JPH0782974B2 - Electrode forming method for electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention is for forming a strip electrode 2 on an end face 1a of an electronic component 1 and two faces 1b, 1b connecting the end face 1a as shown in FIG. The present invention relates to an electrode forming method for electronic components.

2. Description of the Related Art Conventionally, the formation of the above electrodes was performed by screen printing, but in this case, the screen dimensions change due to damage or elongation of the screen, and the electrode dimensions vary, and the formed electrodes are The present applicant has proposed a method of forming an electrode capable of preventing a time-dependent change of the screen and a positional deviation of the electrode (Japanese Patent Application No. 63-321629).

In this method, as shown in FIG. 12 (a), a slit plate 13 having a through slit 13a having a width corresponding to the width of the electrode to be formed is positioned above the electrode paste 12 bath, As shown in FIG. 12 (b), the end face 1a is placed on top of 13
Arrange the electronic component 1 so as to straddle the through slit 13a, and after that or before that, as shown in FIG. 12 (c), the electrode paste 12 is raised to a certain height over the upper surface of the slit plate 13, and As shown in FIG. 12 (d), the electronic component 1 is removed, and as shown in FIG. 12 (e), the strip-shaped electrode paste 12 is applied to the end face 1a of the electronic component 1 and the two faces 1b, 1b connected to it. This is done by forming.

However, in the case of the proposed method, since one slit is formed for one strip electrode, when forming a wide electrode, the width of Since it is necessary to use a wide slit, the electrode, mainly the electrode portion formed on the end face 1a, becomes thicker as the amount of the electrode paste attached increases, or, as shown in FIG. 13, the surface of the electrode paste. Electrode 1 formed on two surfaces 1b, 1b by tension
There was a problem that the ends of the two parts were rounded.

Also, by applying it to the capacitor with a fuse shown in FIG.
When the end of the electrode 12a is rounded, as shown in FIG. 15, the length of the fuse wire 16 changes due to the variation in the attachment position of the fuse wire. For example, when the fuse wire 16 is attached like a, the fuse wire 16 becomes long. And when b, fuse wire 16
There is also a problem that the fusing property becomes shorter and the fusing characteristics vary.

The present invention has been made to solve such problems,
It is an object of the present invention to provide an electrode forming method for an electronic component, which can make the thickness of the electrode relatively constant and can form a strip electrode having an angular end portion.

Means for Solving the Problems The present invention provides a method for forming an electrode over an end face of a plate-shaped electronic component and at least one face continuous with the end face, and for one electrode, two or more through slits or a large number of through holes. Is formed in a band shape as a whole, and the plate material having the width of the entire band shape corresponding to the width of the electrode is positioned above the electrode paste bath, and the end surface on the plate material straddles the through slit or the through hole. The electronic component is arranged in this manner, and thereafter or prior to this, the electrode paste is raised to a certain height over the upper surface of the plate material, and the electrode paste is applied to the end face of the electronic component and at least one surface continuous with the end face.

Action In the present invention, as shown in FIGS. 7 and 8, two or more through slits 3a or a large number of through holes 3b formed in a band shape.
Since the overall width W ₁ of each electrode is set according to the width W ₂ of one electrode, the cross-sectional area of each through-slit or through-hole is small. Since one electrode is formed, it is possible to suppress an increase in the amount of the electrode paste adhered, and it is small even if the upper end of the raised electrode paste on the plate material is rounded due to the surface tension. Can be made uniform, and the surface connected to the end surface of the electronic component can be made into a square state.

EXAMPLES The present invention will be specifically described below. FIG. 1 shows an electrode forming apparatus suitable for use in the present invention. This apparatus includes a plate 3 having a through slit 3a formed therein, a container 4 on which the plate 3 is placed, and an electrode paste 2 bath stored therein.
And a pressurizing means 5 provided on the side surface side of the container 4,
When the pressing plate 5a provided in the pressing means 5 is pushed down and the electrode paste 2 is pushed, a part of the electrode paste 2 is pushed out from the through slit 3a.

The through slit 3a is seventh more as shown in the figure, for example, the entire four as one set in this example is formed in a strip shape, the width W ₂ of one electrode to be formed is the width W ₁ of the entire Is formed in a size corresponding to. The joint between the plate 3 and the container 4 is sealed so that the electrode paste 2 does not leak.

When predetermined preparations such as bringing the electrode paste 2 bath to a predetermined temperature are completed, first, as shown in FIG. 2, the electronic component 1 is held upright by a holding member or the like not shown,
The end face 1a on which the electrode of the electronic component 1 is to be formed is the through slit 3a.
The electronic component 1 is placed on the plate 3 so as to straddle it. At this time, there may be a gap between the plate material 3 and the electronic component 1 or they may be in contact with each other.

Next, as shown in FIG. 3, the pressing means 5 is pressed to push out the desired amount of the electronic component paste 2 from the through slit 3a of the plate material 3. As a result, the electronic component paste 2 is applied onto the plate material 3.
Is in a raised state. At this time, since two or more through slits 3a are provided for one electrode 2 as described above, the cross-sectional area per one through slit becomes small, and each through slit 3a is inserted as shown in FIG. Even if each upper end of the electrode paste 2 is rounded, it can be made smaller than the conventional case shown by the broken line, and the height is uniform.
Then, the electrode paste 2 group in this state contacts and adheres to the end surface 1a of the electronic component 1 and the two surfaces 1b, 1b continuous with the end surface 1a. When there are two or more electrodes (solidified electrode paste) 2 to be formed in the electronic component 1, one set of two or more through slits 3a corresponding to one electrode is used as the number of electrodes 2. Depending on the situation, a plurality of sets may be formed on the plate material 3.

After that, the electronic component paste 2 on the plate material 3 is returned into the container 4, and then the electronic component 1 is lifted as shown in FIG.
Then, as shown in FIG. 5, the electronic component 1 has two surfaces 1b, 1
When the end of the electrode 2 attached to b is relatively angular, 3
The strip-shaped electrode 2 having a U-shaped cross section over the surfaces 1a, 1b, 1b is 1
The electrodes are formed at the same time by performing the electrode forming process once. The electronic component 1 may be lifted before returning the electrode paste 2 into the container 4.

Here, regarding the width and the spacing of each through slit 3a in one set, if it is not necessary to integrate one electrode like the electrode of the capacitor with a fuse,
The size is set such that the electrode pastes 2 inserted through the adjacent through slits 3a come into contact with each other and the whole is gathered. On the contrary, if such integration is not required, each through slit
The electrode paste 2 inserted through 3a may be attached to the electronic component 1 in a state of being separated from each other, or the electrode paste 2 may be attached to the electronic component 1 in an intermediate state between the two. Good.

Then, as shown in FIG. 6, the electrode paste 2 attached to the upper surface of the plate member 3 is scraped off by the scraping tool 6. This scraping is unnecessary when the electrode paste 2 is not attached to the upper surface of the plate material 3. After that, the above-mentioned electrode forming process is repeated for the next electronic component.

In this embodiment, the plate material 3 is provided with through slits, but the present invention is not limited to this, and for example, as shown in FIG. 8, one row is made up of a plurality of through holes 3b and two rows are provided. It is also possible to implement this by forming it in a two-strip shape and using the one having a size such that the overall width W ₁ corresponds to the width W ₂ of the electrode to be formed. The formation pattern of the through holes 3b is not limited to this example, and various other patterns can be adopted, and the overall width
If W ₁ is regulated, it may be arranged randomly.

In this embodiment, the electronic component 1 is first placed on the plate material 3 and the electrode paste 2 is then extruded onto the plate material 3. However, the present invention first extrudes the electrode paste 2 onto the plate material 3, After that, the electronic component 1 may be placed on the plate member 3 on which the electrode paste 2 is raised to form the electrode 2.

In the embodiment described above, the pressing means 5 is provided on the side surface side of the container 4 to push the electrode paste 2 onto the plate material 3, but the present invention is not limited to this and is shown in FIG. As described above, the container 4 is placed inside the vacuum case 7 and the like, and the pipe 8 provided so as to communicate with and connect to the container 4 is taken out of the vacuum case 7 and the like, and the inside of the vacuum case 7 and the like is connected to a vacuum pump not shown. Alternatively, the electrode paste 2 may be sucked up and depressurized to be sucked up onto the plate material 3 (indicated by an outline arrow). Further, as shown in FIG. 10, a side plate 9 is attached around the plate member 3 so that the upper end is higher than the upper surface of the plate member 3, and the plate member 3 is immersed in the electrode paste 2 bath and penetrated. The electrode 2 may be formed on the electronic component 1 by raising the electrode paste 2 from the slit 3a at a constant height.

Further, although the electronic component 1 is placed directly on the plate member 3 in the above-described embodiment, the present invention is not limited to this, and an elastic sheet is attached to the upper surface of the plate member 3 to bring the plate member 3 and the electronic component 1 into close contact with each other. You may try to improve the sex. When the adhesion is improved in this way, there is an advantage that the spread of the electrode paste attached to the electronic component 1 due to wetting can be suppressed at the time of application, and the plate material 3 can be less contaminated.

And further, the present invention provides a large number of electronic components 1 on the plate member 3.
By arranging the electrodes to form electrodes, multi-processing is possible.

In addition, here, an example of forming electrodes on the end face 1a and two faces 1b, 1b connected to the end face 1a is given, but when forming electrodes on one face of the two faces 1b, 1b and the end face 1a, Has the same effect.

Effect of the Invention As described in detail above, in the case of the present invention, the overall width of two or more through slits or a large number of through holes formed in strips has a size corresponding to the width of one electrode. , The cross-sectional area of each through slit or through hole is small, and one electrode is formed by the electrode paste group having a small cross-sectional area that penetrates the through slit or the through hole. Therefore, it is possible to suppress an increase in the amount of electrode paste attached. Also, since the upper end of the raised electrode paste on the plate material is rounded due to surface tension, it is small,
The thickness of the electrode can be made uniform, and the surface connected to the end surface of the electronic component can be made angular.

Further, in a capacitor with a fuse to which the present invention is applied and which has an electrode formed, there is an effect that the fusing characteristics can be prevented from varying.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an electrode forming apparatus suitable for carrying out the present invention, and FIGS. 2, 3 and 4 are vertical sectional views showing an embodiment of the present invention,
FIG. 5 is a perspective view showing an electrode portion formed according to the present invention, FIG. 6 is a perspective view showing a state where a scraping operation is being performed in association with the present invention, and FIGS. A plan view showing the formation state of a through slit or a through hole as a part, FIGS. 9 and 10 are sectional views and perspective views showing another embodiment of the present invention, and FIG. 11 shows the shape of an electrode formed in an electronic component. FIG. 12 is a perspective view, FIG. 12 is an explanatory diagram of a conventional electrode forming method, and FIGS. 13 to 15 are explanatory diagrams of problems in the conventional electrode forming method. 1 ... Electronic component, 1a ... End face, 1b ... Surface continuous with end face 1a, 2 ... Electrode (and electrode paste), 3 ... Plate material, 3a
…… Through slit, 3b …… Through hole, 4 …… Container, 5 ……
Pressurizing means, 7 ... vacuum case.

Claims (1)

[Claims] 1. A method of forming an electrode on an end face of a plate-shaped electronic component and at least one face connected to the end face, wherein two or more through slits or a large number of through holes are formed in a strip shape for one electrode as a whole. And a plate member having the entire width of the strip corresponding to the width of the electrode is positioned above the electrode paste bath, and the electronic component is arranged on the plate member so that the end face straddles the through slit or the through hole. Then, after or before this, the electrode paste is raised to a certain height over the upper surface of the plate material, and the electrode paste is applied to the end surface of the electronic component and at least one surface continuous with the end face of the electronic component.