JPH08111573A - Thick film paste - Google Patents
Thick film pasteInfo
- Publication number
- JPH08111573A JPH08111573A JP24422294A JP24422294A JPH08111573A JP H08111573 A JPH08111573 A JP H08111573A JP 24422294 A JP24422294 A JP 24422294A JP 24422294 A JP24422294 A JP 24422294A JP H08111573 A JPH08111573 A JP H08111573A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- weight
- pad
- film paste
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003960 organic solvent Substances 0.000 abstract description 23
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 17
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 17
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 17
- 239000000843 powder Substances 0.000 abstract description 14
- 238000007649 pad printing Methods 0.000 abstract description 11
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract description 9
- 239000001856 Ethyl cellulose Substances 0.000 abstract description 7
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 7
- 229920000180 alkyd Polymers 0.000 abstract description 7
- 229920001249 ethyl cellulose Polymers 0.000 abstract description 7
- 235000019325 ethyl cellulose Nutrition 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 20
- 238000001035 drying Methods 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 238000012546 transfer Methods 0.000 description 12
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 7
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は厚膜ペーストに関する
ものである。This invention relates to thick film pastes.
【０００２】[0002]
【従来の技術】近年の電子部品は、小型化の進歩が著し
く、セラミックを基材に用いた電子部品もその例外では
ない。例えば、基材中央部に凹部を形成し、その中に部
品を実装して低背化を図ったものや、基材の上面、側
面、下面の全面に配線を施し高密度化を図ったもの等が
商品化されている。このような凹凸のある基材または立
方体基材全面に、厚膜ペーストを用いて連続した配線等
を施すには、各平面ごとにスクリーン印刷するか、描画
方式を用いるしかなかった。しかしながら、スクリーン
印刷は凹面には対応できず、また描画方式は量産性に劣
り、実用的ではない。一方、３次元曲面等を含めた凹凸
のある基板に印刷する方法としては、パッド印刷法（別
称：タンポ印刷）が知られている。2. Description of the Related Art Recent miniaturization of electronic components is remarkable, and electronic components using ceramics as a base material are no exception. For example, a product with a recess formed in the center of the base material to mount components inside to reduce the height, or a product with high density achieved by wiring the entire top, side, and bottom surfaces of the base material. Etc. have been commercialized. In order to form a continuous wiring or the like using a thick film paste on the entire surface of the base material having such irregularities or the cubic base material, there was no choice but to use screen printing or drawing method for each plane. However, screen printing is not practical because it cannot deal with concave surfaces and the drawing method is inferior in mass productivity. On the other hand, a pad printing method (also called tampo printing) is known as a method for printing on a substrate having irregularities including a three-dimensional curved surface.
【０００３】[0003]
【発明が解決しようとする課題】ところが、上記のよう
なパッド印刷法による厚膜ペーストでは次のような問題
点があった。However, the thick film paste prepared by the pad printing method as described above has the following problems.
【０００４】一般的なパッド印刷法では膜厚２〜３μｍ
が上限であり、厚膜ペーストに要求される膜厚である５
〜２０μｍには対応できなかった。In a general pad printing method, the film thickness is 2 to 3 μm.
Is the upper limit and the film thickness required for thick film paste is 5
It was not possible to cope with ~ 20 μm.
【０００５】すなわち、パッド印刷は、凹版オフセット
印刷の一種であるので、凹版深さを深くすれば膜厚を厚
くできるものの、通常のスクリーン印刷用ペーストや浸
漬塗布用ペーストでは、ペーストの凝集力や粘着力が不
足するために、シリコンパッドから基材へ完全転写せ
ず、良好な膜厚および形状の膜形成が不可能であった。That is, since pad printing is a type of intaglio offset printing, the film thickness can be increased by increasing the intaglio depth, but with ordinary screen printing pastes and dip coating pastes, the cohesive force of the paste and Since the adhesive strength was insufficient, it was impossible to completely transfer from the silicon pad to the substrate, and it was impossible to form a film having a good film thickness and shape.
【０００６】この発明の目的は、複数の印刷面を有する
電子部品に対してもパッド印刷によって良好な膜形成が
可能な厚膜ペーストを提供することにある。An object of the present invention is to provide a thick film paste capable of forming a good film on an electronic component having a plurality of printing surfaces by pad printing.
【０００７】[0007]
【課題を解決するための手段】本発明は、上記のような
問題点を解決するためになされたもので、導電粉末と、
ロジン誘導体と、有機溶剤と、少なくともエチルセルロ
ース、ポリビニルブチラール、アルキド樹脂のうち１つ
を含む厚膜ペーストであって、厚膜ペースト１００重量
％に対して前記ロジン誘導体を５〜２０重量％含有し、
かつ、前記エチルセルロース、前記ポリビニルブチラー
ル、前記アルキド樹脂のうち少なくとも１つを０．５重
量％以上含有していることを特徴とするものである。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and includes a conductive powder and
A thick film paste containing a rosin derivative, an organic solvent, and at least one of ethyl cellulose, polyvinyl butyral, and an alkyd resin, wherein the rosin derivative is contained in 5 to 20 wt% with respect to 100 wt% of the thick film paste,
In addition, at least one of the ethyl cellulose, the polyvinyl butyral, and the alkyd resin is contained in an amount of 0.5% by weight or more.
【０００８】また、本発明は、前記有機溶剤が、２０℃
付近における蒸気圧が０．３〜１０ｍｍＨｇである成分
を前記有機溶剤１００重量％に対して６０重量％以上含
むことを特徴とするものである。In the present invention, the organic solvent is 20 ° C.
It is characterized in that a component having a vapor pressure in the vicinity of 0.3 to 10 mmHg is contained in an amount of 60% by weight or more based on 100% by weight of the organic solvent.
【０００９】[0009]
【作用】本発明の厚膜ペーストでは、パッド印刷に必要
な厚膜ペーストの凝集力や粘着力を十分に有するので、
５０〜１５０μｍ程度の深い凹版を用いたパッド印刷を
行っても完全転写可能である良好なパッド印刷性を有す
ることができる。The thick film paste of the present invention has sufficient cohesive force and adhesive force of the thick film paste necessary for pad printing.
Even if pad printing using a deep intaglio plate of about 50 to 150 μm is performed, it is possible to have good pad printability that allows complete transfer.
【００１０】また、有機溶剤が２０℃付近における蒸気
圧が０．３〜１０ｍｍＨｇであるものを前記有機溶剤１
００重量％に対して６０重量％以上含む場合には、適切
な乾燥速度が得られるので、パッドへの転写前に凹板内
で厚膜ペーストが乾燥することなく、かつ、乾燥に必要
な熱風の温度もパッドを劣化させることのない適切な温
度となる。The organic solvent having a vapor pressure at 20 ° C. of 0.3 to 10 mmHg is used as the organic solvent 1
When it is contained in an amount of 60% by weight or more with respect to 00% by weight, an appropriate drying rate can be obtained, so that the thick film paste is not dried in the concave plate before the transfer to the pad and the hot air required for the drying is used. Is also an appropriate temperature that does not deteriorate the pad.
【００１１】[0011]
【実施例】以下、本発明の厚膜ペーストの実施例につい
て説明する。まず、本発明の厚膜ペーストの製造方法に
ついて説明する。 （１）まず、ビヒクルを作製するために、ビヒクルの樹
脂主成分として、乾燥膜の凝集性および粘着性を得るた
めのロジン誘導体である重合ロジンを用い、重合ロジン
以外の樹脂成分としては、厚膜ペーストの流動性および
保存安定性を得るためのエチルセルロース、ポリビニル
ブチラール（ＰＶＢ）、アルキド樹脂のうち少なくとも
１つを用いる。EXAMPLES Examples of the thick film paste of the present invention will be described below. First, a method of manufacturing the thick film paste of the present invention will be described. (1) First, in order to prepare a vehicle, a polymerized rosin, which is a rosin derivative for obtaining cohesiveness and tackiness of a dry film, is used as the resin main component of the vehicle. At least one of ethyl cellulose, polyvinyl butyral (PVB), and alkyd resin is used to obtain fluidity and storage stability of the film paste.
【００１２】（２）これらの樹脂を各々の有機溶剤に溶
解してビヒクルを作成する。共通して使用している有機
溶剤であるジブチルフタレート（ＤＢＰ）は、乾燥膜の
粘着性を安定して得るための成分である。ただし、これ
は必ずしも必要な成分ではない。(2) A vehicle is prepared by dissolving these resins in each organic solvent. Dibutyl phthalate (DBP), which is an organic solvent commonly used, is a component for stably obtaining the tackiness of a dry film. However, this is not always a necessary ingredient.
【００１３】（３）このようにして得られたビヒクルを
導電粉末であるＡｇ−Ｐｄ合金粉を分散し、厚膜ペース
トを得る。(3) The vehicle thus obtained is dispersed with Ag-Pd alloy powder, which is a conductive powder, to obtain a thick film paste.
【００１４】本実施例においては、上記製造方法で得ら
れた厚膜ペーストの組成として、導電粉末であるＡｇ−
Ｐｄ粉末と、ビヒクルの樹脂主成分である重合ロジン
と、重合ロジン以外の樹脂成分であるエチルセルロー
ス、ポリビニルブチラール、およびアルキド樹脂と、有
機溶剤である乳酸ブチル、ジブチルフタレート（ＤＢ
Ｐ）、Ｏ−キシレン、およびｎ−アミルアルコールを表
１で示すように設定し、それぞれに対するパッド印刷性
および膜厚（μｍ）を表１中に示している。In the present embodiment, the composition of the thick film paste obtained by the above manufacturing method is Ag- which is a conductive powder.
Pd powder, polymerized rosin that is the resin main component of the vehicle, ethyl cellulose, polyvinyl butyral, and alkyd resin that are resin components other than the polymerized rosin, and butyl lactate, dibutyl phthalate (DB) that are organic solvents.
P), O-xylene, and n-amyl alcohol were set as shown in Table 1, and pad printability and film thickness (μm) for each are shown in Table 1.
【００１５】[0015]
【表１】 [Table 1]
【００１６】なお、表１において、試料Ｎｏ．に＊を付
したものは本発明の範囲外の試料であり、その他は本発
明の範囲内の実施例を示す。In Table 1, the sample No. Those marked with * are samples outside the scope of the present invention, and others indicate examples within the scope of the present invention.
【００１７】次に、表１における膜厚の測定方法および
パッド印刷性の評価について説明する。 （１）まず、銅板に印刷パターン形状を深さ１００μｍ
にエッチングした凹版に、ブレードを用いて厚膜ペース
トを充填する。Next, the method of measuring the film thickness and the evaluation of the pad printability in Table 1 will be described. (1) First, print pattern shape is 100 μm deep on a copper plate.
The thick film paste is filled into the intaglio plate etched in step 1 using a blade.
【００１８】（２）その上に凸形状のシリコンパッドを
押し付け、凹版中のペーストの一部をシリコンパッド上
に転写する。(2) A convex silicon pad is pressed onto it, and a part of the paste in the intaglio plate is transferred onto the silicon pad.
【００１９】（３）送風によりシリコンパッド上で主有
機溶剤成分を蒸発させ、厚膜ペーストを粘着シート状ま
で乾燥させる。(3) By blowing air, the main organic solvent components are evaporated on the silicon pad, and the thick film paste is dried to an adhesive sheet.
【００２０】（４）このようにして形成した粘着膜を段
差のあるアルミナ基板に転写印刷した。そして、印刷後
の膜厚を蛍光Ｘ線膜厚計を用いて測定した。(4) The adhesive film thus formed was transferred and printed onto an alumina substrate having a step. Then, the film thickness after printing was measured using a fluorescent X-ray film thickness meter.
【００２１】このように測定した結果、表１のパッド印
刷性の評価について、完全転写した厚膜ペーストのみを
パッド印刷性良好とし、○で示した。また、パッド印刷
性不良は×、また、完全転写させるためにはシリコンパ
ッドが劣化する程度まで風温を高く設定する必要がある
場合、またはシリコンパッドからアルミナ基板へのペー
ストの転移が不完全の場合は、パッド印刷性が良好でな
いものとして△で示した。As a result of the measurement as described above, in the evaluation of the pad printability in Table 1, only the completely transferred thick film paste was regarded as good pad printability, and indicated by ◯. Poor pad printability is bad. Also, if it is necessary to set the air temperature high enough to deteriorate the silicon pad for complete transfer, or if the paste transfer from the silicon pad to the alumina substrate is incomplete. In this case, the pad printability was not good, which was indicated by Δ.
【００２２】試料Ｎｏ．１は、パッド印刷性が不良であ
り、膜厚も測定できなかった。これは、試料Ｎｏ．１は
粘着性を付与する重合ロジン量が３重量％と少ないた
め、シリコンパッドからアルミナ基板に完全転写しない
ためである。Sample No. In No. 1, the pad printability was poor and the film thickness could not be measured. This is sample No. No. 1 is because the amount of the polymerized rosin that imparts tackiness is as small as 3% by weight, so that it is not completely transferred from the silicon pad to the alumina substrate.
【００２３】試料Ｎｏ．２ないし試料Ｎｏ．１２は、パ
ッド印刷性が良好であり、厚膜ペーストに要求される膜
厚を得ることができた。Sample No. 2 to sample No. In No. 12, the pad printability was good, and the film thickness required for the thick film paste could be obtained.
【００２４】なお、試料Ｎｏ．７は、エチルセルロース
の量が少ないため、凹版上での作業性が他の試料に比べ
て劣ったが、例えばブレードのかき取りスピードを遅く
する等、作業条件を厳しくすれば使用可能である。Sample No. Sample No. 7 was inferior to the other samples in workability due to the small amount of ethyl cellulose, but can be used if the work conditions are strict, such as slowing down the blade scraping speed.
【００２５】試料Ｎｏ．１３は、パッド印刷性が良好で
なかった。また、試料Ｎｏ．１４も、パッド印刷性が良
好でなかった。これらの理由については後述する。Sample No. In No. 13, the pad printability was not good. In addition, the sample No. Also in No. 14, the pad printability was not good. The reasons for these will be described later.
【００２６】ここで、有機溶剤の乾燥条件について説明
する。乾燥条件は有機溶剤の蒸気圧範囲で異なり、蒸気
圧範囲が２〜１０ｍｍＨｇの有機溶剤では室温の送風に
よる乾燥でよく、蒸気圧範囲が０．３〜２ｍｍＨｇの有
機溶剤では熱風乾燥が必要である。また、１０ｍｍＨｇ
以上の有機溶剤では乾燥が速すぎるため、凹版内で乾燥
し、シリコンパッドに転写しなくなり、さらに、０．３
ｍｍＨｇ以下の有機溶剤では乾燥に必要な熱風の温度が
高くなりすぎて、シリコンパッドが劣化するため使用で
きない。Here, the drying conditions of the organic solvent will be described. Drying conditions differ depending on the vapor pressure range of the organic solvent. For an organic solvent having a vapor pressure range of 2 to 10 mmHg, drying by blowing air at room temperature may be used, and for an organic solvent having a vapor pressure range of 0.3 to 2 mmHg, hot air drying is required. . Also, 10 mmHg
Since the organic solvent above dries too quickly, it dries in the intaglio and does not transfer to the silicon pad.
With an organic solvent of mmHg or less, the temperature of the hot air required for drying becomes too high and the silicon pad deteriorates, so that it cannot be used.
【００２７】表２に本実施例で用いたＤＢＰ以外の有機
溶剤の各温度での蒸気圧を示す。Table 2 shows the vapor pressures of organic solvents other than DBP used in this example at various temperatures.
【００２８】[0028]
【表２】 [Table 2]
【００２９】なお、ＤＢＰの２０℃付近での蒸気圧は記
載していないが少なくとも０．１ｍｍＨｇ以下ある。Although the vapor pressure of DBP at around 20 ° C. is not described, it is at least 0.1 mmHg or less.
【００３０】つまり、本実施例の有機溶剤は、ＤＢＰの
みでは乾燥に必要な熱風の温度が高くなりすぎて、シリ
コンパッドが劣化するため使用できないが、ＤＢＰと他
の有機溶剤を混合させることで乾燥速度および乾燥温度
を作業性のよい適切なものにしている。That is, the organic solvent of this embodiment cannot be used with DBP alone because the temperature of the hot air required for drying becomes too high and the silicon pad deteriorates. However, by mixing DBP with another organic solvent. The drying speed and the drying temperature are suitable and have good workability.
【００３１】ここで、試料Ｎｏ．１３は、２０℃におけ
る蒸気圧が０．４ｍｍＨｇである乳酸ブチルが厚膜ペー
スト１００重量％に対して６重量％、２０℃付近で蒸気
圧が少なくとも０．１ｍｍＨｇ以下のＤＢＰが同じく６
重量％であり、乳酸ブチルとＤＢＰとは有機溶剤１００
重量％に対して互いに５０重量％である。この試料Ｎ
ｏ．１３は、転写は可能であるが、乾燥に必要な熱風温
度が高くなりすぎ、転写用のシリコンパッドの強度が低
下して傷つきやすくなるため、総合的にはパッド印刷性
が良好でない。Here, the sample No. In No. 13, butyl lactate having a vapor pressure of 0.4 mmHg at 20 ° C. is 6% by weight based on 100% by weight of the thick film paste, and DBP having a vapor pressure of at least 0.1 mmHg at 20 ° C. is 6%.
Wt% and butyl lactate and DBP are organic solvents 100
50% by weight of one another with respect to% by weight. This sample N
o. In No. 13, although transfer is possible, the hot air temperature required for drying becomes too high, the strength of the silicon pad for transfer is lowered, and the silicon pad is easily scratched. Therefore, overall pad printability is not good.
【００３２】また、試料Ｎｏ．１４は、２０℃における
蒸気圧が０．４ｍｍＨｇである乳酸ブチルが厚膜ペース
ト１００重量％に対して６重量％、２０℃における蒸気
圧が１４．５ｍｍＨｇであるｎ−プロパノールが同じく
６重量％であり、乳酸ブチルとｎ−プロパノールとは有
機溶剤１００重量％に対して互いに５０重量％である。
この試料Ｎｏ．１４は、一応転写は可能であるが、乾燥
が速く、凹版内からシリコンパッドへのペーストの転移
が完全に行われず膜厚が薄くなるため総合的にはパッド
印刷性が良好でない。Sample No. 14 is 6% by weight of butyl lactate having a vapor pressure of 0.4 mmHg at 20 ° C. with respect to 100% by weight of the thick film paste, and 6% by weight of n-propanol having a vapor pressure of 14.5 mmHg at 20 ° C. Butyl lactate and n-propanol are 50% by weight with respect to 100% by weight of the organic solvent.
This sample No. In No. 14, transfer is possible, but the drying speed is high, the transfer of the paste from the intaglio to the silicon pad is not completed completely, and the film thickness becomes thin, so the pad printability is not good overall.
【００３３】従って、それぞれの試料の有機溶剤成分の
うち、好ましくは乳酸ブチルまたはＯ−キシレンまたは
ｎ−アミルアルコールを６０重量％以上含む方がよい。
乳酸ブチルまたはＯ−キシレンまたはｎ−アミルアルコ
ールを６０重量％以上含むと乾燥速度および乾燥温度を
確実に作業性のよい適切なものにすることができる。Therefore, it is preferable that the organic solvent component of each sample preferably contains butyl lactate, O-xylene or n-amyl alcohol in an amount of 60% by weight or more.
When butyl lactate, O-xylene, or n-amyl alcohol is contained in an amount of 60% by weight or more, the drying speed and the drying temperature can be surely made appropriate with good workability.
【００３４】ところで、本実施例では、導電粒子比率を
７０〜８０重量％と比較的高い比率でのみ評価したが、
これは焼成後の膜厚を厚くするためであり、その必要が
なければ７０重量％以下の低比率でもよい。By the way, in this example, the conductive particle ratio was evaluated only at a relatively high ratio of 70 to 80% by weight.
This is to increase the film thickness after firing, and if not necessary, it may be a low ratio of 70% by weight or less.
【００３５】また、ビヒクルの樹脂主成分として重合ロ
ジンを用いるのは、重合ロジンが乾燥膜の凝集性および
粘着性を有するからである。また、これらは重合ロジン
に限定されるものではなく、水添ロジン、エステル化ロ
ジン等の他のロジン誘導体であれば使用可能である。The reason why the polymerized rosin is used as the resin main component of the vehicle is that the polymerized rosin has the cohesiveness and tackiness of a dry film. Further, these are not limited to polymerized rosins, and other rosin derivatives such as hydrogenated rosin and esterified rosin can be used.
【００３６】また、重合ロジンは２０重量％以上を添加
していないが、これは例えば重合ロジンを３０重量％ま
で添加すると樹脂成分の割合が多くなってしまい、実質
上、電極膜を形成できないからである。Further, 20% by weight or more of the polymerized rosin is not added. This is because, for example, when the polymerized rosin is added up to 30% by weight, the proportion of the resin component becomes large and the electrode film cannot be formed substantially. Is.
【００３７】また、重合ロジン以外の樹脂成分としてエ
チルセルロースまたはポリビニルブチラール（ＰＶＢ）
またはアルキド樹脂を用いるのは、これらが厚膜ペース
トの流動性および保存安定性を有するからである。Further, ethyl cellulose or polyvinyl butyral (PVB) is used as a resin component other than the polymerized rosin.
Alternatively, the alkyd resin is used because they have the fluidity and storage stability of the thick film paste.
【００３８】また、導電粉末は、Ａｇ−Ｐｄ導電粉末に
限定するものではなく、Ａｇ、Ａｕ、Ｃｕ、Ｎｉ等の金
属粉、またはガラス、金属酸化物等の絶縁粉、またはＲ
ｕＯ2等の抵抗ペースト用粉末等でもよい。導電粉末と
してＡｇ−Ｐｄ導電粉末を用いるのは、他の導電粉末に
比べて耐マイグレーション性に優れているからである。The conductive powder is not limited to Ag-Pd conductive powder, but metal powder such as Ag, Au, Cu and Ni, or insulating powder such as glass and metal oxide, or R.
A powder for resistance paste such as uO 2 may be used. The reason why Ag-Pd conductive powder is used as the conductive powder is that it is superior in migration resistance to other conductive powders.
【００３９】次に、凹版深さと膜厚との関係について説
明する。ここでは、最も膜厚が厚くなった表１に示す試
料Ｎｏ．６を用いて、凹版深さが５０μｍ、７５μｍ、
１００μｍ、１２５μｍ、１５０μｍである各種凹版の
パッド印刷性および膜厚を表３に示している。Next, the relationship between the intaglio depth and the film thickness will be described. Here, the sample No. 1 shown in Table 1 having the largest film thickness is shown. 6, the intaglio depth of 50 μm, 75 μm,
Table 3 shows the pad printability and film thickness of various intaglio plates having a thickness of 100 μm, 125 μm, and 150 μm.
【００４０】[0040]
【表３】 [Table 3]
【００４１】パッド印刷性はすべての凹版で良好であっ
た。各種凹版ごとの膜厚は表２に示す通りであり、凹版
深さと膜厚は相関関係がある。従って、５０μｍ〜１５
０μｍ深さの凹版を用いることにより、厚膜ペーストに
必要な５μｍ〜２０μｍ程度の膜厚が得られることがわ
かった。Pad printability was good for all intaglio plates. The film thickness of each intaglio plate is as shown in Table 2, and the intaglio depth and the film thickness have a correlation. Therefore, 50 μm to 15
It was found that by using an intaglio having a depth of 0 μm, a film thickness of about 5 μm to 20 μm required for a thick film paste can be obtained.
【００４２】ところで、本発明は上記実施例に限定され
るものではなく、本発明の要旨の範囲内において種々の
応用、変形が可能である。By the way, the present invention is not limited to the above embodiments, but various applications and modifications are possible within the scope of the gist of the present invention.
【００４３】[0043]
【発明の効果】本発明の厚膜ペーストでは、パッド印刷
に必要な厚膜ペーストの凝集力や粘着力を十分に有する
ため、５０〜１５０μｍ程度の深い凹版を用いたパッド
印刷を行っても、完全転写可能である良好なパッド印刷
性を有することができるので、複数の印刷面を有する電
子部品に対してもパッド印刷によって良好な膜形成が可
能である。Since the thick film paste of the present invention has sufficient cohesive force and adhesive force of the thick film paste necessary for pad printing, even if pad printing using a deep intaglio plate of about 50 to 150 μm is performed, Since it can have a good pad printability capable of complete transfer, a good film can be formed by pad printing even on an electronic component having a plurality of printing surfaces.
【００４４】また、有機溶剤が２０℃付近における蒸気
圧が０．３〜１０ｍｍＨｇである成分を前記有機溶剤１
００重量％に対して６０重量％以上含む場合には、適切
な乾燥速度が得られるので、パッドへの転写前に凹板内
で厚膜ペーストが乾燥することなく、かつ、乾燥に必要
な熱風の温度もパッドを劣化させることのない適切な温
度となるので、より一層作業性のよいものにすることが
できる。Further, a component having a vapor pressure of 0.3 to 10 mmHg at around 20 ° C. is added to the organic solvent 1
When it is contained in an amount of 60% by weight or more with respect to 00% by weight, an appropriate drying rate can be obtained, so that the thick film paste is not dried in the concave plate before the transfer to the pad and the hot air required for the drying is used. Since the temperature of is also an appropriate temperature that does not deteriorate the pad, workability can be further improved.
Claims (2)
と、少なくともエチルセルロース、ポリビニルブチラー
ル、アルキド樹脂のうち１つを含む厚膜ペーストであっ
て、厚膜ペースト１００重量％に対して前記ロジン誘導
体を５〜２０重量％含有し、かつ、前記エチルセルロー
ス、前記ポリビニルブチラール、前記アルキド樹脂のう
ち少なくとも１つを０．５重量％以上含有していること
を特徴とする厚膜ペースト。1. A thick film paste containing a conductive powder, a rosin derivative, an organic solvent, and at least one of ethyl cellulose, polyvinyl butyral, and an alkyd resin, wherein the rosin derivative is 100% by weight of the thick film paste. 5 to 20% by weight, and 0.5% by weight or more of at least one of the ethyl cellulose, the polyvinyl butyral, and the alkyd resin, a thick film paste.
気圧が０．３〜１０ｍｍＨｇである成分を前記有機溶剤
１００重量％に対して６０重量％以上含むことを特徴と
する請求項１記載の厚膜ペースト。2. The organic solvent according to claim 1, wherein the organic solvent contains a component having a vapor pressure of 0.3 to 10 mmHg at around 20 ° C. in an amount of 60% by weight or more based on 100% by weight of the organic solvent. Thick film paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24422294A JP3183061B2 (en) | 1994-10-07 | 1994-10-07 | Thick film paste for pad printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24422294A JP3183061B2 (en) | 1994-10-07 | 1994-10-07 | Thick film paste for pad printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08111573A true JPH08111573A (en) | 1996-04-30 |
| JP3183061B2 JP3183061B2 (en) | 2001-07-03 |
Family
ID=17115568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24422294A Expired - Fee Related JP3183061B2 (en) | 1994-10-07 | 1994-10-07 | Thick film paste for pad printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3183061B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7158031B2 (en) | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
| USRE40137E1 (en) | 1997-05-01 | 2008-03-04 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
| KR101008004B1 (en) * | 2010-03-30 | 2011-01-14 | 주식회사 연안테크놀로지 | Method of manufacturing synthetic resin parts for mobile phones printed with antenna pattern using ink |
| US7948382B2 (en) | 1997-08-20 | 2011-05-24 | Round Rock Research, Llc | Electronic communication devices, methods of forming electrical communication devices, and communications methods |
| JP2017082348A (en) * | 2015-10-26 | 2017-05-18 | 八興産業株式会社 | Wire rope equipment |
| KR20220113000A (en) * | 2021-02-05 | 2022-08-12 | 주식회사 아이에스피 | system and method for measuring the thickness of continuous prints based on X-ray fluorescence analysis |
-
1994
- 1994-10-07 JP JP24422294A patent/JP3183061B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7158031B2 (en) | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
| US7265674B2 (en) | 1992-08-12 | 2007-09-04 | Micron Technology, Inc. | Thin flexible, RFID labels, and method and apparatus for use |
| US7583192B2 (en) | 1992-08-12 | 2009-09-01 | Keystone Technology Solutions, Llc | Radio frequency identification device and method |
| USRE40137E1 (en) | 1997-05-01 | 2008-03-04 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
| US7948382B2 (en) | 1997-08-20 | 2011-05-24 | Round Rock Research, Llc | Electronic communication devices, methods of forming electrical communication devices, and communications methods |
| KR101008004B1 (en) * | 2010-03-30 | 2011-01-14 | 주식회사 연안테크놀로지 | Method of manufacturing synthetic resin parts for mobile phones printed with antenna pattern using ink |
| JP2017082348A (en) * | 2015-10-26 | 2017-05-18 | 八興産業株式会社 | Wire rope equipment |
| KR20220113000A (en) * | 2021-02-05 | 2022-08-12 | 주식회사 아이에스피 | system and method for measuring the thickness of continuous prints based on X-ray fluorescence analysis |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3183061B2 (en) | 2001-07-03 |
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