JPH079326A - Forming device of surface plate surface - Google Patents

Abstract

PURPOSE:To leave no chip or no foreign matter on the surface of a surface plate after processing, and to give no damage to a work, when the surface plate is used as a tool, and to give no bad influence to the polishing process accuracy, by removing the chips and the foreign matters with a brush while feeding a liquid to the surface of the surface plate whose surface is processed and formed by a tool. CONSTITUTION:This forming device of the surface of a surface plate in a plane polishing device is a forming device of the surface of the surface plate having a chip removing means which consists of a liquid feeding pipe 18 and a brush 7, and a tool 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface plate forming device for forming one surface or a part of a metal surface plate, a grindstone surface plate or the like used in a flat surface polishing apparatus or the like into a predetermined shape. More specifically, the present invention relates to a platen surface forming apparatus including a chip removing means for removing chips generated when forming a platen surface.

[0002]

2. Description of the Related Art As a conventional technique, there is a cutting device for grooving a surface plate. This is the actual exploitation Sho 61-16952
As disclosed in Japanese Patent Publication No. 1, a blade is applied to the working surface of a rotating surface plate, and the blade is moved in the radial direction of the surface plate based on a value set as a target at a point on the outer circumference or the inner circumference. There are things that cut while moving. In addition, JP-A-3
Japanese Patent Publication No. 149179 discloses a dressing device fixed to the upper and lower stools for simultaneously dressing the surfaces of the first and second grindstones, respectively.

[0003]

However, among the conventional techniques described above, in the case of Japanese Utility Model Laid-Open No. 61-169521, the outer surface of the platen to the central part of the platen (or the central part to the outer peripheral part). Since the cutting tool is linearly moved to a certain point, the deeper the target cutting value at a certain point is, the more load the cutting tool has as it advances toward the center, and the larger the cutting amount. The knife itself will hurt. Therefore, there is a problem that the finish of the surface plate surface is likely to have irregular irregularities, and that chips and foreign substances remain on the processed surface, causing scratches on the work in the subsequent polishing process. The same thing may occur in the case of Japanese Patent Laid-Open No. 3-149179. In order to solve this problem, a method of stopping the surface plate after cutting and manually removing the chips with a brush or the like has been adopted, but there is a problem that a great amount of time must be spent. Moreover, none of the above-mentioned conventional techniques discloses a measure for removing chips. In view of these circumstances, the present invention eliminates the above-mentioned drawbacks of the prior art, and with a simple configuration, when forming the surface plate surface, without polishing chips or foreign matter left on the processed surface, was subjected to polishing or grinding. It is an object of the present invention to provide a surface plate forming apparatus that does not sometimes damage a work or adversely affect processing accuracy.

[0004]

The present invention is intended to solve the above-mentioned problems, and employs the following technical means. The invention according to claim 1 employs a technical means in which the surface plate forming device in the flat surface polishing device includes a chip removing means.
Further, the invention according to claim 2 adopts the technical means in which the chip removing means includes a liquid supply pipe and a brush. Further, the invention according to claim 3 employs a technical means of integrally forming the tool, the liquid supply pipe, and the brush.

[0005]

As a result of adopting the above technical means, the present invention rotates the surface plate to apply the tool to the outer peripheral portion (inner peripheral portion) of the machining surface,
The tool, the liquid supply pipe, and the brush are gradually fed at a predetermined speed to the inner peripheral side (outer peripheral side) of the surface plate in the radial direction and a surface plate surface is formed. The liquid supply pipe supplies the liquid to the machining point on the tip of the tool and the surface plate, or supplies the liquid to the center of the surface plate with respect to the tool and supplies the liquid to the machining point by the centrifugal force of the rotation of the surface plate. After forming the surface plate surface, remove the tool from the surface plate surface and return the brush to the outer peripheral side in the radial direction.
While supplying the liquid, a brush is pressed against the formed surface plate surface to remove the chips and foreign matters remaining on the surface plate surface so that no chips or the like remain on the processed surface. Therefore, the work is not scratched when the platen is subjected to polishing or grinding, and the processing accuracy is not adversely affected.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows a double-sided plane polishing apparatus provided with a platen surface forming apparatus. Normally, a double-sided surface polishing apparatus is one in which a workpiece held by a carrier meshed with a sun gear and an internal gear is pressed against a rotating upper and lower surface plate for processing. Here, 1 is an upper surface plate, 2 is a lower surface plate, and 3 is a driver. The upper surface plate 1 is driven by a driver 3.
Reference numeral 4 denotes a surface plate surface forming device, which comprises a horizontal feeding device 5 and a vertical feeding device 6, and the horizontal feeding device 5 has a tool support provided with tools 7 and 7 (for example, blades) vertically. The member 8 is guided by the linear guide 9a, and is horizontally moved in the direction of arrow A between the inner and outer circumferences of the surface plate by the rotation of the ball screw 10a. The vertical feed device 6 has the same structure, and the machine base 12 on which the horizontal feed device 5 is placed is guided by the linear guide 9b and is moved in the vertical direction by the rotation of the ball screw 10b. 11a, 11b
Is a horizontal feed servomotor and a vertical feed servomotor, respectively, and the surface of the surface plate can be formed into an arbitrary shape by computer control by the controller 13. Surface plate forming device 4 configured as described above
In the case of forming the surface plate surface linearly by, for example, first, if the upper surface plate 1 is processed, the upper surface plate 1 is raised to a predetermined height within the range of engaging the driver 3, and the blade edge of the tool 7 is fixed. Adjust to 0 when it matches the board. Next, after inputting the machining shape to the control device 13, the surface plate is rotated to start machining (FIG. 2). The processing by the surface plate surface forming device may be performed from the outer peripheral side or the inner peripheral side of the surface plate, but the upper surface plate 1 is moved in the direction of arrow A in FIG. When the machining is finished, the tool 7 is returned to the start position. Since the same applies to the processing of the lower turn table 2, the description thereof will be omitted. The upper surface plate 1 is an alignment bearing 1
Since 4 is used, it must be fixed during processing. Therefore, as shown in FIG. 1, when the upper surface plate 1 rises,
The block 15 contacts the stopper 16, the centering of the upper surface plate 1 does not function, and the upper surface plate 1 is fixed. When the upper surface plate 1 is lowered after the processing is completed, the centering works again. It should be noted that, in FIG. 1, the upper and lower platens are opened for the sake of clarity, but the state shown in FIG. Next, the surface plate forming device is provided with a brush 17 and a liquid supply pipe 18 as a chip removing device in addition to the tool 7. The functions of the brush 17 and the liquid supply pipe 18 during processing will be described with reference to FIGS. 2 and 3. When the upper surface plate 1 is engaged with the driver 3 and rotated, and the surface plate surface is processed by a start button or the like, first, the liquid is supplied from the liquid supply pipe 18 toward the surface plate surface. Next, the tool 7 is pressed against the surface plate surface. The positional relationship among the tool 7, the brush 17, and the liquid supply pipe 18 is, as viewed from the side surface of the platen surface forming device, as shown in FIG. . The brush 17 is on the rear side of the platen rotation with respect to the tool 7. Further, when the surface plate forming device is viewed from the front, as shown in FIG. 3, the liquid supply pipe 18, the tool 7, and the brush 17 are arranged in this order in the rotation direction of the surface plate. The liquid supply pipe 18 is located on the center side of the platen with respect to the tool 7 because the liquid is carried to the outer peripheral side of the platen by the centrifugal force of the platen rotation. The height relationship between the tool 7, the brush 17, and the liquid supply pipe 18 is in the order of the brush 17, the tool 7, and the liquid supply pipe 18,
The bristles of the brush 17 are closest to the surface plate surface. The bristles of the brush 17 are closer to the surface plate surface than the tool 7 so that not only the processing by the tool 7 but also the cutting chips by the liquid supplied from the brush 17 and the liquid supply pipe 18 can be removed. This is because. When the apparatus for forming the surface plate advances in the direction of arrow A in FIG. 1 and, for example, the processing from the outer peripheral side to the inner peripheral side is completed, the tool 7 is separated from the surface plate surface, and only the brush 17 contacts the surface plate surface to supply the liquid. While supplying the liquid from the pipe 18, this time, conversely, the chip removing operation is performed from the inner peripheral side to the outer peripheral side. Although the liquid supplied from the liquid supply pipe 18 is for removing chips, it must be one that does not adversely affect machinability and grindability when forming the surface plate surface for that purpose. The liquids used are mainly water, oil-based cutting agents, and water-soluble cutting agents. The positional relationship among the tool 7, the brush 17, and the liquid supply pipe 18 changes depending on the processing shape of the surface plate surface. The machining shape may be a straight line, a curved line, a spiral, a concentric circle, or the like, but it is necessary to prevent the liquid supply pipe 18 from hitting the surface plate when the tool 7 is applied to the surface plate surface. As the feeding means of the horizontal feeding device 5 and the vertical feeding device 6, a servomotor and a ball screw are used.
Or by servo motor, rack, pinion, etc.
It goes without saying that various known feeders can be used. Further, the platen surface forming device 4 may be fixed to the lapping machine or may be detachably provided. In the case of fixing, it is possible to freely rotate between the processing position between the upper and lower surface plates and the standby position on the outer periphery of the flat polishing device by a conventional means such as a motor and an air cylinder. Although the technique for forming the lapping plate surface by truing has been described in the present embodiment, it goes without saying that the present technique can be applied to the dressing of the grindstone surface or the polishing pad surface by replacing the tool 7 with pellets or the like. . Further, it can be applied not only to the double-side polishing apparatus but also to the single-side polishing apparatus.

[0007]

As a result of adopting the above configuration, the present invention provides
The following effects can be obtained. (1) Since chips and foreign matter are removed with a brush while supplying liquid to the surface plate formed by processing and forming the surface with a tool, no chips or foreign matter remain on the surface plate after processing, and the surface plate When used as a tool, it does not damage the work and does not adversely affect the polishing accuracy.

[Brief description of drawings]

FIG. 1 is a schematic front view showing a platen surface forming apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic front view of a main part of a platen surface forming apparatus according to an embodiment of the present invention.

FIG. 3 is a side view of a main part of a surface plate forming apparatus according to an embodiment of the present invention.

[Explanation of symbols]

1 ... upper surface plate 2 ... lower surface plate 3 ... driver 4 ... surface plate surface forming device 5 ... horizontal feed device 6 ... vertical feed device 7 ... tool 8 ... tool support member 9a ... Linear guide 9b Linear guide 10a ... Ball screw 10b ...
Ball screw 11a ... Horizontal feed servo motor 11b ... Vertical feed servo motor 12 ... Machine stand 13 ... Controller 14 ... Aligning bearing 15 ... Block 16 ... Stopper 17 ... Brush 18 ... Liquid supply pipe

Claims (3)

[Claims] 1. An apparatus for forming a surface plate surface, wherein the apparatus for forming a surface plate surface in a flat surface polishing apparatus includes a chip removing means. 2. The surface plate surface forming apparatus according to claim 1, wherein the chip removing means comprises a liquid supply pipe and a brush. 3. A surface polishing apparatus according to claim 1, wherein the tool, the liquid supply pipe, and the brush are integrally formed.
The surface plate surface forming device described.