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JPH08175837A - Method for cleaving glass plate and apparatus therefor - Google Patents

Method for cleaving glass plate and apparatus therefor

Info

Publication number
JPH08175837A
JPH08175837A JP32311194A JP32311194A JPH08175837A JP H08175837 A JPH08175837 A JP H08175837A JP 32311194 A JP32311194 A JP 32311194A JP 32311194 A JP32311194 A JP 32311194A JP H08175837 A JPH08175837 A JP H08175837A
Authority
JP
Japan
Prior art keywords
line
glass plate
cleaving
glass
bending moment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP32311194A
Other languages
Japanese (ja)
Inventor
Kazuyuki Komagata
和行 駒形
Toru Iseda
徹 伊勢田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP32311194A priority Critical patent/JPH08175837A/en
Publication of JPH08175837A publication Critical patent/JPH08175837A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PURPOSE: To provide a method and device for dividing a plate glass capable or reducing the generation of a glass fine powder at and after dividing and aiming to prevent the divided plane from the generation of micro-cracks by employing a specific means in dividing the plate glass along the projected dividing lines. CONSTITUTION: This method for dividing a plate glass comprises forming a pre-crack 2a becoming a starting point of a dividing line 2 with a dividing tool 3 at the end part of the plate glass 1 on a projected dividing line 2b of the plate glass 1, applying a bending moment around the projected dividing line 2b e.g. by inserting a wedge 5 at the time of or directly after the forming of the pre-crack 2a, then dividing the plate glass 1 by heating the vicinity of the end of the dividing line 2 with a heating means 4 (e.g. a carbon dioxide gas laser) to progress the dividing line 2 on the projected dividing line 2b and also applying the bending moment around the projected dividing line 2b at or just after the progress of the dividing line 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ガラス板の割断方法お
よび装置に関し、特に、ガラスの微粉を発生しにくいガ
ラス板の割断方法および装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for cleaving a glass plate, and more particularly to a method and a device for cleaving a glass plate which hardly generate fine glass powder.

【0002】[0002]

【従来の技術】従来、ガラス板の切断は、超硬合金など
からなる切断ホイールを一定荷重で押し当てながら切り
線を入れたのちに、切り線の回りに折り曲げ力(曲げモ
ーメント)を加えて割断する方法がとられている。
2. Description of the Related Art Conventionally, for cutting a glass sheet, a cutting wheel made of cemented carbide or the like is pressed under a constant load to make a cutting line, and then a bending force (bending moment) is applied around the cutting line. The method of cutting is taken.

【0003】この時、割断線が切り線からはずれるたぐ
いの折り損じを生じさせないようにするためには、切り
線を入れる際に充分大きな荷重を加える必要がある。そ
のため、切断に本来必要なガラス板の厚み方向に進行す
るメディアンクラックのほかに、ガラス板の表面に略平
行に進行するラテラルクラックがガラス表層部に生じ、
これが切り線形成時あるいは割断後に剥離するため、ガ
ラス微粉の発生が避けられない。
At this time, in order to prevent the breaking line from breaking apart from the cutting line, it is necessary to apply a sufficiently large load to the cutting line. Therefore, in addition to the median crack that progresses in the thickness direction of the glass plate originally necessary for cutting, a lateral crack that progresses substantially parallel to the surface of the glass plate occurs in the glass surface layer portion,
Since this is peeled off when the score line is formed or after cutting, generation of fine glass powder is unavoidable.

【0004】このガラス微粉はガラスの載置台等に付着
してガラス表面に微細な傷を付ける原因となるほか、ガ
ラス表面に付着したガラス微粉が洗浄時にガラス表面を
傷つけたり、洗浄により除去できなかったガラス微粉
が、ガラス板の表面を研磨する際もしくはガラス板を重
ねた際などにガラス板の表面に傷をつけたりするという
問題がある。
The fine glass powder adheres to a glass mounting table or the like and causes fine scratches on the glass surface, and the fine glass powder adhered to the glass surface damages the glass surface during cleaning or cannot be removed by cleaning. There is a problem that the fine glass powder may damage the surface of the glass plate when polishing the surface of the glass plate or when stacking the glass plates.

【0005】[0005]

【発明が解決しようとする課題】ところで、比較的ガラ
ス微粉の発生しにくい割断方法として、炭酸ガスレーザ
ーにより熱応力を生じさせてガラスを割断する方法が知
られている(F.P.GaglianoおよびR.M.Lumleyによる報告
(Proc. of the IEEE,vol. 57,no.2, 1969 ))。これ
は、ガラスを任意の形状に割断する方法としても知られ
ている(特公平 3-13040号)。
By the way, as a cutting method in which fine glass powder is relatively less likely to be generated, there is known a method of cutting glass by causing thermal stress by a carbon dioxide laser (report by FP Gagliano and RM Lumley ( Proc. Of the IEEE, vol. 57, no. 2, 1969)). This is also known as a method of cutting glass into an arbitrary shape (Japanese Patent Publication No. 3-13040).

【0006】しかし、これらの方法によっても、ガラス
板を割断する際には、割断の起点になる予備亀裂をガラ
ス板の端部に形成する必要があり、この予備亀裂を形成
する際にガラスの微粉が生ずる。また、それとは別に、
わずかな距離ではあるが一部を残して割断が止まってし
まい、割断がガラス板の反対の端部まで到達しないとい
う問題がある。このとき、ガラス板を、再度折り割った
のでは、充分な寸法精度が得られない場合がある。
However, even by these methods, when the glass plate is cut, it is necessary to form a preliminary crack which becomes the starting point of the cutting at the end portion of the glass plate. Fine powder is produced. Also, apart from that,
There is a problem that the cleaving does not reach the opposite end of the glass plate because the cleaving stops even though it is a short distance, leaving a part. At this time, if the glass plate is broken again, sufficient dimensional accuracy may not be obtained.

【0007】図2はかかる様子を示した割断線の斜視図
であり、ガラス板1の端部に形成された予備亀裂11を
起点に割断線12が形成された様子を示している。13
は切り残し部を示している。
FIG. 2 is a perspective view of the breaking line showing such a state, and shows a breaking line 12 formed from a preliminary crack 11 formed at the end of the glass plate 1 as a starting point. Thirteen
Indicates the uncut portion.

【0008】本発明の目的は、従来の技術が有する前述
の欠点を解消しようとするものである。
The object of the present invention is to eliminate the above-mentioned drawbacks of the prior art.

【0009】[0009]

【課題を解決するための手段】本発明は、前述の課題を
解決すべくなされたものであり、第1に、ガラス板を割
断予定線に沿って割断するガラス板の割断方法におい
て、ガラス板の割断予定線上でガラス板の端部に割断線
の始点となる予備亀裂を形成するとともに、予備亀裂の
形成時もしくは形成直後に割断予定線の回りに曲げモー
メントを加える予備亀裂形成工程と、次いで、割断線の
端部近傍に局所的な加熱を加えることにより、割断予定
線上に割断線を進行させてガラス板を割断するととも
に、割断線の進行中もしくは進行停止直後に割断予定線
の回りに曲げモーメントを加える割断工程とを備えた、
ことを特徴とするガラス板の割断方法を提供する。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. First, in a glass plate cutting method for cutting a glass plate along a planned cutting line, the glass plate is A pre-crack forming step of adding a bending moment around the planned cleavage line at the time of or immediately after the formation of the pre-crack while forming a pre-crack at the end of the glass plate on the planned cleavage line of By applying local heating near the end of the breaking line, the breaking line progresses on the planned breaking line to break the glass sheet, and around the breaking line during or immediately after stopping the breaking line. With a cleaving process that applies a bending moment,
A method for cleaving a glass plate is provided.

【0010】第2にガラス板に割断線の始点となる予備
亀裂を割断予定線に沿って形成する切断工具と、割断線
の端部近傍に局所的な加熱を加える加熱手段と、割断予
定線に沿って加熱手段とガラス板とを相対移動させる加
熱点移動手段と、ガラス板の割断予定線の回りに曲げモ
ーメントを与える曲げモーメント付勢手段とを備えたこ
とを特徴とするガラス板の割断装置を提供する。
Secondly, a cutting tool for forming a preliminary crack as a starting point of the breaking line on the glass plate along the planned breaking line, a heating means for locally heating near the end of the breaking line, and the planned breaking line. Cleaving a glass sheet, comprising: a heating point moving means for moving the heating means and the glass sheet relative to each other, and a bending moment urging means for applying a bending moment around a planned breaking line of the glass sheet. Provide a device.

【0011】[0011]

【作用】本発明においては、割断の起点となる予備亀裂
の形成に曲げモーメントを併用することにより、予備亀
裂の深さを増すことができる。したがって、極めて弱い
荷重下で切断工具を走らせるだけで熱応力割断を生じさ
せるに充分な深さの深い予備亀裂が形成でき、予備亀裂
部においてガラス微粉の発生が抑制できる。
In the present invention, the depth of the preliminary crack can be increased by using the bending moment together with the formation of the preliminary crack which is the starting point of the fracture. Therefore, just by running the cutting tool under an extremely weak load, a deep preliminary crack having a sufficient depth to cause thermal stress fracture can be formed, and the generation of fine glass powder at the preliminary crack portion can be suppressed.

【0012】また、割断予定線の回りに曲げモーメント
を加えながら割断線の終端部近傍に局所的な加熱を加え
ることにより、割断予定線上に割断線を進行させるた
め、終端部の切り残しが生じにくい。
Further, by locally applying heating to the vicinity of the end portion of the split line while applying a bending moment around the planned split line, the split line advances on the planned split line, leaving uncut portion at the end portion. Hateful.

【0013】[0013]

【実施例】以下、本発明の実施例を図面に従って説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.

【0014】図1は本発明の基本的構成の斜視図であ
る。
FIG. 1 is a perspective view of the basic structure of the present invention.

【0015】割断の対象となるガラス板1は、ガラス割
断時の衝撃からガラス板を保護するため、緩衝材の機能
を持つ保護シート6を介して移動テーブル7の上に載置
されている。本例では、移動テーブル7によって加熱点
を移動する。すなわち、加熱手段4は固定されており、
移動テーブルが割断予定線方向に移動することによっ
て、ガラス板と加熱手段とが割断予定線に沿って相対移
動する。
The glass plate 1 to be cleaved is placed on a moving table 7 via a protective sheet 6 having a function of a cushioning material in order to protect the glass plate from an impact when the glass is cleaved. In this example, the moving point is moved by the moving table 7. That is, the heating means 4 is fixed,
When the moving table moves in the planned cutting line, the glass plate and the heating means relatively move along the planned cutting line.

【0016】また、ガラス板1と保護シート7との間の
割断予定線に沿った位置のガラス板端部には、曲げモー
メント付勢手段たる楔5が挿入されている。また、移動
テーブル7は真空吸着可能となっており、また、保護シ
ート6には吸引用の孔が多数開いているため、ガラス板
1が保護シート6上に真空吸着され、ガラス板1に割断
予定線に沿った曲げモーメントが加わる。なお、楔の形
状によっては、ガラス板1の自重によって、ガラス板1
に割断予定線に沿った曲げモーメントを加えることもで
きる。
Further, a wedge 5 as a bending moment urging means is inserted at the end of the glass plate at a position along the planned dividing line between the glass plate 1 and the protective sheet 7. Further, the moving table 7 is capable of vacuum suction, and since the protective sheet 6 has many suction holes, the glass plate 1 is vacuum-sucked on the protective sheet 6 and cut into the glass plate 1. A bending moment along the planned line is added. Depending on the shape of the wedge, the weight of the glass plate 1 may affect the weight of the glass plate 1.
It is also possible to add a bending moment along the planned breaking line to.

【0017】なお、図で、2は割断線、3は予備亀裂の
形成のための切断工具、8は切断工具を支持し、またガ
ラス板に押しつける動作をする切断工具支持押圧手段で
ある。
In the figure, 2 is a breaking line, 3 is a cutting tool for forming a preliminary crack, 8 is a cutting tool supporting and pressing means for supporting the cutting tool and pressing it against the glass plate.

【0018】本例では、加熱点移動手段として、移動テ
ーブル7を用いたが、割断予定線に沿って加熱手段とガ
ラス板とを相対移動させるものであれば、何でもよい。
特に、本例とは逆に、ガラス板1を固定して加熱手段4
を移動させるものであっても構わない。
In this example, the moving table 7 was used as the heating point moving means, but any means may be used as long as it moves the heating means and the glass plate relatively along the planned cutting line.
In particular, contrary to this example, the glass plate 1 is fixed and the heating means 4 is
May be moved.

【0019】加熱手段4については、レーザー光、加熱
空気、燃焼炎などを単独もしくは複合で使用できる。高
い割断精度を得る理由からは、エキシマレーザー、YA
Gレーザー、炭酸ガスレーザまたは一酸化炭素レーザー
などのレーザー光または燃焼炎を使用することが望まし
い。特に、エネルギー吸収効率および経済的な理由か
ら、炭酸ガスレーザーまたは燃焼炎を使用することが望
ましい。
As the heating means 4, laser light, heated air, combustion flame, etc. can be used alone or in combination. Excimer laser, YA
It is desirable to use laser light or a combustion flame such as a G laser, a carbon dioxide laser or a carbon monoxide laser. In particular, for energy absorption efficiency and economic reasons, it is desirable to use a carbon dioxide laser or a combustion flame.

【0020】本発明では、割断予定線上にずれなく割断
線を進行させるために、割断線の端部近傍を局所加熱す
ることが必要である。局所加熱のためには、加熱源を所
定の場所に導いて行うことが望ましい。加熱手段4とし
てレーザー光を用いた場合は、結晶ファイバー導光路、
中空細管導光路、レンズ・ミラーから成る光学系によっ
て導光することでき、加熱空気を用いる場合は耐熱チュ
ーブなど、燃焼炎を用いる場合は燃焼ノズルとゴムチュ
ーブなどで加熱源を導くことができる。
In the present invention, it is necessary to locally heat the vicinity of the end of the breaking line in order to advance the breaking line on the planned breaking line without displacement. For local heating, it is desirable to guide the heating source to a predetermined place. When laser light is used as the heating means 4, a crystal fiber light guide path,
Light can be guided by an optical system including a hollow thin tube light guide path and a lens / mirror, and a heat source can be guided by a heat-resistant tube or the like when heated air is used and a combustion nozzle and a rubber tube or the like when combustion flame is used.

【0021】切断工具3については、単結晶ダイヤモン
ドあるいは焼結ダイヤモンドなどの先端を尖らせたカッ
ターが使用できる。
As the cutting tool 3, a cutter having a sharp tip such as single crystal diamond or sintered diamond can be used.

【0022】保護シート6および曲げモーメント付勢手
段5として用いる楔は、ガラス板1の損傷を避けるため
に、有機高分子性のものが好ましく、特に、耐熱性のあ
るPTFEシート、ポリイミド樹脂シート、フッ素ゴム
シートなどが好ましい。
The wedge used as the protective sheet 6 and the bending moment urging means 5 is preferably made of an organic polymer in order to avoid damage to the glass plate 1, and particularly, a heat-resistant PTFE sheet, a polyimide resin sheet, A fluororubber sheet or the like is preferable.

【0023】曲げモーメント付勢手段は、少なくとも予
備亀裂形成箇所近傍および予備亀裂を形成するガラス板
の端部と反対方向の端部近傍(すなわち、割断線の終端
近傍)に設けられればよい。図1で、楔5は予備亀裂形
成箇所近傍および割断線の終端近傍の2か所に分けて設
けられている。一方、割断予定線2bと垂直方向に割断
する際に用いられる楔5aはガラス板の全幅にわたっ
て、設けられている。
The bending moment urging means may be provided at least in the vicinity of the preliminary crack forming portion and in the vicinity of the end portion of the glass plate forming the preliminary crack in the direction opposite to the end portion (that is, in the vicinity of the end of the cleavage line). In FIG. 1, the wedge 5 is provided separately at two locations near the pre-crack formation location and near the end of the split line. On the other hand, the wedge 5a used for cutting in the direction perpendicular to the planned cutting line 2b is provided over the entire width of the glass plate.

【0024】次に、本例の装置の動作について説明す
る。まず、移動テーブル7の上に保護シート6および所
定位置の楔5を介して、ガラス板1を載置して、真空吸
着する。次いで、その状態で、切断工具3の刃部分を切
断工具支持押圧手段8によってガラス板1に押しつけ、
ガラス板1の端部の割断予定線2b上に割断線2の始点
となる予備亀裂2aを形成する。さらに、加熱手段4に
よって、割断線終端近傍に局所加熱する。こうして、割
断予定線上に割断線と熱とによって応力集中を生じさ
せ、割断線2を割断予定線上2bに進行させる。この
際、移動テーブル7によって加熱手段4を割断予定線に
沿ってガラス板1に対して相対移動させる。
Next, the operation of the apparatus of this example will be described. First, the glass plate 1 is placed on the moving table 7 via the protective sheet 6 and the wedge 5 at a predetermined position, and vacuum suction is performed. Then, in that state, the blade portion of the cutting tool 3 is pressed against the glass plate 1 by the cutting tool supporting and pressing means 8,
A preliminary crack 2a, which is the starting point of the breaking line 2, is formed on the planned breaking line 2b at the end of the glass plate 1. Further, the heating means 4 locally heats the vicinity of the end of the split line. In this way, stress concentration is caused on the planned breaking line by the breaking line and heat, and the breaking line 2 advances to the planned breaking line 2b. At this time, the moving table 7 moves the heating means 4 relative to the glass plate 1 along the planned cutting line.

【0025】本発明の装置によれば、切断工具3による
予備亀裂の形成は、20〜200gf程度のの弱い荷重
で行うことができる。かかる軽加重で予備亀裂形成を行
うことは、ガラスの微粉生成を避ける意味で非常に好ま
しい。上記の実施例では、曲げモーメントを予備亀裂形
成時に同時に加えているが、予備亀裂の形成後で局所加
熱前に曲げモーメントを加えてもよい。ただし、割断に
要する時間を短縮する意味で、予備亀裂形成と同時に形
成するほうがより好ましい。
According to the apparatus of the present invention, the formation of the preliminary crack by the cutting tool 3 can be performed with a weak load of about 20 to 200 gf. Performing pre-crack formation with such a light weight is very preferable in the sense of avoiding generation of fine powder of glass. In the above embodiment, the bending moment is applied at the same time when the preliminary crack is formed, but the bending moment may be applied after the preliminary crack is formed and before the local heating. However, in order to shorten the time required for cleaving, it is more preferable to form the cracks simultaneously with the formation of the preliminary cracks.

【0026】なお、ガラス板1に曲げモーメントを発生
させるための方法としては本例の方法に限定されず種々
の方法が採用可能である。たとえば楔の両脇をロールな
どにより押えることにより曲げ応力を発生させる方法、
ガラスの裏面もしくは両面から加圧ロールなどによりガ
ラスを押さえることにより行う方法などが使用できる。
The method for generating the bending moment in the glass plate 1 is not limited to the method of this embodiment, and various methods can be adopted. For example, a method to generate bending stress by pressing both sides of the wedge with rolls,
A method of pressing the glass from the back surface or both surfaces of the glass with a pressure roll or the like can be used.

【0027】図3は加圧ロールを用いた場合の加圧ロー
ル配置の側面図であり、21〜23は加圧ロールを示し
ている。これらの加圧ロールはすべて設ける必要は必ず
しもなく、加圧ロール21だけでも曲げモーメント付加
は可能である。
FIG. 3 is a side view of the arrangement of the pressure rolls when the pressure rolls are used, and 21 to 23 show the pressure rolls. It is not always necessary to provide all of these pressure rolls, and the bending moment can be added only by the pressure roll 21.

【0028】割断は具体的には以下のように行われた。
1m角の真空吸着が可能な移動テーブル7に、保護シー
トとして所定箇所に真空吸引のための微細孔を設けたポ
リイミド樹脂シートを接着した。さらに、楔として、x
方向に長さ1m、幅1mm、高さ0.2mmのPTFE
シートを150mm間隔、両側から50mm離して合計
7列接着し、y方向には両端部にのみ長さ10mm、幅
1mm、高さ0.2mmのPTFEシートを150mm
間隔、両側から50mm離して合計14個接着した。
The cleaving was specifically performed as follows.
A polyimide resin sheet having fine holes for vacuum suction at predetermined positions was bonded as a protective sheet to a moving table 7 capable of vacuum suction of 1 m square. Furthermore, as a wedge, x
With a length of 1 m, a width of 1 mm, and a height of 0.2 mm
Sheets are bonded 150mm apart, 50mm apart from both sides for a total of 7 rows bonded, and in the y direction only 150mm long, 10mm long, 1mm wide, 0.2mm high PTFE sheet is 150mm.
A total of 14 pieces were bonded at intervals of 50 mm from both sides.

【0029】この上に充分な洗浄を施したソーダ石灰ガ
ラスからなる長さ1m、幅1m、厚さ0.7mmのガラ
ス板を載せ、真空吸引して固定保持した。切断工具3た
るダイヤモンドカッターを毎秒50mmの速度で水平方
向に直線的に移動させながら、カッターを上下させてガ
ラス端部付近に約40gの荷重で長さ5mmの切り線を
入れた。炭酸ガスレーザ中空細管導光路によって導光し
た炭酸ガスレーザビーム光を移動させることによって、
上記の切り線を起点として割断を行うことができた。
A glass plate having a length of 1 m, a width of 1 m, and a thickness of 0.7 mm made of soda-lime glass that had been thoroughly washed was placed on this, and vacuum suction was performed to hold it. While the diamond cutter as the cutting tool 3 was linearly moved in the horizontal direction at a speed of 50 mm per second, the cutter was moved up and down and a cutting line having a length of 5 mm was inserted near the edge of the glass with a load of about 40 g. By moving the carbon dioxide laser beam light guided by the carbon dioxide laser hollow thin tube light guide,
Cleaving was possible using the above cutting line as a starting point.

【0030】炭酸ガスレーザビームの強度はガラス面で
約50ワットであった。この切断で合計36枚の150
×150mmのガラス基板が得られた。これらの基板を
暗室中にて20万ルクスの光源下で観察したが、ガラス
の微粉の付着は認められず、また、切断の寸法精度は起
点・末端部を含む全周について±0.1mm以内であっ
た。
The intensity of the carbon dioxide laser beam was about 50 watts on the glass surface. A total of 150 pieces for this cutting
A glass substrate of × 150 mm was obtained. These substrates were observed in a dark room under a light source of 200,000 lux, but no fine glass powder was observed, and the dimensional accuracy of cutting was within ± 0.1 mm for the entire circumference including the starting point and the end. Met.

【0031】[0031]

【発明の効果】本発明により、次のような効果が達成さ
れる。
According to the present invention, the following effects are achieved.

【0032】1)切断時および切断後のガラス微粉の発
生が極めて少ないためガラス微粉の付着の少ないガラス
基板が特別の洗浄を行うことなしに得られる。
1) The generation of fine glass powder during and after cutting is extremely small, so that a glass substrate with little adhesion of fine glass powder can be obtained without special cleaning.

【0033】2)ガラス基板の研磨工程で発生する傷が
減少するため研磨加工時間が短縮できる。
2) Since scratches generated in the polishing process of the glass substrate are reduced, the polishing processing time can be shortened.

【0034】3)曲げモーメントを併用しない場合と比
べて高速の切断が高い歩留まりで可能になる。
3) High-speed cutting can be performed with a high yield as compared with the case where a bending moment is not used together.

【0035】4)切り残しが生じないため高い寸法精度
の切断ができる。
4) Since no uncut portion is left, cutting with high dimensional accuracy can be performed.

【0036】5)切断面にマイクロクラックが存在しな
いためガラスの機械強度が高く、洗浄残渣が残りにくい
ため清浄な表面が得やすい。
5) Since the cut surface has no microcracks, the mechanical strength of the glass is high, and cleaning residues are unlikely to remain, so that a clean surface is easily obtained.

【0037】6)研削油などが付着しないためガラスを
洗浄する必要がない。
6) It is not necessary to wash the glass because no grinding oil or the like adheres to it.

【0038】本発明によれば、切り線が入れにくかった
0.2mm以下の薄いガラスについてもガラスを破損す
ることなく歩留まり良く切断することができる。
According to the present invention, even thin glass having a cutting line of 0.2 mm or less, which is difficult to insert, can be cut with a good yield without damaging the glass.

【0039】7)本発明は、特に、液晶表示素子(LC
D)用の基板を製造する場合に用いると、極めて有効で
ある。すなわち、割断時にほとんどガラス微粉が生じな
いため、液晶表示素子基板の上に、異物が残り、電気的
な短絡や、液晶層厚みの基板内変動をによる色むらが発
生する事態を防止することができる。
7) The present invention is particularly applicable to a liquid crystal display device (LC).
It is extremely effective when used for producing a substrate for D). That is, since almost no fine glass powder is generated at the time of cutting, it is possible to prevent foreign matter from remaining on the liquid crystal display element substrate, causing an electrical short circuit and uneven color due to variation in the liquid crystal layer thickness within the substrate. it can.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例に係る装置全体の斜視図FIG. 1 is a perspective view of an entire apparatus according to an embodiment of the present invention.

【図2】割断線の斜視図FIG. 2 is a perspective view of a breaking line.

【図3】本発明の他の実施例に係る加圧ロール部の側面
FIG. 3 is a side view of a pressure roll unit according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1:ガラス板 2:割断線 3:切断工具 4:加熱手段 5:曲げモーメント付勢手段 6:保護シート 7:移動テーブル 11:予備亀裂 12:割断線 13:切り残し部 21、22、23:加圧ロール 1: Glass plate 2: Cutting line 3: Cutting tool 4: Heating means 5: Bending moment urging means 6: Protective sheet 7: Moving table 11: Preliminary crack 12: Cutting line 13: Uncut portion 21, 22, 23: Pressure roll

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】ガラス板を割断予定線に沿って割断するガ
ラス板の割断方法において、 ガラス板の割断予定線上でガラス板の端部に割断線の始
点となる予備亀裂を形成するとともに、予備亀裂の形成
時もしくは形成直後に割断予定線の回りに曲げモーメン
トを加える予備亀裂形成工程と、 次いで、割断線の端部近傍に局所的な加熱を加えること
により、割断予定線上に割断線を進行させてガラス板を
割断するとともに、割断線の進行中もしくは進行停止直
後に割断予定線の回りに曲げモーメントを加える割断工
程とを備えた、ことを特徴とするガラス板の割断方法。
1. A method for cleaving a glass plate along a planned breaking line, comprising forming a preliminary crack at the end of the glass plate on the planned breaking line of the glass plate as a starting point of the breaking line, and preparing a preliminary crack. A preliminary crack formation process in which a bending moment is applied around the planned cleavage line during or immediately after the formation of a crack, and then local heating is applied near the ends of the cleavage line to advance the cleavage line on the planned cleavage line. And a cleaving step of applying a bending moment around the planned cleaving line during or immediately after the cleaving of the glass sheet.
【請求項2】局所的に加熱する加熱源として、炭酸ガス
レーザーまたは燃焼炎を使用することを特徴とする請求
項1記載のガラス板の割断方法。
2. The method for cleaving a glass sheet according to claim 1, wherein a carbon dioxide laser or a combustion flame is used as a heating source for locally heating.
【請求項3】予備亀裂の形成を、200gf以下の加重
で切り線を入れることにより行うことを特徴とする請求
項1または請求項2記載のガラス板の割断方法。
3. The method for cleaving a glass sheet according to claim 1, wherein the preliminary crack is formed by making a cutting line with a weight of 200 gf or less.
【請求項4】ガラス板に割断線の始点となる予備亀裂を
割断予定線に沿って形成する切断工具と、 割断線の端部近傍に局所的な加熱を加える加熱手段と、 割断予定線に沿って加熱手段とガラス板とを相対移動さ
せる加熱点移動手段と、 ガラス板の割断予定線の回りに曲げモーメントを与える
曲げモーメント付勢手段とを備えたことを特徴とするガ
ラス板の割断装置。
4. A cutting tool for forming a preliminary crack which is a starting point of a breaking line on a glass plate along the planned breaking line, a heating means for locally heating near the end of the breaking line, and a planned breaking line. A glass sheet cleaving device comprising: a heating point moving means for relatively moving the heating means and the glass plate along the bending point; and a bending moment urging means for applying a bending moment around the expected breaking line of the glass plate. .
【請求項5】曲げモーメント付勢手段は加圧ロールから
なることを特徴とする請求項4記載のガラス板の割断装
置。
5. The glass sheet cleaving device according to claim 4, wherein the bending moment urging means comprises a pressure roll.
【請求項6】曲げモーメント付勢手段は楔からなること
を特徴とする請求項4記載のガラス板の割断装置。
6. The glass plate cleaving device according to claim 4, wherein the bending moment urging means comprises a wedge.
JP32311194A 1994-12-26 1994-12-26 Method for cleaving glass plate and apparatus therefor Withdrawn JPH08175837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32311194A JPH08175837A (en) 1994-12-26 1994-12-26 Method for cleaving glass plate and apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32311194A JPH08175837A (en) 1994-12-26 1994-12-26 Method for cleaving glass plate and apparatus therefor

Publications (1)

Publication Number Publication Date
JPH08175837A true JPH08175837A (en) 1996-07-09

Family

ID=18151209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32311194A Withdrawn JPH08175837A (en) 1994-12-26 1994-12-26 Method for cleaving glass plate and apparatus therefor

Country Status (1)

Country Link
JP (1) JPH08175837A (en)

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