relatively small and a space for arranging other circuit elements such as resistors and coils and circuit wiring is secured, so that the design The degree of freedom of the laminated electronic component 1 is not impaired, and the high density of the laminated electronic component 1 is thereby realized.

Now, another embodiment of the present invention will be described with reference to FIG. In FIG. 3, parts that are the same as or correspond to those in FIG. 1 are given the same reference numerals, and descriptions thereof will be omitted. In FIG. 3, reference numeral 21 is a laminated electronic component, and the area of the land 6 is gradually increased from the upper layer 8 to the lower layer 9 of the laminated body 10. That is, a plurality of land groups 11 including a plurality of lands 6 having the same area are formed, and these land groups 11 are arranged in order from the smallest area. Also in the laminated electronic component 21 configured in this way, the same effect as that of the laminated electronic component 1 can be obtained.

In the above two embodiments, the case where the ceramic sheet is used as the sheet molded body has been described. However, when a plurality of sheet molded bodies made of a material other than ceramic are laminated to form a laminated body. The present invention can be applied.

Further, in the above-mentioned two embodiments, the laminated electronic component having the capacitor portion as the circuit element therein has been described. However, in addition to the capacitor portion, the laminated electronic component internally having the circuit element such as a resistor and a coil. Also,
The present invention can be applied.

Further, in the above two embodiments, the case where the three-dimensional wiring is drawn out only on one main surface of the laminated body has been described, but the laminated electronic component having the three-dimensional wiring drawn out on both main surfaces of the laminated body is described. Also, the present invention can be applied.

Further, in the above two embodiments, the case where the land is provided on the exposed portion of the three-dimensional wiring regardless of whether or not it is connected to the electrode forming the circuit element will be described. However, the present invention is also applied to the case where the land is provided only for the exposed portion connected to the electrode forming the circuit element and the land is not provided for the exposed portion not connected to the electrode forming the circuit element. it can.

Further, in the above two embodiments, the case where the main surface of the laminated body is provided with the surface circuit including the wiring, the resistance and the like has been described, but the laminated body is not provided with the surface circuit and is mounted at the time of mounting. In addition, the present invention can be applied to a laminated electronic component in which one end of each of the three-dimensional wirings drawn out to the main surface of the laminated body is directly connected to the circuit wiring on the printed wiring board.

[0019]

According to the laminated electronic component of the present invention,
The area of the land increases continuously or stepwise from one main surface side to the other main surface side of a laminated body formed by laminating a plurality of sheet molded bodies. Therefore, on one of the main surfaces of the laminated body, between the two sheet moldings facing each other, the exposed portion on the facing surface of the three-dimensional wiring and the land overlap with each other. Thereby, when stacking the sheet molded bodies in the manufacturing process, even if a slight positional deviation occurs between the sheet molded bodies, the connection between the three-dimensional wiring and the land can be ensured. Further, when the sheet molded body is made of ceramic, when the laminated body is fired, even if the positions of the three-dimensional wiring and the land are deviated between the sheet molded bodies due to the difference in the shrinkage amount of the ceramic, the three-dimensional wiring and the land The connection with is surely made. Therefore, when the laminated electronic component is mounted on the printed wiring board, the circuit element in the laminated electronic component is
It is surely connected to the circuit wiring on the printed wiring board via the land and the three-dimensional wiring, whereby desired characteristics can be obtained in the laminated electronic component.

Further, according to the laminated electronic component of the present invention, the area of the land arranged on one of the main surfaces of the laminated body is relatively small, and the space for arranging other circuit elements and circuit wiring is provided. Since it is secured, the degree of freedom in design is not impaired,
As a result, high density of the laminated electronic component is realized.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts of a laminated electronic component according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of essential parts of a laminated electronic component according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of essential parts of a laminated electronic component according to another embodiment of the present invention.

FIG. 4 is a sectional view of a main part of a conventional laminated electronic component.

FIG. 5 is an exploded perspective view of essential parts of a conventional laminated electronic component.

6 is a partially enlarged view of the laminated electronic component shown in FIG.

[Explanation of symbols]

1, 21 Laminated electronic component 2 Ceramic sheet (sheet molded body) 3, 4 Three-dimensional wiring 3a, 4a Exposed part 6 Land 10 Laminated body 10a Main surface

Claims (1)

[Claims] 1. A laminate formed by laminating a plurality of sheet compacts, a circuit element provided between the sheet compacts, and a through hole penetrating the sheet compact in the thickness direction. Provided on at least one of the main surfaces of the laminated body, and the exposed portion of the three-dimensional wiring and the periphery of the exposed portion on the sheet molded body, or one of them. In a laminated electronic component comprising a conductor and a land connected to the circuit element, from one main surface side of the laminate to the other main surface side,
A laminated electronic component, wherein the area of the land is changed continuously or stepwise.