JPH08176516A - High frequency heat bonding method for inorganic base materials - Google Patents

Abstract

(57) [Summary] [Object] The present invention is capable of preheating and removing moisture of an adherend in a short time by high-frequency heating, and curing the adhesive in a short time by self-heating the adhesive by high-frequency heating. Accordingly, it is an object of the present invention to provide a high-frequency heat-bonding method for an inorganic base material, which can bond an adherend in a short time. A high-frequency heating and bonding method for an inorganic base material according to the present invention comprises a first step of heating the bonding sites of two flat plate-shaped inorganic base materials 11, 12 before bonding by high-frequency heating, and After the step 1, two flat inorganic base materials 11 and 12
Second step of applying the adhesive agent 23 to the bonding site of the plate, and after this second step, two flat inorganic base materials 11 and 12
And a third step of heating the adhesive 23 with high frequency under pressure so that the adhesive surface of the adhesive abuts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an inorganic base material (for example, fiber gypsum board, calcium silicate board, porcelain tile, lightweight expanded concrete, wood cement board, etc.) used as a noncombustible (fireproof) outer wall material for buildings. Composite non-combustible plate, etc.)
The present invention relates to a high-frequency heat-bonding method for an inorganic base material for bonding a substrate.

[0002]

2. Description of the Related Art Conventionally, since the outer wall of a building is required to have weather resistance to withstand wind, rain, ultraviolet rays, temperature, etc.,
For example, inorganic base materials such as fiber gypsum board, calcium silicate board, porcelain tile, lightweight foam concrete, wood cement board, and composite noncombustible board are used.

FIG. 4 shows an example of an exterior corner post used for an outer wall of a corner of a building. That is, one side surface of each of the two flat plate-shaped inorganic base materials 1 and 2 is processed to 45 °, and the adhesive 3 is applied to each side surface of the flat plate-shaped inorganic base materials 1 and 2 processed to 45 °. After that, the flat inorganic base materials 1 and 2
At 90 °, the sides coated with adhesive 3 are overlapped so that they come into contact with each other, and then fixed for several tens of hours (summer season: about 12 hours, winter season: about 24 hours) while being fixed with a clamping jig. By curing the adhesive 3 with the flat plate-shaped inorganic base material 1
And 2 were adhered at a substantially right angle (error at 89 °: + 1 ° to −2 °).

5 (a), (b), (c), (d),
(E) shows another example in which two flat plate-shaped inorganic base materials 4 and 5 are bonded by an adhesive agent 6, respectively. That is, FIG. 5 (a)
Shows an example in which one side surface of the plate-shaped inorganic base material 5 is bonded to the upper surface side portion of the plate-shaped inorganic base material 4 with the adhesive 6.
FIG. 5B shows an example in which one side surface of the plate-shaped inorganic base material 5 is adhered to the central portion of the upper surface of the plate-shaped inorganic base material 4 with an adhesive 6, and FIG. 5D shows an example in which the lower surface of the flat plate-shaped inorganic base material 5 is superposed on the upper surface of the flat plate-shaped inorganic base material 5 with an adhesive 6, and FIG. An example in which one side surface of the material 5 is adhered with an adhesive 6 so that the upper surfaces of the base materials 4 and 5 are flush with each other is shown. FIG. 5E shows a flat plate on the upper surface side portion of the flat inorganic base material 4. An example in which the lower surface side portions of the inorganic base material 5 are superposed on each other and bonded by the adhesive 6 will be described. Figure 5
Also in (a) to (e), they were adhered by the same method as in FIG.

[0005]

However, such a conventional bonding method has a drawback that it takes a long time (summer: about 12 hours, winter: about 24 hours) to cure the adhesive.

Further, the conventional bonding method requires a space proportional to the number and size of products as a space for bonding work.

Further, a huge number of pressing jigs, which is the same as the number of products manufactured in one day, are required.

Since the manufacturing process takes time, there is a drawback that it is difficult to cope with automatic line production. In addition, there are drawbacks such as difficulty in responding to emergency demand such as replacement of defective products.

The present invention has been made in view of the above circumstances, and preheats and removes water from an adherend in a short time by high-frequency heating, and causes the adhesive to self-heat by high-frequency heating in a short time. It is an object of the present invention to provide a high-frequency heat-bonding method for an inorganic base material, which can bond an adherend in a short time by carrying out curing.

[0010]

In order to achieve the above object, the method of high-frequency heating and bonding of an inorganic base material of the present invention comprises a first step of heating the bonding site of the adherend before bonding by high-frequency heating. After the first step, a second step of applying an adhesive to the adhesion site of the object to be adhered, and after the second step, pressure was applied so that the adhesion surface of the object to be adhered abuts. And a third step of heating the adhesive surface by high frequency in this state.

[0011]

According to the present invention, the high-frequency heating preheats and removes water from the adherend in a short time, and the high-frequency heating self-heats the adhesive to cure the adhesive in a short time. The bonded objects can be bonded in a short time, the space for bonding work can be reduced by performing continuous batch processing, and a pressing jig for standing can be eliminated and automatic line can be easily performed.

[0012]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 to FIG. 3 are configuration explanatory views showing a method of manufacturing an exterior corner corner column according to an embodiment of the present invention. That is, FIG. 2 shows high-frequency heating (preheating) of the bonding site of the bonded object before bonding.
Shows the first step of raising the temperature by, for example, fiber gypsum board,
Two flat inorganic base materials 11, 12 such as calcium silicate board, porcelain tile, lightweight foam concrete, wood cement board, composite non-combustible board, etc. are processed to 45 ° on one side, respectively. 45 for 11 and 12 respectively
When the side surface processed to be ° is set between the upper and lower electrodes 13 and 14, and high frequency power having different voltage polarities is supplied from the high frequency power supply 15 to the upper and lower electrodes 13 and 14, a high frequency electromagnetic field is generated between the electrodes 13 and 14. 2 tabular inorganic base materials 1
The side surfaces of each of 1 and 12 processed at 45 ° are dielectrically heated to raise the temperature (80 ° C or higher) in a short time (several tens of seconds) and remove water (reduce the water content). in this case,
When the temperature is raised with respect to the entire plate-shaped inorganic base materials 11 and 12, distortion is likely to occur in the plate-shaped inorganic base materials 11 and 12. Therefore, the strain can be suppressed by intensively heating and raising the temperature of only the side surfaces of the flat inorganic base materials 11 and 12 processed to 45 °.

FIG. 3 shows a second step of applying an adhesive to the adhesion site of the adherend after the first step, and the first step.
After the above step is completed, two flat inorganic base materials 11 and 12 are formed.
To the second step position, and the adhesive is applied to the side surfaces of the two flat inorganic base materials 11 and 12 that have been heated and water removed in the first step and processed at 45 °, respectively. The adhesive is sprayed from the nozzles 16 and 17 for application. First
Two flat plate-like inorganic base materials 11 and 1 heated in the process of
When the adhesive is applied to the side surface of No. 2, the adhesive heats up due to heat conduction. As the adhesive, for example, a urethane type (organic solvent-containing toluene) or an epoxy type (two-component) having excellent weather resistance and durability can be used.

FIG. 1 shows a third step of high-frequency heating the adhesive surface of the object to be adhered so that the adhesive surface is pressed against the surface after the second step, and the second step is completed. After 2
The plate-shaped inorganic base materials 11 and 12 are conveyed to the third step position, and processed into 45 ° of each of the two plate-shaped inorganic base materials 11 and 12 to which the adhesive is applied in the second step. Positioning of the bonding portions is performed by positioning members 20, 21 having positioning cylinders 18, 19 respectively, and electrodes 24, 25 having electrode lifting cylinders 22 so that the formed side surfaces are brought into abutting contact with each other. In this case, the two flat inorganic base materials 11 and 12 are arranged at right angles. Then, the pressurizing cylinders 26 and 27 pressurize the two side faces of the flat inorganic base materials 11 and 12 into contact with each other, and in this pressurizing state, the upper and lower electrodes 24 and 25 are pressed.
When high frequency power having different voltage polarities is supplied to the high frequency power supply 28, a high frequency electromagnetic field is generated between the electrodes 24 and 25,
The adhesive 23 interposed between the two flat inorganic base materials 11 and 12 is dielectrically heated and the adhesive 2 is applied in a short time (tens of seconds).
The hardening acceleration of No. 3 is measured, and after a short pressurizing and cooling time, the two flat inorganic base materials 11 and 12 complete the adhesion.

As described above, the fluidity and the permeability of the adhesive 23 applied to the portion heated by the preheating are improved, and reliable adhesion can be obtained. Further, since the adhesive 23 is heated again by the high-frequency electromagnetic field when the initial temperature of the adhesive 23 rises, the curing time can be significantly shortened. Furthermore, since the initial adhesion (curing) is obtained by the high-frequency heat treatment, it can be transferred to the next process and processed in a short curing time.

As described above, according to this embodiment, the inorganic base material can be bonded in a short time (several tens of seconds), for example, in the structure of the exterior corner column of the structure. Further, by performing the continuous batch processing, the space for the bonding work can be reduced, a pressing jig is not required, and the automatic line can be easily performed.

In the above embodiment, the exterior corner post as shown in FIG. 4 has been described, but the present invention is not limited to this, and FIG.
The same method can be used to bond the inorganic base materials as shown in (a) to (e).

[0019]

As described above, according to the present invention, it is possible to preheat and remove water in an object to be adhered in a short time by high-frequency heating. By curing the adhesive, the adherends can be bonded in a short time, and the space for bonding work can be reduced by performing continuous batch processing, and no clamping jig is required and automatic line operation is easy. It is possible to provide a high-frequency heat-bonding method for an inorganic base material that can be performed.

[Brief description of drawings]

FIG. 1 is a configuration explanatory view showing a third step according to an embodiment of the present invention.

FIG. 2 is a structural explanatory view showing a first step according to an embodiment of the present invention.

FIG. 3 is a structural explanatory view showing a second step according to an embodiment of the present invention.

FIG. 4 is a perspective view showing an example of an exterior projection corner column used for a corner outer wall of a building.

5 (a), (b), (c), (d), and (e) are front views each showing an example in which two plate-shaped inorganic base materials are bonded by an adhesive.

[Explanation of symbols]

1, 2 ... Flat inorganic base material, 3 ... Adhesive agent, 4,5 ... Flat inorganic base material, 6 ... Adhesive agent, 11, 12 ... Flat inorganic base material, 13, 14 ... Electrode, 15 … High frequency power supply, 1
6, 17 ... Adhesive coating nozzle, 18, 19 ... Positioning cylinder, 20, 21 ... Positioning member, 22 ... Electrode lifting cylinder, 23 ... Adhesive, 24, 25 ... Electrode, 2
6, 27 ... Pressurizing cylinder, 28 ... High frequency power source.

Claims (1)

[Claims] 1. A first step of raising the temperature of an adhesion site of an object to be adhered by high frequency heating, and a second step of applying an adhesive to the adhesion site of the object to be adhered after the first step. An inorganic base material comprising a step and a third step after the second step, in which the adhesive surface of the object to be adhered is heated so as to contact the adhesive surface with high frequency. High frequency heat bonding method.