JPH0777291B2 - Method for manufacturing molded circuit board - Google Patents
Method for manufacturing molded circuit boardInfo
- Publication number
- JPH0777291B2 JPH0777291B2 JP2197071A JP19707190A JPH0777291B2 JP H0777291 B2 JPH0777291 B2 JP H0777291B2 JP 2197071 A JP2197071 A JP 2197071A JP 19707190 A JP19707190 A JP 19707190A JP H0777291 B2 JPH0777291 B2 JP H0777291B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- thin plate
- circuit board
- lead frame
- molded circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 title claims description 5
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、リードフレームのような導体薄板を絶縁脂肪
内に埋め込み一体成形してなるモールド成形回路基板の
製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a molded circuit board in which a conductive thin plate such as a lead frame is embedded in insulating fat and integrally molded.
［従来の技術］ モールド成形回路基板は、リードフレームのような所定
の回路形状の導体薄板を絶縁脂肪内に埋め込み一体成形
して構成されるものである。このようなモールド成形回
路基板の製造に際しては、まず金属薄板をエッチングや
プレスによって所定の回路パターン形状に打ち抜き、こ
れをリードフレームとして金型キャビティー内にセット
し、その後キャビティー内に溶融樹脂を流し込んでリー
ドフレームを絶縁樹脂（樹脂成形体）内に埋め込み一体
成形している。[Prior Art] A molded circuit board is constructed by embedding and integrally molding a conductor thin plate having a predetermined circuit shape such as a lead frame in insulating fat. When manufacturing such a molded circuit board, a thin metal plate is first punched into a predetermined circuit pattern shape by etching or pressing, and this is set as a lead frame in a mold cavity, and then molten resin is set in the cavity. The lead frame is poured into the insulating resin (resin molding) and integrally molded.
［発明が解決しようとする課題］ ところで、このようなモールド成形回路基板の製造にお
いては、リードフレームが金型キャビティー内で浮いた
状態であるため、溶融樹脂をキャビティー内に流し込ん
だ時に当該リードフレームが位置ずれを起こし、相互に
絶縁されるべきリードフレームどうしが接触したり、リ
ードフレームが成形品の表面に露出するおそれがあっ
た。このため、従来は、リードフレームの厚さや幅を大
きくすることにより、リードフレーム自体の剛性を向上
させていたが、回路（配線）の自由度を低下させると共
に基板のコンパクト化の妨げになるという問題点があっ
た。[Problems to be Solved by the Invention] In the manufacture of such a molded circuit board, since the lead frame is in a floating state in the mold cavity, the molten resin is likely to flow when the molten resin is poured into the cavity. There is a risk that the lead frames may be displaced, the lead frames to be insulated from each other may come into contact with each other, or the lead frames may be exposed on the surface of the molded product. For this reason, conventionally, the rigidity of the lead frame itself has been improved by increasing the thickness and width of the lead frame, but this reduces the degree of freedom of the circuit (wiring) and hinders downsizing of the board. There was a problem.
本発明は、上記した従来技術の問題を解決するもので、
絶縁樹脂成形の際におけるリードフレームの移動や変形
を防止できるモールド成形回路基板の製造方法の提供を
目的とするものである。The present invention solves the above-mentioned problems of the prior art,
It is an object of the present invention to provide a method for manufacturing a molded circuit board that can prevent the lead frame from moving or deforming during insulating resin molding.
［課題を解決するための手段］ 本発明は、所定の配線パターン形状に成形された導体薄
板を金型内に保持し、この金型内に溶融樹脂を流し込ん
でモールド成形回路基板を製造する方法において、前記
導体薄板は所定位置に複数の貫通孔が形成されており、
前記金型の上型および下型のキャビティ内の対応する位
置の夫々に導電薄板を固定する固定用突起を設けてお
き、上型と下型を組合せることにより固定用突起を前記
導電薄板の貫通孔に嵌合させて導電薄板を上下から固定
し、その状態で金型内に溶融樹脂を流し込んで導電薄板
の上下両面に絶縁樹脂を一体成形することを特徴とする
ものである。[Means for Solving the Problem] The present invention is a method for manufacturing a molded circuit board by holding a conductor thin plate molded into a predetermined wiring pattern shape in a mold and pouring a molten resin into the mold. In, the conductor thin plate has a plurality of through holes formed at predetermined positions,
A fixing projection for fixing the conductive thin plate is provided at each of the corresponding positions in the cavities of the upper mold and the lower mold of the mold, and the fixing protrusion is formed on the conductive thin plate by combining the upper mold and the lower mold. It is characterized in that the conductive thin plate is fixed from above and below by fitting into the through hole, and in that state, the molten resin is poured into the mold to integrally mold the insulating resin on the upper and lower surfaces of the conductive thin plate.
［作用］ 本発明は、金型の固定用突起を導体薄板の貫通孔に嵌合
させることにより導体薄板を上下から固定し、その状態
で金型内に樹脂を流し込んで導体薄板の上下両面に絶縁
樹脂を一体に成形するものであるため、金型や導体薄板
に複雑な加工を施すことなく導体薄板の位置決めを高精
度で行えるとともに、導体薄板の金型内への固定も容易
に行えるので作業効率を向上できる。[Operation] According to the present invention, the conductor thin plate is fixed from above and below by fitting the fixing protrusion of the mold into the through hole of the conductor thin plate, and in that state, the resin is poured into the mold to apply the resin to the upper and lower surfaces of the conductor thin plate. Since the insulating resin is integrally molded, the conductor thin plate can be positioned with high precision without complicated processing on the mold or conductor thin plate, and the conductor thin plate can be easily fixed in the mold. Work efficiency can be improved.
［実施例］ 以下、本発明の実施例を添付図面を参照して説明する。Embodiments Embodiments of the present invention will be described below with reference to the accompanying drawings.
第１図は、本発明により製造されるモールド成形回路基
板の一例の外観を示したものであり、モールド成形回路
基板10は、絶縁脂肪16内にリードフレーム18を埋め込み
一体成形してなるものである。なお、16aはモールド
孔、16bはスルーホールであり、図示のモールド成形回
路基板は、下型の方向から観察したものである。FIG. 1 shows an appearance of an example of a molded circuit board manufactured according to the present invention. The molded circuit board 10 is made by integrally molding a lead frame 18 in an insulating fat 16. is there. 16a is a mold hole, 16b is a through hole, and the illustrated molded circuit board is observed from the direction of the lower mold.
第２図は、リードフレーム18の配線パターンを示したも
のである。リードフレーム18は、燐青銅をプレス加工に
より板厚0.2mmに成形され、所定間隔で複数の嵌合孔
（貫通孔）18aが形成されている。FIG. 2 shows a wiring pattern of the lead frame 18. The lead frame 18 is formed by pressing phosphor bronze to have a plate thickness of 0.2 mm, and has a plurality of fitting holes (through holes) 18a formed at predetermined intervals.
第３図は、リードフレームを金型キャビティー内に固定
した状態を示したもので、第２図に示したような配線パ
ターンでもって固定されている。金型キャビティーは上
型12と下型14とからなり、下型14には第４図に示すよう
にリードフレーム18の嵌合孔18aに挿嵌される嵌合突起2
0が一体形成されている。この嵌合突起20は先端の小径
部20aと、その下の大径部20bとからなり、小径部20aが
リードフレーム18の嵌合孔18a内に挿入されるようにな
っている。一方、上型12には、下型14の嵌合突起20に対
向する位置に、嵌合突起20の小径部20aの上面に当接す
る支持突起22が一体形成されている。FIG. 3 shows a state in which the lead frame is fixed in the mold cavity, and is fixed by the wiring pattern as shown in FIG. The mold cavity is composed of an upper mold 12 and a lower mold 14. The lower mold 14 has a fitting protrusion 2 which is fitted into a fitting hole 18a of a lead frame 18 as shown in FIG.
0 is integrally formed. The fitting protrusion 20 is composed of a small diameter portion 20a at the tip and a large diameter portion 20b below the small diameter portion 20a, and the small diameter portion 20a is inserted into the fitting hole 18a of the lead frame 18. On the other hand, the upper mold 12 is integrally formed with a support protrusion 22 that is in contact with the upper surface of the small diameter portion 20a of the fitting protrusion 20 at a position facing the fitting protrusion 20 of the lower mold 14.
突起20、22が配置される間隔は、リードフレーム18の変
形を0.1mm以下にするために、20mm以下にしている。こ
れは、第５図に示すリードフレームの固定間隔（突起位
置）と変形との相関関係に基づくものである。なお、第
５図の曲線は成形条件、リードフレームの材質、形状等
によって変化する。The distance between the protrusions 20 and 22 is set to 20 mm or less in order to reduce the deformation of the lead frame 18 to 0.1 mm or less. This is based on the correlation between the fixed interval (protrusion position) and the deformation of the lead frame shown in FIG. The curve in FIG. 5 changes depending on the molding conditions, the material and shape of the lead frame, and the like.
以下、製造方法を具体的に説明する。The manufacturing method will be specifically described below.
リードフレーム18の嵌合孔18aを下型14の嵌合突起20の
小径部20aに嵌め込み、その後嵌合突起20の上端に支持
突起22が当接するように上型12を被せる。これによっ
て、金型キャビティー12、14内にリードフレーム18が固
定配置される。このように突起20に嵌合孔18aを嵌合さ
せてリードフレーム18を固定配置することにより、金型
キャビティー12、14に対するリードフレーム18の位置決
めを容易に行うことができる。The fitting hole 18a of the lead frame 18 is fitted into the small-diameter portion 20a of the fitting projection 20 of the lower mold 14, and then the upper mold 12 is covered so that the upper end of the fitting projection 20 is brought into contact with the support projection 22. As a result, the lead frame 18 is fixedly arranged in the mold cavities 12 and 14. By thus fitting the fitting hole 18a into the protrusion 20 and fixing the lead frame 18, the lead frame 18 can be easily positioned with respect to the mold cavities 12 and 14.
次に、金型12、14の中空部30にポリフェニレンサルファ
イド（電気化学工業（株）製Ｐ−140、ガラスフィラー4
0重量％含有）からなる溶融樹脂を流し込むことにより
絶縁樹脂16が形成される。この際、リードフレーム18は
下型14の嵌合突起20の小径部20aによって水平位置が固
定され、また大径部20bと上型12の支持突起22によって
垂直位置が固定されるため、樹脂の充填により位置ずれ
を起こすことはない。Next, polyphenylene sulfide (P-140 manufactured by Denki Kagaku Kogyo Co., Ltd.) and glass filler 4 were placed in the hollow portions 30 of the molds 12 and 14.
The insulating resin 16 is formed by pouring a molten resin containing 0% by weight). At this time, the lead frame 18 is fixed in the horizontal position by the small diameter portion 20a of the fitting protrusion 20 of the lower die 14, and is fixed in the vertical position by the large diameter portion 20b and the support protrusion 22 of the upper die 12, so that the resin There is no misalignment due to filling.
その後、金型キャビティー12、14を外すことにより、第
１図に示すようなモールド成形回路基板10を得ることが
できる。このように製造されたモールド成形回路基板10
におけるリードフレーム18の変形は0.1mm以下であっ
た。また、耐電圧性能を測定した結果、AC2000Vを１分
間印加した場合でも絶縁破壊を起こさない良好なデータ
が得られた。Then, by removing the mold cavities 12 and 14, the molded circuit board 10 as shown in FIG. 1 can be obtained. Molded circuit board 10 manufactured in this way
The deformation of the lead frame 18 was 0.1 mm or less. In addition, as a result of measuring the withstand voltage performance, good data was obtained in which dielectric breakdown did not occur even when 2000 V AC was applied for 1 minute.
［発明の効果］ 以上説明したように、本発明は、導体薄板の貫通孔と金
型の突起との嵌合によって導体薄板を固定する構成であ
るため、金型内における導体薄板の位置固定を良好に行
うことができ、導体薄板の位置精度の高いモールド成形
回路基板を効率的に製造することできるようになる。[Effects of the Invention] As described above, the present invention has a configuration in which the conductor thin plate is fixed by fitting the through hole of the conductor thin plate and the protrusion of the mold. Therefore, the position fixing of the conductor thin plate in the mold is performed. This can be favorably performed, and a molded circuit board with a conductor thin plate having high positional accuracy can be efficiently manufactured.
第１図は、本発明により得られるモールド成形回路基板
の一例の斜視説明図、第２図は、リードフレームの配置
の斜視説明図、第３図は、本発明の一実施例の説明図
で、リードフレームを金型に固定した状態の断面説明
図、第４図は、本発明の一実施例の説明図で、リードフ
レームと固定用突起の詳細説明図、第５図はリードフレ
ームの固定間隔と変形量の関係を示すグラフである。 符号の説明 10:モールド成形基板 12:上型（金型） 14:下型（金型） 16:絶縁樹脂 16a:モールド孔 16b:スルーホール 18:リードフレーム 18a:嵌合孔 20:嵌合突起 20a:小径部 20b:大径部 22:支持突起FIG. 1 is a perspective explanatory view of an example of a molded circuit board obtained by the present invention, FIG. 2 is a perspective explanatory view of an arrangement of a lead frame, and FIG. 3 is an explanatory view of an embodiment of the present invention. FIG. 4 is a cross-sectional explanatory view showing a state in which the lead frame is fixed to a mold, FIG. 4 is an explanatory view of one embodiment of the present invention, a detailed explanatory view of the lead frame and the fixing projections, and FIG. 5 is fixing the lead frame. It is a graph which shows the relationship between a space | interval and the amount of deformation. Explanation of code 10: Molded substrate 12: Upper mold (mold) 14: Lower mold (mold) 16: Insulating resin 16a: Mold hole 16b: Through hole 18: Lead frame 18a: Fitting hole 20: Fitting protrusion 20a: Small diameter part 20b: Large diameter part 22: Support protrusion
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭52−126756（ＪＰ，Ａ) 特開 昭51−60956（ＪＰ，Ａ) 実開 昭63−220595（ＪＰ，Ｕ) 特公 昭47−5574（ＪＰ，Ｂ１) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-52-126756 (JP, A) JP-A-51-60956 (JP, A) Actual development-Sho 63-220595 (JP, U) JP-B 47- 5574 (JP, B1)
Claims (1)
薄板を金型内に保持し、この金型内に溶融樹脂を流し込
んでモールド成形回路基板を製造する方法において、前
記導体薄板は所定位置に複数の貫通孔が形成されてお
り、前記金型の上型および下型のキャビティ内の対応す
る位置の夫々に導電薄板を固定する固定用突起を設けて
おき、上型と下型を組合せることにより固定用突起を前
記導電薄板の貫通孔に嵌合させて導電薄板を上下から固
定し、その状態で金型内に溶融樹脂を流し込んで導電薄
板の上下両面に絶縁樹脂を一体成形することを特徴とす
るモールド成形回路基板の製造方法。1. A method for producing a molded circuit board by holding a conductor thin plate formed in a predetermined wiring pattern shape in a mold and pouring molten resin into the mold, wherein the conductor thin plate is at a predetermined position. A plurality of through-holes are formed in the mold, and fixing protrusions for fixing the conductive thin plate are provided at respective corresponding positions in the cavities of the upper mold and the lower mold of the mold, and the upper mold and the lower mold are combined. By doing so, the fixing projection is fitted into the through hole of the conductive thin plate to fix the conductive thin plate from above and below, and in that state, the molten resin is poured into the mold to integrally form the insulating resin on the upper and lower surfaces of the conductive thin plate. A method for manufacturing a molded circuit board, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2197071A JPH0777291B2 (en) | 1990-07-25 | 1990-07-25 | Method for manufacturing molded circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2197071A JPH0777291B2 (en) | 1990-07-25 | 1990-07-25 | Method for manufacturing molded circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2215095A Division JPH0818197A (en) | 1995-02-10 | 1995-02-10 | Method for manufacturing molded circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0483391A JPH0483391A (en) | 1992-03-17 |
| JPH0777291B2 true JPH0777291B2 (en) | 1995-08-16 |
Family
ID=16368234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2197071A Expired - Lifetime JPH0777291B2 (en) | 1990-07-25 | 1990-07-25 | Method for manufacturing molded circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777291B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2957463B2 (en) * | 1996-03-11 | 1999-10-04 | 日本電気株式会社 | Patch antenna and method of manufacturing the same |
| JP4551552B2 (en) * | 2000-10-24 | 2010-09-29 | 米沢電線株式会社 | Composite circuit board |
| JP2011035277A (en) * | 2009-08-05 | 2011-02-17 | Denso Corp | Bus bar assembly and method of manufacturing the same |
| JP7198066B2 (en) * | 2018-12-06 | 2022-12-28 | 三山工業株式会社 | Method for manufacturing legrest member and legrest member |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126756A (en) * | 1976-04-16 | 1977-10-24 | Matsushita Electric Industrial Co Ltd | Inserttmolding method of preparing electroconductive plate for mounting electronic parts |
-
1990
- 1990-07-25 JP JP2197071A patent/JPH0777291B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0483391A (en) | 1992-03-17 |
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