JPH08167644A - Wafer presser structure of semiconductor wafer package container - Google Patents

Abstract

PURPOSE: To provide a structure of a wafer presser which can surely hold semiconductor wafers positioned at both side ends of semiconductor wafers contained inside a semiconductor wafer package container without being removed by vibration and impact. CONSTITUTION: A reinforcement rod 2 is provided along a longitudinal direction outside a keep blade 3a. One end of the reinforcement rod 2 is joined to the wafer keeper 1. An inside of the reinforcement rod 2 is joined to an outside of the keep blade 3a. Therefore, an outside of the keep blade 3a is supported by the reinforcement rod 2. The blade 3a can be prevented from being twisted up by a semiconductor wafer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a wafer retainer which is provided inside a lid of a semiconductor wafer packaging container and holds an upper edge portion of a wafer housed in the semiconductor wafer packaging container.

[0002]

2. Description of the Related Art A manufactured semiconductor wafer is stored in a semiconductor wafer packaging container, packed and shipped. Figure 6
As shown in (a), the semiconductor wafer packaging container 5 is accommodated in such a manner that the semiconductor wafer 4 is vertically accommodated therein and the semiconductor wafer packaging container 5 is hermetically sealed from above by the lid 51. At this time, as shown in FIG.
Is a wafer retainer 1a attached inside the lid 51.
It is held from above by the pressing blades 3 so that the semiconductor wafer 4 will not be damaged by collision with the semiconductor wafer packaging container or other semiconductor wafers due to vibration during transportation. Conventionally, this pressing blade 3
Is a semiconductor wafer 4 stored in a semiconductor wafer packaging container 5.
The same number of sets as that of the pressing blades 3 are provided, and the side portions of the respective pressing blades 3 are joined to the side portions of the adjacent pressing blades 3 as shown in FIG.

[0003]

However, in the case of packaging with the semiconductor wafer packaging container 5 using such a wafer retainer 1a, the retainer blades 3a located at both ends are provided.
As shown in FIGS. 8 and 9, since there is nothing to support the outside (see FIG. 7), the outside is twisted up by the load applied from the semiconductor wafers 4a located at both ends. . Therefore, there is a problem that the pressing blades 3a are likely to come off from the semiconductor wafers 4a located at both ends when vibration or shock is applied during transportation. The present invention
In view of the above problems, the structure of a wafer retainer that can reliably hold the semiconductor wafers located on both side ends of the semiconductor wafers housed in the semiconductor wafer packaging container without coming off due to vibration or impact. It is intended to provide.

[0004]

Therefore, in the present invention, at least one of the wafer retainers is provided in the structure of the wafer retainer which is provided inside the lid of the semiconductor wafer packaging container and holds the upper edge of the accommodated wafer. Reinforcing means are provided on the pressing blades arranged at the side edges of the.

[0005]

Since the present invention is configured as described above, the pressing blades located on both side ends of the wafer pressing member have rigidity increased by the reinforcing means. As a result, the semiconductor wafer can be securely held without being twisted up even by the load from the semiconductor wafers located at the both ends, and the semiconductor wafer does not come off from the pressing blade due to vibration or shock during transportation.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. Example 1 FIG. 1 is a partially enlarged perspective view of a wafer retainer of Example 1, FIG.
FIG. 4 is a partially enlarged perspective view showing a state where a semiconductor wafer is held by the wafer retainer according to the first embodiment. As shown in FIG. 1, the wafer retainer 1 of the first embodiment is provided with a plurality of retainer blades 3 and retainer blades 3a located on both side ends thereof as in the prior art, the total of which is inside the semiconductor wafer packaging container. The number is equal to the number of semiconductor wafers that can be stored in. Further, the respective holding blades 3 are joined to each other at their side portions, and the holding blades 3a located at both ends are joined to the holding blades 3 located inside thereof. A rod-shaped reinforcing member 2 that is a reinforcing member is provided outside the pressing blade 3a along the longitudinal direction thereof. The reinforcing member 2 is formed to have the same length as the other pressing blades 3, one end of which is joined to the wafer pressing member 1 and the inside of which is joined to the outside of the pressing blade 3a. Next, the operation of the wafer retainer 1 according to the first embodiment will be described. As shown in FIG. 2, when the semiconductor wafer 4 is housed in the semiconductor wafer packaging container and sealed with the lid, each semiconductor wafer 4 is held by the pressing blades 3 and 3a. In the case of the conventional wafer retainer 1a, the retainer blade 3a was not provided with anything supporting the outside thereof, so that the outside thereof was twisted up by the load from the semiconductor wafers 4a located at both ends. , Pressing blade 3a
By providing this reinforcing member 2 on the outside of the
The outer side of a is supported by the reinforcing member 2 and can be prevented from being twisted up.

Second Embodiment FIG. 3 is a partially enlarged perspective view showing a state where a semiconductor wafer is held by the wafer retainer of the second embodiment. In the first embodiment, the reinforcing material 2 was formed in a rod shape, but as shown in FIG. 3, in the second embodiment, the reinforcing material 2 is replaced with a dummy piece 2a having the same shape as the other pressing blades 3. Is
It is provided so as to be joined to the outside of the pressing blades 3a located at both ends. As in the first embodiment, the pressing blades 3a located at both ends are supported by the dummy pieces 2a, and the outer side of the pressing blades 3a can be prevented from being twisted up. Further, by forming the dummy piece 2a into the same shape as the pressing blade 3, the processing becomes easy and the balance of the entire wafer pressing is improved.

Third Embodiment FIG. 4 is a partially enlarged perspective view showing a state where a semiconductor wafer is held by the wafer retainer of the third embodiment. In the first and second embodiments, the reinforcing member is provided outside the pressing blades 3a located at both ends, but as shown in FIG. 4, in the third embodiment, the pressing blades 3b themselves located at both ends are provided. By forming the outer side to be thick, its rigidity is increased and reinforced.

Fourth Embodiment FIG. 5 is a partially enlarged perspective view showing a state where a semiconductor wafer is held by the wafer retainer of the fourth embodiment. Example 4
In Fig. 5, as shown in Fig. 5, the pressing blades 3c located at both ends and the pressing blades 3d inside thereof are integrated,
It is formed so that the whole is thick. Thereby, the rigidity can be further increased as compared with the third embodiment.

[0010]

Since the present invention is configured as described above,
Among the semiconductor wafers stored in the semiconductor wafer packaging container, prevent the semiconductor wafers located at both ends of the semiconductor wafer from coming off from the holding blades holding the semiconductor wafers, thereby eliminating the damage of the semiconductor wafers during transportation. It has the excellent effect that

[Brief description of drawings]

FIG. 1 is a partially enlarged perspective view of a wafer retainer according to a first embodiment.

FIG. 2 is a partially enlarged perspective view showing a state where a semiconductor wafer is held by the wafer retainer according to the first embodiment.

FIG. 3 is a partially enlarged perspective view showing a state where a semiconductor wafer is held by a wafer retainer according to the second embodiment.

FIG. 4 is a partially enlarged perspective view showing a state in which a semiconductor wafer is held by a wafer retainer according to a third embodiment.

FIG. 5 is a partially enlarged perspective view showing a state where a semiconductor wafer is held by a wafer retainer according to a fourth embodiment.

FIG. 6 is a cross-sectional view showing a state where a semiconductor wafer is stored in a semiconductor wafer packaging container.

FIG. 7 is a partially enlarged perspective view showing a conventional wafer retainer.

FIG. 8 is a partially enlarged perspective view showing a state in which a semiconductor wafer is held by a conventional wafer retainer.

9 is a cross-sectional view taken along the line AA of FIG.

[Explanation of symbols]

 1 Wafer holder 1a Wafer holder 2 Reinforcement member 2a Dummy piece 3 Holding blade 3a Holding blade 3b Holding blade 3c Holding blade 3d Holding blade 4 Semiconductor wafer 4a Semiconductor wafer 5 Semiconductor wafer packaging container 51 Lid

Claims (5)

[Claims] 1. A structure for a wafer retainer provided inside a lid of a semiconductor wafer packaging container for holding an upper edge portion of a stored wafer, wherein a retainer blade disposed at at least one side end of the wafer retainer. A structure for holding a wafer of a semiconductor wafer packaging container, characterized in that a reinforcing means is provided. 2. The wafer retainer for a semiconductor wafer packaging container according to claim 1, wherein the reinforcing means is a reinforcing member attached to the outside of the pressing blade arranged at the side end along the longitudinal direction thereof. Structure. 3. The structure for holding a wafer of a semiconductor wafer packaging container according to claim 2, wherein the reinforcing member is formed in a rod shape. 4. The wafer pressing structure for a semiconductor wafer packaging container according to claim 2, wherein the reinforcing member is formed in substantially the same shape as the pressing blade. 5. The structure of a wafer retainer for a semiconductor wafer packaging container according to claim 1, wherein the reinforcing means is formed by thickly retaining blades arranged at a side end of the wafer retainer.