JPH0775173B2 - Electrical connection device and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] In an electrical connection device of a system that utilizes melting and solidification of a low melting point alloy, an insulating layer is provided above the alloy reservoir part for containing the low melting point alloy, and the alloy is stored in the reservoir. Satisfactorily arranged in the section.

[Industrial application field]

The present invention relates to an electrical connecting device, and particularly to an LSI capable of heating and melting a low-melting point alloy for connecting contact pins and inserting and removing contact pins many times with a small force.
The present invention relates to a device for electrically connecting electrical devices such as a module, an IC module, or a circuit board, that is, a connector. Furthermore, the invention relates to the manufacture of such an electrical connection device.

[Conventional technology]

Conventional electrical connection devices usually consist of pins that correspond to male contacts (contact pins) and jacks that correspond to female contacts. ing.

Recently, attempts have been made to reduce the pin insertion force and the withdrawal force by coping with the increase in the number of pins per connection device with the increase in the integration degree. For example, a zero insertion force (ZIF) connection device and Known as the light insertion force (LIF) connection device. Instead of connecting the contact pins to the jacks to these connecting devices by a cam mechanism or applying a contact force all at once after inserting the contact pins into the jack,
There is a form that adopts a mechanism that connects by dividing. However, these connecting devices require a complicated mechanism and complicated handling associated therewith, and also cause an increase in manufacturing cost.

In order to solve the above-mentioned problems, the present inventors have previously disclosed an electrical connecting device of a system in which a contact pin is inserted and removed by utilizing melting and solidification of a low melting point alloy [JP-A-58-58]. 1699
6, Japanese Patent Application No. 58-64737, Japanese Patent Application Laid-Open No. 59-146433, and Japanese Patent Application No. 59-268553].

FIG. 3 is a sectional view of a mounting model of the electrical connecting device disclosed in Japanese Patent Application No. 59-268553.

In FIG. 3, the printed circuit board 1, the connection device 2 and the LS
The I modules 3 are connected in order from the bottom by a first contact pin 5 and a second contact pin 6, respectively.

A glass-ceramic substrate is used for the connection device 2, and a stepped through hole (solder reservoir) 4 through which the contact pins 5 and 6 are inserted is provided in the connection device 2. The inner wall of the hole is made of, for example, Au-Pt thick film paste, and then A metallization layer 8 of Au-Pt / Au2 layer using Au thick film paste is provided, and the head 9 of the contact pin 5 is, for example, 80% Au-20% Sn low melting point metal (solder). ) 7, it is melted and fixed.

[Problems to be solved by the invention]

Since the metallization layer 8 is formed up to the upper part of the inner wall of the through hole 4 in the above-mentioned conventional connecting device, when the low melting point metal 7 is arranged on the step of the hole 4, the low melting point metal is located on the upper part of the through hole. There is a case where it does not flow down to the stepped portion due to a so-called “shelf-hanging” state, and in such a case, there are problems such as poor connection between contact pins and diagonal connection of contact pins.

FIG. 4A and FIG. 4B are cross-sectional views schematically showing a normal arrangement state and a hanging state in the through hole of the low melting point alloy, respectively.

[Means for solving problems]

According to the present invention, the above-mentioned problem is a device for electrically connecting them by interposing them between the electric devices, and the following means are provided: a connecting hod made of an insulating material; A guide hole into which a contact pin of an electric device can be inserted, a metal reservoir formed in a part of the guide hole, a low melting point metal accommodated in the metal reservoir for connection between contacts, and the metal reservoir An electrical connection device comprising a combination of a melatize layer, which is arranged in the vicinity, wherein an insulating layer is provided on the inner wall surface of the guide hole above the metal reservoir region. To be done.

Further, according to the present invention, there is provided a method of manufacturing the above electrical connection device. In this manufacturing method, after forming a metallized layer on the inner wall surface of the guide hole, a wax is arranged in the vicinity of the metal reservoir, the insulating layer is screen-printed on the inner wall surface of the guide hole above the wax, and then the wax is formed. It is characterized by being dissolved.

[Work]

According to the present invention, since the insulating layer is provided on the inner wall surface of the upper portion of the through hole, the connection of the low melting point metal does not occur at the upper portion of the hole.

〔Example〕

 Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view of an essential part for explaining an embodiment of the present invention.

As shown in Fig. 1, a glass-ceramic substrate with a thickness of about 3 mm 1
Diameter of about 1.0mm for inserting contact pin (not shown) into 1
Of the through hole 12 having a stepped portion 13 (diameter 0.6 mm), the inner wall surface of the through hole 12 is provided with a metallized layer 15 which is a heating element made of, for example, a Pt-Au / Au2 layer. An insulating layer using, for example, a dielectric paste on the upper metallized layer 15
16 is formed to a thickness of about 10 to 20 μm. The broken line shown in the figure is, for example, In-48 inserted after forming the insulating layer 16.
It is a low melting point alloy 14 composed of% Sn. The flow rate of the insulating layer 16 is about
About 1 mm is preferable.

2A to 2B are process cross-sectional views for explaining a method of forming an insulating layer according to the present invention.

The process up to the formation of the metallized layer 15 is similar to the conventional method.

As shown in FIG. 2A, powder of wax 17 in the through hole 12 of the glass-ceramic substrate 11 on which the metallized layer 15 is formed, or spheres, after being packed in an appropriate amount, placed in a container 18 filled with the same wax 17, Melt wax 17. In this way, the melted wax 17 fills the lower part of the through hole as shown in FIG. 2B. The substrate 11 (+ wax) cut in this state or at an appropriate position in the container 18 is set in a screen printing machine as shown in FIG. 2C, and the main component is glass thinned with an organic solvent such as terpineocare. The insulating paste 16 is screen-printed (19 is a screen mask). As a result, an insulating paste layer 16 is further formed on the surface of the metallized layer 15. Substrate in this state
When 11 is fired upside down as shown in FIG. 2D, when the temperature rises, the wax first melts and disappears, and then the insulating layer 16 is baked on the surface of the metallized layer 15. At this time, wax 17
The insulating layer is not formed on the portion covered with. In this way, a metal reservoir in which only the upper part of the through hole 17 is insulated can be formed (Fig. 2E). When this metal reservoir was filled with a low melting point metal by the conventional method, it all fell down to the bottom, and stable electrical connection was obtained through the contact pins.

〔The invention's effect〕

As described above, according to the present invention, the low melting point metal (solder) flows down to the stepped portion (the bottom of the metal reservoir) of the through hole, so that the contact pin can perform a stable connecting action.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of an essential part for explaining an embodiment of the present invention, and FIGS. 2A to 2E are process cross-sectional views for explaining a method for forming an insulating layer according to the present invention. FIG. 3 is a cross-sectional view of a mounting model of the electrical connecting device disclosed in Japanese Patent Application No. 59-268553, and FIGS. 4A and 4B are normal layouts in through holes of low melting point metal. It is sectional drawing which showed the installation state and the shelf hanging state typically. 11 …… Glass-ceramic substrate, 12 …… Through hole, 13 …… Stepped portion, 14 …… Low melting point metal, 15 …… Metalized layer, 16 …… Connecting layer.

Claims (2)

[Claims] 1. A device for interposing electrical connection between electrical devices, the device comprising the following means: a connecting hod made of an insulating material, an electrical device drilled through the connecting board. Guide hole into which the contact pin can be inserted, a metal reservoir formed in a part of the guide hole, a low-melting metal housed in the metal reservoir for connection between contacts, and arranged in the vicinity of the metal reservoir An electrical connection device comprising a combination of a melted layer and an insulating layer formed on the inner wall surface of the guide hole above the metal reservoir region. 2. A connection board made of an insulating material, a guide hole penetrating the connection board, into which a contact pin of an electric device can be inserted, and a metal reservoir formed in a part of the guide hole. A low-melting-point metal accommodated in the metal reservoir, which is used for connection between contacts, a metallization layer disposed in the vicinity of the metal reservoir, and an inner wall surface of the guide hole above the metal reservoir region. A method for manufacturing an electrical connecting device including a combination of an insulating layer and an insulating layer; forming a metallized layer on the inner wall surface of the guide hole, and disposing a wax near the metal reservoir; A method for manufacturing an electrical connection device, comprising screen-printing the insulating layer on the inner wall surface of a hole, then melting the wax, and then filling the low melting point metal.